JPS6340490B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure of a crimp base for a crystal oscillator, which includes a metal base of a crimp-type metal container that supports a crystal oscillator, and a metal support base, and a method for manufacturing the same.

Conventionally, this type of crimp-type base has a bottom plate 2 of a metal base 1 made of an oxygen-free copper material, as shown in FIG. Protrusions 5, 5 are provided on the outer surface of the metal support base 4 made of Kovar material, which has holes 6, 6 for glass sealing formed in the protrusions 5, 5, and is formed into an oval shape when viewed from above. Lead wires 7, 7 for applying a voltage to be applied to the crystal piece are sealed to holes 6, 6 for glass sealing with glass 8,
The protrusions 5, 5 are placed so as to be fitted into the openings 3, 3, and the outer surface of the bottom plate 2 of the metal base 1, the inside of the openings 3, 3, the flat part 4a of the metal support 4, and the protrusions. The metal base 1 and the metal support 4 are fixed by pouring silver solder 9 between them.

Regarding the manufacturing method of the crimp-type base, the hole for glass sealing is passed through an electric furnace in order to improve the adhesion between the glass and the inner wall of the hole 6 for glass sealing of the metal support base 4 formed of Kovar material. 6
After performing an oxide film formation treatment on the inner wall of the terminal, a glass button 8 and lead wires 7, 7 are inserted into holes 6, 6 for glass sealing, and fired in a heating furnace to form a glass sealed terminal. However, if the objective is to improve the adhesion of the glass, the oxide film need only be formed on the inner wall of the hole 6 for sealing the glass, but since the metal support 4 is passed through an electric furnace, the oxide film is formed only on the inner wall of the hole 6. It is also generated on the outer surface at the same time. However, if there is an oxide film on the flat surface 4a of the metal support 4, brazing cannot be performed, so in order to braze the metal support 4 to the bottom plate 2 of the metal base 1, the metal support 4 has the lead wire 7 sealed with glass as described above. After removing the oxide film by soaking it in an acidic solution such as hydrochloric acid, a metal support 4 is placed on the outer surface of the bottom plate 2 of the metal base 1 with silver solder in between, and this is passed through a heating furnace and soldered. It was something to do.

However, when brazing the conventional metal support 4 to the metal base 1, it is necessary to remove the oxide film on the metal support 4 that is formed to seal the lead wires 7, 7 to the glass. Therefore, during brazing, the silver solder 9 spreads to the side surface 4b of the metal support base 4. That is, when the metal support 4 is immersed in an acid solution to remove the oxide film, not only the planar portion 4a and the protrusions 5, 5, which are the brazed parts of the metal support 4, but also the entire surface of the metal support 4 are oxidized. This is because the coating is removed and the solder easily turns around the side surface 4b of the metal support 4. However, this diffusion of the silver solder 9 on the side surface 4b of the metal support 4 affects the appearance of the metal support 4. This significantly damaged the product and lowered its commercial value.

Further, in the above manufacturing method, the step of forming an oxide film on the metal support 4 → the step of glass sealing the lead wires 7, 7 in the glass sealing holes 6, 6 of the metal support 4 → the oxidation of the metal support 4 The process follows the process of removing the coating → the brazing process, but among these, the glass sealing process and the brazing process are both processes of applying heat to the metal base 1 or metal support 4 through a heating furnace. Cannot be performed at the same time. For this reason, the conventional manufacturing method has the disadvantage that the number of man-hours increases and work efficiency deteriorates. Moreover, in the conventional manufacturing method, silver solder is applied after sealing the glass 8 to the metal supporting base 4, so even if silver solder is used that has a lower melting point than glass, the glass will remelt during soldering. Since the glass is intended to be hermetically sealed, it is not preferable to perform the heating process twice.

The present invention solves the conventional drawbacks by forming the metal support base from a copper-clad Kovar material, disposing oxygen-free copper on the flat parts and protrusions, and forming an oxide film on the surface of the Kovar material. forming and silver brazing the metal support to the metal base;
To provide a crimp-type base for a crystal oscillator that prevents silver solder from diffusing on the side surface of a metal support base and provides a good appearance when assembled.

