JPS6356199B2 - - Google Patents
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- Publication number
- JPS6356199B2 JPS6356199B2 JP58135136A JP13513683A JPS6356199B2 JP S6356199 B2 JPS6356199 B2 JP S6356199B2 JP 58135136 A JP58135136 A JP 58135136A JP 13513683 A JP13513683 A JP 13513683A JP S6356199 B2 JPS6356199 B2 JP S6356199B2
- Authority
- JP
- Japan
- Prior art keywords
- molecular beam
- crystal
- intensity ratio
- beam intensity
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/002—Controlling or regulating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
この発明は分子線結晶成長法による高品質のア
ルミニウム・ガリウム・砒素(AlGaAs)結晶の
製造方法に関するものである。
AlGaAsはGaAsよりも禁制帯幅を広くするこ
とができ、屈折率も小さいので、GaAsとヘテロ
接合して半導体レーザを構成しているが、レーザ
の特性を高めるために非発光中心が少ない高品質
のAlGaAs結晶が要求されている。
上述のAlGaAs結晶を製造する分子線結晶成長
装置の一例を第1図により説明すると、超高真空
槽12の中にはGaAs基板結晶1がモリブデン製
のブロツク2にインジウムにより貼りつけられて
おり、ブロツク2の裏面に設けられたヒーター3
により、基板はブロツクを介して加熱される。ブ
ロツク2の裏面には更に熱電対4が設けられ、ブ
ロツクの裏面温度によりヒーター3の加熱温度を
制御する。基板1の直面する真空槽12の内周面
にはAs,Ga,Alなどの母材材料蒸発源5,6,
7とBe,Siなどの不純物材料蒸発源8,9が設
けられ、母材材料、不純物を加熱、蒸発もしくは
昇華させる。それぞれの蒸発源の蒸発口にはシヤ
ツターが設けられ、シヤツターの開かれた蒸発口
より蒸発、昇華した分子は発射され、加熱された
基板へ入射し基板上で結晶が成長する。発射され
る分子線の強度は各蒸発源の加熱温度により制御
される。
上述の分子線結晶成長において、Al,Ga及び
Asの分子線強度割合が適切であり、基板の加熱
温度が適温であれば、結晶性の良いAlGaAs単結
晶が成長するが、これまで高品質の結晶が形成す
る具体的な成長条件を検知する方法は知られてい
なかつた。即ち、基板の温度は熱電対または放射
温度計によつて測定されているが、実際の結晶が
成長する基板表面の温度はいずれの場合も正確に
知ることができず、結晶成長条件などによつて、
基板表面温度は微妙に変るため推定することも困
難であつて、熱電対、放射温度計の測定値を結晶
成長条件のパラメータとして用い得なかつた。ま
た分子線強度比と結晶の品質の関係については、
Appl.Phys.Lett.39(6)、(1981)pp486−487におい
て、分子線強度比As/Gaを低い場合とその8倍
とに変えて成長した結晶の光ルミネセンスのスペ
クトルを測定し、強度比が低い場合にバンドエツ
ジエミツシヨンが観測されるので品質の高い結晶
が得られるとしている。しかしこの場合の分子線
強度比はAsリツチの条件であるとしており、具
体的な条件は明らかにされていない。
また、J.Appl.Phys.52(9)、(1981)p5792におい
て、分子線強度比As/(Al+Ga)を〜10と大き
くすると光ルミネセンスのスペクトルから評価さ
れる結晶の品質は悪く、分子線強度比が2のとき
最も良いスペクトルが得られるとしているが、具
体的な成長条件、正確な基板表面温度などが示さ
れておらず、再現性に乏しかつた。
このようにこれまで高品質のAlGaAs結晶が得
られる具体的な成長条件をこれまで同定すること
ができず、経験的に得られた成長条件に基いて結
晶成長を行つていたが、再現性が乏しく成長条件
などが少しでも変ると、形成する結晶の品質に影
響を与え、高品質のAlGaAs結晶が高収率で製造
できなかつた。
この発明の目的は光学的にも電気的にも特性の
優れた高品質のAlGaAs結晶を分子線結晶成長法
にて再現性良く製造する方法を提供することにあ
る。
AlGaAs結晶の成長中に基板表面に電子線を照
射して回折像を観察すると、回折像と結晶成長条
件及び形成した結晶の品質との間に明確な相関関
係があることが判り、観察された回折像によつて
高品質のAlGaAs結晶が得られる条件を特定する
ことができることを見出し、この発明を完成し
た。
分子線結晶成長において、形成するAlGaAs結
晶の品質を左右する主たる成長条件としては上述
の如く、Asに対するAlとGaの分子線強度比と基
