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JPS6327186B2 - - Google Patents
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JPS6327186B2 - - Google Patents

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Publication number
JPS6327186B2
JPS6327186B2 JP16596078A JP16596078A JPS6327186B2 JP S6327186 B2 JPS6327186 B2 JP S6327186B2 JP 16596078 A JP16596078 A JP 16596078A JP 16596078 A JP16596078 A JP 16596078A JP S6327186 B2 JPS6327186 B2 JP S6327186B2
Authority
JP
Japan
Prior art keywords
varnish
phenol
water
phenol varnish
dehydration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16596078A
Other languages
Japanese (ja)
Other versions
JPS5591668A (en
Inventor
Seishichi Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP16596078A priority Critical patent/JPS5591668A/en
Publication of JPS5591668A publication Critical patent/JPS5591668A/en
Publication of JPS6327186B2 publication Critical patent/JPS6327186B2/ja
Granted legal-status Critical Current

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  • Reinforced Plastic Materials (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明はフエノールワニスの脱水を従来より低
温で終了させるフエノール樹脂積層板の製造方法
に関するものである。 近年の積層板は印刷配線板の加工工程での反り
を小さくするために紙基材として従来のリンター
紙に代えてクラフト紙を使用している。しかし、
クラフト紙を使用すると繊維中の不純物が多くな
り、これらの不純物が電解質を多く含むため電気
特性が低下し、実用上問題であつた。そこで従来
の低温打抜加工性積層板用のワニスは桐油変成フ
エノールワニスに電気特性を向上させる水溶性フ
エノールワニスを10〜20部混合したり、あるいは
紙基材にあらかじめ水溶性フエノールワニスを含
浸、乾燥することにより10〜15%の水溶性フエノ
ールワニスを付着した紙基材を使用し、更にこの
紙基材に桐油変性フエノールワニスを含浸、乾燥
してプリプレグを得ていた。これらの方法で得ら
れる積層板は電気特性は満足できるが、水溶性ワ
ニスを使用すると可塑剤が相対的に減少するので
積層板が固くなつて打抜加工性が劣るから、打抜
加工温度を20〜40℃高くする必要があり、打抜温
度を高くすると印刷配線板の反りが大きくなつて
使用上問題があつた。そこで打抜加工性を低下さ
せずに電気特性を向上できるようにする方法が望
まれてきた。このような要求に対して本発明者は
紙基材の含水率を通常7%位のものを10〜15%に
したり、あるいはフエノールワニスに水を1〜3
%加えることによつて打抜加工性を殆んど低下す
ることなく電気特性を向上させる方法を見い出し
た。フエノールワニス中に水分が存在すると積層
板の電気特性がよくなる理由は次のように考えら
れる。フエノールワニス中に含まれる水分により
紙基材の繊維は膨張し、そのためにフエノール樹
脂が繊維の内部にまで浸透しやすくなり、紙基材
の繊維とフエノール樹脂の密着性が良くなる。フ
エノール樹脂積層板は吸水量が多くなると電気特
性が低下するが、紙基材の繊維とフエノール樹脂
との密着が良くなると、積層板の吸水量が減少
し、水分による悪影響が低減されて電気特性が良
くなるものと考えられる。以上の事実からフエノ
ールワニス中に水分が残るようにすれば良いこと
がわかるが、水分が多くなるとフエノールワニス
には溶解しなくなり、水分とフエノールワニスが
分離してしまうため実際上使用できない。フエノ
ールワニスには少量の水分であれば溶解するが、
特に桐油変成したフエノールワニスは水分が溶け
にくい。従来は水分とフエノールワニスの分離を
避けるためにフエノールワニス温度が100℃±5
℃に上昇するまで脱水し、特に桐油変成したフエ
ノールワニスは脱水を十分に行つていたが、上述
したように水分はフエノールワニス中に溶ける範
囲で多く含まれるほどよいものである。 本発明は上記の点に鑑みてなされたものであ
り、その目的とするところは生成したフエノール
ワニスの減圧脱水をフエノールワニス中に溶解限
度内の水分が残留する状態となつた時点で終了す
ることにより、フエノールワニス中に溶解限度内
で従来より多量の水分を残留させることができる
から、フエノールワニスを含浸した紙基材プリプ
レグを積層して得られる積層板の吸水率や絶縁抵
抗を向上できるようにしたフエノール樹脂積層板
の製造方法を提供するにある。 本発明を以下、詳述する。フエノールまたはク
レゾールのようなフエノール類と桐油、水及びパ
ラトルエンスルホン酸(PTSA)を配合した混合
物を反応させて桐油変性したフエノール類を生成
し、次いで桐油変性したフエノール類とホルマリ
ンをアルカリ触媒下で反応させて桐油変性したレ
ゾール型のフエノールワニスを生成する。生成し
たフエノールワニスを減圧脱水して一度低下した
フエノールワニス温度が60〜90℃に上昇するとフ
エノールワニス中に水が溶解した状態で減圧脱水
を終了し、次いで得られたフエノールワニスをメ
タノールに溶解した後、メタノールに溶解したフ
エノールワニスに水溶性フエノールワニスを混合
する。次いで水溶性フエノールワニスを混合した
フエノールワニスをクラフト紙のような紙基材に
含浸乾燥させて紙基材プリプレグを得た後、重ね
合せた複数の紙基材プリプレグを加熱加圧してフ
エノール樹脂積層板を形成する。フエノール類と
して桐油変性したフエノールを用い、生成したフ
エノールワニスを従来の最終脱水温度100〜105℃
まで減圧脱水してメタノールが30〜35重量%にな
るようにメタノールで溶解したフエノールワニス
は水を3〜10%溶解するが、この時のフエノール
ワニスのゲルタイムは10〜20分であり、水の溶解
度はゲルタイムに比例する。本発明は脱水後のフ
エノールワニスに水を加えることなく溶解限度内
の水がフエノールワニス中に残留する時点で脱水
を終了するもので、3〜10%の水をフエノールワ
ニス中に残留させた時点でフエノールワニスの減
圧脱水を終了するには、脱水中に一度低下したフ
エノールワニス温度が60〜80℃に上昇した時点で
減圧脱水を終了すればよい。なお上記の温度は脱
水時間が20〜40分の場合であり、脱水時間が異な
る場合は減圧脱水を終了する温度も変つてくるの
で、あらかじめ温度と脱水量の関係を調べておく
必要がある。またフエノール類として桐油変性し
たクレゾールを用い、生成したクレゾールワニス
を従来の最終脱水温度100〜105℃まで減圧脱水し
てメタノールが30〜35重量%になるようにメタノ
ールで溶解したクレゾールワニスは水を1〜3%
溶解し、この時のクレゾールワニスのゲルタイム
はフエノールワニスと同様に10〜20分である。1
〜3%の水をクレゾールワニス中に残留させた時
点でクレゾールワニスの減圧脱水を終了するに
は、脱水時間が20〜40分の場合脱水中に一度低下
したクレゾールワニス温度が80〜90℃に上昇した
時点で減圧脱水を終了すればよい。 本発明はフエノール類とホルマリンを反応させ
てフエノールワニスを生成し、生成したフエノー
ルワニスの減圧脱水をフエノールワニス中に溶解
限度内の水分が残留する状態となつた時点で終了
するので、フエノール類としてフエノールまたは
クレゾールを用いた場合にもフエノールワニス中
に溶解限度内の水分を残留させることができ、し
かもフエノールワニス中で水分が分離することが
ない。このように、フエノール類とホルマリンを
反応させて発生する縮合水を利用してフエノール
ワニスを調製することができるものであり、別途
工程での水による希釈など必要とならなく、一連
の生産工程によりフエノールワニスを調製でき、
生産性が高くなるものである。また脱水後の水分
を残留させたフエノールワニスを含浸した紙基材
プリプレグを積層して積層板を形成するので、フ
エノールワニス中の水分を吸収した紙基材の繊維
が膨張してフエノール樹脂が紙基材の繊維の内部
