JPS6342856B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hermetic package for circuit elements and a method for manufacturing the same. For more details, see crystal oscillators, crystal resonators, crystal wave devices, optical sensors,
The present invention relates to an airtight package for a circuit element that houses a circuit element such as a hybrid circuit therein, and a method for manufacturing the same.

Conventionally, as shown in FIG. 1, the airtight package for circuit elements has a box-shaped case body 1 with a lead wire insertion hole 3 for inserting the lead wire 2, and the lead wire 2 is inserted into the lead wire insertion hole 3. The case body 1 is inserted therethrough and connected to the element 4, and the insertion hole 3 is sealed with a glass 5. Further, the upper part of the case body 1 is covered with a lid body b and bonded.

FIG. 2 shows a sectional view of the vicinity of the conventional lead wire insertion hole 3. As is clear from FIG. 2, the lead wire insertion hole 3 is formed such that the edge 7 of the case body 1 is bent inward.
The lead wire 2 was inserted into the gap 8 formed by the above, and the glass 2 was embedded and baked and sealed. As is well known, such a lead wire insertion hole 3 is formed by a burning process, but such a burn process has the drawbacks of being extremely expensive and having a low yield. Packages had no choice but to be expensive.

It is an object of the present invention to provide an airtight package for circuit elements and a method for manufacturing the same that does not have these drawbacks. That is, it is an object of the present invention to provide an airtight package for a circuit element that can securely fix a lead wire and maintain airtightness without providing a lead wire insertion hole 3 subjected to a burn process as in the conventional case, and a method for manufacturing the same. purpose.

Therefore, the airtight package for circuit elements according to the present invention has lead wire insertion portions on the peripheral wall of one or two case bodies that have edges bent at approximately right angles and are missing the bottom. , insert the lead wire, connect the tip inside the case body to the element, arrange and seal a glass in the lead wire sealing part formed by the peripheral wall and the bent edge, and further close the open side of the case body. The device is characterized in that it is sealed by a lid body.

Further, in the method of manufacturing an airtight package for circuit elements according to the present invention, a lid is placed on a graphite pedestal, and a lead is inserted through the bent edge bent at an almost right angle and the peripheral wall. One or two case bodies having a wire insertion portion and without a bottom are placed on the lid body with the bent edges facing outward, and a lead wire is inserted into the lead wire insertion portion, and the Glass is placed in the lead wire sealing part formed by the bent edge and the peripheral wall, and then the periphery and top of the case body are covered with graphite and heated to melt the glass and seal the lead wire. After that, an element is connected to the tip of the lead wire, and the opening of the case body is further sealed with a lid.

According to the airtight package for circuit elements and the manufacturing method thereof according to the present invention, there is no need for a lead wire insertion hole formed by burning process, and since this is not formed, it is possible to manufacture an extremely inexpensive airtight package for circuit elements. There are advantages.

To explain the present invention in more detail, the airtight package for circuit elements according to the present invention is a case having a bent edge 101 bent at a substantially right angle, as shown in a cross-sectional view of a typical embodiment thereof in FIG. The main body 10 is used. As is clear from the perspective view of FIG. 4, the case body 10 has a bent edge 101 and a peripheral wall 102, and the peripheral wall 102 is provided with a lead wire insertion portion 30. Lead wire insertion part 30
Although it is circular in FIG. 4, it is not limited to this; for example, it can be a rectangle as shown in FIG. 5 a, or it can be an ellipse as shown in FIG. 5 b. . Furthermore, as shown in FIGS. 5c and 5d, the ends of the peripheral wall 102 may be cut off to form semicircular or square lead wire insertion portions 30.

In the embodiment shown in FIG.
is provided, and the lead wire 20 is inserted through this lead wire insertion portion 30. This lead wire 20 is connected to the element 40. A lead wire sealing portion 60 for sealing the lead wire 20 is formed by a folding line portion 101 of the case body 10 and a peripheral wall 102. A glass 50 is placed in this lead wire sealing portion 60, and the lead wire 20 is sealed. Further, the upper and lower open sides of the case body 10 are sealed with lids 70 and 71.

FIG. 6 is a sectional view of another embodiment according to the invention. In this embodiment, the ends of the case bodies 10a and 10b that do not have the bent edge 101 as shown in FIGS. It is inserted into the case body 10 and connected to the element 40. The lead wire sealing section 60 for sealing the lead wire 20 is somewhat different from the previous embodiment, and is formed by the peripheral wall 102 and the upper and lower bent edges 102 of the case bodies 10a and 10b. A glass 50 is placed in this lead wire sealing portion 60, and the lead wire 20 is sealed. Furthermore, the open sides of the two case bodies 10a and 10b are connected to the lid bodies 70 and 71.
It is sealed by.