板温度である。
第2図はGaAs基板温度を750℃として成長し
たAlGaAs結晶からの光ルミネンスのスペクトル
を示し、第2図aはAsの分子線強度と、AlとGa
を加えた分子線強度比As/(Al+Ga)を3.4とし
て成長した結晶のスペクトルであり、第2図bは
上記の分子線強度比を1.0として成長した結晶の
スペクトルであり、それぞれの矢印で示したピー
クは束縛励起子による発光ピークである。この発
光ピークの幅は狭く、強度は大きい程、欠陥が少
なく、光学的な品質の高い結晶ということができ
る。従つて、第2図より分子線の強度比を3.4か
ら1.0と小さくすると、結晶の品質が向上する傾
向を示すことが判る。
尚、本明細書で用いる基板温度とは基板を貼付
したモリブデン製ブロツクの裏面に熱電対を圧接
して測定した温度を意味し、分子線強度は結晶成
長時の基板の位置にイオンゲージを置き分圧を測
定して、式(1)により求めた値である。
式中、xは分子の種類、Pxは分圧、Txは蒸発
源の温度、Mxは1モル当りの分子の重さ、ηxは
N2のイオン化率を1としたときの分子xのイオ
ン化率で経験的に式(2)で与えられることが知られ
ている。
ηx=0.6ΣZ/14+0.4 ……(2)
式中、Zは原子数で、ΣZは分子xを構成する
原子の原子数の総和を意味する。また、分子線強
度比はJAs4/(JGa+JAl)を意味する。
第3図はGaAs基板温度と分子線強度比を種々
変えて成長したAlGaAs結晶からの束縛励起子の
発光強度の相対値を示したグラフである。第3図
のグラフより基板温度を高くする程束縛励起子の
発光強度が増加し、また同じ基板温度でもAs/
(Al+Ga)の分子線強度比が小さい程束縛励起子
の発光強度が増加することが判る。そして、基板
温度が720℃と750℃の場合は分子線強度比が1.0
のとき、基板温度が780℃の場合は分子線強度比
が2.5附近のとき最も高い発光強度が得られる。
しかし更に分子線強度比を小さくすると、結晶表
面にAl,Gaが単体で析出し、結晶性の劣化を生
じる傾向を示す。
上記よりAlGaAs結晶の成長条件を基板温度が
約750℃のときは分子線強度比を1.0附近とし、基
板温度を上昇するにつれて分子線強度比を大きく
して、基板温度が780℃近傍のとき分子線強度比
が2.5附近となるような範囲とすることにより品
質の優れたAlGaAs結晶が成長することゝなる。
上述の束縛励起子の発光強度測定で高品質の結
晶と判定された試料のホール移動度と自由電子の
濃度を測定した結果は次表の如くであつた。
This invention relates to a method for producing high quality aluminum-gallium-arsenic (AlGaAs) crystals using molecular beam crystal growth. AlGaAs can have a wider forbidden band width than GaAs and has a smaller refractive index, so it is used in a heterojunction with GaAs to form a semiconductor laser, but in order to improve the laser characteristics, it is of high quality with fewer non-emissive centers. AlGaAs crystals are required. An example of a molecular beam crystal growth apparatus for manufacturing the above-mentioned AlGaAs crystal will be explained with reference to FIG. 1. In an ultra-high vacuum chamber 12, a GaAs substrate crystal 1 is attached to a molybdenum block 2 using indium. Heater 3 installed on the back of block 2
The substrate is heated through the block. A thermocouple 4 is further provided on the back surface of the block 2, and the heating temperature of the heater 3 is controlled by the temperature of the back surface of the block. On the inner peripheral surface of the vacuum chamber 12 facing the substrate 1, there are base material evaporation sources 5, 6, such as As, Ga, Al, etc.
