JPS6328871B2 - - Google Patents
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- Publication number
- JPS6328871B2 JPS6328871B2 JP55096829A JP9682980A JPS6328871B2 JP S6328871 B2 JPS6328871 B2 JP S6328871B2 JP 55096829 A JP55096829 A JP 55096829A JP 9682980 A JP9682980 A JP 9682980A JP S6328871 B2 JPS6328871 B2 JP S6328871B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- aluminum phosphate
- sintering
- sintered body
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Ceramic Products (AREA)
Description
【発明の詳細な説明】
本発明は炭化珪素セラミツクス質高電気伝導材
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a highly electrically conductive silicon carbide ceramic material.
高密度炭化珪素セラミツクスは高い硬度、高い
高温強度を有する材料として知られ高温構造材料
への応用など有用なエンジニアリングセラミツク
スとして各種の用途への開発が進められている。 High-density silicon carbide ceramics are known as materials with high hardness and high high-temperature strength, and are being developed for various uses as useful engineering ceramics, including applications in high-temperature structural materials.
よく知られているように炭化珪素は共有結合性
の強い化合物であり、それ自体では非常に焼結し
にくい。そこで高密度の焼結体を得るためには何
らかの焼結助剤が必要である。ホツトブレス焼結
あるいは常圧焼結の場合の焼結助剤として知られ
ているのはホウ素、炭化ホウ素、アルミニウム、
酸化アルミニウムなどである。これらの焼結助剤
を用いることにより高密度で高強度を有する炭化
珪素セラミツクスを作ることができる。しかし、
これらの焼結助剤を用いた焼結体には実用化する
上で特性面にまだ問題がある。この問題の一つは
焼結体の加工の困難さである。高密度炭化珪素セ
ラミツクスには従来の金属部品に置き変えて使用
したいという用途が多いため普通高い寸法精度が
要求される。そこで焼結したままで製品となるこ
とは少ない。このため焼結体の加工が必要になる
がタービン翼などのような複雑形状の場合には一
般の機械加工も困難となる。この場合、炭化珪素
焼結体の電気伝導度が高ければ放電加工あるいは
電解研磨などの電気的加工法が可能となる。しか
し上記の焼結助剤を用いた焼結体の電気伝導度は
これらの加工ができる程高くない。 As is well known, silicon carbide is a compound with strong covalent bonds and is very difficult to sinter by itself. Therefore, in order to obtain a high-density sintered body, some kind of sintering aid is required. Known sintering aids for hot breath sintering or pressureless sintering include boron, boron carbide, aluminum,
Aluminum oxide, etc. By using these sintering aids, silicon carbide ceramics with high density and high strength can be produced. but,
Sintered bodies using these sintering aids still have problems in terms of characteristics for practical use. One of the problems is the difficulty in processing sintered bodies. High-density silicon carbide ceramics are often used to replace conventional metal parts, so high dimensional accuracy is usually required. It is rare that the sintered material is turned into a product. For this reason, machining of the sintered body is necessary, but in the case of complex shapes such as turbine blades, general machining becomes difficult. In this case, if the electrical conductivity of the silicon carbide sintered body is high, electrical machining methods such as electrical discharge machining or electrolytic polishing become possible. However, the electrical conductivity of the sintered body using the above-mentioned sintering aid is not high enough to enable these processes.
本発明者等は真に実用に耐える高密度炭化珪素
セラミツクスを作り出すことを検討する過程で本
発明に到達したものであつて、本発明は、リン酸
アルミニウム0.5〜30重量%、残部炭化珪素から
なる混合物を焼結して得られた高密度を有する電
気的加工用炭化珪素セラミツクス質高電気伝導材
を要旨とするものである。 The present inventors arrived at the present invention in the process of studying the creation of high-density silicon carbide ceramics that can truly withstand practical use. The gist of this invention is to provide a highly electrically conductive silicon carbide ceramic material for electrical processing, which has a high density and is obtained by sintering a mixture of the following.
本発明により得られた炭化珪素セラミツクス質
高電気伝導材は放電加工、電解研磨が可能であ
り、また低電気抵抗が要求される種々の用途に適
している。 The silicon carbide ceramic highly electrically conductive material obtained according to the present invention can be subjected to electrical discharge machining and electrolytic polishing, and is suitable for various uses requiring low electrical resistance.