Next, a method of manufacturing an airtight package for circuit elements according to the present invention will be explained.

According to the manufacturing method of the present invention, first, as shown in FIG.
1, and place the case body 10 on top of the case body 1 with the bent edge 101 facing upward.
0, the glass 50 with the lead wire 20 inserted therethrough is placed in the lead wire sealing part 60, and the lead wire 20 is inserted into the case body 10. Next, the left and right graphite holders 81 and 82 having lead wire insertion holes 801 are slid to define the lead wire sealing portion 60 and place the graphite jig 90 above.

After heating in such a state to melt the glass 20 and sealing the lead wire 20, the element 40 is connected to the tip of the lead wire 20 inside the case body 10, and then the bent edge 101 of the case body 10 is connected to the element 40. Lid body 7 on the side
Cover and adhere with 0 (Fig. 3). Such a lid body 7
0 and 71 are not limited in the present invention, and may be, for example, a metal plate, or a lid body (when packing a light emitting element, etc.) with a metal frame and a glass plate in the center. .

According to the second manufacturing method according to the present invention, as shown in FIG. The case main body 10b is arranged so that the case main body 10b is placed so that the other case main body 10a is placed on top of the other case main body 10a so that the bent edge 101 is on top.
Thereafter, the glass 50 with the lead wire 20 inserted therethrough is placed in the lead wire sealing part 60, and the lead wire 20 is inserted into the case bodies 10a and 10b. Next, the left and right graphite holders 81 and 82 having lead wire insertion holes 801 are slid to define the lead wire sealing portion 60 and the graphite jig 90 is placed above.

After heating in such a state to melt the glass 20 and sealing the lead wire 20, the element 40 is connected to the tip of the lead wire 20 inside the case body 10a, 10b, and the open side of the case body 10a is Cover and adhere with a lid 70 (FIG. 6).

The airtight package for circuit elements according to the present invention has the advantage that it is an inexpensive airtight package for circuit elements because it does not have an insertion hole formed by burning process as in the conventional case. Furthermore, according to the method of manufacturing an airtight package for circuit elements according to the present invention, lead wires can be sealed to the capacitor without providing a perforated insertion hole, thereby reducing manufacturing costs and improving yield. There is an advantage that it can be used.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a conventional airtight package for circuit elements, FIG. 2 is a sectional view of a lead wire sealing part of a conventional airtight package for circuit elements, and FIG. 3 is a sectional view of a conventional airtight package for circuit elements. 4 and 5 are perspective views of the case body used in the present invention, FIG. 6 is a sectional view of the second embodiment according to the present invention, and FIG. 7 is a cross-sectional view of the case body used in the present invention. FIG. 8 is a sectional view for explaining a second embodiment of the method for manufacturing an airtight package for circuit elements according to the present invention. 1...Case body, 2...Lead wire, 3...Lead wire insertion hole, 4...Element, 5...Glass, 6...
...Lid body, 10a, 10b...Case body, 101
...bent edge, 102 ... peripheral wall, 20 ... lead wire, 30 ... lead wire insertion part, 40 ... element, 5
0...Glass, 60...Lead wire sealing part, 70,
71... Lid body, 80, 81, 82... Graphite pedestal, 801... Lead wire insertion hole, 90... Graphite jig.

Claims (1)

[Claims] 1. A lead wire insertion portion is provided on the peripheral wall of one or two case bodies that have an edge bent at a substantially right angle and a bottom is missing, and the lead wire is inserted through the peripheral wall. Then, the tip inside the case body is connected to the element, a glass is placed and sealed in the lead wire sealing part formed by the peripheral wall and the bent edge, and the open side of the case body is further sealed with a lid body. An airtight package for circuit elements characterized by: 2. The airtight package for a circuit element according to claim 1, wherein the case body is singular. 3. The airtight package for a circuit element according to claim 1, wherein the case body has two pieces. 4 Place the lid on a graphite pedestal, and create a case body that has a bent edge bent at a nearly right angle and a lead wire insertion part for passing the lead wire through the peripheral wall, and has no bottom. One or two pieces are installed on the lid body so that the bent edge faces outward, and the lead wire is inserted into the lead wire insertion part, and the lead wire sealing is formed by the bent edge and the peripheral wall. Manufacturing an airtight package for a circuit element, the method comprising the steps of: placing glass on the top of the case body, then covering the periphery and top of the case body with graphite, and heating to melt the glass and seal the lead wires. Method. 5. A method of manufacturing an airtight package for a circuit element according to claim 4, characterized in that a single case body is used. 6. A method of manufacturing an airtight package for a circuit element according to claim 4, characterized in that two of the case bodies are used.