JPS632285B2 - - Google Patents
Info
- Publication number
- JPS632285B2 JPS632285B2 JP6408884A JP6408884A JPS632285B2 JP S632285 B2 JPS632285 B2 JP S632285B2 JP 6408884 A JP6408884 A JP 6408884A JP 6408884 A JP6408884 A JP 6408884A JP S632285 B2 JPS632285 B2 JP S632285B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copolymer
- weight
- terephthalic acid
- diallyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001577 copolymer Polymers 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 25
- 229920000647 polyepoxide Polymers 0.000 claims description 25
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 18
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 18
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 claims description 14
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 12
- 239000011342 resin composition Substances 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 2
- 239000000203 mixture Substances 0.000 description 27
- 239000000047 product Substances 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 20
- 238000006116 polymerization reaction Methods 0.000 description 16
- 239000000178 monomer Substances 0.000 description 15
- -1 azo compound Chemical class 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 150000002978 peroxides Chemical class 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 150000007524 organic acids Chemical class 0.000 description 4
- 150000001451 organic peroxides Chemical class 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 229920006305 unsaturated polyester Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 2
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- GWHJZXXIDMPWGX-UHFFFAOYSA-N 1,2,4-trimethylbenzene Chemical compound CC1=CC=C(C)C(C)=C1 GWHJZXXIDMPWGX-UHFFFAOYSA-N 0.000 description 2
- YBYOAKWOMFCPAY-UHFFFAOYSA-N 1,2-bis(3-methylbutyl)benzene Chemical compound CC(C)CCC1=CC=CC=C1CCC(C)C YBYOAKWOMFCPAY-UHFFFAOYSA-N 0.000 description 2
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 2
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 2
- AFZZYIJIWUTJFO-UHFFFAOYSA-N 1,3-diethylbenzene Chemical compound CCC1=CC=CC(CC)=C1 AFZZYIJIWUTJFO-UHFFFAOYSA-N 0.000 description 2
- DSNHSQKRULAAEI-UHFFFAOYSA-N 1,4-Diethylbenzene Chemical compound CCC1=CC=C(CC)C=C1 DSNHSQKRULAAEI-UHFFFAOYSA-N 0.000 description 2
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
- 235000013539 calcium stearate Nutrition 0.000 description 2
- 239000008116 calcium stearate Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 239000012933 diacyl peroxide Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002432 hydroperoxides Chemical class 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- HFPZCAJZSCWRBC-UHFFFAOYSA-N p-cymene Chemical compound CC(C)C1=CC=C(C)C=C1 HFPZCAJZSCWRBC-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- JWZZKOKVBUJMES-UHFFFAOYSA-N (+-)-Isoprenaline Chemical compound CC(C)NCC(O)C1=CC=C(O)C(O)=C1 JWZZKOKVBUJMES-UHFFFAOYSA-N 0.000 description 1
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 1
- PYOLJOJPIPCRDP-UHFFFAOYSA-N 1,1,3-trimethylcyclohexane Chemical compound CC1CCCC(C)(C)C1 PYOLJOJPIPCRDP-UHFFFAOYSA-N 0.000 description 1
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical class CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
- NMUWSGQKPAEPBA-UHFFFAOYSA-N 1,2-dibutylbenzene Chemical compound CCCCC1=CC=CC=C1CCCC NMUWSGQKPAEPBA-UHFFFAOYSA-N 0.000 description 1
- VPHBYBUYWBZLEX-UHFFFAOYSA-N 1,2-dipropylbenzene Chemical compound CCCC1=CC=CC=C1CCC VPHBYBUYWBZLEX-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- BLZIWBDUMUJHOE-UHFFFAOYSA-N 1,3-dibutylbenzene Chemical compound CCCCC1=CC=CC(CCCC)=C1 BLZIWBDUMUJHOE-UHFFFAOYSA-N 0.000 description 1
- GWTBXGSNWKXTPX-UHFFFAOYSA-N 1,3-dipropylbenzene Chemical compound CCCC1=CC=CC(CCC)=C1 GWTBXGSNWKXTPX-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- XKBRARIYUCPYSS-UHFFFAOYSA-N 1,4-bis(3-methylbutyl)benzene Chemical compound CC(C)CCC1=CC=C(CCC(C)C)C=C1 XKBRARIYUCPYSS-UHFFFAOYSA-N 0.000 description 1
- VGQOZYOOFXEGDA-UHFFFAOYSA-N 1,4-dibutylbenzene Chemical compound CCCCC1=CC=C(CCCC)C=C1 VGQOZYOOFXEGDA-UHFFFAOYSA-N 0.000 description 1
- PHUANMGFAOCUOQ-UHFFFAOYSA-N 1,4-dipropylbenzene Chemical compound CCCC1=CC=C(CCC)C=C1 PHUANMGFAOCUOQ-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- XHAFIUUYXQFJEW-UHFFFAOYSA-N 1-chloroethenylbenzene Chemical compound ClC(=C)C1=CC=CC=C1 XHAFIUUYXQFJEW-UHFFFAOYSA-N 0.000 description 1
- YZJJFHCVOBMNQJ-UHFFFAOYSA-N 1-hydroperoxydecane Chemical compound CCCCCCCCCCOO YZJJFHCVOBMNQJ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QAPLQMROVGLYLM-UHFFFAOYSA-N 2-butan-2-ylperoxybutane Chemical compound CCC(C)OOC(C)CC QAPLQMROVGLYLM-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- SPQMVUPFYWDFCB-UHFFFAOYSA-N 2-hydroperoxybutane Chemical compound CCC(C)OO SPQMVUPFYWDFCB-UHFFFAOYSA-N 0.000 description 1
- IFDLFCDWOFLKEB-UHFFFAOYSA-N 2-methylbutylbenzene Chemical compound CCC(C)CC1=CC=CC=C1 IFDLFCDWOFLKEB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 description 1
