JPH0686563B2 - Laminated phenol resin varnish - Google Patents
Laminated phenol resin varnishInfo
- Publication number
- JPH0686563B2 JPH0686563B2 JP60291932A JP29193285A JPH0686563B2 JP H0686563 B2 JPH0686563 B2 JP H0686563B2 JP 60291932 A JP60291932 A JP 60291932A JP 29193285 A JP29193285 A JP 29193285A JP H0686563 B2 JPH0686563 B2 JP H0686563B2
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- varnish
- solvent
- resin varnish
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000005011 phenolic resin Substances 0.000 title claims description 40
- 239000002966 varnish Substances 0.000 title claims description 26
- 150000002989 phenols Chemical class 0.000 title description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- 239000008096 xylene Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920003987 resole Polymers 0.000 claims description 5
- 125000003158 alcohol group Chemical group 0.000 claims 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- 238000005470 impregnation Methods 0.000 description 7
- 239000000123 paper Substances 0.000 description 6
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 240000002834 Paulownia tomentosa Species 0.000 description 3
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- 239000002383 tung oil Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- -1 that is Substances 0.000 description 2
- 235000019492 Cashew oil Nutrition 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229940059459 cashew oil Drugs 0.000 description 1
- 239000010467 cashew oil Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、クラフト紙、リンター紙、これらの混抄紙等
のセルローズ系積層板用基材への含浸性のすぐれたフェ
ノール樹脂ワニスに関するものである。Description: TECHNICAL FIELD The present invention relates to a phenol resin varnish having excellent impregnability into a base material for a cellulosic laminate such as kraft paper, linter paper, and mixed paper thereof. is there.
[従来技術] 一般に積層板用フェノール樹脂は変性材、即ちシュー油
またはそれらの精製品、桐油、アマニ油、ヒマシ油、ノ
ニルフェノール、アニリン、ポリブタジエン等とフェノ
ール、クレゾール等のフェノール類をパラトルエンスル
ホン酸等の酸性触媒下で反応させ、中和後ホルムアルデ
ヒド及び塩基性触媒を添加してレゾール化反応を行い、
変性フェノール樹脂を得た後減圧下にて脱水濃縮し、メ
タノール、エタノール、トルエン等の溶剤で希釈し含浸
用ワニスとしている。[Prior Art] Generally, a phenolic resin for laminated boards is a modified material, that is, a shoe oil or a refined product thereof, tung oil, linseed oil, castor oil, nonylphenol, aniline, polybutadiene and the like and phenols such as cresol and paratoluenesulfonic acid. React under acidic catalyst such as, and after neutralization add formaldehyde and basic catalyst to perform the resolization reaction,
After obtaining the modified phenolic resin, it is dehydrated and concentrated under reduced pressure and diluted with a solvent such as methanol, ethanol or toluene to obtain a varnish for impregnation.
次に、このワニスをクラフト紙、リンター紙、これらの
混抄紙等のセルローズ系積層板基材に含浸し乾燥して積
層板用プリプレグを得ている。Next, this varnish is impregnated into a cellulosic laminate base material such as kraft paper, linter paper, or a mixed paper of these papers and dried to obtain a prepreg for a laminate.
ところが、従来のワニスは積層板用基材への樹脂分の含
浸性が悪く、得られた積層板は煮沸後の絶縁抵抗、誘導
率、誘電正接等の電気性能や吸水率が低下し、実用に供
し得ないものであった。However, the conventional varnish has a poor impregnating property of the resin component into the laminate base material, and the obtained laminate has poor electrical performance such as insulation resistance, inductivity, dielectric loss tangent and the like after boiling, and is practically used. It could not be used for.
この対策として、低分子量の水溶性フェノール樹脂やメ
ラミン樹脂等による1次含浸処理の後、前記の如きフェ
ノール樹脂ワニスによる2次含浸処理を行い、積層板用
プリプレグとする方法が一般的に行われているが、1次
含浸する樹脂が硬く積層板の打抜性に問題があり、また
2回含浸処理するので生産性にも問題がある。As a countermeasure for this, a method of making a prepreg for a laminated plate is generally carried out by performing a primary impregnation treatment with a low molecular weight water-soluble phenolic resin or a melamine resin, and then a secondary impregnation treatment with a phenolic resin varnish as described above. However, the resin to be impregnated first is hard and there is a problem in the punchability of the laminated plate, and since it is impregnated twice, there is also a problem in productivity.
