JPS6342858B2 - - Google Patents
Info
- Publication number
- JPS6342858B2 JPS6342858B2 JP16877180A JP16877180A JPS6342858B2 JP S6342858 B2 JPS6342858 B2 JP S6342858B2 JP 16877180 A JP16877180 A JP 16877180A JP 16877180 A JP16877180 A JP 16877180A JP S6342858 B2 JPS6342858 B2 JP S6342858B2
- Authority
- JP
- Japan
- Prior art keywords
- fixing pin
- fixing
- tank
- gripping device
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 238000011282 treatment Methods 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000000605 extraction Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明はIC製品の品質向上、品質管理、省力
化と連続的、自動的、完全機械化による大量生産
を目的とするデイルタイプ（Dil Tipe）IC端子
連続はんだ付け装置（以下単にIC端子連続はん
だ付け装置という。）に関するものである。[Detailed Description of the Invention] The present invention is a Dil Tipe IC terminal continuous soldering device ( (hereinafter simply referred to as an IC terminal continuous soldering device).
本発明に記載のICはすべてデイルタイプ（Dil
Tipe）のものである。 All ICs described in this invention are of the Dil type (Dil
Tipe).
従来IC端子にリード線をはんだ付けするには
IC端子のリード線をいちいち人手ではんだ槽に
浸漬して、はんだ付けを施し、その後の工程もす
べて人手によつて行なわれていたため手数を要
し、はんだ付け作業者による偏りがあり、IC製
品の品質が一定せず、またIC端子リード線には
んだ付けを施した後の洗浄時にはんだ付けされた
リード線が曲り、不良品が発生する欠点があつ
た、またIC製品の品質管理が著しく困難であつ
た。 How to solder lead wires to conventional IC terminals
The lead wires of IC terminals were manually dipped into a solder bath and soldered, and all subsequent processes were done manually, which was time-consuming and caused bias among soldering workers. The quality of the IC terminal lead wires was inconsistent, and when cleaning the IC terminal lead wires after soldering, the soldered lead wires were bent, resulting in defective products.Also, it was extremely difficult to control the quality of IC products. It was hot.
本発明者は上記に鑑み、複数個のICを収容し
た本発明者の発明になる新規なIC把持装置を使
用することによつてIC端子リード線に連続的に
フラツクス処理、ハンダ被覆、水洗、乾燥、溶剤
処理、溶剤乾燥、IC取出しができる装置（本発
明においてはIC端子連続はんだ付け装置と称す
る。）を完成するに至つたものである。即ち本発
明は複数個のIC固定ピン４がそれぞれ嵌挿支持
される穴を設けた治具本体１にIC固定ピン４が
嵌挿され、該IC固定ピン４の上部にはIC固定ピ
ン回転止め固定板７を備え、IC固定ピン４には
治具本体１と該固定板７との間に該固定板７と共
にIC固定ピン４がスプリングの伸縮力によつて
上下運動するスプリングを備え、治具本体１の下
方部にはマグネツトを備え、２個のIC固定ピン
４の下端部をICの両端に設けられた２ケ所の凹
部９に挿入して、マグネツトの間に一定の空隙８
を設けてICがマグネツトによつて吸引されて、
IC固定ピン４の下端部に固着され、治具本体１
の両端部に回転板１２を設けて該回転板１２には
回転板１２に挿入したり又は回転板から抜くこと
によつて治具本体１の回転が阻止されたり又は回
転する回転板固定ピン１３を設け、IC固定ピン
４とICを把持した治具本体１が回転板１２を介
して回転ローラ２９（第８図）によつて左右に垂
直に角度50〜55度を交互に回転傾斜してIC固定
ピンの先端に止着したIC端子の両側面に存在す
るリード線１１，１１′が交互に浸漬されるIC把
持装置がそれぞれの処理を受けて、通過するIC
挿入装置、フラツクス貯槽、回転式ハンダ槽、水
洗槽、乾燥装置、溶剤処理槽、溶剤乾燥装置、
IC製品取出装置の各処理槽及び処理装置を設け、
IC把持装置の両端の駆動部がコンベアによつて
間歇的に作動してIC端子リード線部分がそれぞ
れの処理を受けてIC把持装置が上記の各処理槽
及び処理装置を通過した後ICが再びICマガジン
に取出されて空になつたIC把持装置が循環して
最初のIC挿入装置に戻るそれぞれの装置を備え
たIC端子連続はんだ付け装置を提供するもので