にまで浸透することができ、紙基材の繊維とフエ
ノール樹脂との密着性が向上するから、積層板の
吸水率が減少し、更に積層板は吸湿しにくくなる
から、絶縁抵抗などの電気特性が向上する。即
ち、本発明はフエノールワニスの生成の際に発生
する縮合水を利用して紙基材の繊維を膨張させ、
生産効率よく電気特性の優れたフエノール樹脂積
層板を製造しようとするものである。 本発明を以下、実施例により具体的に説明す
る。 実施例 1 フエノール130g、桐油65g、水8.5g及び
PTSA0.17gを1フラスコに仕込み、113℃〜
120℃で30分反応させた。反応終了後生成物を冷
却し、およそ50℃になつた時点で37%ホルマリン
を140gと25%アンモニア水6c.c.を加えて加熱し、
100℃で60分間反応させてフエノールワニスを生
成し、この後65cmHgに減圧して脱水した。3〜
5分で液温は55〜60℃になるが、時間がたち水の
量が減少してくると液温は徐々に上昇した。フエ
ノールワニスの温度が80℃になつた時、脱水を終
了し、メタノールを100g投入して冷却した。得
られたフエノールワニス100部に水溶性フエノー
ルワニス10部を混合した後、紙基材(HL−10)
に混合したワニスを含浸乾燥し、レジンコンテン
ト48〜50%のプリプレグを得た。このプリプレグ
8枚と35μの接着剤付き銅箔を重ねて金型内で成
型し、積層板を得た。得られた積層板の特性を表
1に示す。 実施例 2 クレゾール130g、桐油65g及びPTSA0.10g
を1フラスコに仕込み、123〜130℃で30分反応
させた。反応終了後生成物を冷却し、37%ホルマ
リンを140gと25%アンモニア水50c.c.を加えて100
℃で60分反応させた。この後生成したクレゾール
ワニスを実施例1のように脱水し、液温が90℃で
脱水を終了した後、メタノール100gを投入して
冷却した。得られたクレゾールワニス100部に水
溶性フエノールワニス10部を混合した後、混合し
たワニスを使つて実施例1と同様にして積層板を
得た。得られた積層板の特性を表1に示す。 比較例 1 実施例1と同様に行なつたが、ただフエノール
ワニスの脱水最終温度を100℃とした。脱水時間
は35分であつた。 比較例 2 実施例2とほとんど同様に行なつたが、フエノ
ールワニスの脱水最終温度を100℃とした。
The present invention relates to a method for producing a phenolic resin laminate in which dehydration of phenol varnish is completed at a lower temperature than conventionally. In recent years, laminates use kraft paper instead of conventional linter paper as the paper base material to reduce warping during the processing of printed wiring boards. but,
When kraft paper is used, the fibers contain a large amount of impurities, and since these impurities contain a large amount of electrolyte, the electrical properties deteriorate, which is a practical problem. Therefore, conventional varnishes for low-temperature punching processable laminates are made by mixing 10 to 20 parts of water-soluble phenol varnish that improves electrical properties with tung oil modified phenol varnish, or by pre-impregnating paper base material with water-soluble phenol varnish. A paper base material to which 10 to 15% water-soluble phenol varnish was attached by drying was used, and the paper base material was further impregnated with tung oil-modified phenol varnish and dried to obtain a prepreg. The laminates obtained by these methods have satisfactory electrical properties, but when water-soluble varnish is used, the plasticizer content is relatively reduced, making the laminates hard and poor in punching properties, so the punching temperature must be lowered. It was necessary to raise the punching temperature by 20 to 40°C, and when the punching temperature was increased, the warpage of the printed wiring board increased, causing problems in use. Therefore, there has been a desire for a method that can improve electrical properties without reducing punching workability. In response to such demands, the present inventors increased the water content of the paper base material from the usual 7% to 10 to 15%, or added phenol varnish with 1 to 3% water.
We have found a method for improving the electrical properties by adding % to 50% of the metal without substantially reducing the punching workability. The reason why the presence of water in the phenol varnish improves the electrical properties of the laminate is considered as follows. The water contained in the phenol varnish causes the fibers of the paper base to expand, which makes it easier for the phenol resin to penetrate into the inside of the fibers, improving the adhesion between the fibers of the paper base and the phenol resin. The electrical properties of phenolic resin laminates decrease when the amount of water absorbed increases, but as the adhesion between the fibers of the paper base and the phenolic resin improves, the amount of water absorbed by the laminate decreases, reducing the negative effects of moisture and improving the electrical properties. It is thought that this will improve. From the above facts, it can be seen that it is best to allow water to remain in the phenol varnish, but if the water content increases, it will no longer dissolve in the phenol varnish, and the water and phenol varnish will separate, making it practically unusable. A small amount of water will dissolve in phenol varnish, but
