JPS6333318B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a local soldering device used for soldering electronic components to a printed circuit board and for removing electronic components soldered to the printed circuit board.

Conventionally, this type of local soldering apparatus has a table 3 on which a printed circuit board is placed, as shown in FIG. Several locking mechanisms 5 that slide in a straight line on the table 3 and hold down the ends of the printed circuit board, a solder tank 1 provided at the bottom of the table 3, and a lock mechanism 5 for squirting out the solder in the solder tank 1. A position indicating mechanism 7 has a soldering nozzle 6, and further includes an arm 7b that rotates around a shaft 7c at the top of the device and an air nozzle 7a provided at the tip of the arm 7b.
When installing or removing electronic components on a printed circuit board, the positioning mechanism 7 points the target position of the printed circuit board directly above the soldering nozzle 6 to position the printed circuit board. It was attached by a locking mechanism 5. Therefore, since the cap 4 that supports the printed circuit board has a small area, it is difficult to seat the printed circuit board, and it is difficult to position the printed circuit board by placing the nozzle 7a of the positioning mechanism 7 over the electronic components with one hand. Because the position indicating mechanism 7 must be held by the end and operated with one hand, it may be obstructed by adjacent electronic components, or the lead wire of the electronic component may get caught on the cap 4, or when making small adjustments. Printing on the table 3 of a local soldering device is difficult, and it is difficult to position the soldering device as desired, and it is necessary to slide several locking mechanisms 5 one by one to the edge of the printed circuit board and tighten the screws to fix them. It takes a lot of time to position and support and fix the board, and it also has drawbacks such as poor accuracy.

An object of the present invention is to eliminate such conventional drawbacks, and to provide a local soldering device that can greatly simplify the positioning of a printed circuit board on a table, shorten the time required, and perform the process with high precision. .

According to the present invention, in a local soldering device such as a printed circuit board, a light beam is irradiated onto the printed circuit board,
A film pattern is formed on the printed circuit board placed above the solder nozzle, and an optical position indicating mechanism is used to indicate the target position on the printed circuit board. A local soldering device is obtained, comprising a table fitted with a fixing elastic mat.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 2 shows a local soldering device which is an embodiment of the present invention. In FIG. 2, the present local soldering device has a solder bath (not shown) housed in the lower part of a housing 8, and a solder nozzle 12 from which molten solder from the solder bath is spouted. An optical position indicating mechanism 13 is provided on the upper part of the body 8 to indicate the target position of the printed circuit board to a position directly above the solder nozzle 12.

The solder bath has a solder jetting motor (not shown), and the solder is spouted from the solder nozzle 12 by the force of this jetting motor to form a solder wave front suitable for soldering to a printed circuit board. ing. Note that the molten solder spouted from the solder nozzle 12 escapes through the escape hole 1 provided in the table 10.
It is returned to the soldering bath from 0a.

The optical position indicating mechanism 13 is composed of a lamp 13a, several condenser lenses 13b under the lamp 13a, an objective lens 13d, and a film 13c provided between the lenses 13b and 13d.
3e, a pattern is formed on the film at a position directly above the solder nozzle 12, and the position is indicated.

As shown in FIG. 3, the table 10 is provided with a suitable heat insulating material 10' inside thereof to block the heat of the solder bath and reduce its influence on the upper surface of the table 10. Furthermore, a heat-resistant and elastic mat 11 is attached to the top surface of the table 10, and a printed circuit board 14 with an electronic component 15 mounted thereon is mounted on the top surface of the table 10.
By placing one hand 16 on the group of 5 and continuing to press lightly in the direction of arrow A, the tips of the electronic components 15a slightly bite into the printed circuit board 14 to support and fix it. Note that the mat 11 is made of a conductive material and is designed to discharge static electricity generated on the printed circuit board 14 and the like.
It has the role of protecting electronic components, such as integrated circuits, mounted on the circuit board 4.

Furthermore, this local soldering device is provided with an air hose 19 at the top, and is configured to send, for example, vacuum or pressure air, and the hose 19 can be pulled out as necessary, allowing the printed circuit board 14 to The solder in the hole 14a can be removed. Furthermore, a control section 9 is attached to this local soldering device, and this control section 9 has the function of controlling the voltage or time applied to each section, the solder melting temperature, etc.