- UIYHUUARNKRKGV-UHFFFAOYSA-N 2-prop-2-enoxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCC=C UIYHUUARNKRKGV-UHFFFAOYSA-N 0.000 description 1
- NOHVEOHMUTVZOS-UHFFFAOYSA-N 2-tert-butylperoxybutane Chemical compound CCC(C)OOC(C)(C)C NOHVEOHMUTVZOS-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- HGFWTERYDVYMMD-UHFFFAOYSA-N 3,3-dichlorooxolane-2,5-dione Chemical compound ClC1(Cl)CC(=O)OC1=O HGFWTERYDVYMMD-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
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- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
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- 239000004953 Aliphatic polyamide Substances 0.000 description 1
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- 230000005856 abnormality Effects 0.000 description 1
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- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
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- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000001743 benzylic group Chemical group 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
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- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
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- 238000004581 coalescence Methods 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
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- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
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- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
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- 230000005484 gravity Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 239000001257 hydrogen Substances 0.000 description 1
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- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
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- 239000004922 lacquer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】
本発明は、耐衝撃性、耐熱性に特に優れた硬化
可能な樹脂組成物に関するものである。
従来よりジアリルオルソフタレート及びジアリ
ルイソフタレートから誘導されたプレポリマーを
主としたジアリルフタレート系樹脂は、高温高湿
時特に電気的性質の保持力に優れていることか
ら、高信頼性を要求される電気・電子的用途に重
用され、多年の実績を積んでいる。
上記ジアリルフタレート系樹脂は、またすぐれ
た寸法安定性、耐熱性、耐水・耐湿性その他の特
性を有しているが、密着性に欠けるという欠点も
指摘されている。ジアリルフタレート系樹脂は通
常種々の補強材、充填剤等と混合して用いられる
ため、相互の密着或いは濡れが不十分な場合は、
補強効果が得難く、樹脂の性能を発揮することが
できない。さらに成形品の中には、金属部分がイ
ンサート或いは封入されたり、貼着されたりした
ものがあり、このような場合にも相互の密着性が
強く要求される。従来から樹脂の変性やブレン
ド、カツプリング剤の選択等多くの努力がなされ
てきたが、十分に満足して実用に供されたものは
未だ皆無といつてよい。
他方エポキシ樹脂は種々の好ましい特性を持つ
ているために、エンジニアリングプラスチツクと
して、また電気・電子分野の絶縁材料等として、
広く活用されていることはよく知られている。エ
ポキシ樹脂は周知のように有機酸またはその酸無
水物やアミン類、アミド類等を硬化剤として硬化
させ、不溶不融の三次元構造の硬化物とすること
ができる。硬化物に要求される性能に応じて、多
種の硬化剤の中から選択することが可能である反
面、その選択を誤つたり、使用量が適正でない場
合には、エポキシ樹脂の性能が低下してしまうこ
とが多い。また通常用いられる硬化剤では硬化速
度が遅く、上記のようにその使用量が制約を受け
ることもあつて、硬化剤量により硬化速度を調節
することも困難である。
さらにエポキシ樹脂は、耐水性・耐湿性に難点
がある。現在では樹脂自身の改質、使用法の検討
等により次第に改良されてきたとはいうものの、
根本的な解決に至つていない。しかしながら、エ
ポキシ樹脂の密着性は抜群にすぐれている。した
がつてジアリルフタレート系樹脂とエポキシ樹脂
を配合して用いる場合に、それぞれの長所を生か
し、短所を補完し合うことによつて、すぐれた材
料を提供しうると考えられる。このような例はい
くつか知られている。これらのものは、寸法安定
性、熱時剛性などの機械的特性、耐熱性、電気的
特性などに優れ、高い信頼性を要求される分野で
評価されている。しかしながらこのものは脆く、
靭性が不十分である難点があり、近年成形品の小
型化に伴つて、その成形品の内薄部分や小さな突
起部分などの割れや欠け発生の問題が大きくなつ
てきた。
本発明者らは、従来のこのような樹脂を超える
諸特性を有し、さらに改善された高い衝撃値、高
度の耐熱性を有する強靭な新規の樹脂を開発すべ
く、鋭意研究を重ねてきた。
その結果、後述のテレフタル酸ジアリルエステ
ル共重合体及びエポキシ樹脂の両者を配合したも
のが、先に述べた従来の樹脂の特性を超えてお
り、さらに改善された曲げ強さ、耐熱性及び大幅
に改善された耐衝撃性を有することを見出し、本
発明を完成したのである。
すなわち、本発明はジアリルフタレート系樹脂
とエポキシ樹脂とを配合してなり、上記ジアリル
フタレート系樹脂は下記のテレフタル酸ジアリル
エステル共重合体を1重量%以上含み、上記エポ
キシ樹脂はジアリルフタレート系樹脂及びエポキ
シ樹脂の合計量中1〜80重量%であることを特徴
とする高耐衝撃性、高耐熱性の硬化可能な樹脂組
成物である。
上記テレフタル酸ジアリルエステル共重合体と
はテレフタル酸ジアリルエステルと下式()で
表わされる芳香族炭化水素とを有機過酸化物、ア
ゾ化合物の存在下に重合して得られた共重合体を
いう。本発明においては、以下に述べるようなテ
レフタル酸ジアリルエステル共重合体が組成物の
高い衝撃値を与える改質材として特に好ましい。
即ち、次式()
但し、上式()中、R1及びR2は、それぞれ
水素原子及び低級アルキル基よりなる群から選ば
れた基を示し、n=1〜3の整数である。
で表わされるベンジル位に少なくとも1個の水素
原子を有する芳香族炭化水素と次式()
で表わされるテレフタル酸ジアリルエステルとの
共重合体であつて、
(a) 式()モノマー単位の末端に式()モノ
マー単位1個が、上記ベンジル位において式
()モノマー単位のアリル基とそのC及び/
又はCと炭素−炭素結合した構造を有する。更
に
(b) 該共重合体の式()モノマー単位のアリル
基で形成された炭素−炭素結合分子鎖部分の該
式()モノマー単位の数が3〜11個、好まし
くは3〜10個であるという構造的特徴を有する
共重合体である。
該共重合体の構造を例えば、式()化合物
としてトルエン(R1=R2=H、n=1)を用
いた場合で示すと次式()で表わされる。
上式()において、Rは未反応のアリル基
及び/又は該共重合体の他の分子鎖部分を構成
するアリル基から導かれた鎖
を表わす。このような態様の例として、例え
ば、次式()
で表わされる構造部分を挙げることができる。
又上記式()の構造部分中、式()モノマ
ー単位のアリル基で形成された炭素−炭素結合
分子鎖部分の式()モノマー単位の数は式
()に示したとおり3〜11であるが、この炭
素−炭素結合分子鎖部分は、式()に示した
頭−尾結合、即ち、次式()
のほかに、下記の式()のごとく頭−頭結合
部分を有することができる。
上記構造部分式()中の式()モノマー
単位は、2つのエステル結合を介して2つの式
()及び()の構造部分を結合させる分岐
点を構成している。
又、Rが未反応のアリル基の場合は、次式
()で表わすことができる。
上記式()構造部分は、テレフタル酸ジア
リルエステル共重合体の硬化に際して架橋点と
なる部分である。
本発明に用いるテレフタル酸ジアリルエステ
ル共重合体は、以下に挙げるような諸性質をも
つ共重合体が望ましい。
(C) ウイス(Wijs)法測定によるヨウ素価40〜
85。
(d) 25℃における真比重が1.20〜1.25
(e) 軟化範囲約50〜約120℃。
(f) 50%メチルエチルケトン溶液粘度80〜300セ
ンチポイズ(30℃)。
(g) GPC(ゲル・パーミエーシヨン・クロマトグ
ラフイー)法で測定したポリスチレン換算数平
均分子量(Mn)が4000〜10000、重量平均分
子量(Mw)が70000〜200000で、且つMnと
Mwとの比Mw/Mnで表わした分子量分布が
10〜40。
(h) ブラベンダープラストグラフで測定したブラ
ベンダー溶融粘度が250〜2600m・gで、プロ
セツシング時間が5〜65分。
本発明のテレフタル酸ジアリルエステル共重合
体を製造するにあたつては、原料モノマーである
式()の芳香族炭化水素と式()のテレフタ
ル酸ジアリルエステルとを有機過酸化物もしくは
アゾ化合物触媒の存在下に、好ましくは(a),(b)の
構造及び(c)〜(h)の諸性質をもつ共重合体を得るべ