In addition, the present invention provides an oxide film formed on the outer surface of the metal support other than the flat and protruding parts of a metal support made of copper-clad Kovar material and having oxygen-free copper disposed on the flat and protruding parts. By doing so, the lead wire is glass-sealed into the glass-sealing hole of the metal support and the metal support and metal base are brazed at the same time, reducing assembly man-hours and manufacturing costs compared to conventional methods. An object of the present invention is to provide a method for manufacturing a crimp-type base for a crystal oscillator.

Hereinafter, the details of the present invention will be explained based on the drawings. In FIGS. 2 to 4, reference numeral 11 denotes a metal base that is open at the bottom and formed in a cross-sectional shape and shaped like an oval when viewed from above, and 12 and 12 are openings made in the bottom plate 13 of the metal base 11. The metal base 11 is formed by press-forming an oxygen-free copper plate. 14 is a metal base 11
A flat part 15 placed on the outer surface of the bottom plate 13 and protrusions 16 and 16 fitted into the openings 12 and 12 of the metal base 11 are formed, and a hole 1 for glass sealing is formed in the protrusions 16 and 16, respectively.
7 and 17 are metal supports for a crystal oscillator, which are oval in shape when viewed from the flat surface. This metal support stand 14
1 is formed by press-molding a metal plate made of a copper-clad Kovar material, that is, a metal plate made by bonding a thinner oxygen-free copper 19 to Kovar 18, and forms it into the above-mentioned shape. Oxygen-free copper 19 made of copper-clad Kovar material is disposed on the protrusions 16, 16. 20, 20 are holes 17 for glass sealing made in the metal support 14;
A lead wire connected to the crystal piece inserted in 17,
21, 21 are glass sealed in the holes 17, 17 for glass sealing of the metal support 14, 22 are the bottom plate 13 of the metal base 11, the inside of the openings 12, 12, and the flat part 15 of the metal support 14; Projection part 16,1
It is silver solder poured between the 6 and 6.

In order to manufacture the crimp type base having the above configuration, first, the metal support 14, which has been formed as described above and has been subjected to treatments such as degreasing and pickling, is first coated with the metal support 14, which has been subjected to treatments such as degreasing and pickling. The metal support 14 is passed through an electric furnace to form an oxide film on its outer surface and the inner wall of the hole 17 for glass sealing. Next, the metal support base 14 on which the oxide film has been formed is immersed in an alkaline solution such as a caustic soda solution. By immersing the metal support 14 in this alkaline solution, the oxide film is formed on the outer surface of the main body of the metal support 14 made of Kovar material and the inner walls of the holes 17, 17 for glass sealing. Most of the generated oxide film remains as it is, but the oxide film formed on the flat part 15 and the protruding parts 16, 16 of the metal support 14 made of non-oxidized copper material is removed by using an alkaline solution. It will be destroyed. After that, glass powder is pre-sintered in the glass sealing holes 17, 17 of the metal support 14, and a lead wire insertion hole 23 is formed in the center.
Insert the glass button 23 provided with the metal support 14 and insert the lead wire 20 into the lead wire insertion hole 23a of the glass button 23.
6 and 16 are fitted into the openings 12 and 12 provided in the bottom plate 13 of the metal base 11, and the flat part 15 of the metal support 14 is attached to the metal base 11 with silver solder 22 interposed therebetween.
It is installed on the outer surface of the bottom plate 13 of. Then, these are heated by passing them through a heating furnace. At the same time as the silver solder 22 is melted in the heating furnace, the glass button 2
3 and 23 are also melted to form the bottom plate 13 of the metal base 11.
The silver solder 22 on the outer surface of the metal base 11 enters into the gap between the openings 12, 12 and the protrusions 16, 16.
and the metal support 14 are bonded together, and at the same time the lead wires 20, 20 are inserted into the holes 17, 1 of the metal support 14.
7 will be glass sealed. in this case,
As mentioned above, the flat part 15 and the protruding parts 16, 16, which are made of oxygen-free copper material of the metal support base 14, have no oxide film on their surfaces, so the silver solder 22 diffuses into these parts. Since there is an oxide film on the side surface 14a of the metal support base 14 formed in
The silver solder 22 does not spread over this side surface 14a portion.

