JPS6410912B2 - - Google Patents
Info
- Publication number
- JPS6410912B2 JPS6410912B2 JP253380A JP253380A JPS6410912B2 JP S6410912 B2 JPS6410912 B2 JP S6410912B2 JP 253380 A JP253380 A JP 253380A JP 253380 A JP253380 A JP 253380A JP S6410912 B2 JPS6410912 B2 JP S6410912B2
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- ceramic molded
- holes
- molybdenum
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Description
【発明の詳細な説明】
本発明は多極気密端子の製造方法の改良に係わ
り、特に作業能率の改善された製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing a multi-polar airtight terminal, and more particularly to a manufacturing method with improved working efficiency.
従来から、セラミツク成形体に多数のリード線
を封着し、該成形体表面の気密性を保持してなる
多極気密端子を製造する方法として、極ごとに、
モリブデンの中間層を設け、その上にろう付性を
良くするためニツケルを電気メツキした後、リー
ド線を銀ろう付する方法が行なわれていた。 Conventionally, as a method for producing a multi-polar airtight terminal by sealing a large number of lead wires to a ceramic molded body and maintaining the airtightness of the surface of the molded body, for each pole,
The method used was to provide an intermediate layer of molybdenum, electroplated with nickel on top of it to improve brazing properties, and then solder the lead wires with silver.
この方法では、リード線は相互に絶縁されてい
る必要があるため、セラミツク成形体の表面にリ
ード線封着のためにあけられた多数の貫通孔の周
りに、相互に隣接する極間が接続しないように、
局部的にモリブデンペーストの塗布、焼付を行な
い、その上に電気メツキをした後銀ろう付するこ
とが行なわれていた。 In this method, the lead wires must be insulated from each other, so adjacent poles are connected around the numerous through holes drilled on the surface of the ceramic molded body for sealing the lead wires. So as not to,
Molybdenum paste was applied locally, baked, electroplated, and then silver soldered.
しかしながらこのような方法においては、極ご
とにモリブデンペーストの塗布、焼付および電気
メツキを行なうため、極数だけこれらの作業を行
なわなければならず、多大な時間と手数を要し、
作業能率が悪いという難点があつた。 However, in this method, since molybdenum paste is applied, baked, and electroplated for each pole, these operations must be performed for each pole, which takes a lot of time and effort.
The problem was that work efficiency was poor.
本発明はこのような難点を解消するためになさ
れたもので、モリブデンペーストの塗布、焼付工
程およびメツキの工程を一度に行なつた後、極ご
とに機械的に分割絶縁し、リード線を封着するこ
とを特徴とする多極気密端子の製造方法を提供す
るものである。 The present invention has been made to solve these difficulties, and after applying the molybdenum paste, baking process, and plating process are performed all at once, each pole is mechanically divided and insulated, and the lead wires are sealed. The present invention provides a method for manufacturing a multi-polar hermetic terminal, characterized in that
以下、図面に基づいて本発明を説明する。 The present invention will be explained below based on the drawings.
本発明の製造方法においては、まず、第１図に
示す多数の貫通孔１を有するセラミツク成形体２
の表面全体に、第２図に示すようにモリブデンペ
ーストを塗布し、還元性雰囲気中で1400℃程度の
高温下に焼付けて、金属モリブデン層３を設けた
後、その上に電気メツキ法により、ニツケルメツ
キ層４を設ける。 In the manufacturing method of the present invention, first, a ceramic molded body 2 having a large number of through holes 1 as shown in FIG.
As shown in Fig. 2, a molybdenum paste is applied to the entire surface of the metal molybdenum layer 3, which is baked at a high temperature of about 1400°C in a reducing atmosphere. A nickel plating layer 4 is provided.
次いで、その上に表面研磨機により、下部のセ
ラミツク層に達する凹溝５を機械的に刻設し、極
となる貫通孔１の周囲を互いに絶縁分割する。 Next, a groove 5 is mechanically carved thereon by a surface polisher to reach the lower ceramic layer, thereby insulating and dividing the periphery of the through hole 1, which will serve as a pole.
この刻設の位置は、第３図に示すように、なる
べく凹溝が直線状となり、しかも最小の溝数で分
割されるような位置とするのが、作業能率上望ま
しい。 As shown in FIG. 3, it is desirable for the position of this engraving to be such that the grooves are as straight as possible and are divided into the minimum number of grooves in terms of work efficiency.
次いで、表面に残留する研磨くず等を洗浄除去
し、貫通孔１にリード線６を挿入した後、孔の周
囲に銀ろう７を配置し、全体を850℃の炉に入れ
て、リード線６をろう付する。 Next, polishing debris remaining on the surface is washed and removed, and the lead wire 6 is inserted into the through hole 1. Silver solder 7 is placed around the hole, and the whole is placed in a furnace at 850°C, and the lead wire 6 is inserted into the through hole. to braze.