7 and impurity material evaporation sources 8 and 9 such as Be and Si are provided to heat, evaporate, or sublimate the base material and impurities. A shutter is provided at the evaporation port of each evaporation source, and the evaporated and sublimated molecules are ejected from the evaporation port that is opened and incident on the heated substrate, where crystals grow on the substrate. The intensity of the emitted molecular beam is controlled by the heating temperature of each evaporation source. In the above molecular beam crystal growth, Al, Ga and
If the molecular beam intensity ratio of As is appropriate and the heating temperature of the substrate is appropriate, AlGaAs single crystals with good crystallinity will grow, but until now it has not been possible to detect the specific growth conditions for forming high-quality crystals. The method was unknown. In other words, although the temperature of the substrate is measured using a thermocouple or a radiation thermometer, the temperature of the substrate surface where the actual crystal grows cannot be accurately known in either case, and depends on the crystal growth conditions. Then,
Since the substrate surface temperature varies slightly, it is difficult to estimate it, and values measured by thermocouples and radiation thermometers cannot be used as parameters for crystal growth conditions. Regarding the relationship between molecular beam intensity ratio and crystal quality,
In Appl.Phys.Lett.39(6), (1981) pp486-487, we measured the photoluminescence spectra of crystals grown with the molecular beam intensity ratio As/Ga low and 8 times higher. It is said that when the intensity ratio is low, band edge emission is observed, so high quality crystals can be obtained. However, the molecular beam intensity ratio in this case is said to be a condition for As richness, and the specific conditions have not been clarified. Furthermore, in J.Appl.Phys.52(9), (1981) p5792, when the molecular beam intensity ratio As/(Al+Ga) is increased to ~10, the quality of the crystal evaluated from the photoluminescence spectrum is poor; It is said that the best spectrum can be obtained when the line intensity ratio is 2, but the specific growth conditions and accurate substrate surface temperature are not disclosed, resulting in poor reproducibility. In this way, until now it has not been possible to identify specific growth conditions for obtaining high-quality AlGaAs crystals, and crystal growth has been carried out based on empirically obtained growth conditions. If the growth conditions are insufficient and the growth conditions change even slightly, the quality of the crystals formed will be affected, making it impossible to produce high-quality AlGaAs crystals at high yields. An object of the present invention is to provide a method for producing high-quality AlGaAs crystals with excellent optical and electrical properties using molecular beam crystal growth with good reproducibility. When the substrate surface was irradiated with an electron beam during AlGaAs crystal growth and the diffraction image was observed, it was found that there was a clear correlation between the diffraction image, the crystal growth conditions, and the quality of the formed crystal. The present invention was completed based on the discovery that the conditions under which high-quality AlGaAs crystals can be obtained can be determined using diffraction images. In molecular beam crystal growth, the main growth conditions that influence the quality of the AlGaAs crystal to be formed are, as mentioned above, the molecular beam intensity ratio of Al and Ga to As and the substrate temperature. Figure 2 shows the photoluminescence spectrum from an AlGaAs crystal grown at a GaAs substrate temperature of 750°C, and Figure 2a shows the molecular beam intensity of As and the Al and Ga
Figure 2b is the spectrum of a crystal grown with the molecular beam intensity ratio As/(Al+Ga) added to 3.4, and Figure 2b is the spectrum of a crystal grown with the above molecular beam intensity ratio of 1.0, as indicated by the respective arrows. This peak is the emission peak due to bound excitons. The narrower the width and the higher the intensity of this emission peak, the fewer defects there are and the higher the optical quality of the crystal. Therefore, it can be seen from FIG. 2 that when the molecular beam intensity ratio is decreased from 3.4 to 1.0, the quality of the crystal tends to improve. In addition, the substrate temperature used in this specification means the temperature measured by pressing a thermocouple onto the back side of a molybdenum block to which a substrate is attached, and the molecular beam intensity is measured by placing an ion gauge at the position of the substrate at the time of crystal growth. This is the value obtained by measuring the partial pressure and using equation (1). In the formula, x is the type of molecule, P x is the partial pressure, Tx is the temperature of the evaporation source, Mx is the weight of the molecule per mol, and ηx is
It is known from experience that the ionization rate of molecule x is given by equation (2) when the ionization rate of N 2 is set to 1. ηx=0.6ΣZ/14+0.4...(2) In the formula, Z is the number of atoms, and ΣZ means the total number of atoms constituting the molecule x. Moreover, the molecular beam intensity ratio means J As4 /(J Ga + J Al ). FIG. 3 is a graph showing the relative values of the emission intensity of bound excitons from AlGaAs crystals grown with various GaAs substrate temperatures and molecular beam intensity ratios. From the graph in Figure 3, the emission intensity of bound excitons increases as the substrate temperature increases, and even at the same substrate temperature, As/
It can be seen that the smaller the molecular beam intensity ratio of (Al+Ga), the more the emission intensity of bound excitons increases. When the substrate temperature is 720℃ and 750℃, the molecular beam intensity ratio is 1.0.
