JPS635897B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for supplying multiple articles and a jig for supplying multiple articles.

2. Description of the Related Art When assembling semiconductor devices, etc., a method of assembling a large number of semiconductor devices at the same time has been adopted for the purpose of reducing manufacturing costs. For example, as shown in FIG. 1, in the assembly of a diode 4, an electric circuit element (pellet) 2 is sandwiched between the end faces of a pair of leads 1, and the pellet 2 and the sandwiched lead portion are sealed with a glass tube 3. Pellet charging is carried out as follows. A large number of pellets 2 are placed onto a multiple article supply jig (pellet charging jig) 5 shown in FIGS. 2a and 2b. This pellet charging jig 5 has through holes 6 regularly arranged vertically and horizontally.
are provided on the upper surface, these through holes 6 are normally closed by a shutter 7 that slides inside the pellet charging jig 5, and a housing recess 8 for accommodating pellets is formed on the upper surface. Therefore, after vibrating the pellet charging jig 5 and storing the pellets 2 in each of the storage recesses 8, the pellets 2 that do not fit into the storage recesses 8 are collected in one place (the end of the frame) of the pellet charge jig 5, and In this state, they are stacked on the assembly jig 9 as shown in FIGS. 3 and 4. As shown in FIG. 4, the assembly jig 9 consists of an upper plate 10, a lower plate 11 parallel to the upper plate, and a column (not shown) for integrating these parts. The upper plate 10 has an accommodation hole 1 for accommodating the glass tube 3.
2, and a guide hole 13 into which the thin shaft portion of the lead 1 is inserted is provided at the bottom. Further, a seat 14 consisting of a depression is provided on the upper surface of the lower plate 11 directly below the guide hole 13, and is adapted to support the lower end of the lead 1 inserted into the accommodation hole 12. Further, the arrangement of these accommodation holes 12 coincides with the accommodation recesses 8 of the pellet charging jig 5. Therefore, after positioning and overlapping the pellet charging jig 5 on the assembly jig 9, the shutter 7 is moved to align the through hole 15 of the shutter 7 with the through hole 6. Then, the pellet 2 supported by the shutter 7 falls through the through hole 15 and the through hole 16, respectively, and falls into the assembly jig 9.
The pellet falls into the accommodation hole 12, enters the glass tube 3 in the accommodation hole 12, and rests on the upper end surface of the lead 1, where pellet charging is performed.

However, in such pellet charging, silicon pieces brought in together with the silicon pellets and silicon pieces of pellets damaged by the vibration of the pellet charging jig enter the storage recess, as shown in Figure 4. This silicon piece 16 is supplied into the glass tube 3 at the same time as the pellet when the shutter 7 is closed. As a result, if the diode is sealed with glass in this state, this silicon piece will electrically connect the two leads when the diode is used, which will cause a shot failure.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method and a supplying jig for simultaneously feeding a plurality of articles to a group of article supply locations without introducing foreign matter into the group of articles.

The present invention will be explained below with reference to Examples.

Figures 5 to 8 show an embodiment in which the present invention is applied to pellet charging, in which Figure 5 is an external view, Figure 6 is a partial sectional view, and Figure 7 is an external view during pellet charging. , FIG. 8 is a sectional view showing the pellet charging state. As shown in FIGS. 5 and 6, this pellet charging jig 17 is formed of a box body 19 with a hollow portion 18 inside, and an edge 2 that protrudes along the outer periphery of the upper surface of the upper plate 20.
1. In addition, pellets 2 are placed on the upper plate 20.
Accommodating holes 23 for accommodating 2 are provided regularly in the vertical and horizontal directions. The bottom surface of this accommodation hole 23 is formed by an auxiliary plate 24 attached to the lower surface of the upper plate 20.
Further, a vacuum suction hole 25 is provided at the bottom of the accommodation hole of this auxiliary plate 24 . The dimensional relationship among the vacuum suction hole 25, accommodation hole 23, and pellet 22 is, for example, when the pellet size is 0.4 mm□.
Accommodation hole diameter is 0.7mm□, vacuum suction hole diameter is 0.25mm
It is φ. Further, a hollow portion 18 is provided on one side of the box body 19.
A pipe 26 is provided which communicates with the pipe 2.
6 is connected to a vacuum pump system (not shown).
In addition, two arms 27 are provided on one side of this box body 19.
is provided protrudingly, and this arm 27 is provided with a rotation hole 28 serving as a rotation center.

