JPS6342857B2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention covers the entire process of coating solder on IC terminal lead wires used in an IC terminal continuous soldering device,
In particular, the Dale type (Dil.
This article relates to an IC gripping device (hereinafter simply referred to as an IC gripping device).

All ICs described in the present invention are of the Dil.
Tipe).

Conventional IC terminal continuous soldering equipment did not yet exist, and the entire process was performed manually. As a result, the efficiency of solder coating on IC terminal lead wires is low, and the quality of IC products with solder coating on IC terminal lead wires (hereinafter referred to as soldered products) varies widely due to individual bias, resulting in the occurrence of defective products. In many cases, it is difficult to control the quality of soldered products, and mass production is impossible.

In view of the above, the inventors of the present invention have conducted various studies and as a result have successfully completed an IC terminal continuous soldering device. The present invention relates to an IC gripping device used in this IC terminal continuous soldering device, and as shown in FIG. 1 and FIG.
The IC fixing pins 4 are fitted into a jig main body 1 that has holes in which the fixing pins 4 are respectively inserted and supported, and a fixing plate 7 for preventing rotation of the IC fixing pins is provided on the top of the IC fixing pins 4 to fix the IC. The pin 4 is provided with a spring 5 between the jig body 1 and the fixing plate 7 so that the IC fixing pin 4 moves up and down together with the fixing plate by the elastic force of the spring. Equipped with a magnet 2, the lower ends of the two IC fixing pins 4 are attached to the IC.
Insert it into the two recesses 9 provided at both ends of the
A certain gap 8 is provided between the magnets, and the IC is attracted by the magnet and fixed to the lower end of the IC fixing pin 4. Rotating plates 12 are provided at both ends of the jig body 1, and the rotating plates 12 is provided with a rotating plate fixing pin 13 that prevents or rotates the jig main body 1 by inserting it into or removing it from the rotating plate 12, and grips the IC fixing pin 4 and the IC. The angle between the jig body and the vertical is 50~
The lead wires 11 and 11' on both sides of the IC terminal fixed to the tip of the IC fixing pin 4 are alternately immersed in the solder bath 15 and soldered to the lead wires by rotating and tilting them alternately at 55 degrees. The present invention provides a Dale type IC gripping device used in a continuous IC terminal soldering device.

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a partially omitted sectional view of an embodiment of the IC gripping device of the present invention, and FIG. 6 is a perspective view thereof. FIG. 2 is a plan view of FIG. 1.

In FIG. 1, an IC fixing pin 4 equipped with a spring 5 is attached to a jig main body 1 of an IC gripping device, and an upper rotation stopper fixing plate 7, which is spaced apart from the jig main body 1 by the spring 5, Supported and IC
A magnet 2 is attached to the jig body 1 below the fixing pin 4.
and fix it with the two IC fixing pins 4 across the gap 8.
Insert the IC into the two recesses 9 and 9' (Fig. 5) on both the left and right sides of the IC from the IC magazine 16 (Fig. 6), and secure the IC with the IC fixing pin 4 using the magnet 2.
Fixed to.

In the case of Figure 1, two adjacent IC fixing pins 4
One Dale type IC is supported by

After completing all the processes of the continuous soldering device, to take out the Dale type IC whose lead wires are coated with solder and store it in the IC magazine, press the upper rotation stopper plate 7 downward and the spring 5 will contract to release the magnet. 2 and the IC body 10 widens, the IC body 10 separates from the support of the magnet, falls downward, and is stored in the IC magazine, completing the soldered product.

Figure 3 shows the IC terminal continuous soldering equipment.
The IC gripping device is rotated and tilted at the upper part of the soldering tank, and the IC terminal lead wire is immersed in the solder melting tank, and the IC gripping device of the present invention is shown in a rotating and tilted state for applying solder coating to the IC terminal lead wire. In the partially omitted cross-sectional view of the embodiment, a plurality of lead wires 11, 11' connected to both sides of an IC terminal are vertically connected to A-B or C- in a solder melting bath 15.
The IC is immersed in a solder melting bath at an angle of 50 to 55 degrees as shown in D, so that solder coating is applied from one lead wire of the IC to the other lead wire.

