JPS6358227B2 - - Google Patents
Info
- Publication number
- JPS6358227B2 JPS6358227B2 JP12150482A JP12150482A JPS6358227B2 JP S6358227 B2 JPS6358227 B2 JP S6358227B2 JP 12150482 A JP12150482 A JP 12150482A JP 12150482 A JP12150482 A JP 12150482A JP S6358227 B2 JPS6358227 B2 JP S6358227B2
- Authority
- JP
- Japan
- Prior art keywords
- replenisher
- plating
- copper
- plating solution
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 239000007789 gas Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 13
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- OGIIWTRTOXDWEH-UHFFFAOYSA-N [O].[O-][O+]=O Chemical compound [O].[O-][O+]=O OGIIWTRTOXDWEH-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 5
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 4
- 239000005750 Copper hydroxide Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 4
- 229910001956 copper hydroxide Inorganic materials 0.000 description 4
- 229910000431 copper oxide Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1669—Agitation, e.g. air introduction
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、液の安定性に優れた無電解銅めつき
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electroless copper plating method with excellent liquid stability.
（従来の技術）
従来、印刷配線板は銅張積層板を使用して不要
な部分を蝕刻して取り去り配線パターンを形成し
ていたが、省資源・省エネルギーの面から基板上
の必要なパターンのみに銅めつきをすることが要
求されるようになつた。(Prior technology) Conventionally, printed wiring boards used copper-clad laminates and removed unnecessary parts by etching to form wiring patterns, but in order to save resources and energy, only the necessary patterns on the board were formed. Copper plating is now required.
この要求に対処するために開発されたのが、無
電解銅めつきである。無電解銅めつきは、アルカ
リ性の銅イオン錯体溶液であり、ホリルマリンを
還元剤として、パラジウム等のめつき触媒あるい
は銅表面に金属銅を析出させるものである。 Electroless copper plating was developed to meet this demand. Electroless copper plating uses an alkaline copper ion complex solution and uses forylmarin as a reducing agent to deposit metallic copper on a plating catalyst such as palladium or on a copper surface.
無電解銅めつき液を安定に連続的に運転するた
めには、銅の析出によつて消費された成分を新た
に高濃度補充液等の補充液によつて補充し、組成
を一定に保つ必要がある。 In order to operate the electroless copper plating solution stably and continuously, the components consumed by copper deposition must be replenished with a new replenisher such as a high-concentration replenisher to keep the composition constant. There is a need.
第１図及び第２図は、従来の無電解めつき装置
を示すもので、（第２図は、第１図Ａ部の拡大図
である。）図中、１はめつき槽、２は循環パイプ、
３は循環ポンプ、４はフイルタ、５は補充液添加
ポンプ、６は補充液導入管、７はミキサー、４は
補充液タンク、９はコントローラ、１０は補充
液、１１は補充液とめつき液の静止界面である。 Figures 1 and 2 show a conventional electroless plating apparatus (Figure 2 is an enlarged view of section A in Figure 1). In the figure, 1 is a plating tank, and 2 is a circulation tank. pipe,
3 is a circulation pump, 4 is a filter, 5 is a replenisher addition pump, 6 is a replenisher introduction pipe, 7 is a mixer, 4 is a replenisher tank, 9 is a controller, 10 is a replenisher, and 11 is a replenisher and plating liquid. It is a stationary interface.
（発明が解決しようとする課題）
従来は、このような装置によつて、断続的にめ
つき反応で消費される成分を補充液として補充し
ていたため、補充液が吐出されない期間に、第２
図に示したような高濃度補充液とめつき液の静止
した接触界面１１が形成され、補充液がめつき液
とは組成が異なるため、局所的な暴走反応が起
き、第３図に示すように補充液導入管の先端部に
銅の析出１２、酸化銅の付着１３、あるいは水酸
化銅の形成による補充液導入管の目詰まり１４な
どの現象が発生した。(Problems to be Solved by the Invention) Conventionally, such a device intermittently replenishes the components consumed in the plating reaction as a replenisher.
A stationary contact interface 11 between the highly concentrated replenisher and the plating liquid is formed as shown in the figure, and since the replenisher has a different composition from the plating liquid, a local runaway reaction occurs, as shown in Figure 3. Phenomena such as copper precipitation 12, adhesion of copper oxide 13, or clogging 14 of the replenisher inlet tube due to the formation of copper hydroxide occurred at the tip of the replenisher inlet tube.
また、このような酸化銅および水酸化銅は、め
つき槽に持ち込まれた場合、銅ふりとして知られ
る暴走反応のひきがねとなるものである。 Moreover, such copper oxide and copper hydroxide, when brought into a plating bath, trigger a runaway reaction known as copper slag.