ある。 In view of the above, the present inventor has developed a method of continuously fluxing, soldering, washing, and rinsing IC terminal lead wires by using a novel IC gripping device invented by the present inventor that accommodates a plurality of ICs. We have completed a device (referred to as an IC terminal continuous soldering device in the present invention) that can perform drying, solvent treatment, solvent drying, and IC removal. That is, in the present invention, an IC fixing pin 4 is inserted into a jig main body 1 having holes in which a plurality of IC fixing pins 4 are respectively inserted and supported, and an IC fixing pin rotation stopper is provided on the upper part of the IC fixing pin 4. A fixing plate 7 is provided, and the IC fixing pin 4 is provided with a spring between the jig main body 1 and the fixing plate 7, which allows the IC fixing pin 4 to move up and down together with the fixing plate 7 by the elastic force of the spring. A magnet is provided in the lower part of the tool body 1, and the lower ends of the two IC fixing pins 4 are inserted into two recesses 9 provided at both ends of the IC, and a certain gap 8 is created between the magnets.
is installed, the IC is attracted by the magnet,
It is fixed to the lower end of the IC fixing pin 4, and the jig body 1
A rotating plate 12 is provided at both ends of the rotating plate 12, and the rotating plate fixing pin 13 is inserted into or removed from the rotating plate 12 to prevent the jig main body 1 from rotating or rotated. is provided, and the IC fixing pin 4 and the jig main body 1 holding the IC are rotated and tilted vertically at an angle of 50 to 55 degrees alternately from side to side by a rotating roller 29 (Fig. 8) via a rotating plate 12. The IC gripping device, in which the lead wires 11 and 11' on both sides of the IC terminal fixed to the tip of the IC fixing pin are immersed alternately, undergoes each process and the IC passes through.
Insertion device, flux storage tank, rotary soldering tank, washing tank, drying device, solvent treatment tank, solvent drying device,
Each processing tank and processing device for IC product extraction equipment is installed.
The drive parts at both ends of the IC gripping device are operated intermittently by the conveyor, and the IC terminal lead wire portions undergo their respective processing, and after the IC gripping device passes through each of the processing tanks and processing devices described above, the IC is returned to its original position. To provide an IC terminal continuous soldering device equipped with respective devices in which an empty IC holding device taken out into an IC magazine circulates and returns to the first IC insertion device.
次に本発明を図面によつて詳細説明する。 Next, the present invention will be explained in detail with reference to the drawings.
第６図は本発明の一実施例の本体部分の平面図
のフローシートを示すもので、ICマガジンより
供給された複数個例えば15個のICを収容したIC
把持装置の複数組をチエンコンベアで間歇送りの
IC端子連続はんだ付け装置で、ICは例えば15mm
×30mm×５mmの大きさでその端子の両側に複数個
の厚さが0.6mm程度のリード線を突出させたもの
である。 FIG. 6 shows a flow sheet of a plan view of the main body of an embodiment of the present invention, and shows an IC containing a plurality of ICs, for example, 15 ICs, supplied from an IC magazine.
Multiple sets of gripping devices are fed intermittently using a chain conveyor.
With IC terminal continuous soldering equipment, IC is 15mm, for example.
It has a size of 30 mm x 5 mm and has a plurality of lead wires approximately 0.6 mm thick protruding from both sides of the terminal.