In particular, phenol varnish modified from tung oil is difficult to dissolve in water. Conventionally, the phenol varnish temperature was set at 100℃±5 to avoid separation of water and phenol varnish.
Phenol varnish that has been dehydrated until the temperature rises to a temperature of 0.degree. C., especially phenol varnish modified with tung oil, has been sufficiently dehydrated, but as mentioned above, the more water that can be contained in the phenol varnish, the better. The present invention has been made in view of the above points, and its purpose is to terminate the vacuum dehydration of the produced phenol varnish when water within the solubility limit remains in the phenol varnish. This allows a larger amount of water to remain in the phenol varnish within the solubility limit than before, which can improve the water absorption rate and insulation resistance of the laminate obtained by laminating paper base prepreg impregnated with phenol varnish. The present invention provides a method for producing a phenolic resin laminate. The present invention will be explained in detail below. Tung oil modified phenols are produced by reacting a mixture of phenol or phenols such as cresol with tung oil, water and para-toluene sulfonic acid (PTSA), and then the tung oil modified phenols and formalin are reacted under an alkali catalyst. The reaction produces a resol-type phenol varnish modified with tung oil. The generated phenol varnish was dehydrated under reduced pressure, and once the temperature of the phenol varnish rose to 60 to 90°C, the vacuum dehydration was completed with water dissolved in the phenol varnish, and then the obtained phenol varnish was dissolved in methanol. Afterwards, a water-soluble phenol varnish is mixed with the phenol varnish dissolved in methanol. Next, a paper base material such as kraft paper is impregnated with a phenol varnish mixed with a water-soluble phenol varnish and dried to obtain a paper base prepreg, and then a plurality of stacked paper base prepregs are heated and pressurized to form a phenol resin laminate. Form a board. Using phenol modified with tung oil as the phenol, the resulting phenol varnish is heated to the conventional final dehydration temperature of 100 to 105℃.
Phenol varnish that has been dehydrated under reduced pressure and dissolved in methanol so that the methanol content is 30 to 35% by weight dissolves 3 to 10% water, but the gel time of phenol varnish at this time is 10 to 20 minutes, and the water Solubility is proportional to gel time. In the present invention, dehydration is completed when water within the solubility limit remains in the phenol varnish without adding water to the phenol varnish after dehydration, and when 3 to 10% of water remains in the phenol varnish. In order to terminate the vacuum dehydration of the phenol varnish, the vacuum dehydration may be completed when the temperature of the phenol varnish, which once decreased during dehydration, rises to 60 to 80°C. Note that the above temperatures are for a dehydration time of 20 to 40 minutes, and if the dehydration time is different, the temperature at which vacuum dehydration ends will also change, so it is necessary to investigate the relationship between temperature and amount of dehydration in advance. In addition, cresol varnish modified with tung oil is used as the phenol, and the cresol varnish produced is dehydrated under reduced pressure to the conventional final dehydration temperature of 100 to 105°C, and the cresol varnish is dissolved in methanol to make the methanol content 30 to 35% by weight. 1-3%
When dissolved, the gel time of cresol varnish is 10 to 20 minutes, similar to phenol varnish. 1