く反応条件を設定して共重合反応を行わしめるこ
とによつて製造される。
上記式()の芳香族炭化水素のR1及びR2は、
それぞれ、水素原子及び低級アルキル基よりなる
群から選ばれるが、上記低級アルキル基としては
C1〜C5のアルキル基が例示できる。このような
式()化合物の例としては、たとえば、トルエ
ン、エチルベンゼン、n−プロピルベンゼン、イ
ソプロピルベンゼン、n−ブチルベンゼン、イソ
ブチルベンゼン、sec−ブチルベンゼン、n−ア
ミルベンゼン、sec−アミルベンゼン、イソアミ
ルベンゼン、(2−メチルブチル)−ベンゼン、o
−キシレン、m−キシレン、p−キシレン、キシ
レン異性体混合物、プソイドクメン、1,2−ジ
エチルベンゼン、1,3−ジエチルベンゼン、
1,4−ジエチルベンゼン、1,2−ジプロピル
ベンゼン、1,3−ジプロピルベンゼン、1,4
−ジプロピルベンゼン、ジイソプロピルベンゼン
類、p−シメン、1,2−ジブチルベンゼン、
1,3ジブチルベンゼン、1,4−ジブチルベン
ゼン、1,2−ジイソアミルベンゼン、1,3−
ジイソアミルベンゼン、1,4−ジイソアミルベ
ンゼン、1,2,3−トリメチルベンゼンなどを
例示することができる。
又、有機過酸化物触媒、アゾ化合物触媒の例と
しては、以下の如き化合物を例示することができ
る。
過酸化ジ−tert−ブチル、過酸化ジ−sec−ブ
チル、過酸化tert−ブチル−sec−ブチル、過酸
化ジクミル等の過酸化ジアルキル類や過酸化ジア
リール類。
過酸化ベンゾイル等の過酸化ジアロイル類や過
酸化ジアシル類。
過シユウ酸ジ−tert−ブチル、過安息香酸tert
−ブチル等の如き過カルボン酸のアルキルエステ
ル類;2,2′−アゾビスイソブチロニトリル、
2,2′−アゾビス−(2−メチルブチロニトリ
ル)、2,2′−アゾビス−(2−メチルヘプタニト
リル)、1,1′−アゾビス−(1−シクロヘキシル
カルボニトリル)、2,2′−アゾビスイソ酪酸メ
チル、4,4′−アゾビス−(4−シアノペンタン
酸)、アジドベンゼン等の如きアゾ化合物;tert
−ブチルヒドロペルオキシド、sec−ブチルヒド
ロペルオキシド、テトラリルヒドロペルオキシ
ド、クミルヒドロペルオキシド、ベンジルヒドロ
ペルオキシド、ベンズヒドリルヒドロペルオキシ
ド、デカリルヒドロペルオキシド、アセチルペル
オキシド、シクロヘキシルヒドロペルオキシド、
n−デシルヒドロペルオキシド等のヒドロペルオ
キシド類;更に、分子状酸素によつて、酸化され
やすい化合物、本発明においてはテレフタル酸ジ
アリルエステル、式()で表されるベンジル位
に少くとも1個の水素原子を有する芳香族炭化水
素或いは本発明共重合体が相当するが、これらが
予め或いは共重合反応中に空気または酸素により
酸化して過酸化物を生成させれば、本発明の共重
合反応の触媒として十分使用できる。なお、上記
テレフタル酸ジアリルエステル共重合体について
は、本出願人の先の出願に係る特願昭57−189981
号に詳細に記載している。
テレフタル酸ジアリルエステル共重合体のブレ
ンドの比率はジアリルフタレート樹脂(ジアリル
フタレートプレポリマー及びテレフタル酸ジアリ
ルエステル共重合体)の本発明で用いられるジア
リルフタレート系樹脂の合計量中、テレフタル酸
ジアリルエステル共重合体を、1重量%以上、好
ましくは5重量%以上、更に好ましくは20重量%
以上であることが組成物の耐衝撃性を改善する上
で好ましい。配合量の上限には特に制限はなく、
特に耐熱性が要求されるときは該共重合体の配合
比率を高くすればよい。又、特に、ジアリルオル
ソフタレート樹脂を使用する場合に優れた曲げ強
さを得るには、上記共重合体を2〜90重量%の範
囲にブレンドすることが好ましい。
本発明に用いられるジアリルフタレート系樹脂
とは必須成分として上記のテレフタル酸ジアリル
エステル共重合体を含み、他の成分として、ジア
リルフタレート樹脂のオルソ、イソ、テレの当該
モノマーの重合によつて得られる、通常数平均分
子量2000〜20000、溶剤可溶、加熱可融であつて、
分子内にアリル基を有する後重合可能なジアリル
フタレートプリポリマーの単独、あるいは該プリ
ポリマーと反応性モノマーやオリゴマーとの混合
物及び/又は不飽和ポリエステル及び/又はエポ
キシアクリレート樹脂等を総称していう。
上記反応性モノマー或いはオリゴマーとして
は、ジアリルオルソフタレート、ジアリルイソフ
タレート、ジアリルテレフタレート、ジアリルテ
トラクロロまたはブロモオルソ、イソ、およびテ
レフタレート、ジアリルクロレンデート、トリア
リルイソシアヌレート、トリアリルシアヌレー
ト、トリアリルトリメリテート、トリアリルホス
フエート、スチレン、α−クロルスチレン、メチ
ル(メタ)アクリレート、ブチル(メタ)アクリ
レート、エチレングリコールジ(メタ)アクリレ
ート、プロピレングリコールジ(メタ)アクリレ
ート、トリメチロールプロパントリ(メタ)アク
リレート、グリシジル(メタ)アクリレート、ア
リル(メタ)アクリレート、メチルアクリレート
アクリルアミド、ダイアセトンアクリルアミド、
N−ビニルカルバゾン、N−メチロールアクリル
アミド、メチレンビスアクリルアミド、メタクリ
ルアミド、N−tert−ブチルアクリルアミド、
2,4−または2,6−トリレンジイソシアネー
ト、マレイン酸セミエステル、フタル酸モノアリ
ルエステル、アリルグリシジルエーテル等、或い
はこれらの低分子量重合体があげられ、これらの
中から単独で、または適当に組合せて用いること
ができる。
反応性モノマー或いはオリゴマーの配合量は、
ジアリルフタレート系樹脂の100重量部当り200重
量部以下が好ましい。200重量部をこえる配合は、
硬化速度の不当な遅延、硬化収縮率の増加による
成形物の内部歪みの増大等が顕著になり好ましく
ない。
不飽和ポリエステルとしては、不飽和二塩基酸
として、たとえばマレイン酸、無水マレイン酸、
フマール酸、イタコン酸、シトラコン酸、グルタ
コン酸、メサコン酸などの一種または二種以上、
飽和二塩基酸として、たとえば、コハク酸、グル
タル酸、アジピン酸、セバシン酸、ドデカンジカ
ルボン酸などの脂肪族ジカルボン酸、フタル酸、
無水フタル酸、イソフタル酸、テレフタル酸及び
これらのハロゲン化物、テトラヒドロフタル酸、
ヘキサヒドロフタル酸などの一種または二種以上
とエチレングリコール、プロピレングリコール、
ネオペンチルグリコールのような多価アルコール
とから合成されるものを指す。各成分の選択とそ
の組合せは、プリプレグの用途に応じて決めれば
よい。たとえば、高度の寸法安定性、耐熱性等が
要求される場合には、テレフタル酸系の不飽和ポ
リエステルを用いるのが、好ましい。
エポキシアクリレート樹脂とはエポキシ樹脂と
メタアクリル酸又はアクリル酸との反応物をい
う。エポキシ樹脂としては後述のものが用いられ
る。
本発明に用いられるエポキシ樹脂としては、一
分子当り少くとも平均2個以上のエポキシ基を有
するものが望ましく、このようなエポキシ化合物
としては、エチレングリコール、グリセリン、ト
リメチロールプロパンなどの多価アルコールと、
エピハロヒドリンの反応によつて得られるエーテ
ル型エポキシ化合物、レゾルシノール、ハイドロ
キノン、カテコール、ビスフエノールA、ハロゲ
ン化ビスフエノールAなどの多価フエノールとエ
ピハロヒドリンの反応によつて得られるグリシジ
ルエーテル型エポキシ化合物、フエノールノボラ
ツク樹脂或いはクレゾールノボラツク樹脂とエピ
ハロヒドリンの反応によつて得られるノボラツク
型エポキシ化合物、脂肪族または脂環状オレフイ
ンなどをエポキシ化して得られるエポキシ化合
物、ビス(N、N−ジグリシジルアミノメチル)
ベンゼンまたはシクロヘキサン、ポリブタジエン
のエポキシ化物などが用いられる。
これらは、組成物の用途に応じて選択すればよ
いが、たとえば高度の寸法安定性、耐熱性等が要
求される場合には、ビスフエノールAとエピクロ
ルヒドリンとの反応によつて得られるビスフエノ
ール型エポキシ樹脂或いはノボラツク樹脂とエピ
クロルヒドリンとの反応によつて得られるノボラ
ツク型エポキシ樹脂が好ましい。
このエポキシ樹脂使用量は、本発明の硬化可能
な樹脂組成物の樹脂分全量を100重量%としたと
き、1〜80重量%、好ましくは3〜60重量%、さ
らに好ましくは5〜50重量%が適当であり、曲げ
特性、耐衝撃性等の機械特性、充填剤や金属との
密着性が著しく改善される。該エポキシ樹脂の使
用量が上記の範囲より少い場合は、本発明の樹脂
組成物と充填剤や金属、或いは既に硬化させた成
形体との密着性が低下するなどの欠点が生じ、該
組成物の効果的な使用範囲が狭くなる。また、使
用量が上記範囲を越えるときは、寸法安定性、耐
湿性、耐熱性、電気特性が低下し、信頼性が落ち
るなど、必須成分である本発明のジアリルフタレ
ート系樹脂の特徴を損うこととなり、本発明の目
的を達することが困難となる。
エポキシ樹脂以外のものを硬化させる硬化剤と
しては、過酸化ジ−tert−ブチル、過酸化ジクミ
ル等の過酸化ジアルキル類や過酸化ジアリール
類;メチルエチルケトンペルオキシド、シクロヘ
キサノンペルオキシドの如きケトンペルオキシ
ド;1,1−ビス(tert−ブチルペルオキシ)−
3,3,5−トリメチルシクロヘキサンの如きペ
ルオキシケタール;クメンヒドロペルオキシドの
如きヒドロペルオキシド;過酸化ラウロイル、過
酸化ベンゾイル、過酸化2,4−ジクロルベンゾ
イルの如き過酸化ジアロイルや過酸化ジアシル;
ジイソプロピルペルオキシジカルボネートの如き
ペルオキシカルボネート;tert−ブチルペルオキ
シアセテート、tert−ブチルペルオキシピバレー
ト、tert−ブチルペルオキシオクトエート、tert
−ブチルペルオキシベンゾエートの如きペルオキ
シエステルが例示でき、更に上記有機過酸化物以
外のアゾビスイソブチロニトリルの如きアゾ化合
物も同様に用いることができる。
これらの硬化剤はそれぞれ単独で、或いは二種
以上組合せて使用することができ、その使用量は
通常本発明の樹脂分100重量部当り0.1〜6重量部
である。
また重合促進剤として、たとえば、ナフテン酸
或いはオクトエ酸のコバルト塩、バナジウム塩、
マンガン塩等の金属石けん類、ジメチルアニリ
ン、ジエチルアニリンの如き芳香族第三級アミン
類などを本発明の樹脂分100重量部当り、たとえ
ば0.005〜6重量部の如き量を添加してもよい。
エポキシ樹脂を硬化させる硬化剤としては、ジ
シアンジアミドのような脂肪族ポリアミド、芳香
族アミン、有機酸の無水物を用いることができる
が、常温で反応が進行しない硬化剤が望ましい。
芳香族アミンとしては、たとえばメタフエニレ
ンジアミン、キシリレンジアミン、ジアミノジフ
エニルメタン、ジアミノジフエニルスルホン、ベ
ンジルジメチルアミンなどがあげられる。
有機酸の無水物としては、たとえば無水フタル
酸、テトラヒドロ無水フタル酸、無水マレイン
酸、クロレンド酸無水物、ピロメリツト酸無水
物、3,3′,4,4′−ベンゾフエノンテトラカル
ボン酸無水物、メチルナジツク酸無水物、ドデシ
ル無水コハク酸、無水ジクロルコハク酸、無水ヘ
キサヒドロフタル酸などがある。
また芳香族アミンと有機酸無水物との混合物ま
たは共融合変性物も使用することができるし、必
要に応じて微量の脂肪族アミンを加えてもよい。
これらの硬化剤の使用量は、エポキシ樹脂の1グ
ラム当量当り0.5〜1.5グラム当量に相当するよう
にすればよい。
本発明の樹脂組成物は、必要に応じて、たとえ
ば充填剤、難燃剤、カツプリング剤、重合禁止
剤、内部離型剤、顔料、着色剤その他の添加剤