To explain the feeding operation of the pellet charging jig 17 to the assembly jig 29, first, a large number of pellets 22 are placed on the upper plate 20 of the box body 19.
and vibrate the pellet charging jig 17. This vibration is carried out by placing the pellet charging jig 17 on a generally known vibrator (not shown), but it may also be built into the vibrator. Due to this vibration, the pellet 22 enters the accommodation recess 30 consisting of the accommodation hole 23 and the auxiliary plate 24. In parallel with this vibration, a vacuum pump system is operated to suck air above the upper plate 20 through the vacuum suction holes 25. At this time, the chipped minute silicon fragments 31 are removed from the vacuum suction hole 2 as shown in FIG.
5 and enters the internal hollow part 18 of the box body 19. Further, the pellet 22 enters the accommodation recess 30 and is held by vacuum suction. Therefore, the pellets 22 that have not entered the storage recess 30 are removed.

Next, while in this vacuum suction state, move the box body 19 18
The upper plate 20 is turned over so that the upper plate 20 is on the lower side as shown in FIGS. 7 and 8. At this time, since the pellet 22 is held by vacuum suction, it does not fall downward, but the silicon fragments 31 remaining on the upper plate 20 fall. Therefore, only the pellets 22 are held on the upper plate 20, which is the lower surface. Therefore, the pellet charging jig 17 is superimposed on the assembly jig 29 and the vacuum is cut off. At this time, each pellet 22 is positioned directly above the accommodation hole 32 of the assembly jig 29. As a result, the pellet 22 falls into the accommodation hole 32, enters the glass tube 23 in the accommodation hole 32, and rests on the upper end surface of the lead 34, whereby the pellet is charged.

According to this embodiment, when the pellets are put into the pellet charging jig, the silicone fragments with the chipped pellets mixed in with the pellets are removed during vacuum suction when the pellets are aligned, and the remaining silicone fragments are removed. falls when the pellet charging jig is turned over. Therefore, silicon fragments are not charged when charging the pellets to the assembly jig. Therefore, shoot defects due to the contamination of silicon debris as in the prior art do not occur, and the yield is improved.

Note that the present invention is not limited to the above embodiments. For example, the pellet charging jig may be incorporated into a diode assembly line using the rotation hole in the arm to completely automate the pellet charging operation. Furthermore, the present invention can be applied to methods other than pellet charging.

As described above, according to the method of supplying a plurality of articles using the multiple article supply jig of the present invention, it is possible to simultaneously supply a group of desired article supply locations without introducing foreign matter into the group of articles. can.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of the diode, Figures 2a and b are external views and cross-sectional views of a conventional pellet supply jig used for assembling the diode, and Figure 3 is an assembly jig using the conventional pellet supply jig. FIG. 4 is a cross-sectional explanatory view showing inconveniences during pellet feeding in the conventional method; FIG. 5 is a perspective view showing an embodiment of the multiple article feeding jig of the present invention; FIG. 6 is a partially sectional view, and FIGS. 7 and 8 are a perspective view and a partially sectional view showing an embodiment of the method for supplying multiple articles according to the present invention. 1...Reed, 2...Pellet, 3...Glass tube, 4
...Diode, 5...Multiple article supply jig, 6...Through hole, 7...Shutter, 8...Accommodation recess, 9...Assembling jig,
10... Upper plate, 11... Lower plate, 12... Accommodation hole, 13...
Guide hole, 14...Seat, 15...Through hole, 16...Silicon piece, 17...Pellet charge jig, 18...Hollow part, 19...Box body, 20...Top plate, 21...Edge, 22
...Pellet, 23...Accommodation hole, 24...Auxiliary plate, 25
...Vacuum suction hole, 26...Pipe, 27...Arm, 2
8...Rotation hole, 29...Assembling jig, 30...Accommodation recess, 3
1...Silicon fragment, 32...Accommodation hole, 33...Glass tube, 34...Lead.

Claims (1)

[Claims] 1. In a plurality of semiconductor pellet supply methods for simultaneously supplying a plurality of semiconductor pellets to a plurality of locations to which the semiconductor pellets are supplied, the semiconductor pellet has accommodation recesses arranged on the upper surface corresponding to the locations to which the semiconductor pellets are supplied; preparing a plurality of semiconductor pellet supply jigs each having a semiconductor pellet accommodating portion having a vacuum suction hole on the bottom surface of each of the plurality of accommodating recesses in a state in which the plurality of accommodating recesses are on top;
A step of placing a large number of semiconductor pellets on the plurality of semiconductor pellet supply jigs and vibrating the plurality of semiconductor pellet supply jigs for a certain period of time in a vacuum suction state to accommodate the semiconductor pellets in the accommodation recess; a step of removing unused semiconductor pellets, a step of inverting the plurality of semiconductor pellet supply jigs so that the accommodation recesses are facing down and positioning them above the semiconductor pellet supply location, and cutting off the vacuum suction state. A plurality of semiconductor pellet supply methods characterized in that the semiconductor pellets in the storage recess are supplied to each semiconductor pellet supply location.