従来のワニスを使用し、1回の含浸のみで含浸処理時間
を長くすることが試られたが、含浸速度が大幅に低下
し、生産性を低下させる欠点がある。It has been attempted to use a conventional varnish and prolong the impregnation treatment time by only one impregnation, but there is a drawback in that the impregnation rate is significantly reduced and the productivity is reduced.
[発明の目的] 本発明は、1回の含浸処理のみで基材へ十分に含浸する
含浸性のよいフェノール樹脂ワニスを提供することを目
的とする。[Object of the Invention] An object of the present invention is to provide a phenol resin varnish having a good impregnating property, which can sufficiently impregnate a substrate with only one impregnation treatment.
[発明の構成] 本発明は、積層板用フェノール樹脂ワニスにおいて、フ
ェノール樹脂がレゾール型フェノール樹脂であり、ワニ
ス中の樹脂分が45〜75重量%、溶剤が25〜55重量%であ
り、かつ溶剤は、C1〜C3のアルコール20〜80重量%、ト
ルエン又はキシレン 10〜70重量%、水5〜40重量%か
らなることを特徴とする積層板用フェノール樹脂ワニス
を要旨とするものである。[Structure of the Invention] The present invention relates to a phenol resin varnish for a laminate, wherein the phenol resin is a resol type phenol resin, the resin content in the varnish is 45 to 75% by weight, and the solvent is 25 to 55% by weight, and The solvent is a gist of a phenol resin varnish for a laminated board, which is characterized by comprising 20 to 80% by weight of a C 1 to C 3 alcohol, 10 to 70% by weight of toluene or xylene, and 5 to 40% by weight of water. is there.
ここで、レゾール型フェノール樹脂は、変性剤、即ちカ
シュー油またはそれらの精製品、桐油、アマニ油、ヒマ
シ油、ノニルフェノール、アニリン、ポリブタジエン等
とフェノール、クレゾール等のフェノール類をパラトル
エンスルホン酸等の酸性触媒下で反応させ、中和後ホル
ムアルデヒド及び塩基性触媒を添加してレゾール化反応
を行い、変性フェノール樹脂を得た後減圧下にて脱水濃
縮して得られるものである。Here, the resol type phenol resin is a modifier, that is, cashew oil or a refined product thereof, tung oil, linseed oil, castor oil, nonylphenol, aniline, polybutadiene and the like and phenols such as cresol and paratoluenesulfonic acid and the like. It is obtained by reacting under an acidic catalyst, neutralizing, adding formaldehyde and a basic catalyst to carry out a resolization reaction, obtaining a modified phenol resin, and then dehydrating and concentrating under reduced pressure.
本発明においてはフェノール樹脂として、桐油変性レゾ
ール型フェノール樹脂を使用するのが好ましい。In the present invention, it is preferable to use a tung oil-modified resol type phenol resin as the phenol resin.
このフェノール樹脂を前記溶剤にて希釈する。溶剤のう
ち、C1〜C3のアルコール(以下、低級アルコールとい
う)とは炭素数1〜3の脂肪族のモノアルコールをい
い、メタノール、エタノール、1-プロパノール、2-プロ
パノールであるが、特にメタノール、1-プロパノールが
好ましい。The phenol resin is diluted with the solvent. Among the solvents, C 1 to C 3 alcohols (hereinafter referred to as lower alcohols) refer to aliphatic monoalcohols having 1 to 3 carbon atoms, such as methanol, ethanol, 1-propanol, and 2-propanol. Methanol and 1-propanol are preferable.
本発明の主たる特徴は、低級アルコールとトルエン又は
キシレンとともに水を使用することである。The main feature of the present invention is the use of water with a lower alcohol and toluene or xylene.
ワニス中の上記溶剤とフェノール樹脂との割合は、溶剤
25〜55重量%(以下、%という)に対してフェノール樹
脂45〜75%である。The ratio of the above solvent and phenolic resin in the varnish is the solvent
It is 45 to 75% by weight of phenol resin to 25 to 55% by weight (hereinafter referred to as "%").