を、該組成物の特性を損わない範囲で配合して用
いて、成形加工性あるいは成形品の物性を改善す
ることができる。
充填剤としては通常用いられる無機および/ま
たは有機質の充填剤が使用でき、これらは一種で
も複数種併用してでも利用できる。或いは該組成
物を結合剤として用いて、研削用砥石やサンドペ
ーパー類を製造する場合には、市販の各種砥粒、
研削助剤、気孔剤等と混合、成形することができ
る。
本発明の樹脂組成物は硬化が速く、また調節も
可能で、種々の成形方法が適用できるよう調節す
ることもでき、すぐれた成形性を示し、寸法安定
性がよい。その成形品は耐熱性耐衝撃性、耐水・
耐湿性、耐薬品性、密着性にすぐれ、表面硬度が
高く、経時変化が少い。したがつて機械強度、電
気特性が、特に高温・高湿時において抜群であ
り、信頼性は極めて高い。
以下、実施例により更に群しく説明する。
テレフタル酸ジアリルエステル共重合体の
製造例 1〜2
タービン翼式可変式撹拌機、モノマー及び触媒
供給用二重管式供給ノズル、チツ素パージ口、リ
ーク弁、サンプリング口、温度計及び圧力計を備
えた内径600mm、内容積120のジヤケツト付
SUS304製重合槽を使用した。モノマー及び触媒
供給用二重管式供給ノズルは重合層の胴部の液面
下に取り付け、重合槽にはいる前からは外管の内
径を1.5mmとし、供給配管中での滞留時間をでき
るだけ短くした。ノズルの閉塞に備えて、このよ
うなノズルを3個設置した。サンプリング口も重
合槽の胴部に設置し、重合反応中内圧を利用し
て、液相のサンプルが採取できるようにした。チ
ツ素パージ口には油回転式真空ポンプとチツ素ボ
ンベを接続し、必要に応じて切替えられるように
した。
上記重合槽に、後掲表1に示した式()芳香
族炭化水素(HC)の60Kgを仕込み、常温で、真
空ポンプで減圧にし、チツ素ガスで常圧に戻す操
作を3回繰返して槽内の空気をチツ素で置換した
のち、再び減圧にし、重合槽を密閉した。撹拌機
を起動して240RPMで撹拌しながら、ジヤケツト
にスチームを通じて、温度140℃に昇温した。
撹拌速度を上げて720RPMとし、二重管式ノズ
ルの外管からテレフタル酸ジアリルエステルを所
定の速度で、また同時に過酸化ジ−tert−ブチル
(DTBPO)と式()芳香族炭化水素(HC)を
モル比0.5:1となるように予め混合しておいた
ものを所定の速度で、吐出圧70Kg/cm2のポンプで
重合槽へ供給した。この間、重合槽の温度は140
℃を保つようにスチームを調節した。なお供給す
べき式()テレフタル酸ジアリルエステル
(DAT)は15℃に、過酸化ジ−tert−ブチルと芳
香族炭化水素の混合物は5℃にそれぞれ冷却し、
重合槽へ至る配管はそれぞれ保冷した。重合槽圧
力は0.3〜2Kg/cm2Gであつた。
所定量のテレフタル酸ジアリルエステル、芳香
族炭化水素、過酸化ジ−tert−ブチルの供給が終
了すれば、ステームをとめ、撹拌速度を下げて、
240RPMとし、ジヤケツトに冷却水を通して冷却
した。常温付近まで冷却したのち、リーク弁を開
けて、常圧に戻し、重合反応を終了した。
重合反応中はサンプリング口から適宜サンプル
を採取して、屈折率、及びGPCで反応を追跡し
た。
テレフタル酸ジアリルエステル、芳香族炭化水
素及び過酸化ジ−tert−ブチルの供給速度と供給
量を後掲表1に示した。
上で得られた重合反応液を、薄膜式蒸発器を用
いて、揮発分を留去し、蒸発残分中の未反応芳香
族炭化水素の、共重合体と未反応テレフタル酸ジ
アリルエステルの合計に対する比率を、重量で
0.3:1とし、次いで蒸発残分を、供給したテレ
フタル酸ジアリルエステルの、重量で5倍のメタ
ノールを仕込んだ撹拌槽に滴下しながら撹拌し、
共重合体を析出させた。析出した共重合体を同量
のメタノールでよく洗い、ろ過、乾燥、粉砕して
粉末状の共重合体を得た。
共重合体の収率及び物性を表1に示した。
【表】
上記表1において
(1) は、ゲルパーミエーシヨンクロマトグラフ法
によるポリスチレン換算測定値で、ウオーター
ズ社製「150CGPC」装置を用いた。
(2) は、ハトラー社製「PF61」光透過式自動融
点測定装置を用いた。
(3) は、ブラベンダー社(独)製のブラベンダー
プラストグラフによる測定値。
混練室容量50c.c.、ロータ型式W50H、試料50g
+ステアリン酸亜鉛0.5g、混練室温度130℃、ロ
ータ回転数22RPMで混練抵抗が5000m・gに達
するまで行い、記録紙のトルク曲線から、トルク
最低値をブラベンダー溶融粘度とし、試料投入終
了時から5000m・gまでの時間をプロセツシング
時間とした。
実施例1〜9,比較例1〜5
表2に示す各組成物をよく混合した後、ロール
練り(前ロール75〜100℃、後ロール30〜80℃、
混練時間6分)してシート状とし、これをヘンシ
エルミキサーで粉砕してコンパウンドとした。
上記コンパウンドを20〜30gとり、金型を用い
て手動プレスで直径50mm、厚さ10mmのほぼ円板状
のタブレツトをつくり、高周波予熱器で約80℃に
予熱したのち、直ちに所定の温度に調整しておい
た圧縮成形用金型のキヤビテイの中央部に置き、
自動プレスで金型温度160℃、圧力100Kg/cm2で20
分間成形し、直径約100mm、厚さ2mmの円板状成
型品を得た。該成形品について、JISK−6911に
準ずる一般試験法、JISK−7211に準ずる落錘衝
撃試験法及び耐熱試験を行い、その結果を表2に
示した。
なお、表2の成形品の物性中、落錘衝撃値及び
耐熱性は以下の方法で測定した。
落錘衝撃試験
成形品2枚から36個のテストピースをダイヤモ
ンドカツターで切り出して測定にあてた。試験機
は、デユポン式落球試験機(荷重500g、支持台
フラツト、撃芯1/2インチR)を用い、デイク
ソン・モード法により50%破壊高さを求めた(参
考:JISK−7211)。
耐熱性試験
150℃の恒温槽中に2時間放置後、デシケータ
ー中で放冷した3枚の成形品を用いて行つた。
各成形品試験片について初期重量を実測し、つ
いで、これら試験片を200±2℃に調整した恒温
槽中に適当な時間放置した後、デシケーター中で
放冷してそれぞれの重量を実測した。このとき、
3枚の試験片の重量減少の平均値が初期重量の10
%に達していない場合は、再びこれらの試験片を
200+2℃の恒温槽に適当な時間放置し、再び重
量減少を求め、3枚の試験片の重量減少の平均値
が初期重量に対して10%に達するまで繰返し、こ
の試験に要した時間で耐熱性を評価した。
【表】
【表】
実施例10,比較例6
実施例2のコンパウンドを用いて、円板状成形
品を得るに際して、外径14mm,内径6mm,厚さ
0.5mmの鉄製平ワツシヤーをコンパウンドと共に
金型キヤビテイー中に置き、実施例2と同様に成
形して、ワツシヤーを埋込んだ円板状成形品を得
た。該成形品を、+80℃で2時間、次いで−25℃
で2時間処理するのを1サイクルとする温度サイ
クル試験にかけたところ、10サイクル後も異常を
認めなかつた。
上と同様にして、比較例2のコンパウンドを用
いて得たワツシヤー埋込み成形品は、2サイクル
後ワツシヤー周囲にクラツクが生じた。
実施例11〜13,比較例7〜8
実施例2,3及び6、比較例2及び3の組成の
各樹脂混合物を用いて、下記の配合物からなる組
成物約1Kgを下記のような方法で調製した。
配合物
樹脂混合物 100重量部
ハイドロキノン 0.01 〃
メタクリロキシシラン 0.6 〃
ステアリン酸カルシウム 2 〃
ガラス短繊維 ※ 100 〃
炭酸カルシウム 40 〃
※旭フアイバーグラス社製
上記配合物中、ジクミルパーオキサイド、ジシ
アンジアミド、ハイドロキノンおよびメタクリロ
キシシランを樹脂と共にアセトン500gに溶解せ
しめた。これを容量3の擂潰機に仕込み、次い
で、予めよく混合しておいたステアリン酸カルシ
ウムと炭酸カルシウムとを入れて約5分間混合し
た後、ガラス短繊維を仕込み、更に10分間混合し
た。これを1昼夜放置して残留アセトンを揮散せ
しめたあと、ロール(前ロール100℃、後ロール
90℃)にて約10分間混練した。ロールよりシート
状に取り出したコンパウンドを直径2mmのスクリ
ーンを備えたフエザーミルにて粉砕し、グラニユ
ール状のコンパウンドとした。
得られた各コンパウンドを実施例1〜9と同様
にして成形し、物性試験を行つた結果を表3−
1,3−2に示した。
【表】
【表】
実施例14,比較例10
実施例2及び比較例2の組成の各樹脂混合物を
用いて、下記の組成からなる配合物を、ほぼ同量
のメチルエチルケトンを用いてよく混練し、溶剤
を除去後整粒して、170℃で熱プレス法により、
厚さ5mmの板状成形品を得た。
配合物
樹脂混合物 20容量部
砥粒JIS 2CWA#46 50 〃
氷晶石 30 〃
得られた成形品をJISK6911に準じて曲げ特性
を測定した結果を表4に示した。
【表】 DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a curable resin composition having particularly excellent impact resistance and heat resistance. Conventionally, diallyl phthalate resins, which are mainly composed of prepolymers derived from diallyl orthophthalate and diallyl isophthalate, are required to have high reliability because they have excellent retention of electrical properties, especially at high temperatures and high humidity. It is used extensively in electrical and electronic applications and has a proven track record over many years. Although the diallyl phthalate resin has excellent dimensional stability, heat resistance, water/moisture resistance, and other properties, it has been pointed out that it lacks adhesion. Since diallyl phthalate resin is usually mixed with various reinforcing materials, fillers, etc., if mutual adhesion or wetting is insufficient,