When the substrate temperature is 780°C, the highest emission intensity is obtained when the molecular beam intensity ratio is around 2.5.
However, when the molecular beam intensity ratio is further reduced, Al and Ga tend to precipitate alone on the crystal surface, resulting in deterioration of crystallinity. From the above, the AlGaAs crystal growth conditions are such that when the substrate temperature is approximately 750°C, the molecular beam intensity ratio is around 1.0, and as the substrate temperature increases, the molecular beam intensity ratio is increased, and when the substrate temperature is around 780°C, the molecular beam intensity ratio is approximately 1.0. By setting the line intensity ratio in a range of around 2.5, an AlGaAs crystal of excellent quality can be grown. The hole mobility and free electron concentration of the sample determined to be a high quality crystal by the above-mentioned bound exciton emission intensity measurement were measured, and the results were as shown in the following table.
【表】
上記の表より分子線強度比が小さい条件で成長
させた結晶程、高いホール移動度を示し、光学的
特性が優れた結晶、即ち基板温度が780℃で分子
線強度比が2.3と基板温度が750℃で分子線強度比
が1.0の条件で成長した結晶はいずれも優れた電
気特性を示し、AlGaAs結晶の成長条件が最適で
あることが裏付けられる。しかし、分子線強度比
の制御は比較的信頼性が高いが、基板温度は上述
の如くブロツクの裏面より熱電対により測定した
温度であつて、基板表面の実際の温度との対応関
係は基板を保持しているブロツクの構造などに依
存し、異なる装置間ではブロツク裏面より同じ温
度が測定されたとしても基板表面の温度は必ずし
も常に同じという保証は得られない。
そこで、この発明において、GaAs基板に
AlGaAs層が成長しているときに高速電子回折像
を観察する。即ち、第1図において、電子線回折
用の電子銃10を真空槽12に取付け、電子銃1
0よりの電子線が基板表面を照射し、反射光が到
達する反対側の真空槽内壁には電子線回折用スク
リーン11を設け、回折像を観察する。
上述の如くして、GaAs基板温度と分子線強度
比As/(Al+Ga)を変えて、基板にAlGaAsを
成長させ、高速電子回折像を観察した結果、観測
される回折像が基板温度と分子線強度比に依存す
ることが見出された。例えば、電子線を(001)
GaAs基板の(110)方向に沿つて入射させ基
板温度が700℃で分子線強度比が1.7以上の時の回
折像は第4図aの如く2倍周期構造を示す。基板
温度が750℃で分子線強度比が1.7の時の回折像は
第4図bに示すように1倍周期構造を示す。更
に、基板温度が780℃で分子線強度比が1.7となる
と回折像は第4図cに示すように3倍周期構造を
示す。
上記の観察された回折像と基板温度、分子線強
度比の関係を第5図に示す。図中、縦軸は分子線
強度比、横軸は基板温度、は3倍周期構造、○
は1倍周期構造、◎は2倍周期構造が観察された
領域を示す。第5図より、基板温度が低く、分子
線強度比が大きい条件で成長した結晶は2倍周期
構造で、基板温度を高く、分子線強度比が小さく
なるにつれて、回折像は次第に1倍周期構造から
3倍周期構造へ移つていくことが判る。第3図の
グラフより、基板温度が750℃附近で分子線強度
比が約1.0から、基板温度が780℃で分子線強度比
が約2.5までの範囲の条件下で成長した結晶はそ
の品質が最も優れていることから、この範囲を第
5図に示すと、点線で示したようになる。即ち、
観察される回折像が1倍周期構造から、3倍周期
構造へ移動したときの条件であつて、この条件で
結晶成長を行うと最も品質の優れた結晶が得られ
ることになる。
具体的にこの発明によりAlGaAs結晶を製造す
る方法を述べると、真空槽内にGaAs基板を設定
し、槽内を所定の真空にすると共に基板を加熱
し、蒸発源より母材材料としてAl,Ga,As分子
線を発射させる。必要に応じてBe,Siなどの不
純物の分子線を併せて発射させても良い。基板の
加熱温度及び分子線強度比は成長した結晶が1倍
周期構造の回折像を観察されるような成長条件に
設定するのが望ましいが、必ずしも厳格に要求さ
れるものではない。
基板上に或る程度のAlGaAs層が形成したら、
電子線を照射し、回折像を観察する。観察された
回折像が1倍周期構造であつたら、基板温度を若
干上昇させる。また必要に応じて、分子線強度比
を若干小さくする。このように成長条件を変えて
結晶を成長させ、観察された回折像が1倍周期構
造から、3倍周期構造に変つたら、その条件で結
晶成長を継続して行う。当初に観察された結晶回
折像が2倍周期構造の場合は基板の加熱温度を上
げ、必要に応じて分子線強度比を小さくして、回
折像が1倍周期構造から更に3倍周期構造へ移行
したときの条件で結晶成長を行うようにする。
当初に観察された結晶の回折像が3倍周期構造
の場合は、基板温度を下げ、必要であれば分子線
強度比を大きくして結晶の成長を行い、回折像が
1倍周期構造となつた時点で、基板温度を再び上
昇する。温度の上昇幅は、下げ幅より小さくし
て、回折像が1倍周期構造より3倍周期構造に戻
つたときの条件で結晶成長を行うことにより品質
の優れたAlGaAs結晶が形成する。このとき分子
線強度比も小さくなるよう制御しても良い。
上記回折像を3倍周期構造へ移行させる手段と
して基板温度の制御を主体的に述べたが、分子線
強度比を主体的に制御しても良い。
上述の如くして成長する結晶の高速電子線に基
いて基板温度と分子線強度比を最適な結晶成長条
件に制御することができたら、その結晶成長条件