溶剤中の低級アルコールとトルエン又はキシレンと水の
割合は、低級アルコール20〜80%、トルエン又はキシレ
ン10〜70%、水5〜40%であるが、低級アルコール30〜
60%、トルエン又はキシレン20〜60%、水10〜30%が好
ましい。The ratio of lower alcohol to toluene or xylene to water in the solvent is lower alcohol 20 to 80%, toluene or xylene 10 to 70%, and water 5 to 40%, but lower alcohol 30 to
60%, toluene or xylene 20-60%, and water 10-30% are preferred.
フェノール樹脂が桐油変性レゾール型フェノール樹脂の
場合は、特にメタノール/トルエン=2/1〜1/2好まし
い。When the phenol resin is a tung oil-modified resol type phenol resin, methanol / toluene = 2/1 to 1/2 is particularly preferable.
即ち、本発明は溶剤として低級アルコールの他にトルエ
ン又はキシレンを加えることにより、水の割合をより多
くすることが可能となり、これによりセルロース系積層
板用基材へのレゾール型フェノール樹脂の含浸性が向上
する。That is, the present invention makes it possible to increase the proportion of water by adding toluene or xylene as a solvent in addition to a lower alcohol, and thus the impregnability of the resol-type phenol resin into the cellulose-based laminate substrate. Is improved.
なお、水に関して、最終ワニス中に存在する水の一部又
は全部を、フェノール樹脂製造後脱水する際樹脂中に残
存させる場合も本発明に含まれるものである。Regarding water, a case where a part or all of the water present in the final varnish is left in the resin during dehydration after production of the phenol resin is also included in the present invention.
また、かかる溶剤にアセトン、ブタノール等の他の溶剤
を10%以下加える場合も本発明に含まれるものである。The present invention also includes the case where 10% or less of another solvent such as acetone or butanol is added to such a solvent.
[発明の効果] 本発明のフェノール樹脂ワニスは積層板用基材への含浸
性がすぐれているので、このワニスを用いて得られた積
層板の特性、特に煮沸後の絶縁抵抗等の電気特性、打抜
性、吸水率がすぐれたものとなる。[Effects of the Invention] The phenol resin varnish of the present invention has excellent impregnating ability to the substrate for laminates, and therefore the properties of the laminate obtained using this varnish, particularly the electrical properties such as insulation resistance after boiling. It has excellent punchability and water absorption.
更には、従来のワニスのように2回含浸の必要がなくな
る。Furthermore, it is not necessary to impregnate twice, unlike the conventional varnish.
[実施例] フェノール樹脂ワニスの製造例 桐油40部(重量部、以下同じ)、フェノール60部、パラ
トルエンスルホン酸0.5部を反応釜に仕込み、100℃にて
2時間反応させ、アンモニア0.6部にて中和した。[Example] Production Example of Phenol Resin Varnish 40 parts of tung oil (parts by weight, the same applies hereinafter), 60 parts of phenol and 0.5 part of paratoluenesulfonic acid were charged in a reaction kettle and reacted at 100 ° C for 2 hours to give 0.6 part of ammonia. Neutralized.
次いで、37%ホルマリン40部、トリエチルアミン6部を
添加し、100℃にて3時間反応させた。その後500mmHgに
て減圧脱水を行い、桐油変性フェノール樹脂(以下、フ
ェノール樹脂Aという)を得た。Then, 40 parts of 37% formalin and 6 parts of triethylamine were added and reacted at 100 ° C. for 3 hours. Then, dehydration under reduced pressure was performed at 500 mmHg to obtain a tung oil-modified phenol resin (hereinafter referred to as phenol resin A).
実施例1 フェノール樹脂A100部をメタノール:トルエン:水=4:
4:2の混合溶剤100部にて希釈してフェノール樹脂ワニス
を得た。Example 1 100 parts of Phenol Resin A is methanol: toluene: water = 4:
A phenol resin varnish was obtained by diluting with 100 parts of a 4: 2 mixed solvent.