It is difficult to obtain a reinforcing effect, and the performance of the resin cannot be demonstrated. Furthermore, some molded products have metal parts inserted, enclosed, or adhered to each other, and even in such cases, mutual adhesion is strongly required. Many efforts have been made in the past, including modification of resins, blending, and selection of coupling agents, but it can be said that there are still no products that are fully satisfactory and have been put to practical use. On the other hand, epoxy resins have various favorable properties, so they are used as engineering plastics and insulating materials in the electrical and electronic fields.
It is well known that it is widely used. As is well known, epoxy resins can be cured using organic acids or their acid anhydrides, amines, amides, or the like as a curing agent to form a cured product with an insoluble and infusible three-dimensional structure. Although it is possible to select from a variety of curing agents depending on the performance required of the cured product, if the selection is incorrect or the amount used is inappropriate, the performance of the epoxy resin may deteriorate. I often end up. Further, the curing rate of commonly used curing agents is slow, and as mentioned above, the amount used is sometimes subject to restrictions, and it is difficult to control the curing rate by changing the amount of the curing agent. Furthermore, epoxy resins have drawbacks in water resistance and moisture resistance. Although it has been gradually improved by modifying the resin itself and considering its usage,
No fundamental solution has been reached. However, epoxy resin has excellent adhesion. Therefore, when a diallylphthalate resin and an epoxy resin are used in combination, it is thought that an excellent material can be provided by taking advantage of their respective strengths and complementing each other's weaknesses. Several such examples are known. These materials have excellent mechanical properties such as dimensional stability and thermal rigidity, heat resistance, and electrical properties, and are evaluated in fields that require high reliability. However, this item is fragile;
It has the disadvantage of insufficient toughness, and as molded products have become smaller in recent years, the problem of cracking and chipping in the thin inner parts and small protrusions of the molded products has become more serious. The inventors of the present invention have conducted extensive research in order to develop a new, tough resin that has various properties that exceed those of conventional resins, and also has improved high impact value and high heat resistance. . As a result, a compound containing both the terephthalic acid diallyl ester copolymer and the epoxy resin described below exceeds the properties of the conventional resin described above, and has further improved bending strength, heat resistance, and They discovered that it has improved impact resistance and completed the present invention. That is, the present invention is made by blending a diallyl phthalate resin and an epoxy resin, the diallyl phthalate resin contains 1% by weight or more of the following terephthalic acid diallyl ester copolymer, and the epoxy resin contains a diallyl phthalate resin and an epoxy resin. It is a curable resin composition with high impact resistance and high heat resistance, characterized in that the amount of the epoxy resin is 1 to 80% by weight based on the total amount of epoxy resin. The above terephthalic acid diallyl ester copolymer refers to a copolymer obtained by polymerizing terephthalic acid diallyl ester and an aromatic hydrocarbon represented by the following formula () in the presence of an organic peroxide and an azo compound. . In the present invention, a terephthalic acid diallyl ester copolymer as described below is particularly preferred as a modifier that imparts a high impact value to the composition.
That is, the following formula () However, in the above formula (), R 1 and R 2 each represent a group selected from the group consisting of a hydrogen atom and a lower alkyl group, and n = an integer of 1 to 3. An aromatic hydrocarbon having at least one hydrogen atom at the benzylic position represented by the following formula () A copolymer with terephthalic acid diallyl ester represented by (a) one monomer unit of formula () at the end of the monomer unit of formula (), and an allyl group of the monomer unit of formula () at the benzyl position and its C and/
Or it has a structure in which C and carbon-carbon bonds are formed. Furthermore, (b) the number of monomer units of the formula () in the carbon-carbon bond molecular chain portion formed by the allyl group of the monomer unit of the formula () of the copolymer is 3 to 11, preferably 3 to 10. It is a copolymer with certain structural characteristics. The structure of the copolymer, for example, when toluene (R 1 =R 2 =H, n=1) is used as the compound of formula (), is represented by the following formula (). In the above formula (), R is an unreacted allyl group and/or a chain derived from an allyl group constituting another molecular chain portion of the copolymer. represents. As an example of such an aspect, for example, the following formula () The structural part represented by can be mentioned.