第６図のフローシートはIC把持装置２８に別
に設けたICマガジンより複数個のICを挿入１６
し、ついでモーター２４によつてプーリ２５，２
５′を回転せしめて、IC把持装置２８の両端の駆
動部が作動して、IC把持装置がフラツクス槽１
７、はんだ槽１８、水洗部１９，２０、乾燥部２
１、溶剤処理部２２、溶剤乾燥部、IC取出部２
３の処理槽及び処理部よりなる処理装置にそれぞ
れ左右交互に50〜55度傾斜することによつて間歇
的にそれぞれのICが左右交互に垂直に対して50
〜55度傾斜して送られてIC端子リード線が各処
理槽に浸漬して処理を受け最後の工程からIC端
子リード線に、はんだ被覆されたIC製品がICマ
ガジンに取出され、ついで空になつたIC把持装
置が一回転して最初のIC挿入工程１６へセツト
される。 The flow sheet shown in FIG.
Then, the motor 24 drives the pulleys 25 and 2.
5', the driving parts at both ends of the IC gripping device 28 operate, and the IC gripping device moves into the flux tank 1.
7. Solder bath 18, washing section 19, 20, drying section 2
1. Solvent processing section 22, solvent drying section, IC extraction section 2
By tilting the processing equipment consisting of the processing tank and processing section of 3 at an angle of 50 to 55 degrees alternately on the left and right, each IC is intermittently tilted at an angle of 50 to 55 degrees with respect to the vertical on the left and right alternately.
The IC terminal lead wires are fed at an angle of ~55 degrees and are immersed in each treatment tank for treatment.From the final process, the solder-coated IC products are taken out into the IC magazine and then emptied into IC terminal lead wires. The exhausted IC gripping device rotates once and is set to the first IC insertion step 16.
IC端子が各処理槽に浸漬される場合、各処理
槽が浸漬を充分ならしめるため上下運動するよう
にしてもよい。 When the IC terminal is immersed in each processing tank, each processing tank may be moved up and down to ensure sufficient immersion.
次にIC把持装置２８について、その一実施例
の部分断面図を第１図に示す如く、IC固定ピン
４を止着可能な複数個の穴を設けた治具本体１に
スプリング５を備えたIC固定ピン４を挿入して
治具本体１の下方にマグネツトの磁力によつて固
定し、空隙８を設けてIC固定ピン４の先端をIC
の両側部の凹部９，９′に挿入してIC１０をマグ
ネツト２によつて２個のIC固定ピン４の下端に
固定する。IC固定ピン４の上方にIC固定ピン４
の回転止め固定板７を設け、各IC固定ピン４に
備えたスプリング５によつて上下運動が自在に、
治具本体１に支持されるようになし、治具本体１
の両端部には回転板１２を設け、回転板固定ピン
１３によつて回転板１２の回転を阻止し、この回
転板固定ピン１３を回転板１２より抜くことによ
つて、回転板１２を回転させ、回転板１２に固着
されたIC固定ピン４とICとを把持した治具本体
１が左右に回転傾斜してIC端子の両端面のリー
ド線１１，１１′が交互にはんだ槽に浸漬される
ことによつてリード線１１，１１′にはんだ付け
が施される。 Next, regarding the IC gripping device 28, as shown in FIG. 1, which is a partial cross-sectional view of an embodiment thereof, a jig body 1 is provided with a spring 5 and a jig body 1 is provided with a plurality of holes to which IC fixing pins 4 can be fixed. Insert the IC fixing pin 4 and fix it under the jig main body 1 by the magnetic force of the magnet, create a gap 8, and attach the tip of the IC fixing pin 4 to the IC.
The IC 10 is inserted into the recesses 9 and 9' on both sides of the IC 10 and fixed to the lower ends of the two IC fixing pins 4 by the magnet 2. IC fixing pin 4 above IC fixing pin 4
A rotation stopper fixing plate 7 is provided, and each IC fixing pin 4 is provided with a spring 5 that allows for free vertical movement.
The jig body 1 is supported by the jig body 1.
