JPS6321758B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electroplating device that can uniformize the distribution of the amount of plating applied to a strip to be plated (hereinafter referred to as a strip).

Previously, the present inventors proposed an electroplating device as shown in FIG. 1 (Japanese Patent Application No. 57-5390 (Japanese Unexamined Patent Publication No. 58-123898)).

In FIG. 1, a strip 1 is passed through a conductor roll 3 between electrodes 2 and plated. This electrode 2 has a nozzle 5 (a slit cut in the electrode 2) processed into a cushion shape, and is installed in an electroplating tank 9 containing plating liquid 8, and the plating liquid 8 is pumped The pressure is increased at 6, and it is supplied to the header 4 through the pipe 7, and is blown onto the strip 1 in the form of a jet stream from the cushion-type nozzle 5 provided on the electrode 2.

The features of this electroplating device are the following points (1) and (2).

(1) The jet of plating liquid from the angled cushion-type nozzle 5 forms a pressure pocket region 10 with high pressure in the middle of the nozzle 5, and this pressure pocket causes the strip 1 to be centered between the electrodes 2. The board is passed through. Therefore, compared to the case where the cushion-type nozzle 5 is not provided, the distance between the electrodes 2 can be made smaller, and power consumption can be reduced.

(2) Since the plating liquid is sprayed as a jet stream from the cushion-type nozzle 5, the speed at which the metal ions in the plating liquid diffuse into the strip 1 becomes high, and this occurs when the supply of metal ions cannot keep up with the electrodeposition speed. The "burning" phenomenon of strip 1 can be avoided.

However, in the above-mentioned electroplating apparatus, when the strip 1 passes along the conductor roll 3, a phenomenon in which the plate bends in the width direction, that is, so-called C warping occurs.

For C warpage, strip 1 is conductor roll 3.
This occurs when tension is applied under conditions that create a region along which plastic deformation occurs. for example,
Conductor roll 3 is φ600mm, strip 1
When the thickness of strip 1 is 1.0mm, the strain on the surface of strip 1 is 1.67×10 ^-3 , and the longitudinal elastic modulus is 21000Kg/mm ²
Then, the stress on the strip surface is 35Kg/mm ² . Therefore, if the yield value of the strip 1 is 24 kg/mm ² , the pressure distribution within the strip 1 will be as shown in Fig. 2a, indicating that it is in the elastoplastic region.

Note that FIG. 2b shows the case where the strip 1 runs along the conductor roll 3, and FIGS. 2a and b
In the figure, 1' is the inner surface of the strip 1 (that is, the surface in contact with the conductor roll 3), 1'' is the outer surface, α is the plastic deformation region, and β is the elastic deformation region.

When tension is applied to the strip 1 in the elasto-plastic region, the stress distribution becomes as shown in Figure 3, with compression occurring on the outer surface 1'' of the strip 1 and elongation occurring on the inner surface 1'; , c occurs, and this warp is called C warp.

Note that α in FIG. 3 indicates a compression area. In addition, Fig. 4b is a diagram showing the C warp that occurred at the A-A' section of strip 1 in Fig. 4a [view from the arrow mark in Fig. 4a]
Fig. 4c is a diagram showing the C warp that occurred in the B-B' section [view from the arrow mark in Fig. 4a], and the arrow RO in Fig. 4a indicates the direction of movement of the strip 1 (pulling direction). ) is shown. As is clear from Figure 4 b and c, C
Amount of warpage (height between strip center and strip end)
becomes larger as strip 1 progresses.
This is because when the strip 1 is close to the conductor roll 3, it is restrained by the surface of the roll 3 and the amount of warpage is small;
This is because the amount of warpage increases as the restraint is removed.

Further, the amount of C warpage varies depending on the thickness of the strip, and for example, if the strip is 600 mm wide and the conductor roll is 600 mm in diameter, it will be as shown in FIG.