以上のように、本発明の方法によれば、セラミ
ツク成形体との封着の中間層となる金属モリブデ
ン層の被覆、およびその上へのニツケルメツキ
を、極ごとではなく、成形体の表面全体に一度に
行なうので、特にニツケルの電気メツキがしやす
く、全体の作業時間が大幅に短縮されるという利
点がある。 As described above, according to the method of the present invention, the coating of the metal molybdenum layer, which serves as an intermediate layer for sealing with the ceramic molded body, and the nickel plating thereon are performed not on each pole but on the entire surface of the molded body. Since it is done all at once, it is particularly easy to electroplat nickel, and has the advantage of greatly shortening the overall working time.
第１図は本発明に用いるセラミツク成形体の上
面図、第２図は本発明の方法を示す一部拡大断面
説明図であり、第３図は凹溝の刻設位置を示す説
明図である。
１……貫通孔、２……セラミツク成形体、３…
…金属モリブデン層、４……ニツケルメツキ層、
５……凹溝、６……リード線、７……銀ろう。
Fig. 1 is a top view of a ceramic molded body used in the present invention, Fig. 2 is a partially enlarged cross-sectional explanatory view showing the method of the present invention, and Fig. 3 is an explanatory view showing the positions of grooves. . 1... Through hole, 2... Ceramic molded body, 3...
...metallic molybdenum layer, 4...nickel metal layer,
5... Concave groove, 6... Lead wire, 7... Silver solder.
Claims (1)
の上表面に、モリブデンペーストを塗布、焼付け
て金属モリブデン層を設けた後、その上に金属メ
ツキを施し、次いでその上にセラミツク成形体に
達する凹溝を機械的に刻設して、前記貫通孔を相
互に分割し、しかる後該貫通孔にリード線を挿通
し、その端部をメツキ層にろう着するとともに、
貫通孔を封止めすることを特徴とする多極気密端
子の製造方法。1. A molybdenum paste is applied to the upper surface of a ceramic molded body in which a large number of through holes are drilled, and a metal molybdenum layer is provided by baking, and then metal plating is applied on top of that, and then the ceramic molded body is reached. Mechanically carving grooves to divide the through holes, then inserting lead wires into the through holes and brazing the ends to the plating layer,
A method for manufacturing a multi-polar airtight terminal, characterized by sealing a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP253380A JPS5699988A (en) | 1980-01-16 | 1980-01-16 | Method of manufacturing multielectrode airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP253380A JPS5699988A (en) | 1980-01-16 | 1980-01-16 | Method of manufacturing multielectrode airtight terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5699988A JPS5699988A (en) | 1981-08-11 |
| JPS6410912B2 true JPS6410912B2 (en) | 1989-02-22 |
Family
ID=11532012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP253380A Granted JPS5699988A (en) | 1980-01-16 | 1980-01-16 | Method of manufacturing multielectrode airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5699988A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020194416A1 (en) * | 2019-03-25 | 2020-10-01 | 株式会社ニコン | Processing system and processing method |
| US11338506B2 (en) | 2019-06-28 | 2022-05-24 | Sodick Co., Ltd. | Lamination molding apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7237546B2 (en) * | 2018-11-29 | 2023-03-13 | 株式会社東芝 | Electric wiring penetration device and manufacturing method thereof |
-
1980
- 1980-01-16 JP JP253380A patent/JPS5699988A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020194416A1 (en) * | 2019-03-25 | 2020-10-01 | 株式会社ニコン | Processing system and processing method |
| US11338506B2 (en) | 2019-06-28 | 2022-05-24 | Sodick Co., Ltd. | Lamination molding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5699988A (en) | 1981-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5845171B2 (en) | Manufacturing method of solid electrolytic capacitor | |
| US4023876A (en) | Method of making a fluorescent display device having segmentary anodes | |
| JPS6410912B2 (en) | ||
| JPS54157296A (en) | Electrode structure and the manufacturing method | |
| JPH04246813A (en) | Solid electrolytic capacitor containing fuse | |
| GB1376568A (en) | Travelling wave tubes | |
| US2818522A (en) | Ceramic frame grid | |
| JP3794751B2 (en) | Manufacturing method of chip-type solid electrolytic capacitor | |
| JPH0730656Y2 (en) | Ozone generator | |
| JPS5961116A (en) | Method of producing chip type solid electrolytic condenser | |
| DE663897C (en) | Method for connecting a quartz body to a metal part or another quartz body by soldering | |
| US3719566A (en) | Process for making integrated circuit packages | |
| US3360852A (en) | Manufacture of ceramic bases | |
| JPS6149812B2 (en) | ||
| JPH01109711A (en) | Composite chip solid electrolytic capacitor | |
| KR830000962B1 (en) | Confidential terminal | |
| JPS5897851A (en) | Manufacture of metallic part | |
| JPS58100967A (en) | Manufacture of metallic parts | |
| SU109598A1 (en) | Method for making vacuum-tight metal junctions with ceramics | |
| JPS5933176Y2 (en) | airtight terminal | |
| KR920010498B1 (en) | Ceramic package manufacturing method of semiconductor apparatus | |
| JPS59127813A (en) | Manufacture of rotary transformer | |
| JPH04188653A (en) | Manufacture of hermetical sealing stem | |
| JPS5852343B2 (en) | Handout Taisouchino Seizouhouhou | |
| JPS6451613A (en) | Formation of external electrode terminal for leadless chip part |