Incidentally, since the brazing process and the glass sealing process are carried out simultaneously, it is desirable that the melting points of the silver solder and the glass be close to each other.

As described above, the present invention forms the metal support from a copper-clad Kovar material, and forms an oxide film on the planar portion and the protruding portion where the oxygen-free copper material, which is the joint portion with the metal base of the metal support, is disposed. Since the oxide film is formed only on the Kovar material part without forming it, it is possible to prevent the silver solder from diffusing to the side of the metal support.
The product value of the crimp type base can be increased by improving its appearance. Furthermore, since the brazing process and the glass sealing process can be carried out simultaneously, it is possible to reduce the number of manufacturing and assembly steps compared to conventional crimp-type bases of this type, thereby realizing cost reduction.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional crimp-type base for a crystal oscillator, FIG. 2 is a sectional view of a crimp-type base for a crystal oscillator according to the present invention, FIG. 3 is a plan view, and FIG. 4 is a glass button. FIG. DESCRIPTION OF SYMBOLS 11... Metal base, 12... Opening, 13... Bottom plate, 14... Metal support stand, 14a... Side surface of metal support stand, 15... Plane part, 16... Projection part, 17... Hole for glass sealing, 18... Kovar material , 19...Oxygen-free copper material, 20...Lead wire, 21...Glass, 22...Silver solder, 23...Glass button, 23a...Lead wire insertion hole.

Claims (1)

[Claims] 1. Metal base 1 having an opening 12 in the bottom plate 13
1, a flat part 15 placed on the outer surface of the bottom plate 13 of the metal base 11, and a protrusion 16 fitted into the opening 12 of the metal base 11, and a hole for glass sealing in the protrusion 16. It consists of a metal support 14 with a hole 17 drilled therein, and a lead wire 20 inserted into the hole 17 of the metal support 14, and the lead wire 20 is sealed to the hole 17 of the metal support 14 with a glass 21.
In the crimp-type base for a crystal oscillator, the base plate 13 and the inside of the opening 12 of the metal base 11 and the plane part 15 and the protruding part 16 of the metal support base 14 are bonded with silver solder 22. The stand 14 is formed of a copper-clad Kovar material made by bonding an oxygen-free copper material to one side of the Kovar material, and the oxygen-free copper material of the copper-clad Kovar material is disposed on the plane portion 15 and the protruding portion 16. A crimp-type base for a crystal oscillator, characterized in that an oxide film is formed on the surface of the Kovar material. 2. It is made of a copper-clad Kovar material made by bonding an oxygen-free copper material to one side of Kovar material, and has a flat part 15 and a protruding part 16. A hole 17 for glass sealing is formed in the protruding part 16, and the flat part 15 and the protruding part are made of a copper-clad Kovar material. An oxide film is formed on the surface of the metal support 14 on which an oxygen-free copper material such as a copper-clad Kovar material is disposed in the portion 16, and the metal support 14 is immersed in an alkaline solution to form an oxygen-free copper material. After removing the oxide film on the flat part 15 and the protruding part 16, the glass button 23 is inserted into the glass sealing hole 17 of the metal support 14, and the lead wire insertion hole 23a of the glass button 23 is removed.
The lead wire 20 is inserted into the metal base 11, and the protruding part 16 is fitted into the opening 12 provided in the bottom plate 13 of the metal base 11, and the flat part 15 is placed on the outer surface of the bottom plate 13 via silver solder 22, and placed in a heating furnace. A method for manufacturing a crimp-type base for a crystal oscillator, characterized in that glass sealing of the lead wire 20 and brazing of the metal base 11 and the metal support 14 are performed at the same time by heating.