A rotary plate 12 is provided at both ends of the rotary plate 12, and rotation of the rotary plate 12 is prevented by a rotary plate fixing pin 13. By removing the rotary plate fixing pin 13 from the rotary plate 12, the rotary plate 12 can be rotated. Then, the jig body 1 holding the IC and the IC fixing pin 4 fixed to the rotary plate 12 is rotated and tilted left and right, so that the lead wires 11 and 11' on both end faces of the IC terminal are alternately dipped into the solder bath. By doing this, the lead wires 11, 11' are soldered.
第１図の場合は相隣れる２個のIC固定ピン４
によつて１個のICが支持されている。 In the case of Figure 1, two adjacent IC fixing pins 4
One IC is supported by
第２図は第１図の平面図、第３図ははんだ付け
槽の工程におけるIC把持装置の傾斜状態を示し
たものでIC把持装置が左右交互にＡ−Ｂ線又は
Ｃ−Ｄ線まで50〜55゜傾斜してIC端子リード線が
はんだ槽に浸漬されリード線にはんだ被覆が完全
に施されることを示したものである。 Figure 2 is a plan view of Figure 1, and Figure 3 shows the tilted state of the IC gripping device during the soldering bath process. This shows that the IC terminal lead wire is immersed in the solder bath at an angle of ~55°, and the solder coating is completely applied to the lead wire.
第４図は第１図側面の回転板１２部分を示した
側面図で１３は回転板固定ピン、１４，１４′は
回転板のストツパーである。 FIG. 4 is a side view showing the rotary plate 12 portion on the side surface of FIG. 1, and 13 is a rotary plate fixing pin, and 14 and 14' are rotary plate stoppers.
IC固定ピン４を支持した治具本体１がストツ
パー１４，１４′まで、即ち（Ａ−Ｂ）又は（Ｃ
−Ｄ）（第３回）の角度まで傾斜しIC端子リード
線部分がはんだ槽中に浸漬される。 When the jig body 1 supporting the IC fixing pin 4 reaches the stopper 14, 14', that is, (A-B) or (C
-D) (Third time) The IC terminal lead wire portion is immersed in the solder bath.
第５図ははんだ付けが施される１個のICの斜
視図の一例を示すもので複数個のIC端子リード
線１１，１１′がIC１０の両側面から水平に突出
し、直角に曲げられているため、IC端子リード
線にはんだ付けを施すためにははんだ溶融槽中に
上記及び第３図に示す如く、ICの片方のリード
線ごとに交互に一定角度例えば50〜55゜回転傾斜
して浸漬する方法（本発明においてはローリング
はんだ付け法という）を採用することによつて始
めてIC端子リード線の先端部からはんだ槽の面
に真直に浸漬され、リード線のみに完全にはんだ
付けが施され、IC本体には何等影響を及さない
利点がある。このことは本発明におけるフラツク
ス槽１７、水洗１９，２０、溶剤処理２２におい
ても全く同様である。 FIG. 5 shows an example of a perspective view of one IC to be soldered. A plurality of IC terminal lead wires 11, 11' protrude horizontally from both sides of the IC 10 and are bent at right angles. Therefore, in order to solder the IC terminal lead wires, as shown above and in Figure 3, each lead wire of the IC is immersed in the solder melting tank at a fixed angle, for example, 50 to 55 degrees. By adopting a method (referred to as rolling soldering method in the present invention), the tip of the IC terminal lead wire is dipped straight into the surface of the solder bath, and only the lead wire is completely soldered. , which has the advantage of not affecting the IC itself in any way. This also applies to the flux tank 17, water washing 19, 20, and solvent treatment 22 in the present invention.
このことはフラツクス貯槽１７、水洗槽１９，
２０、溶剤処理槽２２においても同様である
本発明は本発明者の発明になる上記ローリング
はんだ付け法によるIC端子連続はんだ付け装置
を使用することによつてIC端子のリード線に完
全にはんだ付けが施され、作業の完全な一貫作業
の機械装置による連続化と自動化がなされる。そ
のためIC製品の大量生産が可能となり省力化が
大で製品の品質のバラツキが著しく少なく、品質
管理が容易で、IC製品の品質が安定する数々の
利点がある。 This means that the flux storage tank 17, the washing tank 19,
20. The same applies to the solvent treatment tank 22.The present invention is accomplished by completely soldering the lead wires of IC terminals by using the IC terminal continuous soldering device using the rolling soldering method described above, which is an invention of the present inventor. The entire line of work will be serialized and automated using mechanical equipment. This makes it possible to mass-produce IC products, resulting in large labor savings, significantly less variation in product quality, easy quality control, and stable quality of IC products, which has many advantages.