に基いて結晶成長を行う。
これまで分子線結晶成長法においては、結晶成
長の最適な条件は知られておらず、例え最適な基
板温度、分子線強度比が知られていたとしても、
実際にその条件下で結晶成長を行うことは殆ど不
可能に近かつたが、この発明によれば、結晶が成
長する基板表面の温度が正確に測定されなくて
も、或るいは結晶成長する分子線強度比の正確な
値が判らなくても、上記基板温度及び分子線強度
比を最適な条件に導いて結晶成長を行うことがで
き、上記最適条件に制御する方法も容易且つ確実
であつて、常に高品質のAlGaAs結晶を再現性良
く製造することができる。[Table] From the table above, the crystal grown under conditions with a smaller molecular beam intensity ratio exhibits higher hole mobility and has better optical properties, i.e., a crystal with a molecular beam intensity ratio of 2.3 at a substrate temperature of 780°C. All crystals grown under the conditions of a substrate temperature of 750°C and a molecular beam intensity ratio of 1.0 exhibit excellent electrical properties, confirming that the growth conditions for AlGaAs crystals are optimal. However, although the control of the molecular beam intensity ratio is relatively reliable, the substrate temperature is the temperature measured by a thermocouple from the back side of the block as described above, and the correspondence relationship with the actual temperature of the substrate surface is Depending on the structure of the block being held, there is no guarantee that the temperature on the surface of the substrate will always be the same even if the same temperature is measured from the back side of the block between different devices. Therefore, in this invention, the GaAs substrate is
Observe the high-speed electron diffraction image while the AlGaAs layer is growing. That is, in FIG. 1, an electron gun 10 for electron beam diffraction is attached to a vacuum chamber 12, and the electron gun 1 is
An electron beam from zero irradiates the substrate surface, and an electron beam diffraction screen 11 is provided on the inner wall of the vacuum chamber on the opposite side where the reflected light reaches, and a diffraction image is observed. As described above, AlGaAs was grown on the substrate by changing the GaAs substrate temperature and the molecular beam intensity ratio As/(Al+Ga), and the high-speed electron diffraction image was observed. It was found that it depends on the intensity ratio. For example, electron beam (001)
The diffraction image when the beam is incident along the (110) direction of the GaAs substrate, the substrate temperature is 700° C., and the molecular beam intensity ratio is 1.7 or more shows a twice periodic structure as shown in FIG. 4a. The diffraction image when the substrate temperature is 750° C. and the molecular beam intensity ratio is 1.7 shows a 1 times periodic structure as shown in FIG. 4b. Furthermore, when the substrate temperature is 780° C. and the molecular beam intensity ratio is 1.7, the diffraction image shows a three-fold periodic structure as shown in FIG. 4c. FIG. 5 shows the relationship between the observed diffraction image, substrate temperature, and molecular beam intensity ratio. In the figure, the vertical axis is the molecular beam intensity ratio, the horizontal axis is the substrate temperature, and 3 times the periodic structure.