As shown in FIG. 1, by removing the rotating plate fixing pin 13 on the side surface of the IC gripping device from the rotating plate 12 and rotating it, the rotating plate rotates and tilts, and the IC fixing pin 4 for grasping each IC is placed on one side. By tilting the lead wires 11 and 11' on one side of the IC alternately into the solder bath by tilting the lead wires 11 and 11' at an angle of 50 to 55 degrees and then rotating the lead wires 11 and 11' to the opposite side by 50 to 55 degrees to completely connect all the lead wires. A solder coating is applied.

Figure 5 shows an example of a perspective view of one Dil.Tipe IC to which solder coating is applied. A plurality of lead wires 11, 11' protrude horizontally from both sides of the IC, and are arranged at right angles. IC
In order to apply solder coating to the terminal lead wires, as shown above and in Figure 3, each lead wire on one side of the IC is placed in the solder melting bath at a constant angle with respect to the vertical.
By adopting the method of dipping at a rotation angle of 50 to 55 degrees (referred to as rolling soldering method in the present invention), the tip of the IC terminal lead wire is dipped straight into the surface of the solder bath. The advantage is that only the wires are completely coated with solder and the IC body is not affected in any way.

FIG. 4 shows a side view of the tilting device at both ends of FIG.

The effects of the present invention are summarized as follows. In the present invention, since the plurality of lead wires 11, 11' protrude horizontally from both sides of the IC and are bent at right angles, it is extremely difficult to solder the IC lead wires automatically and completely mechanically. The purpose of the present invention can be achieved and its effects achieved by using the IC gripping device of the present invention in order to mechanically, automatically and continuously solder the IC at the lower end.
The IC fixing pin 4 and the upper rotation stopper fixing plate 7, which are attached to the IC, are tilted at 50 to 55 degrees together with the jig main body 1 as they pass through each soldering process, and then the IC is removed from the magnet after soldering. By using the IC gripping device of the present invention, each process of the IC terminal continuous soldering device can be smoothly applied to the IC terminal lead wire. The solder is uniformly coated with no variation between soldered IC products, the quality control of the soldered products is easy, and mass production is possible through continuous production, and the uniformity of soldered products and labor savings are achieved. significantly larger.

[Brief explanation of the drawing]

FIG. 1 is a partially omitted sectional view of an embodiment of the IC gripping device of the present invention, FIG. 2 is a plan view of FIG. 1,
FIG. 3 is a partially omitted cross-sectional view of an embodiment showing the rotating and tilting state of the IC gripping device during the soldering process;
FIG. 4 is a side view of the rotationally inclined portion of the IC gripping device shown in FIG.
FIG. 3 shows a partially omitted perspective view of the gripping device. 1... Jig body, 2... Magnet, 4...
IC fixing pin, 5... Spring, 7... Upper rotation stopper fixing plate, 8... Gap between IC and magnet, 9, 9'... Recess on IC side, 10... IC body, 11, 11'...IC terminal lead wire, 12...
Rotating plate on both sides of IC gripping device, 13... Rotating plate fixing pin, 14, 14'... Stopper, 15... Solder bath, 16... IC magazine.

Claims (1)

[Claims] 1. An IC fixing pin 4 is inserted into a jig main body 1 having holes into which a plurality of IC fixing pins 4 are respectively inserted and supported, and a fixing plate 7 for preventing rotation of the IC fixing pin is provided above the IC fixing pin 4. The IC fixing pin 4 is provided with a spring 5 between the jig body 1 and the fixing plate 7 so that the IC fixing pin 4 moves up and down together with the fixing plate 7 by the elastic force of the spring. A magnet 2 is provided at the lower part of the IC, and the lower ends of the two IC fixing pins 4 are inserted into two recesses 9 provided at both ends of the IC to create a certain gap 8 between the magnets. , the IC is attracted by a magnet and fixed to the lower end of the IC fixing pin 4, and rotating plates 12 are provided at both ends of the jig main body 1.
2 is provided with a rotary plate fixing pin 13 that prevents or rotates the jig main body 1 by being inserted into or removed from the rotary plate 12, and the IC fixing pin 4 and the jig holding the IC are provided. The ingredient body 1 is rotated and tilted alternately at an angle of 50 to 55 degrees with respect to the vertical.
Continuous soldering of IC terminals in which the lead wires 11 and 11' on both sides of the IC terminal fixed to the tip of the IC fixing pin 4 are alternately immersed in the solder bath 15 and soldered to the lead wires. Dale type IC gripping device in the device.