第１図は本発明に使用されるIC把持装置の一
実施例の一部省略された断面図、第２図は第１図
の平面図、第３図ははんだ付け工程のIC把持装
置の回転傾斜状態を示す一実施例の一部省略され
た断面図、第４図は第１図のIC把持装置の回転
傾斜部分の側面図、第５図は端子にリード線を備
えたデイルタイプIC1個の斜視図、第６図は本発
明の一実施例の本体部分の平面図、第７図は第６
図の側部駆動部の一部省略された側面図第８図は
本発明のIC把持装置の一部省略した斜視図を示
す。
１……治具本体、２……マグネツト、４……
IC固定ピン、５……スプリング、７……上部回
転止め固定板、８……ICとマグネツトとの空隙、
９，９′……IC側面の凹所、１０……IC、１１，
１１′……IC端子リード線、１２……IC把持装置
両側面の回転板、１４……回転板固定ピン、１
４，１４′……ストツパー、１５……はんだ槽、
１６……IC挿入工程、１７……フラツクス貯槽、
１８……はんだ付工程、１９，２０……水洗工
程、２１……乾燥工程、２２……溶剤処理工程、
２３……溶剤乾燥IC取出し工程、２４……モー
ター、２５，２５′……チエンコンベアによる駆
動ブーリー、２６，２６′……IC把持装置の両端
駆動部、２７……チエインコンベア、２８……
IC把持装置、２９……IC把持装置両側面の回転
板１２を回転せしめる回転ローラ。
Fig. 1 is a partially omitted sectional view of an embodiment of an IC gripping device used in the present invention, Fig. 2 is a plan view of Fig. 1, and Fig. 3 is a rotation of the IC gripping device during the soldering process. A partially omitted cross-sectional view of one embodiment showing the tilted state, FIG. 4 is a side view of the rotationally tilted portion of the IC gripping device of FIG. 1, and FIG. 5 is one Dale type IC with a lead wire on the terminal. FIG. 6 is a plan view of the main body of an embodiment of the present invention, and FIG.
FIG. 8 is a partially omitted side view of the side drive unit shown in the figure. FIG. 8 shows a partially omitted perspective view of the IC gripping device of the present invention. 1... Jig body, 2... Magnet, 4...
IC fixing pin, 5... Spring, 7... Upper rotation stopper fixing plate, 8... Gap between IC and magnet,
9, 9'...Recess on IC side, 10...IC, 11,
11'...IC terminal lead wire, 12...Rotating plate on both sides of IC gripping device, 14...Rotating plate fixing pin, 1
4, 14'...stopper, 15...solder bath,
16...IC insertion process, 17...flux storage tank,
18...Soldering process, 19,20...Water washing process, 21...Drying process, 22...Solvent treatment process,
23...Solvent drying IC removal process, 24...Motor, 25, 25'...Drive booley by chain conveyor, 26, 26'...Both end drive section of IC gripping device, 27...Chain conveyor, 28...
IC gripping device, 29...Rotating roller that rotates the rotary plates 12 on both sides of the IC gripping device.
