JPS63185880A - Snow melting structure and manufacture - Google Patents
Snow melting structure and manufactureInfo
- Publication number
- JPS63185880A JPS63185880A JP1776687A JP1776687A JPS63185880A JP S63185880 A JPS63185880 A JP S63185880A JP 1776687 A JP1776687 A JP 1776687A JP 1776687 A JP1776687 A JP 1776687A JP S63185880 A JPS63185880 A JP S63185880A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- base member
- snow melting
- snow
- melting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Buildings Adapted To Withstand Abnormal External Influences (AREA)
- Resistance Heating (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、冬季、多雪地帯における屋根瓦１歩道或いは
車道等への積雪を防ぐための融雪構造体に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a snow melting structure for preventing snow from accumulating on roof tiles, sidewalks, roads, etc. in areas with heavy snowfall during winter.
（従来の技術）
従来、多雪地帯における除雪には、道路等においては、
除雪車等の除雪機械を使用した機械的な除雪が採用され
、民家の屋根などでは、人力による雪降しが主に行われ
ていた。また、道路に散水管を埋設し、この散水管によ
り道路の表面に地下水を散水することにより融雪が行わ
れていた。更に、歩道や玄関などに金属発熱体を埋設し
、この金属発熱体に通電して発熱させることにより融雪
していた。(Conventional technology) Conventionally, for snow removal in areas with heavy snowfall, roads, etc.
Mechanical snow removal using snow removal machines such as snowplows was adopted, and snow removal from the roofs of private houses was mainly done manually. In addition, snow melting was performed by burying water pipes in roads and sprinkling groundwater onto the surface of the road. Furthermore, metal heating elements were buried in sidewalks, entrances, etc., and snow was melted by energizing the metal heating elements to generate heat.
（発明が解決しようとする問題点）
しかし、上記の如き従来の機械的及び人力による除雪で
は、費用、労力、危険性などに問題点がある。また、地
下水の散水による方法では、散水管の散水穴の目詰まり
、排水量の増大、地下水の使用による地盤性下等の難点
がある。更に、金属発熱体を使用する場合、コンクリー
トなどに埋設したときの熱伝導性の問題及び埋設時の発
熱体の破損等の問題があり、しかも、金属発熱体では、
温度のコントロールが難しく、温度を一定にするには、
温度の制御回路が必要となり、不経済となる等の問題点
があった。(Problems to be Solved by the Invention) However, the conventional mechanical and manual snow removal methods described above have problems such as cost, labor, and danger. In addition, methods using groundwater sprinkling have drawbacks such as clogging of the watering holes in the watering pipes, increased amount of drainage, and poor ground quality due to the use of groundwater. Furthermore, when using a metal heating element, there are problems such as thermal conductivity when buried in concrete, etc., and damage to the heating element when buried.
It is difficult to control the temperature and to keep it constant,
There were problems such as the need for a temperature control circuit, which was uneconomical.
（問題点を解決するための手段）
本発明は、上記の欠点を解決するために成されたもので
、臘根瓦等任意の形状に成形した絶縁性を有する基部材
と、該基部材の表面に焼結した温度依存性セラミック半
導体による発熱体と、該発熱体の表面に焼結した電気絶
縁材とから構成することによって、耐候性、耐薬品性に
優れ、極めて信頼性が高く、安全かつ効率的に除雪する
ことの可能な融雪構造体を提供するものである。(Means for Solving the Problems) The present invention has been made to solve the above-mentioned drawbacks. Composed of a heating element made of a temperature-dependent ceramic semiconductor sintered on the surface and an electrical insulating material sintered on the surface of the heating element, it has excellent weather resistance and chemical resistance, and is extremely reliable and safe. The present invention also provides a snow melting structure that can efficiently remove snow.
３、発明の詳細な説明
以下、本発明を図面の実施例に基づいて詳細に説明する
。なお、第１図は本発明に係る融雪構造体の原理を示す
一部を切除した斜視図を示す。3. Detailed Description of the Invention The present invention will be described in detail below based on embodiments of the drawings. Note that FIG. 1 shows a partially cutaway perspective view showing the principle of the snow melting structure according to the present invention.