To finish the vacuum dehydration of the cresol varnish when ~3% of water remains in the cresol varnish, if the dehydration time is 20 to 40 minutes, the temperature of the cresol varnish, which once decreased during dehydration, must drop to 80 to 90℃. When the temperature rises, the vacuum dehydration may be completed. In the present invention, phenols and formalin are reacted to produce phenol varnish, and the vacuum dehydration of the produced phenol varnish is completed when water within the solubility limit remains in the phenol varnish. Even when phenol or cresol is used, water within the solubility limit can remain in the phenol varnish, and the water does not separate in the phenol varnish. In this way, phenol varnish can be prepared using the condensed water generated by reacting phenols and formalin, and there is no need for dilution with water in a separate process, and it can be prepared through a series of production processes. Phenol varnish can be prepared,
This increases productivity. In addition, since a laminate is formed by laminating paper base prepreg impregnated with phenol varnish that retains moisture after dehydration, the fibers of the paper base material that have absorbed the moisture in the phenol varnish expand and the phenol resin is transferred to the paper. It can penetrate deep into the fibers of the base material, improving the adhesion between the fibers of the paper base material and the phenolic resin, reducing the water absorption rate of the laminate, and making it difficult for the laminate to absorb moisture. Electrical properties such as insulation resistance are improved. That is, the present invention uses condensed water generated during the production of phenol varnish to expand the fibers of the paper base material,
The aim is to manufacture a phenolic resin laminate with good production efficiency and excellent electrical properties. The present invention will be specifically explained below using examples. Example 1 130g of phenol, 65g of tung oil, 8.5g of water and
Add 0.17g of PTSA to 1 flask and heat to 113℃~
The reaction was carried out at 120°C for 30 minutes. After the reaction was completed, the product was cooled, and when the temperature reached approximately 50°C, 140 g of 37% formalin and 6 c.c. of 25% aqueous ammonia were added and heated.
A phenol varnish was produced by reacting at 100° C. for 60 minutes, and then dehydrated by reducing the pressure to 65 cmHg. 3~
The liquid temperature reached 55-60°C in 5 minutes, but as time passed and the amount of water decreased, the liquid temperature gradually rose. When the temperature of the phenol varnish reached 80°C, dehydration was completed, and 100 g of methanol was added to cool it. After mixing 10 parts of water-soluble phenol varnish with 100 parts of the obtained phenol varnish, paper base material (HL-10) was prepared.
The mixture was impregnated with varnish and dried to obtain a prepreg with a resin content of 48-50%. Eight sheets of this prepreg and 35 μm adhesive-coated copper foil were layered and molded in a mold to obtain a laminate. Table 1 shows the properties of the obtained laminate. Example 2 Cresol 130g, tung oil 65g and PTSA 0.10g
was charged into one flask and reacted at 123 to 130°C for 30 minutes. After the reaction is complete, cool the product, add 140 g of 37% formalin and 50 c.c. of 25% aqueous ammonia, and add 100 g of 37% formalin and 50 c.c.
The reaction was carried out at ℃ for 60 minutes. The cresol varnish thus produced was dehydrated as in Example 1, and after the dehydration was completed at a liquid temperature of 90° C., 100 g of methanol was added and cooled. After mixing 10 parts of the obtained cresol varnish with 10 parts of water-soluble phenol varnish, a laminate was obtained in the same manner as in Example 1 using the mixed varnish. Table 1 shows the properties of the obtained laminate. Comparative Example 1 The same procedure as in Example 1 was carried out, except that the final temperature for dehydration of the phenol varnish was 100°C. The dehydration time was 35 minutes. Comparative Example 2 The procedure was carried out in almost the same manner as in Example 2, except that the final temperature for dehydration of the phenol varnish was 100°C.