このような問題を解決するものとして、めつき
液を循環する循環パイプを備えためつき槽とめつ
き液中に開口した補充液導入管を有し断続的に補
充液をめつき液中に供給する補充液供給装置とよ
り成る無電解銅めつき装置において、補充液導入
管に、めつき液、補充液と接触しても暴走反応を
起こさない液体を流入し、補充液導入管内に残存
する補充液を除去するようにしたものがある。 To solve this problem, a plating tank equipped with a circulation pipe for circulating the plating solution and a replenisher introduction pipe opened into the plating solution are used to intermittently supply the replenisher into the plating solution. In an electroless copper plating apparatus consisting of a replenisher supply device, a liquid that does not cause a runaway reaction when it comes into contact with the plating solution or replenisher is introduced into the replenisher inlet pipe, and the replenisher remaining in the replenisher inlet pipe is removed. There are some that remove the liquid.
しかし、この装置では、(1)めつき液組成の変化
により補充液をより多く消費すること、(2)廃液量
の増加、(3)暴走反応を起こさない液体を入れるタ
ンク、その補充ポンプ、補充ポンプをON／OFF
させる電気回路など、設備的に大掛かりなものを
必要とすること等の欠点がある。 However, with this device, (1) more replenisher is consumed due to changes in the plating solution composition, (2) an increase in the amount of waste fluid, and (3) a tank containing a liquid that does not cause a runaway reaction and its replenisher pump. Turn refill pump on/off
There are drawbacks such as the need for large-scale equipment such as electrical circuits for
本発明は、このような点に鑑みてなされたもの
で、補充液導入管先端部における局所的な暴走反
応がなく、液の安定性を改善でき、補充液量と廃
液量とを液減できる無電解めつきの方法に関する
ものである。 The present invention has been made in view of these points, and there is no local runaway reaction at the tip of the replenisher introducing tube, improving the stability of the liquid and reducing the amount of replenisher and waste liquid. The present invention relates to a method of electroless plating.
（課題を解決するための手段）
本発明は、めつき液を循環する循環パイプとめ
つき液中に開口した補充液導入管を有し断続的に
補充液をめつき液中に供給するめつき方法におい
て、補充液導入管に連結した気体供給装置から気
体を流入し、補充液導入管内に残存する補充液を
除去するようにしたことを特徴とする無電解銅め
つき方法である。(Means for Solving the Problems) The present invention provides a plating method that includes a circulation pipe for circulating a plating solution and a replenisher introduction pipe opened into the plating solution, and intermittently supplies a replenisher to the plating solution. This is an electroless copper plating method characterized in that gas is introduced from a gas supply device connected to a replenisher inlet pipe to remove replenisher remaining in the replenisher inlet pipe.
補充液導入管に気体を流入し、補充液導入管内
に残存する補充液を除去するには、
(イ) 補充液導入管内に気体を絶えず流し続ける。 To remove the replenisher remaining in the replenisher inlet tube by flowing gas into the replenisher inlet tube, (a) Keep gas constantly flowing in the replenisher inlet tube.
すなわち、定常的に流入する気体に断続的に
補充液が添加され、両者の混合物がめつき液に
添加されるようにする。 That is, the replenisher is intermittently added to the gas that is constantly flowing in, and a mixture of both is added to the plating solution.
(ロ) 必要量の補充液を添加した後、次の添加まで
の間、気体を定常的に流し、補充液とめつき液
との静止した接触界面が形成されることを避け
る。(b) After adding the required amount of replenisher and until the next addition, gas is allowed to flow steadily to avoid the formation of a stationary contact interface between the replenisher and the plating solution.
(ハ) 必要量の補充液を添加した後、補充液導入管
内に残存した補充液を置換するに充分な量の気
体を流す。(c) After adding the required amount of replenisher, flow a sufficient amount of gas to replace the replenisher remaining in the replenisher inlet pipe.
等の方法により行うことができる。This can be done by the following methods.
使用しうる気体としては、空気、酸素、オゾ
ン、過酸化水素飽和空気、窒素等がある。 Gases that can be used include air, oxygen, ozone, hydrogen peroxide saturated air, nitrogen, and the like.
第４図は、(イ)の方法により、補充液導入管内に
残存する補充液を除去する場合の補充液供給装置
の配管を示す系統図であり、２は循環パイプ、５
は補充液添加ポンプ、６は補充液導入管、８は補
充液タンク、９はコントローラ、１５はエアポン
プで、常時スイツチはONにされている。 FIG. 4 is a system diagram showing the piping of the replenisher supply device when the replenisher remaining in the replenisher introducing pipe is removed by the method (a), where 2 is a circulation pipe, 5 is a
1 is a replenisher addition pump, 6 is a replenisher inlet pipe, 8 is a replenisher tank, 9 is a controller, and 15 is an air pump, which is always switched on.