来者発明に係る融雪構造体は、屋根瓦、タイル等を構成
する基部材１と、該基部材１の上に形成される発熱体２
と、該発熱体２の上に形成される電気絶縁材３とから構
成されている。The snow melting structure according to the present invention includes a base member 1 constituting a roof tile, tile, etc., and a heating element 2 formed on the base member 1.
and an electrical insulating material 3 formed on the heating element 2.
先ず、基部材１としては、絶縁性を有するセラミックが
使用され、これを流し込み法、押し出し成形法等により
、屋根瓦、タイル等の所望の形状に成形した後、一度焼
き又は二度焼きで所定の温度及び雰囲気で焼結する。First, as the base member 1, an insulating ceramic is used, which is formed into a desired shape such as a roof tile or tile by a pouring method or an extrusion method, and then fired once or twice to a predetermined shape. Sinter at a temperature and atmosphere of
次に、発熱体２としては、温度依存性のセラミック半導
体、例えば、Ｐ Ｔ Ｃ（Ｐｏｓｉｔｉｖｅ Ｔｅｍｐ
ｅｒａＬｕｒｅ Ｃｏｅｆｆｉｃｉｅｎｔ：抵抗が正の
温度係数）のセラミックスを使用するが、このセラミッ
ク半導体の原料は比較的安価である。Next, as the heating element 2, a temperature-dependent ceramic semiconductor, for example, PTC (Positive Temperature
A ceramic having a positive temperature coefficient of resistance is used, and the raw material for this ceramic semiconductor is relatively inexpensive.
そして、このようなセラミック半導体の原料の中で、本
発明においては熱安定性の高い、例えばＴｉＯ□ （酸
化チタン）、ＳｎＯ□ （酸化錫）を使用する。Among such raw materials for ceramic semiconductors, in the present invention, highly thermally stable materials such as TiO□ (titanium oxide) and SnO□ (tin oxide) are used.
しかし、例えばＳｎＯ，では、酸素分子の吸着により、
空気中では絶縁体となるので、酸素分子と置換するよう
なアンチモン或いは鉛を添加して半導体機能を強化する
。この場合、アンチモン或いは鉛などの強化材料は、焼
成中に蒸発する可能性が高く、そのために効果が低下す
る恐れがあるので、これには、酸化シリコンを安定剤と
して使用する。なお、この酸化シリコンは同時に電気抵
抗の調節材としての効果も高い。However, for example, in SnO, due to the adsorption of oxygen molecules,
Since it becomes an insulator in air, antimony or lead is added to replace oxygen molecules to strengthen the semiconductor function. In this case, silicon oxide is used as a stabilizer, since reinforcing materials such as antimony or lead are likely to evaporate during firing, thereby reducing their effectiveness. Note that this silicon oxide is also highly effective as an electrical resistance adjusting material.
また、発熱体２の上に形成する電気絶縁体３としては、
陶器等の釉薬が使用される。Moreover, as the electric insulator 3 formed on the heating element 2,
Glazes such as pottery are used.
そこで、発熱体２としてのセラミック半導体は仮焼した
後、この仮焼物を粉砕し、この粉砕物に他の微粉末を加
えてスラリー（不溶解物に水を加えた混合物）を作り、
これを基部材１の表面に塗布し、その上に電気絶縁材３
の釉薬を施した後、焼成して一体化させる。また、発熱
体２には、図示しないが、電極を設ける。Therefore, after calcining the ceramic semiconductor as the heating element 2, the calcined product is crushed, and other fine powders are added to the crushed product to make a slurry (a mixture of insoluble matter and water).
Apply this to the surface of the base member 1, and apply the electrical insulating material 3 on top of it.
After applying the glaze, it is fired and integrated. Further, although not shown, the heating element 2 is provided with an electrode.
そして、この基部材１を所定の場所に敷設し、発熱体２
に通電して発熱させ、電気絶縁体３上の雪を解かすので
ある。なお、基部材１としてセラミックが使用されてい
るので、該セラミ・ツクを焼結すると同時に、発熱体２
のセラミック半導体も熱処理される。Then, this base member 1 is laid at a predetermined location, and the heating element 2
Electricity is applied to generate heat, which melts the snow on the electrical insulator 3. Note that since ceramic is used as the base member 1, the heating element 2 is sintered at the same time as the ceramic is sintered.