本発明においてリン酸アルミニウムはホツトプ
レス焼結の場合には勿論、常圧焼結の場合にも焼
結助剤として働き炭化珪素を緻密化させ、また同
時に焼結体に電気伝導性を付与することがわかつ
た。 In the present invention, aluminum phosphate acts as a sintering aid not only in hot press sintering but also in pressureless sintering to densify silicon carbide and at the same time impart electrical conductivity to the sintered body. I understood.
このリン酸アルミニウム添加の効果が生じる理
由についてはいまだ充分解明されていない。 The reason why this effect of adding aluminum phosphate occurs has not yet been fully elucidated.
しかし、この場合に使用される1900〜2300℃の
焼結温度においてはリン酸アルミニウムは炭化珪
素と反応、分解し生成したリン及びアルミニウム
あるいはそれらの化合物は炭化珪素に固溶すると
ともに粒界に存在し焼結が進み緻密化すると考え
られる。また、電気抵抗が小さくなる理由として
はリンが炭化珪素の炭素と置換固溶し、電子供与
体として働くためと考えられる。 However, at the sintering temperature of 1,900 to 2,300°C used in this case, aluminum phosphate reacts with silicon carbide and decomposes, resulting in phosphorus and aluminum or their compounds being solidly dissolved in silicon carbide and existing at grain boundaries. It is thought that sintering progresses and becomes denser. Further, the reason why the electrical resistance becomes smaller is thought to be that phosphorus forms a solid solution by substitution with carbon in silicon carbide and acts as an electron donor.
本発明者の実験によれば最初炭化珪素粉末に配
合する場合には必ずしもリン酸アルミニウム
(AlPO4)の形でなくともよく、酸性リン酸アル
ミニウム等の加熱により容易にリン酸アルミニウ
ムに変化する形態のものでもよいことが確認され
ている。要するに、原料として配合する形態はど
うであれ加熱途中でリン酸アルミニウムが生成さ
れておればよい。 According to the inventor's experiments, when initially blended into silicon carbide powder, it does not necessarily have to be in the form of aluminum phosphate (AlPO 4 ), but in a form that easily changes to aluminum phosphate by heating acidic aluminum phosphate, etc. It has been confirmed that it can also be used. In short, it is sufficient that aluminum phosphate is generated during heating, regardless of the form in which it is blended as a raw material.
本発明における炭化珪素セラミツクスの生成形
体中には、上述の目的効果を奏するためにリン酸
アルミニウムが含有されていることが必要である
が、この量の余りに大量すぎると、結合部のリン
酸アルミニウムの量が多くなりすぎ、高温強度を
損うことになつたり、また、低熱膨脹性という炭
化珪素の特質を減少せしめることから好ましくな
く、また余りに少量すぎると、充分緻密化せず電
気導電性の点でも好ましくなくなる。以上の理由
から、添加するべきリン酸アルミニウム量は0.5
〜30重量%、好ましくは1.5〜15重量%である。 It is necessary for the formed product of silicon carbide ceramics in the present invention to contain aluminum phosphate in order to achieve the above-mentioned desired effect, but if this amount is too large, the aluminum phosphate in the bonding portion If the amount is too large, it is undesirable because it will impair high temperature strength and reduce the characteristic of silicon carbide, which is low thermal expansion.If it is too small, it will not be sufficiently densified and the electrical conductivity Even the points become unfavorable. For the above reasons, the amount of aluminum phosphate that should be added is 0.5
-30% by weight, preferably 1.5-15% by weight.
実施例 1
炭化珪素粉末としては市販の純度99%、粒径1
ミクロン以下のものを用いた。この炭化珪素粉末
に3重量%のリン酸アルミニウム粉末(粒径1μ
以下)を加えた混合物をアルゴン雰囲気中で2000
℃、1h、200Kg/cm2の条件にてホツトプレスし、
径30mm、厚さ約10mmの焼結体を得た。この焼結体
の理論密度に対する相対密度は98.2%であつた。
またこの焼結体の両面間の電気抵抗を測定したと
ころ2.1Ωであつた。Example 1 Commercially available silicon carbide powder with purity of 99% and particle size of 1
A material of micron or smaller was used. Add 3% by weight of aluminum phosphate powder (particle size 1μ) to this silicon carbide powder.