【表】 表1から明らかなように本発明になる実施例1
乃至実施例2で得られた積層板は比較例より吸水
率が小さく、絶縁抵抗も向上した。
[Table] As is clear from Table 1, Example 1 of the present invention
The laminates obtained in Example 2 had lower water absorption and improved insulation resistance than those of Comparative Examples.

Claims (1)

【特許請求の範囲】[Claims] 1 フエノール類とホルマリンを反応させてフエ
ノールワニスを生成し、生成したフエノールワニ
スの減圧脱水を、フエノールワニス中に溶解限度
内の水分が残留する状態となつた時点で終了し、
この水分を残留させたフエノールワニスを紙基材
に含浸させ、次いでこのフエノールワニスを含浸
させた紙基材プリプレグを積層することを特徴と
するフエノール樹脂積層板の製造方法。
1. Generate phenol varnish by reacting phenols and formalin, and terminate vacuum dehydration of the generated phenol varnish when water within the solubility limit remains in the phenol varnish,
A method for manufacturing a phenolic resin laminate, comprising impregnating a paper base material with the phenol varnish in which water remains, and then laminating a paper base prepreg impregnated with the phenol varnish.
JP16596078A 1978-12-29 1978-12-29 Method of making phenollresinnlaminated board Granted JPS5591668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16596078A JPS5591668A (en) 1978-12-29 1978-12-29 Method of making phenollresinnlaminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16596078A JPS5591668A (en) 1978-12-29 1978-12-29 Method of making phenollresinnlaminated board

Publications (2)

Publication Number Publication Date
JPS5591668A JPS5591668A (en) 1980-07-11
JPS6327186B2 true JPS6327186B2 (en) 1988-06-02

Family

ID=15822279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16596078A Granted JPS5591668A (en) 1978-12-29 1978-12-29 Method of making phenollresinnlaminated board

Country Status (1)

Country Link
JP (1) JPS5591668A (en)

Also Published As

Publication number Publication date
JPS5591668A (en) 1980-07-11

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