◎ indicates a region where a once periodic structure was observed, and a region where a double periodic structure was observed. From Figure 5, the crystal grown under the conditions of low substrate temperature and high molecular beam intensity ratio has a twice periodic structure, and as the substrate temperature increases and the molecular beam intensity ratio decreases, the diffraction image gradually becomes a once periodic structure. It can be seen that the structure shifts to a three-fold periodic structure. From the graph in Figure 3, the quality of crystals grown under conditions ranging from a molecular beam intensity ratio of approximately 1.0 at a substrate temperature of around 750°C to a molecular beam intensity ratio of approximately 2.5 at a substrate temperature of 780°C is found to be poor. Since it is the best, this range is shown in FIG. 5 as indicated by the dotted line. That is,
This is a condition when the observed diffraction image moves from a 1 times periodic structure to a 3 times periodic structure, and if crystal growth is performed under these conditions, a crystal with the highest quality will be obtained. Specifically, the method for producing AlGaAs crystals according to the present invention is described by setting a GaAs substrate in a vacuum chamber, creating a predetermined vacuum in the chamber, heating the substrate, and releasing Al and Ga as base materials from an evaporation source. , fires an As molecular beam. If necessary, molecular beams of impurities such as Be and Si may also be emitted. Although it is desirable that the heating temperature of the substrate and the molecular beam intensity ratio be set to growth conditions such that a diffraction image of the grown crystal having a one-time periodic structure is observed, this is not strictly required. Once a certain amount of AlGaAs layer is formed on the substrate,
Irradiate with an electron beam and observe the diffraction image. If the observed diffraction image has a 1 times periodic structure, the substrate temperature is slightly increased. Also, if necessary, the molecular beam intensity ratio is made slightly smaller. When the crystal is grown while changing the growth conditions in this manner, and the observed diffraction image changes from a 1 times periodic structure to a 3 times periodic structure, crystal growth is continued under the same conditions. If the initially observed crystal diffraction image has a 2x periodic structure, increase the heating temperature of the substrate and reduce the molecular beam intensity ratio as necessary to change the diffraction image from a 1x periodic structure to a 3x periodic structure. Crystal growth is performed under the conditions at the time of transition. If the initially observed diffraction image of the crystal has a 3 times periodic structure, lower the substrate temperature and if necessary increase the molecular beam intensity ratio to grow the crystal, until the diffraction image becomes a 1 times periodic structure. At that point, the substrate temperature is raised again. An AlGaAs crystal of excellent quality is formed by making the temperature increase smaller than the temperature decrease and performing crystal growth under conditions such that the diffraction pattern returns from the 1 times periodic structure to the 3 times periodic structure. At this time, the molecular beam intensity ratio may also be controlled to be small. Although control of the substrate temperature has been mainly described as a means for shifting the above-mentioned diffraction image to a triple periodic structure, the molecular beam intensity ratio may also be controlled mainly. Once the substrate temperature and molecular beam intensity ratio can be controlled to optimal crystal growth conditions based on the high-speed electron beam of the crystal growing as described above, crystal growth is performed based on the crystal growth conditions. Until now, in the molecular beam crystal growth method, the optimal conditions for crystal growth have not been known, and even if the optimal substrate temperature and molecular beam intensity ratio were known,
It is almost impossible to actually grow a crystal under such conditions, but according to the present invention, it is possible to grow a crystal even if the temperature of the substrate surface on which the crystal grows cannot be accurately measured. Even if the exact value of the molecular beam intensity ratio is not known, crystal growth can be performed by guiding the substrate temperature and molecular beam intensity ratio to the optimum conditions, and the method of controlling the above optimum conditions is also easy and reliable. As a result, high-quality AlGaAs crystals can always be produced with good reproducibility.