In addition, in the structural part of the above formula (), the number of monomer units of the formula () in the carbon-carbon bond molecular chain part formed by the allyl group of the formula () monomer unit is 3 to 11 as shown in the formula (). However, this carbon-carbon bond molecular chain portion is the head-to-tail bond shown in formula (), that is, the following formula () In addition to , it can have a head-head bonding part as shown in the following formula (). The formula () monomer unit in the above structural subformula () constitutes a branching point that connects the two structural parts of formula () and () via two ester bonds. Further, when R is an unreacted allyl group, it can be represented by the following formula (). The structural portion of the above formula () is a portion that becomes a crosslinking point during curing of the terephthalic acid diallyl ester copolymer. The terephthalic acid diallyl ester copolymer used in the present invention is preferably a copolymer having the following properties. (C) Iodine value measured by Wijs method: 40~
85. (d) True specific gravity at 25°C is 1.20 to 1.25 (e) Softening range is about 50 to about 120°C. (f) 50% methyl ethyl ketone solution viscosity 80-300 centipoise (30°C). (g) The polystyrene equivalent number average molecular weight ( Mn ) measured by GPC (gel permeation chromatography) method is 4000 to 10000, the weight average molecular weight ( Mw ) is 70000 to 200000, and Mn The molecular weight distribution expressed as the ratio Mw / Mn to Mw is
10-40. (h) Brabender melt viscosity measured with a Brabender plastograph is 250 to 2600 m/g, and processing time is 5 to 65 minutes. In producing the terephthalic acid diallyl ester copolymer of the present invention, the aromatic hydrocarbon of the formula () and the terephthalic acid diallyl ester of the formula (), which are raw material monomers, are combined with an organic peroxide or an azo compound catalyst. By conducting a copolymerization reaction in the presence of a copolymer, preferably by setting reaction conditions to obtain a copolymer having the structures (a) and (b) and the properties (c) to (h). manufactured by R 1 and R 2 of the aromatic hydrocarbon in the above formula () are:
Each is selected from the group consisting of a hydrogen atom and a lower alkyl group, and the lower alkyl group is
Examples include C1 to C5 alkyl groups. Examples of such compounds of formula () include, for example, toluene, ethylbenzene, n-propylbenzene, isopropylbenzene, n-butylbenzene, isobutylbenzene, sec-butylbenzene, n-amylbenzene, sec-amylbenzene, isoamylbenzene. Benzene, (2-methylbutyl)-benzene, o
-xylene, m-xylene, p-xylene, xylene isomer mixture, pseudocumene, 1,2-diethylbenzene, 1,3-diethylbenzene,
1,4-diethylbenzene, 1,2-dipropylbenzene, 1,3-dipropylbenzene, 1,4
-dipropylbenzene, diisopropylbenzenes, p-cymene, 1,2-dibutylbenzene,
1,3 dibutylbenzene, 1,4-dibutylbenzene, 1,2-diisoamylbenzene, 1,3-
Examples include diisoamylbenzene, 1,4-diisoamylbenzene, and 1,2,3-trimethylbenzene. Further, as examples of organic peroxide catalysts and azo compound catalysts, the following compounds can be exemplified. Dialkyl peroxides and diaryl peroxides such as di-tert-butyl peroxide, di-sec-butyl peroxide, tert-butyl-sec-butyl peroxide, and dicumyl peroxide. Diaroyl peroxides and diacyl peroxides such as benzoyl peroxide. Di-tert-butyl peroxalate, tert-perbenzoate
- alkyl esters of percarboxylic acids such as butyl; 2,2'-azobisisobutyronitrile;
2,2'-azobis-(2-methylbutyronitrile), 2,2'-azobis-(2-methylheptanitrile), 1,1'-azobis-(1-cyclohexylcarbonitrile), 2,2' -Azo compounds such as methyl azobisisobutyrate, 4,4'-azobis-(4-cyanopentanoic acid), azidobenzene, etc.; tert
-butyl hydroperoxide, sec-butyl hydroperoxide, tetralyl hydroperoxide, cumyl hydroperoxide, benzyl hydroperoxide, benzhydryl hydroperoxide, decalyl hydroperoxide, acetyl peroxide, cyclohexyl hydroperoxide,
Hydroperoxides such as n-decyl hydroperoxide; Furthermore, compounds that are easily oxidized by molecular oxygen, in the present invention, terephthalic acid diallyl ester, at least one hydrogen at the benzyl position represented by the formula () This corresponds to an aromatic hydrocarbon having atoms or the copolymer of the present invention, but if these are oxidized with air or oxygen in advance or during the copolymerization reaction to produce a peroxide, the copolymerization reaction of the present invention can be performed. Can be used satisfactorily as a catalyst. Regarding the above-mentioned terephthalic acid diallyl ester copolymer, Japanese Patent Application No. 189981, filed earlier by the present applicant,
Details are given in the issue. The ratio of the blend of diallyl terephthalate copolymer is the diallyl phthalate resin (diallyl phthalate prepolymer and diallyl terephthalate copolymer) in the total amount of diallyl phthalate resin used in the present invention. The amount of coalescence is 1% by weight or more, preferably 5% by weight or more, more preferably 20% by weight.
The above is preferable in order to improve the impact resistance of the composition. There is no particular restriction on the upper limit of the amount added,
In particular, when heat resistance is required, the blending ratio of the copolymer may be increased. In particular, in order to obtain excellent bending strength when diallyl orthophthalate resin is used, it is preferable to blend the above-mentioned copolymer in a range of 2 to 90% by weight. The diallyl phthalate resin used in the present invention contains the above-mentioned terephthalic acid diallyl ester copolymer as an essential component, and is obtained by polymerizing the ortho, iso, and tele monomers of the diallyl phthalate resin as other components. , usually has a number average molecular weight of 2000 to 20000, is soluble in solvents and fusible by heating,
A general term for a post-polymerizable diallyl phthalate prepolymer having an allyl group in the molecule, or a mixture of the prepolymer and a reactive monomer or oligomer, and/or an unsaturated polyester and/or an epoxy acrylate resin. The reactive monomers or oligomers include diallyl orthophthalate, diallyl isophthalate, diallyl terephthalate, diallyltetrachloro or bromoortho, iso, and terephthalate, diallylchlorendate, triallyl isocyanurate, triallyl cyanurate, triallyl trimeryl. tate, triallyl phosphate, styrene, α-chlorostyrene, methyl (meth)acrylate, butyl (meth)acrylate, ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate , glycidyl (meth)acrylate, allyl (meth)acrylate, methyl acrylate acrylamide, diacetone acrylamide,
N-vinylcarbazone, N-methylolacrylamide, methylenebisacrylamide, methacrylamide, N-tert-butylacrylamide,
Examples include 2,4- or 2,6-tolylene diisocyanate, maleic acid semiester, phthalic acid monoallyl ester, allyl glycidyl ether, etc., or low molecular weight polymers thereof. Can be used in combination. The amount of reactive monomer or oligomer is
The amount is preferably 200 parts by weight or less per 100 parts by weight of the diallyl phthalate resin. If the composition exceeds 200 parts by weight,
This is undesirable because the curing rate is unduly delayed and the internal distortion of the molded product increases due to an increase in the curing shrinkage rate. Unsaturated polyesters include unsaturated dibasic acids such as maleic acid, maleic anhydride,
One or more types of fumaric acid, itaconic acid, citraconic acid, glutaconic acid, mesaconic acid, etc.