Ceramic semiconductors are also heat treated.
更に、上記の発熱体２としてのセラミック半導体は、温
度−電気抵抗の変化が特異でサーモスタットとして働く
ので、それ自身がヒータであると同時に、自己発熱によ
って発熱体２は自動的に温度を調節する機能を有してい
る。Furthermore, the ceramic semiconductor used as the heating element 2 has a unique temperature-electrical resistance change and works as a thermostat, so it is itself a heater, and at the same time, the heating element 2 automatically adjusts the temperature by self-heating. It has a function.
〔実施例１〕
第２図及び第３図に示すように、基部材１は屋根瓦の形
状に成形する。一方、発熱体２のセラミック半導体とし
て酸化錫９５部に酸化アンチモン５部を加えてよく混合
し、これを１２５０度の酸化雰囲気で仮焼する。次いで
、この仮焼物を粉砕し、この粉砕物７０部に石英微粉末
３０部を加えてスラリーを作る。そして、このスラリー
を屋根瓦に形成した基部材１の表面全体にスプレーがけ
し、その上に釉薬の電気絶縁材３を塗布した後、１２０
０度で焼結して一体化させる。[Example 1] As shown in FIGS. 2 and 3, the base member 1 is formed into the shape of a roof tile. On the other hand, as a ceramic semiconductor for the heating element 2, 95 parts of tin oxide and 5 parts of antimony oxide are added and mixed well, and the mixture is calcined in an oxidizing atmosphere at 1250 degrees. Next, this calcined product is pulverized, and 30 parts of fine quartz powder is added to 70 parts of this pulverized product to prepare a slurry. Then, after spraying this slurry over the entire surface of the base member 1 formed into a roof tile and applying the glaze electrical insulating material 3 on it,
Sinter and integrate at 0 degrees.
この屋根瓦で屋根をふき、降雪時には発熱体２に通電し
て発熱させ、屋根瓦上の積雪を融雪させる。The roof is covered with these roof tiles, and when it snows, the heating element 2 is energized to generate heat and melt the snow on the roof tiles.
〔実施例２〕
第４図に示すように、基部材１はタイル形状に成形する
。一方、発熱体２として上記のセラミック半導体の粉砕
物９０部に、石英微粉末１０部のスラリーを作り、これ
をタイルの形状に成形した基部材１の上に塗布し、その
上にフリット釉の電気絶縁材３を施して一体に焼結する
。このタイルを歩道上に敷設し、降雪時には通電して融
雪させる。[Example 2] As shown in FIG. 4, the base member 1 is formed into a tile shape. On the other hand, as a heating element 2, a slurry of 90 parts of the above-mentioned crushed ceramic semiconductor and 10 parts of fine quartz powder is made, and this is applied onto the base member 1 formed into the shape of a tile. An electrical insulating material 3 is applied and sintered together. These tiles are laid on the sidewalk, and when it snows, electricity is turned on to melt the snow.
なお、発熱体２及び電気絶縁材３は、図に示すように、
基部材１の上面に、帯状に並列して形成しても、図面の
一点鎖線で示すように格子形状に形成してもよく、或い
は、第１図に示すように、タイル形状基部材１の表面全
体に設定してもよいこと勿論である。Note that the heating element 2 and the electrical insulating material 3 are as shown in the figure.
They may be formed in parallel on the top surface of the base member 1 in a strip shape, or may be formed in a lattice shape as shown by the dashed lines in the drawing, or as shown in FIG. Of course, it may be set on the entire surface.
〔実施例３〕
発熱体２のセラミック半導体としての酸化チタン７０部
と炭酸バリウム３０部の混合物を１２５０度で仮焼し、
微粉末に粉砕する。[Example 3] A mixture of 70 parts of titanium oxide and 30 parts of barium carbonate as the ceramic semiconductor of the heating element 2 was calcined at 1250 degrees,
Grind into a fine powder.
