JPS633015B2 - - Google Patents
Info
- Publication number
- JPS633015B2 JPS633015B2 JP58240934A JP24093483A JPS633015B2 JP S633015 B2 JPS633015 B2 JP S633015B2 JP 58240934 A JP58240934 A JP 58240934A JP 24093483 A JP24093483 A JP 24093483A JP S633015 B2 JPS633015 B2 JP S633015B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- metal
- liquid
- melting point
- dental
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Dental Preparations (AREA)
Description
〔産業上の利用分野〕
本発明は常温で液体の合金に固化用の金属粉末
を混和して用いる歯科用金属材料に関する。
〔従来の技術〕
歯牙の窩洞修復用に充填する歯科用金属材料と
して、従来よりアマルガムが用いられている。こ
れは常温で液体のHgに固化用の金属粉末を混
入・練和するもので金属粉末としては通常Ag−
Sn、Ag−ZnまたはAg−Sn−Zn等が用いられて
いる。
〔発明が解決しようとする問題点〕
このアマルガムは上記した如く常温で液体の金
属としてHgを用いるためにその毒性が問題とな
り、常温においても蒸気となつて毒性雰囲気を作
るために歯科医等に悪い影響を与え、さらに常時
歯牙に充填されている患者にも何らかの悪い影響
があることが考えられている。
しかし、このアマルガムは用法が容易であるた
めに毒性の心配があるにもかかわらず使用がつづ
けられているのが現状である。しかし、Hgに代
わる金属の研究も進んで、既にGa単体やGaの二
元合金が研究されている。Gaは毒性が無く、融
点が約30℃であるためにその融点を下げるために
Inを加えることにより17℃に下げることができる
が未だ使用するには融点が高く作業性が良好でな
いもので広く使用されるには至つていない。
〔問題点を解決するための手段〕
本発明は、常温で液体の合金に固化用の金属粉
末を混入、練和して用いる歯科用金属材料におい
て、常温で液体の合金をIn1〜45wt%、Sn11〜
30wt%とAg、Al、Zn、Au、Cuの一元もしくは
二元を0.05〜2.5wt%加え、残部をGaとしたこと
により15℃以下の融点を持つた四元以上の多元合
金としたことを特徴とする。
〔実施例〕
以下に本発明の実施例を説明する。
常温で液体の合金としてGa−In−Snの三元素
に、Ag、Al、Zn、Au、Cuの一元もしくは二元
を0.05〜2.5wt%加えた多元合金とすることによ
り15℃以下の融点を有する金属とした。
以下に実施例を第1表に示す。
[Industrial Application Field] The present invention relates to a dental metal material that is used by mixing a metal powder for solidification into an alloy that is liquid at room temperature. [Prior Art] Amalgam has conventionally been used as a dental metal material to be filled for tooth cavity restoration. This involves mixing and kneading metal powder for solidification into Hg, which is liquid at room temperature.The metal powder is usually Ag-
Sn, Ag-Zn, Ag-Sn-Zn, etc. are used. [Problems to be solved by the invention] As mentioned above, this amalgam uses Hg as a metal that is liquid at room temperature, so its toxicity becomes a problem, and dentists etc. It is believed that it has a negative effect on patients whose teeth are constantly filled with fillings. However, because this amalgam is easy to use, it continues to be used despite concerns about toxicity. However, research into metals that can replace Hg is progressing, and research into pure Ga and binary alloys of Ga is already underway. Ga is non-toxic and has a melting point of about 30°C, so in order to lower its melting point,
By adding In, the temperature can be lowered to 17°C, but the melting point is still too high for use and the workability is poor, so it has not been widely used. [Means for Solving the Problems] The present invention provides a dental metal material that is used by mixing and kneading metal powder for solidification into an alloy that is liquid at room temperature. Sn11~
By adding 30 wt% and 0.05 to 2.5 wt% of one or two elements of Ag, Al, Zn, Au, and Cu, and the remainder being Ga, a quaternary or higher multi-component alloy with a melting point of 15°C or less was created. Features. [Example] Examples of the present invention will be described below. By creating a multi-element alloy in which 0.05 to 2.5 wt% of one or two elements of Ag, Al, Zn, Au, and Cu are added to the three elements Ga-In-Sn, which are liquid at room temperature, the melting point is lower than 15℃. It is a metal that has Examples are shown in Table 1 below.
