JPH0143239B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat pipe type heat sink having a heating section and a heat radiation section in the circumferential direction of the heat pipe.

In general, a heat pipe is a metal tube in which the pressure inside the heat pipe element is reduced and a working fluid is sealed in. One longitudinal end serves as a heating section and the other end serves as a heat dissipation section, and heat is generated by the rapid movement of the vapor of the working fluid. It transfers heat from the heat sink to the heat sink.

Such heat pipes are used in various heat generating and cooling devices, but for example, when used as a heat sink (radiator) for a semiconductor, a conventional heat sink is configured as shown in Figure 1. .

In this structure, one end of a heat pipe 1 serves as a heating section 2, to which a heating element mounting block 3 is closely connected, and the other end serves as a heat radiating section 4, to which a plurality of fins 5 are attached.

However, in the heat sink having the above structure, the heating section 2 and the heat dissipating section 4 are formed along the longitudinal direction of the heat pipe 1, so the overall length becomes long. Particularly in recent years, devices with a structure in which a large number of semiconductors are attached have come into widespread use, but in this case, the proportion of the heating section 2 in the heat pipe 1 increases, resulting in the problem of increasing the size of the entire device. .

As a result of various studies in view of the above, the present invention aims to reduce the size of a heat sink using a heat pipe by changing the direction of heat transfer from the conventional longitudinal direction to the circumferential direction. It is.

That is, along the longitudinal direction of the heat pipe, fins are attached at predetermined pitches, and comb-like blocks with recesses formed in areas corresponding to the fin positions are arranged so that the recesses of the blocks surround the fins. This is a heat pipe type heat sink characterized in that the heat pipe is inserted into the heat pipe and is attached so as to fit into approximately the lower half of the outer periphery of the heat pipe.

Hereinafter, the present invention will be explained in detail with reference to embodiments shown in the drawings.

FIGS. 2 and 3 show an embodiment in which a heat sink is assembled using the heat pipe of the present invention.

This heat sink has, for example, square fins 5 attached at predetermined pitches along the longitudinal direction of a heat pipe 1, and is attached and fixed to a comb-like heating element mounting block 6 with a presser plate 7.

The fin 5 is formed of a copper plate, an aluminum plate, etc., and has a circular insertion hole 8 approximately in the center thereof.
An annular protrusion 9 is formed on the periphery of this insertion hole 8, and the heat pipe 1 is integrally connected to this insertion hole 8 by a processing method such as press fitting or tube expansion.

Further, the heating element mounting block 6 has a groove 10 having a semicircular cross section formed on the upper surface of a metal block made of copper, aluminum, etc., similar to the fin 5, and vertical cuts 11 along the longitudinal direction to match the fin pitch.
It is formed into a comb tooth shape.

In addition, the heat pipe 1 is made by attaching a mesh 13 having a capillary action to the inner surface of a heat pipe base tube 12 such as a copper tube or an aluminum tube, or providing a surface with grooves processed in groups, and reducing the pressure inside the mesh wick 13. A hydraulic fluid 14 is sealed therein.

In the above heat sink, as shown in FIG.
Approximately half of the lower part in the circumferential direction of the heat pipe 1 that is inserted into the heat pipe 1 and comes into contact with the block 6 becomes the heating part 2;
The other part becomes a heat radiating part 4, and fins 5 are attached to this heat radiating part 4 at a predetermined pitch.

Therefore, in the heat sink having the above structure, a semiconductor (not shown) is attached to the heating element attachment block 6, and
The heat generated from this semiconductor is transmitted to the heating section 2 of the heat pipe 1 through the heating element mounting block 6. Here, the working fluid 14 inside the heating section 2 evaporates, and this evaporation moves in the circumferential direction of the heat pipe 1 and touches the inner wall surface of the heat dissipation section 4 cooled by the fins 5, where the condensed latent heat is generated. is released and reconstituted. The condensed working fluid 14 moves in the circumferential direction due to the capillary action of the wick 13 such as a mesh, returns to the heating section 2, and thereafter the same action is repeated to cool the semiconductor and the like.

In this structure, along the longitudinal direction of the heat pipe 1, most of the lower half of the outer circumference becomes the heating part 2, and the entire upper half becomes the heat radiation part 4, and the direction of heat transfer is mainly the heat pipe. It is carried out along the circular direction.

Therefore, in the heat sink shown in FIG. 2, the heating section 2 and the heat dissipating section 4 are formed in the circumferential direction of the heat pipe 1, so that the direction of heat transfer is in the circumferential direction, instead of the conventional longitudinal direction. Compared to a heat sink that transfers heat only through the heat sink, the space around the heating section can be used more effectively, and the device can be made more compact. Needless to say, if there is a limit to the amount of heat transport, a heat pipe material tube with an appropriate large circumferential area may be used.

In the above embodiment, the heat pipe 1 has a structure in which the fins 5 are attached to the heat dissipation part 4 of the heat pipe 1 having a circular cross section. have an effect.

As explained above, according to the heat pipe type heat sink according to the present invention, since the heating part and the heat radiation part are provided in the circumferential direction of the heat pipe, heat can be transferred in the circumferential direction, and especially in the heat radiation part. The structure in which the fins are attached makes it possible to effectively utilize the external space of the heating section, thereby making it possible to downsize the device.

[Brief explanation of drawings]

FIG. 1 is a front view of a heat sink using a conventional heat pipe, FIG. 2 is a front view of a heat sink using a heat pipe according to the present invention, and FIG. 3 is a sectional view taken along the line -- in FIG. 1... Heat pipe, 2... Heating section, 3, 6...
... Heating element mounting block, 4... Heat dissipation section, 5...
Fin, 10...concave groove, 11...notch, 12...
... heat pipe raw tube, 13 ... mesh, 14 ... working fluid.

Claims (1)

[Claims] 1 Attach the fins at a predetermined pitch along the longitudinal direction of the heat pipe, and insert a comb-tooth-shaped block with a recess formed in a portion corresponding to the fin position so that the recess of the block surrounds the fin. 1. A heat pipe type heat sink, characterized in that the heat pipe is inserted into the heat pipe and is attached so as to fit into approximately the lower half of the outer periphery of the heat pipe.