Saturated dibasic acids include, for example, aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, sebacic acid, dodecanedicarboxylic acid, phthalic acid,
Phthalic anhydride, isophthalic acid, terephthalic acid and their halides, tetrahydrophthalic acid,
One or more types of hexahydrophthalic acid, ethylene glycol, propylene glycol,
Refers to those synthesized from polyhydric alcohols such as neopentyl glycol. The selection of each component and the combination thereof may be determined depending on the use of the prepreg. For example, if a high degree of dimensional stability, heat resistance, etc. are required, it is preferable to use terephthalic acid-based unsaturated polyester. Epoxy acrylate resin refers to a reaction product of epoxy resin and methacrylic acid or acrylic acid. As the epoxy resin, those mentioned below are used. The epoxy resin used in the present invention preferably has an average of at least two epoxy groups per molecule, and examples of such epoxy compounds include polyhydric alcohols such as ethylene glycol, glycerin, and trimethylolpropane. ,
Ether-type epoxy compounds obtained by the reaction of epihalohydrin, glycidyl ether-type epoxy compounds obtained by the reaction of epihalohydrin with polyhydric phenols such as resorcinol, hydroquinone, catechol, bisphenol A, and halogenated bisphenol A, and phenol novo Novolac-type epoxy compounds obtained by the reaction of lacquer resin or cresol novolac resin with epihalohydrin; epoxy compounds obtained by epoxidizing aliphatic or alicyclic olefins; bis(N,N-diglycidylaminomethyl);
Benzene, cyclohexane, epoxidized polybutadiene, etc. are used. These may be selected depending on the intended use of the composition, but if, for example, a high degree of dimensional stability, heat resistance, etc. are required, a bisphenol type obtained by the reaction of bisphenol A and epichlorohydrin may be used. Preferred are epoxy resins or novolak-type epoxy resins obtained by reaction of novolak resins with epichlorohydrin. The amount of this epoxy resin used is 1 to 80% by weight, preferably 3 to 60% by weight, more preferably 5 to 50% by weight when the total resin content of the curable resin composition of the present invention is 100% by weight. is suitable, and mechanical properties such as bending properties and impact resistance, as well as adhesion to fillers and metals, are significantly improved. If the amount of the epoxy resin used is less than the above range, disadvantages such as reduced adhesion between the resin composition of the present invention and fillers, metals, or already cured molded objects may occur, and the composition may The range of effective use of objects becomes narrower. In addition, if the amount used exceeds the above range, the characteristics of the diallylphthalate resin of the present invention, which is an essential component, may be impaired, such as the dimensional stability, moisture resistance, heat resistance, and electrical properties are reduced, and reliability is reduced. This makes it difficult to achieve the objective of the present invention. Curing agents for curing materials other than epoxy resins include dialkyl peroxides and diaryl peroxides such as di-tert-butyl peroxide and dicumyl peroxide; ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; 1,1- Bis(tert-butylperoxy)-
peroxyketals such as 3,3,5-trimethylcyclohexane; hydroperoxides such as cumene hydroperoxide; diaroyl peroxides and diacyl peroxides such as lauroyl peroxide, benzoyl peroxide, and 2,4-dichlorobenzoyl peroxide;
Peroxycarbonates such as diisopropyl peroxydicarbonate; tert-butyl peroxyacetate, tert-butyl peroxy pivalate, tert-butyl peroxyoctoate, tert-butyl peroxy acetate, tert-butyl peroxy pivalate, tert-butyl peroxyoctoate
Examples include peroxy esters such as -butylperoxybenzoate, and azo compounds such as azobisisobutyronitrile other than the above-mentioned organic peroxides can also be used. These curing agents can be used alone or in combination of two or more, and the amount used is usually 0.1 to 6 parts by weight per 100 parts by weight of the resin of the present invention. In addition, as a polymerization accelerator, for example, cobalt salts, vanadium salts of naphthenic acid or octoic acid,
Metal soaps such as manganese salts, aromatic tertiary amines such as dimethylaniline and diethylaniline, etc. may be added in an amount of, for example, 0.005 to 6 parts by weight per 100 parts by weight of the resin of the present invention. As a curing agent for curing the epoxy resin, aliphatic polyamides such as dicyandiamide, aromatic amines, and organic acid anhydrides can be used, but a curing agent that does not undergo reaction at room temperature is desirable. Examples of aromatic amines include metaphenylene diamine, xylylene diamine, diaminodiphenylmethane, diaminodiphenyl sulfone, and benzyldimethylamine. Examples of organic acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, maleic anhydride, chlorendic anhydride, pyromellitic anhydride, and 3,3',4,4'-benzophenonetetracarboxylic anhydride. , methylnadic anhydride, dodecylsuccinic anhydride, dichlorosuccinic anhydride, and hexahydrophthalic anhydride. A mixture or a eutectic modified product of an aromatic amine and an organic acid anhydride may also be used, and a trace amount of aliphatic amine may be added if necessary.
The amount of these curing agents used may be 0.5 to 1.5 gram equivalent per gram equivalent of the epoxy resin. The resin composition of the present invention may contain fillers, flame retardants, coupling agents, polymerization inhibitors, internal mold release agents, pigments, colorants, and other additives, as necessary, so as not to impair the properties of the composition. It is possible to improve the molding processability or the physical properties of the molded article by mixing it within a range where it is not necessary. As the filler, commonly used inorganic and/or organic fillers can be used, and these can be used alone or in combination. Alternatively, when producing grinding wheels or sandpaper using the composition as a binder, various commercially available abrasive grains,
It can be mixed with grinding aids, pore agents, etc. and molded. The resin composition of the present invention cures quickly, is adjustable, can be adjusted to apply various molding methods, exhibits excellent moldability, and has good dimensional stability. The molded product is heat resistant, impact resistant, water resistant,
Excellent moisture resistance, chemical resistance, and adhesion, high surface hardness, and little change over time. Therefore, the mechanical strength and electrical properties are excellent, especially at high temperatures and high humidity, and the reliability is extremely high. Hereinafter, a more detailed explanation will be given based on examples. Production example of terephthalic acid diallyl ester copolymer 1-2 A turbine blade type variable stirrer, a double pipe type supply nozzle for monomer and catalyst supply, a nitrogen purge port, a leak valve, a sampling port, a thermometer and a pressure gauge. Comes with a jacket with an inner diameter of 600 mm and an inner volume of 120 mm.
A polymerization tank made of SUS304 was used. The double-tube supply nozzle for monomer and catalyst supply is installed below the liquid level in the body of the polymerization layer, and the inner diameter of the outer tube is set to 1.5 mm before entering the polymerization tank to minimize the residence time in the supply piping. I made it shorter. Three such nozzles were installed in preparation for nozzle blockage. A sampling port was also installed in the body of the polymerization tank, making it possible to take samples of the liquid phase using the internal pressure during the polymerization reaction. An oil rotary vacuum pump and a nitrogen cylinder were connected to the nitrogen purge port so that they could be switched as needed. The above polymerization tank was charged with 60 kg of aromatic hydrocarbon (HC) of the formula () shown in Table 1 below, and the process of reducing the pressure using a vacuum pump and returning to normal pressure using nitrogen gas at room temperature was repeated three times. After replacing the air inside with nitrogen, the pressure was reduced again and the polymerization tank was sealed. The stirrer was started and while stirring at 240 RPM, steam was passed through the jacket to raise the temperature to 140°C. The stirring speed was increased to 720 RPM, and terephthalic acid diallyl ester was added from the outer pipe of the double pipe nozzle at the specified speed, and at the same time, di-tert-butyl peroxide (DTBPO) and aromatic hydrocarbon (HC) of the formula () were added. were mixed in advance at a molar ratio of 0.5:1 and supplied to the polymerization tank at a predetermined rate using a pump with a discharge pressure of 70 kg/cm 2 . During this time, the temperature of the polymerization tank was 140
The steam was adjusted to maintain the temperature. The formula () diallyl terephthalate (DAT) to be supplied was cooled to 15°C, and the mixture of di-tert-butyl peroxide and aromatic hydrocarbon was cooled to 5°C.
Each pipe leading to the polymerization tank was kept cool. The polymerization tank pressure was 0.3 to 2 Kg/cm 2 G. When the supply of a predetermined amount of terephthalic acid diallyl ester, aromatic hydrocarbon, and di-tert-butyl peroxide is completed, the stem is stopped and the stirring speed is lowered.