【表】
なお、上記Ga−Sn−Inの三元と添加元素共存
状態においてSnが30wt%を越え、Inが1wt%未
満あるいは45wt%を越えると液体金属の融点が
高くなつて実用に供し得ない。またSnが11wt%
未満の場合、上記元素との共存状態において圧縮
強度が不充分となることがわかつた。また、添加
元素については、0.05wt%未満では機械的特性向
上の効果がなく2.5wt%を越える添加では融点の
上昇をきたしてしまうことになる。
以上に示した合金は、石英性るつぼ内に所定量
の成分金属を入れ、N2雰囲気中にて高周波溶解
によつて得ることができる。
次に上記合金を固化用の金属粉末と混合した歯
科用金属材料の圧縮破壊強度を示す。
上記第1表のNo.1に示す成分組成の合金、
Ga65wt%、Sn23wt%、In10wt%、Ag1wt%、
Zn1wt%の液体合金にアトマイズ製法で得た従来
と同様の66Ag−25Sn−9Zn合金の250メツシユ以
下の固化用の金属粉末を1:1.5の重量比にて混
合してよく練和したものを約40℃の恒温槽に入れ
て1時間後に取出して圧縮試験を行ない、約13Kg
f/mm2の圧縮破壊強度を得た。
同様にしてNo.2〜No.8の試料も圧縮試験を行な
つた。その結果を以下の第2表に示す。[Table] In addition, in the above-mentioned Ga-Sn-In ternary and additive element coexistence state, if Sn exceeds 30wt% and In is less than 1wt% or exceeds 45wt%, the melting point of the liquid metal becomes too high to be used for practical use. do not have. Also, Sn is 11wt%
It has been found that when the content is less than 1, the compressive strength becomes insufficient in the coexistence state with the above elements. Furthermore, with regard to additive elements, if the amount is less than 0.05 wt%, there is no effect of improving mechanical properties, and if it is added in excess of 2.5 wt%, the melting point will increase. The alloy shown above can be obtained by placing a predetermined amount of the component metals in a quartz crucible and performing high frequency melting in an N 2 atmosphere. Next, the compressive fracture strength of a dental metal material prepared by mixing the above alloy with metal powder for solidification is shown. An alloy having the composition shown in No. 1 in Table 1 above,
Ga65wt%, Sn23wt%, In10wt%, Ag1wt%,
A metal powder for solidification of 250 mesh or less of 66Ag-25Sn-9Zn alloy, similar to the conventional one obtained by atomization method, was mixed into a liquid alloy containing 1wt% Zn at a weight ratio of 1:1.5 and kneaded well. I put it in a constant temperature bath at 40℃ and took it out after 1 hour and did a compression test, and it weighed about 13Kg.
A compressive fracture strength of f/mm 2 was obtained. Similarly, samples No. 2 to No. 8 were also subjected to compression tests. The results are shown in Table 2 below.
以上の四元以上の多元合金による金属は従来の
Hgと同様に、使用に際してこれを固化用の金属
粉末と混合、混和して歯科用材料として用いるも
のであるが、本金属は合金であるために従来Hg
がAg−Sn、Ag−ZnまたはAg−Sn−Zn等の二元
以上の金属粉末と混合していたのに対しこれらの
金属粉末は無論のことAg、SnまたはZnの単体粉
末と混合しても充分に歯科用材料として使用可能
である。
一般にある温度における液体はその融点が低い
ほど自由エネルギーが大きい。従つて本発明は
Ga単体やGa−In二元系に比べてもある金属や合
金に対する拡散速度は増大する。
また、本発明は四元以上の多元合金としたこと
により表面張力を下げることができ、他金属等へ
のぬれ性を向上させ、さらに多元系であることに
より他金属または合金への拡散を増大させること
ができる。
従つて固化用金属粉末と混和し、充填固化させ
るに際して上記理由によりGa単体やGa−Inの二
元系に比べて非常にすぐれた歯科用金属として利
用することができる。
以上の本発明によると、Ga−In−Snの三元合
金にAg、Al、Zn、Au、Cuを一元もしくは二元
加えた多元合金としたことにより、歯質および他
の金属に対してすぐれたぬれ性を有し、歯牙の窩
洞充填に用いたときに歯質との間に隙間が生ずる
こともなく、しかも融点が低いために使用に際し
ても作業性は極めて良好となる。
また、生体反応における毒性も問題なく歯科用
金属として的するもので、単に窩洞修復のみなら
ず義歯の修復および歯科用の鋳造金属床の修復に
用いて有用である。
The metals made from the above quaternary or higher multi-element alloys are conventional
Like Hg, it is used as a dental material by mixing it with metal powder for solidification, but since this metal is an alloy, conventional Hg
was mixed with two or more metal powders such as Ag-Sn, Ag-Zn or Ag-Sn-Zn, but these metal powders are of course mixed with single powders of Ag, Sn or Zn. It can also be used satisfactorily as a dental material. Generally, the lower the melting point of a liquid at a certain temperature, the greater its free energy. Therefore, the present invention
The diffusion rate for certain metals and alloys increases compared to Ga alone or the Ga-In binary system. In addition, by using a multi-component alloy of quaternary or higher elements, the present invention can lower surface tension, improve wettability to other metals, etc., and furthermore, because it is a multi-component alloy, diffusion to other metals or alloys is increased. can be done. Therefore, when mixed with metal powder for solidification and filled and solidified, it can be used as a dental metal that is much better than Ga alone or a binary system of Ga-In for the above reasons. According to the present invention, the multi-component alloy is made by adding one or two elements of Ag, Al, Zn, Au, and Cu to the ternary alloy of Ga-In-Sn, which has excellent properties against tooth structure and other metals. It has wettability, so when used to fill tooth cavities, no gaps are created between the material and the tooth structure, and its melting point is low, so it has extremely good workability when used. In addition, it has no toxicity in biological reactions and is suitable as a dental metal, and is useful not only for cavity repair but also for denture repair and dental cast metal floor repair.