第1図は分子線結晶成長装置の概略断面図、第
2図は成長したAlGaAs結晶のスペクトル図、第
3図は基板温度と分子線強度比を変化させて成長
させた結晶と発光強度の関係を示すグラフ、第4
図は成長した結晶の高速電子線回析像、第5図は
結晶の回折像の周期構造分布図を示す。
1……GaAs基板、2……ブロツク、3……ヒ
ーター、4……熱電対、5,6,7,8,9……
分子線蒸発源、10……電子銃、11……スクリ
ーン、12……真空槽。
Figure 1 is a schematic cross-sectional view of the molecular beam crystal growth apparatus, Figure 2 is a spectrum diagram of the grown AlGaAs crystal, and Figure 3 is the relationship between crystals grown by varying the substrate temperature and molecular beam intensity ratio and the emission intensity. Graph showing 4th
The figure shows a high-speed electron beam diffraction image of the grown crystal, and FIG. 5 shows a periodic structure distribution diagram of the crystal diffraction image. 1...GaAs substrate, 2...Block, 3...Heater, 4...Thermocouple, 5, 6, 7, 8, 9...
Molecular beam evaporation source, 10...electron gun, 11...screen, 12...vacuum chamber.
Claims (1)
線結晶成長法によりAlGaAs結晶を成長させる方
法において、先ずGaAs基板の温度とAsに対する
AlとGaの分子線強度比を、(110)方向に電子
線を照射したときに結晶成長時の高速電子回折像
が1倍周期構造が観察されるような条件とし、次
いで3倍周期構造が観察されるまで条件を変化さ
せ、3倍周期構造が観察された時点での条件下で
GaAs基板上にAlGaAs結晶層を成長させるよう
にしたことを特徴とするAlGaAs結晶の分子線結
晶成長法。1. In the method of growing AlGaAs crystals by molecular beam crystal growth on a GaAs substrate with a (001) plane, first, the temperature of the GaAs substrate and the
The molecular beam intensity ratio of Al and Ga is set such that when an electron beam is irradiated in the (110) direction, a 1x periodic structure is observed in the high-speed electron diffraction image during crystal growth, and then a 3x periodic structure is observed. Change the conditions until a three-fold periodic structure is observed, and then
A molecular beam crystal growth method for AlGaAs crystal, characterized in that an AlGaAs crystal layer is grown on a GaAs substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135136A JPS6027689A (en) | 1983-07-26 | 1983-07-26 | Method for molecular beam crystal growing of algaas crystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135136A JPS6027689A (en) | 1983-07-26 | 1983-07-26 | Method for molecular beam crystal growing of algaas crystal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6027689A JPS6027689A (en) | 1985-02-12 |
| JPS6356199B2 true JPS6356199B2 (en) | 1988-11-07 |
Family
ID=15144644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58135136A Granted JPS6027689A (en) | 1983-07-26 | 1983-07-26 | Method for molecular beam crystal growing of algaas crystal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6027689A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61227164A (en) * | 1985-03-29 | 1986-10-09 | Agency Of Ind Science & Technol | Method for controlling evaporation of solid |
| JPS6217093A (en) * | 1985-07-13 | 1987-01-26 | Agency Of Ind Science & Technol | Growth method for thin film crystal |
| JPH01176292A (en) * | 1987-12-29 | 1989-07-12 | Nec Corp | Method for molecular-beam epitaxial growth and apparatus therefor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141546A (en) * | 1974-10-05 | 1976-04-07 | Tokyo Seimitsu Co Ltd | SETSUSHOKUKAITENGATACHOTSUKEISOKUTEISOCHI |
| JPS5537092A (en) * | 1978-09-05 | 1980-03-14 | Ibm | Mode switch for setting threshold value |
-
1983
- 1983-07-26 JP JP58135136A patent/JPS6027689A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6027689A (en) | 1985-02-12 |
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