JPS643052B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a supply device for semiconductor devices.

Conventionally, this type of supply device stacks resin-sealed lead frames in an orderly manner using a jig.
One lead frame was lifted up from above by suction, then carried to a position where it could be supplied, positioned, and then a supply operation was performed.
Therefore, the operating mechanism becomes complicated, making it impossible to reduce the scale of the device and making it difficult to shorten the time required for supply.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device supplying apparatus that eliminates the above-mentioned drawbacks.

The present invention is characterized by a storage jig for stacking and storing semi-finished products in which lead frames are resin-sealed;
A shutter located directly above the storage jig and having an upper member, a side member, and a rotating member, a push rod provided on one side of the shutter, and a supply provided on the other side of the shutter. A rail and a suction jig are provided, and the topmost semi-finished product among the semi-finished products stacked on the storage jig is lifted directly upward by the suction jig, and the rotating member is rotated in a vertical direction. By opening the shutter, positioning the half-finished product in a horizontal direction by arranging the end thereof opposite to the upper member and the lower member to the side member, and then rotating the rotary member in the horizontal direction to In the semiconductor device supplying apparatus, the shutter is closed and vertical positioning is performed, and then the semi-finished product is pushed from behind by the pushing rod and supplied to the supply rail.

FIG. 1 shows an embodiment of the present invention, which will be explained below. FIG. 1A is a front view.
1B and 1C are side sectional views taken along the line X-X' of FIG. 1A. FIG. 1B shows the shutter when it is open, and FIG. 1C shows the shutter when it is closed. Figure 1 D is the first
FIG. 2 is a side cross-sectional view showing a state where a semi-finished product is sent to the YY' section in FIG. A;

The resin-sealed lead frames 1 are stacked in a jig 2. Next, open the shutter 3 for supply positioning, and use the suction pad 4 to remove the lead frame 1.
After lifting the upper part of the shutter 3, close the shutter 3. Then, the lead frame 1 is pushed from behind by the pushing rod 5 and fed into the rail 6 of the semiconductor device manufacturing equipment. As is clear from the figure, the shutter 3 has an upper fixing member 14 and a side fixing member 1.
3. It is composed of a rotating member 15 that rotates around an axis 12, and in FIG. 1B, the rotating member 15 is
It rotates and becomes vertical as shown in Figure 3.
is in the open state, and both ends of the top semi-finished product are placed in the upper member 14 in the left and right shutters 3.
The rotary member 20 is then placed in a horizontal position facing the side member 13 under the lower part, and then, as shown by the arrow 20 in FIG. Vertical positioning is performed by supporting the product from below using shutters on the left and right ends of the product. On the other hand, the supply rail 6 consists of an upper member 17 and a lower member 16, between which the left and right ends of the semi-finished product are inserted and fed (FIG. 1D). The height of the shutter 3 and the height of the supply rail are the same. That is, a shutter as shown in FIG. 1C is located on an extension of the supply rail, and by pushing the push rod 5, the semi-finished product is smoothly moved from the shutter 3 to the supply rail 6.

As described above, since the present invention feeds the lead frame lifted directly upward by suction from that position, there is less movement of the lead frame and the mechanism can be simplified, and the time required for feeding can be shortened. It has the advantage of being able to

[Brief explanation of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention. In the figure, 1...Resin-sealed lead frame, 2...Jig, 3...Shutter for supply positioning, 4...Suction pad, 5...Extrusion rod, 6...
…rail.

Claims (1)

[Claims] 1. A storage jig for stacking and storing semi-finished products whose lead frames are resin-sealed, a shutter located directly above the storage jig and having an upper member, a side member, and a rotating member; The shutter includes a push rod provided on one side, a supply rail provided on the other side of the shutter, and a suction jig, and the top of the semi-finished products stacked in the storage jig is The semi-finished product is lifted directly upward by the suction jig, and the rotating member is rotated in a vertical direction to open the shutter and the end of the semi-finished product is placed under the upper member and facing the side member. A supply device for semiconductor devices, characterized in that the semi-finished product is placed, the rotary member is horizontally rotated to close the shutter, and then the semi-finished product is pushed from behind by the push rod and supplied to the supply rail.