On the other hand, the distance between the strip 1 and the electrode 2 is usually about 7 to 10 mm, so if the thickness of the strip 1 is large (the amount of warpage is also large as shown in Figure 5), the strip Contact between the strip 1 and the electrode 2 is likely to occur, causing damage to the plating, and even if the C warp of the strip 1 can be corrected to some extent by the plating liquid jet from the nozzle 5, complete correction may be difficult. Therefore, the distance between the strip 1 and the electrode 2 cannot be made uniform, and a problem arises in that the amount of plating varies.

The present invention was made to solve these problems, and aims to correct the C-curvature of the strip after passing through the conductor roll, to make the surface as flat as possible between the electrodes, and to make the plating weight distribution uniform. The purpose is to

According to research conducted by the present inventors, it has become clear that this object can be achieved if the flow velocity of the jet stream from the cushion-type nozzle can be varied in the width direction of the strip.

The present invention is based on this knowledge, and consists of dividing the inside of the header of the electrode processed into a cushion-type nozzle into several chambers in the width direction of the strip, and providing each chamber with a valve for supplying plating liquid and controlling the flow rate. The present invention relates to an electroplating device characterized by:

The cushion-type nozzle 5 in the electroplating apparatus of the earlier application shown in FIG. 1 has a structure as shown in FIG. That is, the nozzle 5 is machined in the width direction of the strip 1 so that a jet stream is uniformly emitted in this width direction.

In the present invention, the nozzle 5 is divided along the width direction (that is, the width direction of the strip 1) so that the flow velocity of the jet stream can be controlled in the width direction.

FIG. 7 is a diagram showing an embodiment of the apparatus of the present invention, in which FIG. 7a is a perspective view and FIG. 7b is a cross-sectional view.

In Figures 7a and b, the same reference numerals as in Figures 1 to 6 indicate 1.
Figures 4 to 6 show the same functional parts, and 4 ₁ , 4 ₂ . . . are headers of the electrode 2 divided into several chambers (here, 4 chambers), and 11 ₁ , 11 ₂ . . . are each divided header 4 ₁ , 4 ₂ ...
It is a valve installed in...

In Figures 7a and 7b, the plating liquid is applied to valve 1.
The flow rate is preset by 1 ₁ , 11 ₂ ...,
Alternatively, while being controlled by separately measuring the distance to the strip 1, it is supplied to each divided header 4 ₁ , 4 ₂ .

The force applied in the width direction of the strip 1 (the force due to the jet of plating liquid) can be distributed depending on the flow rate of the plating liquid supplied to each of the divided headers 4 ₁ , 4 ₂ .

Therefore, as shown in FIG. 8, for example, when a strip 1 with a C warp is passed through, the jets of plating liquid from the split headers 4 ₁ and 4 ₄ at both ends are set at high speed in the direction of the arrow C. In the direction, the plating liquid jets from the central split headers 4 ₂ and 4 ₃ are set at high speed,
A moment is generated in the direction to correct the C-curvature of the strip 1, thereby making the strip 1 flat.

As detailed above, according to the device of the present invention, even if the strip passed between the electrodes is warped, the warp can be easily corrected, and as a result, the basis weight can be reduced. Uniform plating can be performed.

[Brief explanation of drawings]

Figure 1 is a diagram showing an example of the electroplating device according to the earlier application, Figures 2 to 4 are diagrams explaining the situation in which warpage occurs in the strip during operation of this electroplating equipment, and Figure 5 is the amount of warpage. FIG. 6 is a partially enlarged explanatory diagram of the electroplating device shown in FIG. 1, FIG. 7 is a diagram showing an example of the device of the present invention, and FIG. FIG. 3 is a diagram for explaining the effects of the present invention shown in FIG.

Claims (1)

[Claims] 1. An electroplating device characterized in that the inside of the header of an electrode processed into a cushion-shaped nozzle is divided into several chambers in the strip width direction, and each chamber is provided with a valve for supplying plating liquid and controlling the flow rate.