この微粉砕物のスラリーをタイル形状の基部材１上に塗
布し、その上に電気絶縁材３の釉薬を施して還元雰囲気
において、１２００度で焼成して一体化させる。このタ
イルを歩道上に敷設し、降雪時には通電して融雪させる
。その他の点については、実施例２と同様である。A slurry of this finely pulverized material is applied onto a tile-shaped base member 1, a glaze of an electrical insulating material 3 is applied thereon, and the glaze is baked at 1200 degrees in a reducing atmosphere to integrate the material. These tiles are laid on the sidewalk, and when it snows, electricity is turned on to melt the snow. The other points are the same as in the second embodiment.
（発明の効果）
本発明は叙上のように、発熱体２として、温度依存性の
セラミック半導体を用い、セラミックの基部材１と焼成
して一体化しているため、複合化による障害はなく、耐
候性、耐薬品性等に優れ、極めて信頼性が高い。(Effects of the Invention) As described above, the present invention uses a temperature-dependent ceramic semiconductor as the heating element 2 and is integrated with the ceramic base member 1 by firing, so there is no problem due to compounding. Excellent weather resistance, chemical resistance, etc., and extremely reliable.
しかも、発熱体２を構成する温度依存性のセラミック半
導体には、サーモスタット機能があるので、複雑な温度
調節回路を設ける必要がなく、温度調節が自動的に行わ
れ、効率的かつ経済的に除雪することが可能となるとい
った諸効果がある。Moreover, since the temperature-dependent ceramic semiconductor that makes up the heating element 2 has a thermostatic function, there is no need to provide a complicated temperature control circuit, and temperature control is performed automatically, making it possible to remove snow efficiently and economically. There are various effects such as making it possible to
第１図は本発明に係る融雪構造体の原理を示す一部を切
除した斜視図、第２図は同融雪構造体の一実施例を示す
一部を切除した斜視図、第３図は同側面図、第４図は他
の実施例の斜視図である。
■・・・基部材、 ２・・・発熱体、 ３・・・電気絶
縁材。Fig. 1 is a partially cutaway perspective view showing the principle of the snow melting structure according to the present invention, Fig. 2 is a partially cut away perspective view showing an embodiment of the snow melting structure, and Fig. 3 is the same. The side view and FIG. 4 are perspective views of another embodiment. ■... Base member, 2... Heating element, 3... Electrical insulation material.
Claims (2)
、スラリー状としたものを絶縁性成形体の表面に塗布し
、さらにその上に釉薬を塗布した後焼成したことを特徴
とする融雪構造体の製造方法。(1) A snow melting structure characterized by calcining a ceramic semiconductor raw material, pulverizing it, applying the slurry to the surface of an insulating molded body, further applying a glaze thereon, and then firing it. How the body is manufactured.
部材と、該基部材の表面に焼成した温度依存性セラミッ
ク半導体による発熱体と、該発熱体の表面に焼成した電
気絶縁材とから構成したことを特徴とする融雪構造体。(2) An insulating base member formed into an arbitrary shape such as a tile roof tile, a heating element made of a temperature-dependent ceramic semiconductor fired on the surface of the base member, and an electrical insulating material fired on the surface of the heating element. A snow melting structure comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1776687A JPH0246552B2 (en) | 1987-01-28 | 1987-01-28 | JUSETSUKOZOTAIOYOBISONOSEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1776687A JPH0246552B2 (en) | 1987-01-28 | 1987-01-28 | JUSETSUKOZOTAIOYOBISONOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63185880A true JPS63185880A (en) | 1988-08-01 |
| JPH0246552B2 JPH0246552B2 (en) | 1990-10-16 |
Family
ID=11952831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1776687A Expired - Lifetime JPH0246552B2 (en) | 1987-01-28 | 1987-01-28 | JUSETSUKOZOTAIOYOBISONOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246552B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0430618U (en) * | 1990-05-11 | 1992-03-12 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03290128A (en) * | 1990-04-04 | 1991-12-19 | Kiichi Mori | Feeding device in fish farming pool |
-
1987
- 1987-01-28 JP JP1776687A patent/JPH0246552B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0430618U (en) * | 1990-05-11 | 1992-03-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0246552B2 (en) | 1990-10-16 |
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