Claims (1)
される穴を設けた治具本体１にIC固定ピン４が
嵌挿され、該IC固定ピン４の上部にはIC固定ピ
ン回転止め固定板７を備え、IC固定ピン４には
治具本体１と該固定板７との間に該固定板７と共
にIC固定ピン４がスプリングの伸縮力によつて
上下運動するスプリングを備え、治具本体１の下
方部にはマグネツトを備え、２個のIC固定ピン
４の下端部をICの両端に設けられた２ケ所の凹
部９に挿入して、マグネツトの間に一定の空隙８
を設けてICがマグネツトによつて吸引されて、
IC固定ピン４の下端部に固着され、治具本体１
の両端部に回転板１２を設けて該回転板１２には
回転板１２に挿入したり又は回転板から抜くこと
によつて治具本体１の回転が阻止されたり又は回
転する回転板固定ピン１３を設け、IC固定ピン
４とICを把持した治具本体１が回転ローラを介
して回転ローラによつて左右に垂直に角度50〜55
度を交互に回転傾斜してIC固定ピンの先端に止
着したIC端子の両側面に存在するリード線１１，
１１′が交互に浸漬されるIC把持装置がそれぞれ
の処理を受けて、通過するIC挿入装置、フラツ
クス貯槽、回転式ハンダ槽、水洗槽、乾燥装置、
溶剤処理槽、溶剤乾燥装置、IC製品取出装置の
各処理槽及び処理装置を設け、IC把持装置の両
端の駆動部がコンベアによつて間歇的に作動して
IC端子リード線部分がそれぞれの処理を受けて
IC把持装置が上記の各処理槽及び処理装置を通
過した後ICが再びICマガジンに取出されて空に
なつたIC把持装置が循環して最初のIC挿入装置
に戻るそれぞれの装置を備えたことを特徴とする
IC端子連続はんだ付け装置。1. An IC fixing pin 4 is inserted into a jig main body 1 having holes into which a plurality of IC fixing pins 4 are respectively inserted and supported, and a fixing plate 7 for preventing rotation of the IC fixing pin is provided above the IC fixing pin 4. The IC fixing pin 4 is provided with a spring between the jig body 1 and the fixing plate 7 so that the IC fixing pin 4 moves up and down together with the fixing plate 7 by the elastic force of the spring. A magnet is provided at the lower part of the IC, and the lower ends of the two IC fixing pins 4 are inserted into two recesses 9 provided at both ends of the IC to create a certain gap 8 between the magnets.
is installed, the IC is attracted by the magnet,
It is fixed to the lower end of the IC fixing pin 4, and the jig body 1
A rotating plate 12 is provided at both ends of the rotating plate 12, and the rotating plate fixing pin 13 is inserted into or removed from the rotating plate 12 to prevent the jig main body 1 from rotating or rotated. The IC fixing pin 4 and the jig body 1 holding the IC are rotated vertically to the left and right by the rotating roller at an angle of 50 to 55 degrees.
Lead wires 11 on both sides of the IC terminal fixed to the tip of the IC fixing pin by rotating and tilting the angle alternately,
The IC gripping device 11' is alternately immersed in each process and passes through the IC insertion device, the flux storage tank, the rotary soldering tank, the washing tank, the drying device,
Each processing tank and processing device, including a solvent processing tank, a solvent drying device, and an IC product take-out device, are installed, and the driving parts at both ends of the IC gripping device are operated intermittently by a conveyor.
The IC terminal lead wire part has undergone various treatments.
After the IC gripping device passes through each of the processing tanks and processing devices mentioned above, the IC is taken out into the IC magazine again, and the empty IC gripping device circulates and returns to the first IC insertion device. characterized by
IC terminal continuous soldering equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16877180A JPS5792889A (en) | 1980-11-29 | 1980-11-29 | Device for continuously soldering ic terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16877180A JPS5792889A (en) | 1980-11-29 | 1980-11-29 | Device for continuously soldering ic terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5792889A JPS5792889A (en) | 1982-06-09 |
| JPS6342858B2 true JPS6342858B2 (en) | 1988-08-25 |
Family
ID=15874145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16877180A Granted JPS5792889A (en) | 1980-11-29 | 1980-11-29 | Device for continuously soldering ic terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5792889A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61189869A (en) * | 1985-02-18 | 1986-08-23 | Tamura Seisakusho Co Ltd | Soldering machine |
-
1980
- 1980-11-29 JP JP16877180A patent/JPS5792889A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5792889A (en) | 1982-06-09 |
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