第５図は、ロ，ハの方法の場合の補充液供給装
置の配管を示す系統図であり、１６はエアポンプ
で、ロの場合は補充液添加ポンプ５がON、OFF
のときそれぞれOFF、ONとなるように設定され
ており、ハの場合は、補充液添加ポンプがOFF
となつた後に一定時間ONとなるように設定され
ている。この場合、補充液導入管は、循環パイプ
内のめつき液中に開口し補充液が循環パイプ内に
添加されるものであるが、補充液導入管はめつき
槽中のめつき液に直接挿入され、補充液をめつき
槽に直接添加する場合にも使用し得るものであ
る。 Fig. 5 is a system diagram showing the piping of the replenisher supply device in the case of methods (b) and (c), where 16 is an air pump, and in the case of (b), the replenisher addition pump 5 is turned on and off.
The replenisher addition pump is set to turn OFF and ON when , respectively.
It is set to turn on for a certain period of time after . In this case, the replenisher inlet pipe opens into the plating solution in the circulation pipe and the replenisher is added into the circulation pipe, but the replenisher inlet pipe is inserted directly into the plating solution in the plating tank. It can also be used when adding the replenisher directly to the plating tank.
気体の流入量は、補充液導入管から補充液が充
分除去されるに必要な量である。また、循環パイ
プ内、めつき槽等で、混入された補充液の均一な
混合がなされる量を混入することが好ましい。 The amount of gas inflow is the amount necessary to sufficiently remove the replenisher from the replenisher inlet pipe. Further, it is preferable to mix the replenisher in an amount that allows uniform mixing of the replenisher in the circulation pipe, plating tank, etc.
実施例 １
第４図に示した補充液供給装置を使用して、無
電解銅めつき液を24時間連続運転した。管内流速
は100／min、補充液量は最大200ml／mi、全め
つき液量は700であり、めつき液組成はPH：
12.0、CuSO4・5H2O：10ｇ／、EDTA：30
ｇ／、NaCN：30mg／、GAFAC・RE−610
（東邦化学工業株式会社、商品名；界面活性剤）：
0.25ml／、HCHO：６ml／で、温度は72℃で
ある。なお、気体は空気を使用し、流量を１／
minとした。Example 1 Using the replenisher supply device shown in FIG. 4, an electroless copper plating solution was continuously operated for 24 hours. The flow rate in the pipe is 100/min, the maximum replenishment liquid volume is 200ml/mi, the total plating liquid volume is 700, and the plating liquid composition is PH:
12.0, CuSO 4・5H 2 O: 10g/, EDTA: 30
g/, NaCN: 30mg/, GAFAC・RE-610
(Toho Chemical Industry Co., Ltd., product name: surfactant):
0.25 ml/HCHO: 6 ml/, and the temperature was 72°C. Note that air is used as the gas, and the flow rate is reduced to 1/
It was set as min.
運転終了後、補充液導入管先端部を調べたが、
水酸化銅、酸化銅の付着および銅の析出は全く見
られず、また、めつき液全体でも銅ふりは発生し
なかつた。 After the operation was completed, I checked the tip of the replenisher introduction tube, but found that
No adhesion of copper hydroxide, copper oxide, or precipitation of copper was observed, and no copper flaking occurred in the entire plating solution.
実施例 ２
PHを12.7とし、流入気体を酸素としてその流入
量を500ml／minとし、補充液流入位置をめつき
槽体とした以外は、実施例１と同一条件とした。
この結果、銅ふりは発生しなかつた。Example 2 The conditions were the same as in Example 1, except that the pH was 12.7, the inflow gas was oxygen, the inflow rate was 500 ml/min, and the replenisher inflow position was the plating tank body.
As a result, no copper flaking occurred.
（発明の効果）
以上に説明したように、本発明によつて、補充
液とめつき液との静止界面がなくなり、補充液導
入管先端部における局所的な暴走反応がなくなる
ので、この部分の目詰まりがなくなり、液の安定
性も改善できた。(Effects of the Invention) As explained above, according to the present invention, there is no stationary interface between the replenisher and plating solution, and local runaway reactions at the tip of the replenisher introducing tube are eliminated. The clogging was eliminated and the stability of the liquid was improved.
また、液体を導入する方法に比較して、補充液
量と廃液量とが少なくなつた。 Furthermore, compared to the method of introducing liquid, the amount of replenisher and waste liquid are reduced.
