JPS634352B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat pipe type heat sink in which a heating part and a heat radiation part are divided along the circumferential direction of the heat pipe.

Conventionally, the first heat sink for cooling semiconductors.
A heat pipe type heat sink as shown in the figure is used.

A heating element mounting block 2 is provided in close contact with one end of a heat pipe 1 to form a heating section 3.
A heat dissipation section 5 is formed by attaching a fin 4 to the other end.

However, since the heat sink having the above structure has the heating section 3 and the heat radiation section 5 formed along the longitudinal direction of the heat pipe 1, the overall length becomes long. Particularly in recent years, structures in which a plurality of semiconductors are attached have come into widespread use, and in this case, as shown in FIG. Since the heating parts 3 are formed in a plurality of places by attaching the heat pipe 1 to the heat pipe 1, the ratio of the heating parts 3 to the heat pipe 1 increases, resulting in an increase in the size of the entire device.

The present invention has been developed as a result of various studies in view of the above points, and has been developed to provide a heat pipe with multiple heating parts by changing the heat transfer direction, which was conventionally limited to the longitudinal direction of the heat pipe, to the circumferential direction as well. We have developed a heat pipe type heat sink that is smaller in size.

The present invention will be described in detail below with reference to embodiments shown in the drawings.

3 and 4 show an embodiment of the present invention, in which a heat generating element mounting block 6 has a groove 7 having a semicircular cross section along its longitudinal direction on the top surface of a rectangular parallelepiped metal block. It is formed. The heat pipe 1 is constructed by attaching a mesh (not shown) to the inner wall of a metal tube in close contact with the heat pipe, and reducing the pressure inside the heat pipe to seal in a working fluid.

Reference numeral 4 denotes a rectangular fin, and the lower part of the fin 4 is bent at a right angle to form a flange 8.
The center of the heat pipe 1 is curved into a semicircular shape with an inner diameter approximately equal to the outer diameter of the heat pipe 1.

Reference numeral 9 denotes a holding plate, which is formed by bending both longitudinal ends of a rectangular metal plate, and has slit-shaped insertion holes 10 opened at a predetermined pitch in the center thereof, through which the fins 4 are passed. A holding part 11 having a semicircularly curved central part is formed between the insertion holes 10.

Next, to briefly explain the assembly method, the presser plate 9 is reversed from the state shown in FIG. presser part 11
and the flange 8 of the fin 4 are overlapped. With the fins 4 attached to the three presser plates 9 in this way,
Position and arrange at predetermined intervals. Next, tsuba part 8
The heat pipe 1 is fitted into the semicircularly curved part of the heat pipe 1, and the concave grooves 7 of the three heating element mounting blocks 6 are overlapped on the opposite side of the protrusion in correspondence with the presser plate 9, and then the heat pipe 1 is turned over. Undo. Next, the holding plate 9 that holds the flange 8 of the fin 4 and the heating element mounting block 6 placed opposite thereto are fixed with screws 12, and a heat pipe type heat sink as shown in FIG. 4 is assembled. It is something.

In the heat pipe type heat sink assembled in this way, the heating element mounting block 6 is connected to the heat pipe 1.
In this structure, three heating parts 3 are attached along the longitudinal direction to form three heating parts 3, and a heat dissipation part 5 with fins 4 provided on the outer periphery on the opposite side along the circumferential direction from the heating part 3 is formed. Therefore, heat generated from the semiconductor is transmitted to the heating section 3 of the heat pipe 1 through the heating element mounting block 6, where the working fluid inside the heating section 3 evaporates, and this vapor is released in the circumferential direction of the heat pipe 1. Then, it moves in the longitudinal direction and touches the inner wall surface of the heat radiation part 5 cooled by the fins 4, where it releases latent heat of condensation and condenses. The combined working fluid returns to the heating section 3 side by the capillary action of the mesh, and the same action is repeated thereafter to cool the semiconductor.

Therefore, according to the heat pipe type heat sink having the above structure, a plurality of heating parts 3 are formed in the heat pipe 1, and a heat radiation part 5 is provided with fins 4 on the outer periphery on the opposite side along the circumferential direction from the heating parts 3. are formed, respectively, so that the space outside the heating section 3 can be used more effectively than in the conventional structure shown in FIG. 2, and the device can be made more compact.

Furthermore, according to the above embodiment, the fins 4 can be easily attached, and the slit-shaped insertion holes 1 of the presser plate 9 can be easily attached.
The fin pitch can be adjusted just by inserting it into the 0 position, making it easy to assemble.

5 and 6 show other embodiments of the invention. In this heat pipe type heat sink, a heat pipe 1 is press-fitted into a fin 4 having a circular insertion hole 13 to form a group of three fins, which serve as a heat dissipation section 5. Comb tooth-shaped heating element mounting blocks 14 are mounted on the heat pipes 1 at the portions of the heat pipes 1 with their mounting directions changed by 90 degrees, and fixed with a thermally conductive adhesive. The comb tooth-shaped heating element mounting block 14 has a groove 7 having a semicircular cross section in which the heat pipe 1 is partially fitted, formed on one surface of the metal block, and a groove 7 extending along the longitudinal direction of the surface in which the groove 7 is formed. , a plurality of notches 15 are formed to match the fin pitch.

The structure described above is suitable for application to a heat sink in which semiconductors are attached in different directions.

As explained above, according to the heat pipe type heat sink according to the present invention, the heat transfer direction of the heat pipe provided with a plurality of heating parts can be carried out in both the circumferential direction and the longitudinal direction, thereby reducing the external space of the heating part. It can be used effectively and the device can be made smaller.

[Brief explanation of the drawing]

1 and 2 are front views showing different conventional heat pipe heat sinks, FIG. 3 is an exploded perspective view of a heat pipe heat sink according to an embodiment of the present invention, and FIG. 4 is an assembled view. FIG. 5 is a front view showing another embodiment of the present invention, and FIG. 6 is a left side view of FIG. 5. 1... Heat pipe, 2, 6, 14... Heating element mounting block, 3... Heating section, 4... Fin,
5... Heat dissipation part, 7... Concave groove, 8... Flam part, 9...
Holding plate, 15... cut portion.

Claims (1)

[Claims] 1 A heating section is formed with heating element mounting blocks attached to multiple locations on the outer periphery of the heat pipe along the longitudinal direction, and a heat radiating section is provided with fins on at least the outer periphery on the opposite side along the circumferential direction of the heating section. A heat pipe type heat sink formed by forming.