JPS6367292B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure in which a thin plate spring of a movable contact spring used in a relay or a microswitch is caulked and attached to a relay armature or a terminal plate of a microswitch.

Conventionally, as shown in FIGS. 1 and 2, the protrusion 2 is integrally stamped out from the armature 1, the protrusion 2 is loosely fitted into the hole of the thin plate spring 3, and the protrusion 2 is pressed. The enlarged portion 4 is formed and the thin plate spring 3 is attached by caulking, but the enlarged portion 4 due to caulking applies stress to the thin plate spring around the hole, causing upward warping as shown in the figure. , the position of the movable contact 5 attached to the free end of the thin plate spring 3 changes, and the pressure contact force with the fixed contact (not shown) and the accuracy of the contact gap dimension deteriorate.

The present invention has been made in order to improve the above-mentioned conventional situation.

Embodiments of the present invention will be described below with reference to FIGS. 3 to 5.
This will be explained with reference to the figures.

Projections 12, 12 are integrally punched out from the mounting member 11, and a hole slightly larger than the outer diameter of the projection 12 is bored in the thin plate spring 13.

Then, a hole is loosely fitted into the protrusion 12, and the free end side portion of the thin plate spring 13 to which the movable contact 14 of the protrusion 12 is attached as shown in FIG. The opposite direction portion is pressed and deformed to form the enlarged portion 15.

In this way, since the free end side of the thin plate spring 13 to which the movable contact 14 of the protrusion 12 of the mounting member 11 is attached is not pressurized, the thin plate spring 13 does not warp. Further, the protrusion 12
Although the warpage shown in FIG. 4 occurs in the opposite direction from the free end of the pressed thin plate spring 13, this warpage has no effect on the positional accuracy of the movable contact 14.

Regarding the caulking strength of the thin plate spring, as shown in FIG. 5, it can be sufficiently compensated for by increasing the number of protrusions, and there is no problem, and on the contrary, it can be said that it is preferable because the stress is dispersed.

In addition, in the above-mentioned embodiment, the protrusion 12 is attached to the mounting member 11.
Although it was installed integrally with the projecting part, the rivets were prepared in advance,
A rivet may be passed through the communication hole between the mounting member 11 and the thin plate spring 13, and the rivet leg may be caulked as described above, which is included in the present invention.

As explained above, according to the thin plate spring caulking structure of the present invention, when a thin plate spring such as a movable contact spring having a movable contact attached to the free end is caulked to a mounting member such as an armature, the attachment By loosely fitting the hole of the thin plate spring into the protrusion provided on the member, and deforming only the portion of the protrusion in the direction opposite to the free end side of the thin plate spring to form an enlarged portion, the thin plate is attached. Since deformation due to caulking does not occur on the free end side of the spring to which the movable contact is attached, the accuracy of the contact position can be increased and adjustment of the contact position is not required, making it possible to provide an inexpensive relay or micro switch.

[Brief explanation of drawings]

1 and 2 show a conventional example, with FIG. 1 being a front view and FIG. 2 being a sectional view of a main part. 3 to 5 show embodiments of the present invention, FIG. 3 is a front view,
FIG. 4 is a sectional view of the main part, and FIG. 5 is a perspective view of the relay applied. 11: Mounting member, 12: Projection, 13: Thin plate spring, 14: Movable contact, 15: Ampulla.

Claims (1)

[Claims] 1. In a caulking structure of a thin plate spring, such as a movable contact spring used in a relay, which has a movable contact attached to its free end, the middle of the thin plate spring is caulked to a mounting member such as an armature, in which a protrusion is formed on one side of the mounting member. A hole is provided in the middle of the thin plate spring to loosely fit into the protrusion, and only a portion of the protrusion of the mounting member in a direction opposite to the free end side of the thin plate spring is deformed to form an enlarged portion. A thin plate spring crimping structure characterized by being formed and crimped.