Claims (1)
入、練和して用いる歯科用金属材料において、液
体の合金をIn1〜45wt%、Sn11〜30wt%、およ
びAg、Al、Zn、Au、Cuの5元素の内の一元も
しくは二元の元素を0.05〜2.5wt%、残部Gaとし
たことにより、15℃以下の融点を持つた四元以上
の多元合金としたことを特徴とする歯科用金属材
料。1. In dental metal materials used by mixing and kneading metal powder for solidification into an alloy that is liquid at room temperature, the liquid alloy is mixed with In1-45wt%, Sn11-30wt%, and Ag, Al, Zn, Au, Cu. A dental metal characterized in that it contains 0.05 to 2.5 wt% of one or two of the five elements, and the balance is Ga, resulting in a quaternary or higher multi-component alloy having a melting point of 15°C or less. material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58240934A JPS60135548A (en) | 1983-12-22 | 1983-12-22 | Dental metallic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58240934A JPS60135548A (en) | 1983-12-22 | 1983-12-22 | Dental metallic material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60135548A JPS60135548A (en) | 1985-07-18 |
| JPS633015B2 true JPS633015B2 (en) | 1988-01-21 |
Family
ID=17066814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58240934A Granted JPS60135548A (en) | 1983-12-22 | 1983-12-22 | Dental metallic material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60135548A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4227434C2 (en) * | 1992-08-19 | 1994-08-18 | Geraberger Thermometerwerk Gmb | thermometer |
| US5508003A (en) * | 1993-02-25 | 1996-04-16 | The Center For Innovative Technology | Metallic material with low melting temperature |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5548091B2 (en) * | 1973-06-20 | 1980-12-04 | ||
| JPS5060421A (en) * | 1973-09-29 | 1975-05-24 | ||
| JPS5638669B2 (en) * | 1974-01-14 | 1981-09-08 | ||
| JPS5346418A (en) * | 1976-10-08 | 1978-04-26 | Seiko Epson Corp | Low melting point alloy |
-
1983
- 1983-12-22 JP JP58240934A patent/JPS60135548A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60135548A (en) | 1985-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0173806B1 (en) | Gallium alloy for dental restorations | |
| JPS633015B2 (en) | ||
| US4008073A (en) | Alloy powder for the production of dental amalgam | |
| JPS633016B2 (en) | ||
| JPH0353371B2 (en) | ||
| US3985558A (en) | Dental alloy and amalgam | |
| JPH0323615B2 (en) | ||
| JPH0253504B2 (en) | ||
| US4528034A (en) | Selenium-containing amalgam alloys for dental restoration and method for the preparation thereof | |
| US4453977A (en) | Low silver containing dental amalgam alloys | |
| KR910003552B1 (en) | Dental Metal Flexible Materials | |
| JPH03294449A (en) | Dental metallic material | |
| JPH0227428B2 (en) | ||
| JPS6324059B2 (en) | ||
| US4702765A (en) | Method of making selenium-containing amalgam alloys for dental restoration | |
| JPS60135547A (en) | Dental metallic material | |
| JPH0469216B2 (en) | ||
| JPH0253503B2 (en) | ||
| US249880A (en) | William g | |
| US6190606B1 (en) | Solid amalgamating compositions for the preparation of dental amalgams, amalgam forming compositions containing them, methods for producing dental amalgams with them and dental amalgams produced thereby | |
| JPS6324058B2 (en) | ||
| JPS6324061B2 (en) | ||
| JPS6324060B2 (en) | ||
| JPS6324057B2 (en) | ||
| JPS6325064B2 (en) |