さらに、補充液流入位置をめつき槽本体とした
場合でも、あるいは、めつき槽本体とは別個に設
けた添加槽とした場合でも、めつき液の均一化を
するための撹拌の効果があり、別個に撹拌のため
の装置を設ける必要がなくなつた。また、同時
に、空気撹拌（エアレーシヨン）によつて、亜酸
化銅の酸化等のめつき液の安定化ができ、純枠な
酸素、オゾン、過酸化水素飽和空気などの酸化性
気体では、その効果が大きかつた。 Furthermore, even when the replenisher inflow position is in the plating tank itself, or in an addition tank installed separately from the plating tank main body, stirring is effective for making the plating solution uniform. , it is no longer necessary to provide a separate stirring device. At the same time, air agitation (aeration) can stabilize the plating solution by oxidizing cuprous oxide, etc., and is effective against oxidizing gases such as pure oxygen, ozone, and hydrogen peroxide-saturated air. It was big.
第１図は従来の無電解銅めつき装置を示す概略
図、第２図は従来の無電解めつき装置の一部を示
す断面図、第３図は従来の無電解めつき装置の一
部に暴走反応や発生した様子を示す断面図、第４
図及び第５図は本発明の一実施例を示す概略図。
符号の説明、１……めつき槽、２……循環パイ
プ、３……循環ポンプ、４……フイルタ、５……
補充液添加ポンプ、６……補充液導入管、７……
ミキサー、８……補充液タンク、９……コントロ
ーラ、１０……補充液、１１……補充液とめつき
液の静止界面、１２……析出銅、１３……付着し
た酸化銅、１４……目詰まりした水酸化銅、１５
……エアポンプ、１６……エアポンプ。
Figure 1 is a schematic diagram showing a conventional electroless copper plating apparatus, Figure 2 is a sectional view showing a part of a conventional electroless plating apparatus, and Figure 3 is a part of a conventional electroless plating apparatus. 4 is a cross-sectional view showing the runaway reaction and how it occurs.
FIG. 5 is a schematic diagram showing an embodiment of the present invention. Explanation of symbols, 1...Plating tank, 2...Circulation pipe, 3...Circulation pump, 4...Filter, 5...
Replenishment fluid addition pump, 6... Replenishment fluid introduction pipe, 7...
Mixer, 8...Replenisher tank, 9...Controller, 10...Replenisher, 11...Stationary interface between replenisher and plating solution, 12...Precipitated copper, 13...Adhered copper oxide, 14...Eye Blocked copper hydroxide, 15
...Air pump, 16...Air pump.
Claims (1)
に開口した補充液導入管を有し断続的に補充液を
めつき液中に供給するめつき方法において、補充
液導入管に連結した気体供給装置から気体を流入
し、補充液導入管内に残存する補充液を除去する
ようにしたことを特徴とする無電解銅めつき方
法。 ２ 流入する気体が酸化性気体である特許請求の
範囲第１項記載の無電解銅めつき方法。 ３ 流入する気体が空気である特許請求の範囲第
１項記載の無電解銅めつき方法。 ４ 流入する気体が酸素オゾン、及び過酸化水素
飽和空気の少なくとも一種である特許請求の範囲
第１項記載の無電解銅めつき方法。[Scope of Claims] 1. In a plating method having a circulation pipe for circulating a plating solution and a replenisher introduction pipe opening into the plating solution and intermittently supplying the replenisher into the plating solution, the replenisher introduction pipe 1. A method for electroless copper plating, characterized in that the replenisher remaining in the replenisher introduction pipe is removed by flowing gas from a gas supply device connected to the replenisher. 2. The electroless copper plating method according to claim 1, wherein the gas flowing in is an oxidizing gas. 3. The electroless copper plating method according to claim 1, wherein the gas flowing in is air. 4. The electroless copper plating method according to claim 1, wherein the gas flowing in is at least one of oxygen ozone and hydrogen peroxide saturated air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12150482A JPS5913060A (en) | 1982-07-13 | 1982-07-13 | Electroless copper plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12150482A JPS5913060A (en) | 1982-07-13 | 1982-07-13 | Electroless copper plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5913060A JPS5913060A (en) | 1984-01-23 |
| JPS6358227B2 true JPS6358227B2 (en) | 1988-11-15 |
Family
ID=14812822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12150482A Granted JPS5913060A (en) | 1982-07-13 | 1982-07-13 | Electroless copper plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5913060A (en) |
-
1982
- 1982-07-13 JP JP12150482A patent/JPS5913060A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5913060A (en) | 1984-01-23 |
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