実施例2 フェノール樹脂A100部を1-プロパノール:キシレン:水
=8:1:1の混合溶剤100部にて希釈してフェノール樹脂ワ
ニスを得た。Example 2 100 parts of phenol resin A was diluted with 100 parts of a mixed solvent of 1-propanol: xylene: water = 8: 1: 1 to obtain a phenol resin varnish.
比較例1 フェノール樹脂A100部をメタノール100部にて希釈して
フェノール樹脂ワニスを得た。Comparative Example 1 100 parts of phenol resin A was diluted with 100 parts of methanol to obtain a phenol resin varnish.
比較例2 フェノール樹脂A100部をメタノール:水=8:2の混合溶
剤100部にて希釈してフェノール樹脂ワニスを得た。Comparative Example 2 100 parts of phenol resin A was diluted with 100 parts of a mixed solvent of methanol: water = 8: 2 to obtain a phenol resin varnish.
各例で得られたフェノール樹脂ワニスの樹脂分及び溶剤
成分比は第1表とおりであった。The resin content and solvent component ratio of the phenol resin varnish obtained in each example are shown in Table 1.
各フェノール樹脂ワニスをクラフト紙に含浸乾燥した。 Kraft paper was impregnated with each phenol resin varnish and dried.
このフェノール樹脂含浸紙を8枚重ね合わせて170℃、1
40Kg/cm2にて100分間加熱加圧してフェノール樹脂積層
板を得た。Eight sheets of this phenol resin-impregnated paper are piled up at 170 ℃, 1
A phenol resin laminate was obtained by heating and pressurizing at 40 kg / cm 2 for 100 minutes.
得られた積層板について、第2表に示す特性を測定し
た。The properties shown in Table 2 were measured for the obtained laminate.
各特性の測定方法は次のとおりである。 The measuring method of each characteristic is as follows.
煮沸後の絶縁抵抗及び誘電率、吸水率:JIS K 6911によ
る。Insulation resistance, dielectric constant and water absorption after boiling: according to JIS K 6911.
打抜加工性:パンチング金型で、60℃にて200個の穴を
同時にパンチングし、穴周辺の層間剥離数をみる。Punching workability: Using a punching die, punch 200 holes at 60 ° C at the same time and check the number of delaminations around the holes.
以上のように、実施例の積層板は比較例のものに比べ、
煮沸後の絶縁抵抗、誘電率、打抜加工性及び吸水率にお
いてすぐれたものであることがわがる。As described above, the laminated plate of the example is
It can be seen that it is excellent in insulation resistance, dielectric constant, punching workability and water absorption after boiling.
Claims (1)
フェノール樹脂がレゾール型フェノール樹脂であり、ワ
ニス中の樹脂分が45〜75重量%、溶剤が25〜55重量%で
あり、溶剤は、 C1〜C3のアルコール 20〜80重量% トルエン又はキシレン 10〜70重量% 水 5〜40重量% からなることを特徴とする積層板用フェノール樹脂ワニ
ス。1. A phenolic resin varnish for a laminate, comprising:
Phenolic resin is a resole phenolic resin, the resin content in the varnish is 45 to 75 wt%, the solvent is 25 to 55 wt%, the solvent is an alcohol 20 to 80 wt% toluene or xylene C 1 -C 3 10-70% by weight Water 5-40% by weight Phenolic resin varnish for laminated boards, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60291932A JPH0686563B2 (en) | 1985-12-26 | 1985-12-26 | Laminated phenol resin varnish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60291932A JPH0686563B2 (en) | 1985-12-26 | 1985-12-26 | Laminated phenol resin varnish |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62151472A JPS62151472A (en) | 1987-07-06 |
| JPH0686563B2 true JPH0686563B2 (en) | 1994-11-02 |
Family
ID=17775330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60291932A Expired - Fee Related JPH0686563B2 (en) | 1985-12-26 | 1985-12-26 | Laminated phenol resin varnish |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0686563B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107953A (en) * | 1978-02-13 | 1979-08-24 | Matsushita Electric Works Ltd | Molding phenolic resin material |
| JPS6096643A (en) * | 1983-10-31 | 1985-05-30 | Matsushita Electric Works Ltd | Improvement of storage stability of phenolic resin |
-
1985
- 1985-12-26 JP JP60291932A patent/JPH0686563B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62151472A (en) | 1987-07-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |