JPH0155580B2 - - Google Patents
Info
- Publication number
- JPH0155580B2 JPH0155580B2 JP58004679A JP467983A JPH0155580B2 JP H0155580 B2 JPH0155580 B2 JP H0155580B2 JP 58004679 A JP58004679 A JP 58004679A JP 467983 A JP467983 A JP 467983A JP H0155580 B2 JPH0155580 B2 JP H0155580B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- rail
- sliding rail
- storage container
- rotating rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000005452 bending Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wrapping Of Specific Fragile Articles (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
本発明は半導体装置のハンドリング装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a handling device for semiconductor devices.
従来、半導体装置を収納するのに用いる一般的
なハンドリング装置は第１図に示すような機構を
有している。すなわち、図示しない手段により滑
走レール２上を滑走してきた半導体装置１は、収
納容器３内に落下収納される。しかしながら、従
来半導体装置１は収納容器３に落下した際、位
置、姿勢がランダムになり、次工程でのハンドリ
ングの際、半導体装置１を再整理する必要があ
る。また、半導体装置１はリード４を下向きにし
て収納容器３内に落下するため、リード４が変形
し、後工程でリード４を修正する必要がある。 Conventionally, a general handling device used for housing semiconductor devices has a mechanism as shown in FIG. That is, the semiconductor device 1 that has slid on the sliding rail 2 by means not shown is dropped and stored in the storage container 3. However, when the conventional semiconductor devices 1 fall into the storage container 3, their positions and postures become random, and it is necessary to rearrange the semiconductor devices 1 when handling them in the next process. Further, since the semiconductor device 1 falls into the storage container 3 with the leads 4 facing downward, the leads 4 are deformed and it is necessary to correct the leads 4 in a subsequent process.
本発明は前記問題点を解消するもので、以下に
本発明の一実施例を図により説明する。 The present invention solves the above-mentioned problems, and one embodiment of the present invention will be described below with reference to the drawings.
第２図に示すように、本発明に係るハンドリン
グ装置はリード４の折り曲げ方向を下向きにして
半導体装置１を搬送する滑走レール２と、該滑走
レール２の終端に転回可能に配設した回転レール
５と、該回転レール５の下方に設置し落下した半
導体装置１を上下に収納する収納チユーブ（容
器）７とからなり、前記回転レール５に半導体装
置１を吸着させる固定保持機構としての真空チヤ
ツク８を設け、収納チユーブ７内に半導体装置１
の高さ分ずつ下降する受け治具６を装備したもの
である。 As shown in FIG. 2, the handling device according to the present invention includes a sliding rail 2 for transporting the semiconductor device 1 with the bending direction of the lead 4 facing downward, and a rotating rail rotatably disposed at the end of the sliding rail 2. 5, and a storage tube (container) 7 installed below the rotating rail 5 to store the fallen semiconductor device 1 vertically, and a vacuum chuck serving as a fixed holding mechanism for adhering the semiconductor device 1 to the rotating rail 5. 8 is provided, and the semiconductor device 1 is placed inside the storage tube 7.
It is equipped with a receiving jig 6 that descends by the height of .
実施例において、半導体装置１は滑走レール２
上を図示しない手段により供給されて回転レール
５に搬送される。回転レール５に搬送された半導
体装置１を真空チヤツク８で吸着してこれを回転
レール５に固定した後、回転レール５を半回転さ
せる。この時点で、半導体装置１は一体に半回転
し、リード４の折り曲げ方向が上方向を向く。次
に、回転レール５の真空チヤツク８を開放すると
半導体装置１は収納チユーブ７に落下して収納さ
れる。最初に収納された半導体装置１は収納チユ
ーブ７内に設置された受け治具６上に乗り、受け
治具６が予め設定された半導体装置の高さ分だけ
下降し、次に落下する半導体装置１は既にチユー
ブ７内に収納された半導体装置１上に同じ姿で積
み重ねられて収納チユーブ７に順次収納される。 In the embodiment, the semiconductor device 1 has a sliding rail 2
The upper part is supplied by means not shown and conveyed to the rotating rail 5. After the semiconductor device 1 transferred to the rotating rail 5 is attracted by the vacuum chuck 8 and fixed to the rotating rail 5, the rotating rail 5 is rotated by half a rotation. At this point, the semiconductor device 1 rotates half a turn, and the bending direction of the leads 4 faces upward. Next, when the vacuum chuck 8 of the rotary rail 5 is opened, the semiconductor device 1 falls into the storage tube 7 and is stored therein. The first semiconductor device 1 stored is placed on the receiving jig 6 installed in the storage tube 7, and the receiving jig 6 is lowered by a preset height of the semiconductor device, and the next semiconductor device falls. 1 are stacked in the same shape on top of the semiconductor devices 1 already housed in the tube 7, and are sequentially housed in the storage tube 7.
したがつて、本発明によれば半導体装置は同じ
向きで収納チユーブに収納され、後工程でのハン
ドリングを容易に行なうことができ、しかもリー
ドを上向きにして落下させるため、落下時のリー
ド変形を解消でき、後工程でリード修正が不要と
なり、製造経費を低減できる効果を有するもので
ある。 Therefore, according to the present invention, the semiconductor devices are stored in the storage tube in the same orientation, making it easy to handle them in the subsequent process.Furthermore, since the semiconductor devices are dropped with the leads facing upward, the leads are not deformed when dropped. This eliminates the need for lead correction in post-processing, and has the effect of reducing manufacturing costs.
第１図は従来のハンドリング装置の概略図、第
２図は本発明に係るハンドリング装置の一例を示
す概略図である。
１……半導体装置、２……滑走レール、５……
回転レール、６……受け治具、７……収納チユー
ブ、８……真空チヤツク（固定保持機構）。
FIG. 1 is a schematic diagram of a conventional handling device, and FIG. 2 is a schematic diagram showing an example of a handling device according to the present invention. 1... Semiconductor device, 2... Sliding rail, 5...
Rotating rail, 6... Receiving jig, 7... Storage tube, 8... Vacuum chuck (fixed holding mechanism).
Claims (1)
装置を搬送する滑走レールと、該滑走レールの終
端に転回可能に配設した回転レールと、該回転レ
ールの下方に設置した収納容器とからなり、前記
回転レールに半導体装置を吸着させる固定保持機
構を設け、収納容器内に半導体装置の高さ分ずつ
下降する受け治具を装備したことを特徴とするハ
ンドリング装置。1 Consists of a sliding rail for transporting a semiconductor device with the lead bending direction facing downward, a rotating rail rotatably disposed at the end of the sliding rail, and a storage container installed below the rotating rail, A handling device characterized in that a fixed holding mechanism for adsorbing a semiconductor device to a rail is provided, and a receiving jig is installed in a storage container to lower the semiconductor device by the height of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58004679A JPS59129443A (en) | 1983-01-14 | 1983-01-14 | Handling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58004679A JPS59129443A (en) | 1983-01-14 | 1983-01-14 | Handling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59129443A JPS59129443A (en) | 1984-07-25 |
| JPH0155580B2 true JPH0155580B2 (en) | 1989-11-27 |
Family
ID=11590574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58004679A Granted JPS59129443A (en) | 1983-01-14 | 1983-01-14 | Handling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59129443A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1032810C2 (en) * | 2006-11-03 | 2008-05-06 | Assembleon Bv | Method for placing a component on a substrate and such a device. |
-
1983
- 1983-01-14 JP JP58004679A patent/JPS59129443A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59129443A (en) | 1984-07-25 |
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