2000 min in an argon atmosphere.
Hot press at ℃, 1 hour, 200Kg/ cm2 ,
A sintered body with a diameter of 30 mm and a thickness of about 10 mm was obtained. The relative density of this sintered body to the theoretical density was 98.2%.
Furthermore, when the electrical resistance between both surfaces of this sintered body was measured, it was 2.1Ω.
比較例 1
実施例1のリン酸アルミニウム3重量%の代わ
りにアルミナ(粒径1ミクロン以下)2重量%を
使用し、実施例1と同様にして焼結体を得た。得
られた焼結体の相対密度は99.0%、電気抵抗は
2.5×105Ωであつた。Comparative Example 1 A sintered body was obtained in the same manner as in Example 1 except that 2% by weight of alumina (particle size of 1 micron or less) was used instead of 3% by weight of aluminum phosphate in Example 1. The relative density of the obtained sintered body was 99.0%, and the electrical resistance was
It was 2.5×10 5 Ω.
実施例 2
実施例1に記したと同様の炭化珪素粉末及びリ
ン酸アルミニウム粉末を使用した。この炭化珪素
粉末に5重量%のリン酸アルミニウム粉末を加え
た混合物を300Kg/cm2の圧力にて金型プレスし、
径30mm、厚約10mmの成形体を得た。この成形体を
アルゴン雰囲気中で2000℃、1h加熱した。得ら
れた焼結体の相対密度は94.4%、電気抵抗は7.0
Ωであつた。Example 2 The same silicon carbide powder and aluminum phosphate powder as described in Example 1 were used. A mixture of this silicon carbide powder and 5% by weight of aluminum phosphate powder was pressed into a mold at a pressure of 300 kg/cm 2 .
A molded body with a diameter of 30 mm and a thickness of about 10 mm was obtained. This molded body was heated at 2000°C for 1 hour in an argon atmosphere. The relative density of the obtained sintered body was 94.4%, and the electrical resistance was 7.0.
It was Ω.
実施例 3
実施例2に記したと同様の混合粉末をまず、ア
ルゴン雰囲気中で1700℃、1h加熱した。この粉
末を解砕し実施例2に記したと同様の方法で成
形、焼成した。得られた焼結体の相対密度は97.4
%、電気抵抗は2.8Ωであつた。Example 3 A mixed powder similar to that described in Example 2 was first heated at 1700° C. for 1 hour in an argon atmosphere. This powder was crushed, molded and fired in the same manner as described in Example 2. The relative density of the obtained sintered body is 97.4
%, and the electrical resistance was 2.8Ω.
Claims (1)
化珪素からなる混合物を焼結して得られた電気的
加工用炭化珪素セラミツクス質高電気伝導材。1. A highly electrically conductive silicon carbide ceramic material for electrical processing, obtained by sintering a mixture consisting of 0.5 to 30% by weight of aluminum phosphate and the remainder silicon carbide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9682980A JPS5722172A (en) | 1980-07-17 | 1980-07-17 | Silicon carbide ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9682980A JPS5722172A (en) | 1980-07-17 | 1980-07-17 | Silicon carbide ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5722172A JPS5722172A (en) | 1982-02-05 |
| JPS6328871B2 true JPS6328871B2 (en) | 1988-06-10 |
Family
ID=14175432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9682980A Granted JPS5722172A (en) | 1980-07-17 | 1980-07-17 | Silicon carbide ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5722172A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0664966B2 (en) * | 1984-12-25 | 1994-08-22 | 松下電工株式会社 | Method for manufacturing support plate for movable contact plate for switch |
| JPS62145612A (en) * | 1985-12-20 | 1987-06-29 | 株式会社山武 | Manufacture of switch |
| JPS62145613A (en) * | 1985-12-20 | 1987-06-29 | 株式会社山武 | Manufacture of switch |
| JP6749149B2 (en) | 2016-06-10 | 2020-09-02 | トヨタ紡織株式会社 | Vehicle seat |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5585463A (en) * | 1978-12-15 | 1980-06-27 | Hitachi Ltd | Silicon carbide sintered body and its manufacture |
-
1980
- 1980-07-17 JP JP9682980A patent/JPS5722172A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5722172A (en) | 1982-02-05 |
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