It was set to 240 RPM and cooled by passing cooling water through the jacket. After cooling to around room temperature, the leak valve was opened to return to normal pressure, and the polymerization reaction was completed. During the polymerization reaction, samples were appropriately taken from the sampling port, and the reaction was monitored using refractive index and GPC. The feed rates and amounts of diallyl terephthalate, aromatic hydrocarbon, and di-tert-butyl peroxide are shown in Table 1 below. The volatile components of the polymerization reaction solution obtained above were distilled off using a thin film evaporator, and the total of unreacted aromatic hydrocarbons, copolymer and unreacted terephthalic acid diallyl ester in the evaporation residue was removed. the ratio by weight to
0.3:1, and then the evaporation residue was stirred while being dropped into a stirring tank containing methanol in an amount 5 times the weight of the supplied diallyl terephthalate.
A copolymer was precipitated. The precipitated copolymer was thoroughly washed with the same amount of methanol, filtered, dried, and pulverized to obtain a powdery copolymer. Table 1 shows the yield and physical properties of the copolymer. [Table] In Table 1 above, (1) is a polystyrene equivalent value measured by gel permeation chromatography using a Waters "150CGPC" device. For (2), a light transmission type automatic melting point measuring device "PF61" manufactured by Hattler was used. (3) is the value measured using the Brabender Plastograph manufactured by Brabender (Germany). Kneading chamber capacity 50c.c., rotor model W50H, sample 50g
+ Zinc stearate 0.5g, kneading chamber temperature 130℃, rotor rotation speed 22RPM until kneading resistance reaches 5000m・g. From the torque curve on the recording paper, the lowest torque value is taken as the Brabender melt viscosity, and at the end of sample addition. The processing time was defined as the time from Examples 1 to 9, Comparative Examples 1 to 5 After thoroughly mixing each composition shown in Table 2, roll kneading (front roll 75 to 100°C, rear roll 30 to 80°C,
The mixture was kneaded for 6 minutes) to form a sheet, which was pulverized using a Henschel mixer to form a compound. Take 20 to 30 g of the above compound and manually press it using a mold to make a roughly disc-shaped tablet with a diameter of 50 mm and a thickness of 10 mm. After preheating it to about 80 degrees Celsius with a high-frequency preheater, immediately adjust it to the specified temperature. Place it in the center of the cavity of the compression mold that you have prepared,
20 at a mold temperature of 160℃ and a pressure of 100Kg/ cm2 using an automatic press.
The mixture was molded for minutes to obtain a disc-shaped molded product with a diameter of about 100 mm and a thickness of 2 mm. The molded product was subjected to a general test method according to JISK-6911, a falling weight impact test method according to JISK-7211, and a heat resistance test, and the results are shown in Table 2. In addition, among the physical properties of the molded products in Table 2, the falling weight impact value and heat resistance were measured by the following methods. Falling Weight Impact Test Thirty-six test pieces were cut out from two molded products using a diamond cutter and subjected to measurement. A Dupont-type falling ball tester (load 500g, flat support, 1/2 inch R) was used as the testing machine, and the 50% fracture height was determined by the Dickson mode method (Reference: JISK-7211). Heat Resistance Test Three molded products were left in a constant temperature bath at 150°C for 2 hours and then allowed to cool in a desiccator. The initial weight of each molded product test piece was actually measured, and then these test pieces were left in a constant temperature bath adjusted to 200±2°C for an appropriate period of time, and then allowed to cool in a desiccator, and the weight of each piece was actually measured. At this time,
The average value of the weight loss of the three test pieces is 10 of the initial weight.
%, then test these specimens again.
Leave it in a constant temperature bath at 200 + 2℃ for an appropriate time, measure the weight loss again, and repeat until the average weight loss of the three test pieces reaches 10% of the initial weight. The gender was evaluated. [Table] [Table] Example 10, Comparative Example 6 When obtaining a disk-shaped molded product using the compound of Example 2, the outer diameter was 14 mm, the inner diameter was 6 mm, and the thickness was
A flat iron washer of 0.5 mm was placed in the mold cavity together with the compound, and molded in the same manner as in Example 2 to obtain a disc-shaped molded product with the washer embedded. The molded product was heated at +80°C for 2 hours and then at -25°C.
When subjected to a temperature cycle test in which one cycle was treatment for 2 hours, no abnormality was observed even after 10 cycles. In the washer-embedded molded product obtained using the compound of Comparative Example 2 in the same manner as above, cracks appeared around the washer after two cycles. Examples 11 to 13, Comparative Examples 7 to 8 Using each resin mixture having the composition of Examples 2, 3, and 6, and Comparative Examples 2 and 3, about 1 kg of a composition consisting of the following formulation was processed in the following manner. Prepared with Compound Resin mixture 100 parts by weight Hydroquinone 0.01 〃 Methacryloxysilane 0.6 〃 Calcium stearate 2 〃 Short glass fiber * 100 〃 Calcium carbonate 40 〃 * Manufactured by Asahi Fiberglass In the above formulation, dicumyl peroxide, dicyandiamide, hydroquinone and methacrylate Roxysilane and resin were dissolved in 500 g of acetone. This was charged into a crusher with a capacity of 3, and then calcium stearate and calcium carbonate, which had been thoroughly mixed in advance, were added and mixed for about 5 minutes. Short glass fibers were then added and mixed for an additional 10 minutes. After leaving this for a day and night to volatilize the residual acetone, roll (front roll 100℃, rear roll
The mixture was kneaded at 90°C for about 10 minutes. The compound taken out in sheet form from the roll was pulverized in a feather mill equipped with a screen of 2 mm in diameter to form a granule-like compound. The obtained compounds were molded in the same manner as in Examples 1 to 9, and the physical property tests were performed. The results are shown in Table 3-
1, 3-2. [Table] [Table] Example 14, Comparative Example 10 Using each resin mixture having the composition of Example 2 and Comparative Example 2, a formulation having the following composition was thoroughly kneaded using approximately the same amount of methyl ethyl ketone. After removing the solvent, the particles are sized and heated at 170℃ using a heat press method.
A plate-shaped molded product with a thickness of 5 mm was obtained. Compound Resin mixture 20 parts by volume Abrasive grains JIS 2CWA #46 50 Cryolite 30 Table 4 shows the results of measuring the bending properties of the obtained molded product according to JISK6911. 【table】
Claims (1)
を配合してなり、上記ジアリルフタレート系樹脂
は下記のテレフタル酸ジアリルエステル共重合体
を1重量%以上含み、上記エポキシ樹脂はジアリ
ルフタレート系樹脂及びエポキシ樹脂の合計量中
1〜80重量%であることを特徴とする硬化可能な
樹脂組成物。 上記テレフタル酸ジアリルエステル共重合体と
は、テレフタル酸ジアリルエステルと次式で表わ
されるベンジル位に少なくとも1個の水素原子を
有する芳香族炭化水素との共重合体であつて、テ
レフタル酸ジアリルエステル単位の数が上記芳香
族炭化水素単位1個あたり3〜11個である共重合
体をいう。 但し、上式中、R1及びR2は、それぞれ水素原
子及び低級アルキル基よりなる群から選ばれた基
を示し、n=1〜3の整数である。[Scope of Claims] 1. A diallyl phthalate resin and an epoxy resin are blended, the diallyl phthalate resin contains 1% by weight or more of the following terephthalic acid diallyl ester copolymer, and the epoxy resin is a diallyl phthalate resin. A curable resin composition characterized in that the amount thereof is 1 to 80% by weight based on the total amount of resin and epoxy resin. The above terephthalic acid diallyl ester copolymer is a copolymer of terephthalic acid diallyl ester and an aromatic hydrocarbon having at least one hydrogen atom at the benzyl position represented by the following formula, and is a copolymer of terephthalic acid diallyl ester unit. refers to a copolymer in which the number of aromatic hydrocarbon units is 3 to 11 per one aromatic hydrocarbon unit. However, in the above formula, R 1 and R 2 each represent a group selected from the group consisting of a hydrogen atom and a lower alkyl group, and n = an integer of 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6408884A JPS60208322A (en) | 1984-03-31 | 1984-03-31 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6408884A JPS60208322A (en) | 1984-03-31 | 1984-03-31 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60208322A JPS60208322A (en) | 1985-10-19 |
| JPS632285B2 true JPS632285B2 (en) | 1988-01-18 |
Family
ID=13247970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6408884A Granted JPS60208322A (en) | 1984-03-31 | 1984-03-31 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60208322A (en) |
-
1984
- 1984-03-31 JP JP6408884A patent/JPS60208322A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60208322A (en) | 1985-10-19 |
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