JPS6343480B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electroplating device that can uniformize the distribution of the amount of plating applied to a plating strip (hereinafter referred to as a strip).

Previously, the present inventors proposed an electroplating device as shown in FIG. 1 (Japanese Patent Application No. 57-5390 (Japanese Unexamined Patent Publication No. 58-123898)).

In FIG. 1, a strip 1 is passed through a conductor roll 3 between electrodes 2 and plated. This electrode 2 has a nozzle 5 (a slit cut in the electrode 2) processed into a cushion shape, and is installed in an electroplating tank 9 containing plating liquid 8, and the plating liquid 8 is pumped The pressure is increased at 6, and the water is supplied to the header 4 through the pipe 7, and is blown onto the strip 1 as a jet stream from the cushion-type nozzle 5 provided on the electrode 2.

The features of this electroplating device are the following points (1) and (2).

(1) The plating liquid jet from the angled cushion-type nozzle 5 forms a pressure pocket region 10 with high pressure in the middle of the nozzle 5, and this pressure pocket causes the strip 1 to be centered between the electrodes 2. The board is passed through. Therefore, compared to the case where the cushion-type nozzle 5 is not provided, the distance between the electrodes 2 can be made smaller, and power consumption can be reduced.

(2) Since the plating liquid is sprayed as a jet stream from the cushion-type nozzle 5, the speed at which the metal ions in the plating liquid diffuse into the strip 1 becomes high, and this occurs when the supply of metal ions cannot keep up with the electrodeposition speed. The "burning" phenomenon of strip 1 can be avoided.

However, in the above-mentioned electroplating apparatus, when the strip 1 passes along the conductor roll 3, a phenomenon in which the plate bends in the width direction, that is, so-called C warping occurs.

For C warping, strip 1 is conductor roll 3.
This occurs when tension is applied under conditions that create a region along which plastic deformation occurs. for example,
Conductor roll 3 is φ600mm, strip 1
The thickness of the strip is 1.0mm, and the yield strength of strip 1 is 24Kg/
mm ² and the modulus of longitudinal elasticity is 21000 Kg/mm ² , the stress distribution within the strip 1 is as shown in Figure 2a, indicating that it is in the elastoplastic region.

Note that FIG. 2b shows the case where the strip 1 runs along the conductor roll 3, and FIGS.
In the figure, 1' is the inner surface of the strip 1 (that is, the surface in contact with the conductor roll 3), 1'' is the outer surface, α is the plastic deformation region, and β is the elastic deformation region.

When tension is applied to the strip 1 in the elasto-plastic region, the stress distribution will be as shown in Figure 3, with compression occurring on the outer surface 1'' of the strip 1 and elongation occurring on the inner surface 1'. Warpage as shown in Figures b and c occurs, and this warpage is called C warp.

Note that γ in FIG. 3 indicates a compressed region. Also, Fig. 4b is a diagram showing the C warp that occurred at the A-A' portion of strip 1 in Fig. 4a [view from the arrow in Fig. 4a]
Fig. 4c is a diagram showing the C warp that occurred in the B-B' section [view from the arrow mark in Fig. 4a], and the arrow RO in Fig. 4a indicates the direction of movement of the strip 1 (pulling direction). ) is shown. As is clear from Figure 4 b and c, C
Amount of reversal (height between strip center and strip end)
becomes larger as strip 1 progresses.
This is because when the strip 1 is close to the conductor roll 3, it is restrained by the surface of the roll 3 and the amount of warpage is small;
This is because the amount of warpage increases as the restraint is removed.

Further, the amount of C warpage varies depending on the thickness of the strip, and for example, if the strip is 600 mm wide and the conductor roll is 600 mm in diameter, it will be as shown in FIG.

On the other hand, the distance between strip 1 and electrode 2 is usually
Since the thickness of the strip 1 is about 7 to 10 mm, if the thickness of the strip 1 is large (as the amount of warpage is also large as shown in Fig. 5), contact between the strip 1 and the electrode 2 will easily occur, and the plating will be damaged. Scratches and strips 1
Even if the C warp can be corrected to some extent by the plating liquid jet from the nozzle 5, complete correction may be difficult, and the distance between the strip 1 and the electrode 2 cannot be made uniform, and the plating A problem arises in that the basis weight changes.

The present invention was made to solve these problems, and it corrects the C warpage of the strip after passing through the conductor roll, and makes the surface between the electrodes as flat as possible to make the current density distribution of plating uniform. The purpose is to make the basis weight distribution uniform, and in the case of alloy plating, to make the deposited alloy composition uniform.

According to research by the present inventors, the purpose of this is to change the slit shape of the cushion-type nozzle to change the flow rate of the jet jet in the width direction of the nozzle in the width direction of the strip, thereby distributing the force of the jet jet applied to the strip. It has become clear that this can be achieved by having

The present invention is based on this knowledge, and the opening area becomes larger or smaller as the shape of the slit in the strip width direction of the nozzle of an electrode that has a header and is processed into a cushion-type nozzle moves toward the center. The present invention relates to an electroplating device characterized by a variable shape.

Hereinafter, the apparatus of the present invention will be described in detail with reference to the accompanying drawings.

6 and 7 show the structure of the nozzle part of the electrode according to the device of the present invention. FIG. As shown in FIG. 7, the opening area of the slit 11 decreases toward the center in the width direction of the nozzle 5, and the opening area becomes maximum at the center. Note that the symbols in FIGS. 6 and 7 have the same meanings as those in FIG.

By using the nozzle 5 having the shape of the slit 11 shown in FIGS. 6 and 7, the force applied to the strip of plating liquid ejected from the nozzle 5 can be distributed in the width direction of the strip. C-curvature can be corrected.

For example, when a warped strip 1 as shown in FIG. If the main operation is performed and the plating liquid jet is injected from the center of the header 4 using the nozzle shown in Fig. 7 on the strip surface, the C warp of the strip 1 can be corrected. It is capable of generating a moment in the direction.

It should be noted that since the direction of C warp of the strip 1 is determined by the direction of threading of the conductor roll, it goes without saying that the installation mode of the strip shown in Figs. 6 and 7 should be determined according to this threading direction. stomach.

As described in detail above, conventional cushion-type nozzles have a structure in which the jet comes out uniformly in the width direction, but in the present invention, the outflow area is changed in the nozzle width direction, and the force applied to the strip is distributed. Since the nozzle structure allows the strip to be straightened, it is possible to increase the flow rate of the jet in the part of the warped strip near the electrode, which has the extremely beneficial effect of making it easy to straighten the strip. It is something.

[Brief explanation of drawings]

Figure 1 is a diagram showing an example of the electroplating device according to the earlier application, Figures 2 to 4 are diagrams explaining the situation in which warpage occurs in the strip during operation of this electroplating equipment, and Figure 5 is the amount of warpage. FIG. 6 and FIG. 7 are diagrams showing an example of the device of the present invention, and FIG. 8 is a diagram for explaining the effects of the device of the present invention.

Claims (1)

[Claims] 1. An electrode having a header and processed into a cushion nozzle is characterized in that the shape of the slit in the nozzle in the width direction of the strip is such that the opening area changes from larger to smaller as it moves toward the center. Electroplating equipment.