Next, we will discuss how to use one embodiment of the present invention in the second section.
This will be explained in detail with reference to FIGS.

First, the optical position indicating mechanism 13 moves the film 1 having a pattern that matches the shape of the solder nozzle 12.
3c is set, and this pattern is irradiated onto the solder nozzle 12 as shown in FIG. 4 to form an image 13f. Next, the printed circuit board 14 is placed on the mat 11, and the target electronic component 15 attached to the printed circuit board 14, especially the lead wire 15a, is patterned 13 by the light beam 13e.
Move it so that it is inside f. In this state, the third
As shown in the figure, by lightly placing one hand 16 on a group of electronic components 15, a force is exerted in the direction of arrow A, and the printed circuit board 14 pulls the tips of the lead wires 15a of the electronic components 15 onto the mat as shown in FIG. 11 and is supported and fixed.

Next, with the printed circuit board 14 set on the table 10 as shown in FIG.
7 flows in the direction of arrow D and is ejected from the solder nozzle 12 as shown in FIG.
7' is made. The molten solder at the solder wave head 17' contacts the printed circuit board 14, and the through hole 14 into which the lead wire 15a of the electronic component 15 is inserted.
Melt the solder 18 in a. With the solder melted, the electronic component 15 is pulled out from the printed circuit board 14 in the direction of arrow B. Next, printed circuit board 1
4, the solder in the through holes 14 of the printed circuit board 14 is removed by, for example, a vacuum type or pressure type air nozzle.

Next, when newly attaching the electronic component 15 to the through hole 14a of the printed circuit board, the optical position indicator tank 13 is used to attach the electronic component 15 to the printed circuit board 14 in the same manner as described above.
is set in table 10. Electronic parts 15 in advance
The terminal 15a is passed through the through hole 14 of the printed circuit board 14 and attached. Next, molten solder 1
When solder 7 is ejected from the solder nozzle 12 and comes into contact with the printed circuit board 15 for a certain period of time, the lead wire 15a of the electronic component 15 is attached to the through hole 14a of the printed circuit board 14 and is fixed.

As explained above, in this embodiment, the position is indicated by the light beam 13e from the optical position indicating mechanism.
Since the printed circuit board 14 can be held with both hands, it is easy to make slight movement adjustments, no special fixing device is required, and the printed circuit board 14 is supported over a wide surface. Therefore, setting the printed circuit board 14 on the table 10 is very easy, and the time required for setting can be shortened and the setting can be performed with high accuracy.

In addition, in this embodiment, it is natural to adjust the size of the solder nozzle according to the size of the electronic component 15, but depending on the size of the solder nozzle, the film used in the optical position pointing mechanism can be replaced. can do.

As explained above, in the present invention, by installing an optical position indicator on the top of the device and an elastic mat on the table, positioning and supporting and fixing the printed circuit board on the table is extremely easy and takes a short time. , and has the effect of being able to perform the process with high precision.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional local soldering device, FIG. 2 is a perspective view of an embodiment of the local soldering device according to the present invention, FIG. 3 is a front view showing a printed circuit board set on a table, and FIG. Figure 4 is a plan view showing an example of the light beam irradiated onto the printed circuit board from the optical position indicating mechanism, Figure 5 is a front view showing the relationship between the lead wire of the electronic component and the mat with one hand placed on it, and Figure 6A. , B, C, and D are explanatory views of the local soldering device according to the present invention, viewed from the right side. 8... Housing, 9... Control box, 1
0...Table, 10a...Escape hole, 11...Matsu, 12...Solder nozzle, 13...Optical position indicator, 13a...Lamp, 13b...Lens, 13c...Film, 13d...Light ray , 14
...Printed circuit board, 14a...Through hole, 1
5...Electronic component, 15a...Lead wire, 16...
One hand, 17...molten solder, 17'...solder wave head, 18...solder, 19...air hose.

Claims (1)

[Claims] 1. In a local soldering device for printed circuit boards, etc., a light beam is irradiated onto the printed circuit board, a film pattern is formed on the printed circuit board placed above the soldering nozzle, and a target position on the printed circuit board is indicated. 1. A local soldering device comprising: an optical position pointing mechanism; and a table fitted with an elastic mat that fixes the printed circuit board by biting the tip of an electronic component attached to the printed circuit board.