JPS645815B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to a method for manufacturing a glazed substrate, and more particularly, to a method for manufacturing a glazed substrate in which the thickness of the glaze layer is uniform and there is no chipping or cracking in the glazed portion. For example, the head of a thermal printer has a structure in which heating resistors such as Ta ₂ N are arranged on a so-called glaze substrate, which is a ceramic substrate with a glaze layer formed on it. The heating resistor is installed, for example, in the range of 8 to 12
This is done by etching after aligning the mask with lines of mm/mm. Therefore, it is desirable that the glaze layer of the glaze substrate used here not only be free from chipping and cracks but also have a uniform thickness. If the thickness of the glaze layer is non-uniform, the lines will be uneven during the above-mentioned mask alignment, making it difficult to obtain a good product. Glazed substrates can generally be obtained by coating or printing a glass component on a ceramic substrate and then firing it. Usually, the firing process raises the edges of the glaze layer and creates a glaze with a uniform thickness. There is a drawback that it cannot be layered. Therefore, conventionally, methods have been adopted to make the thickness of the glaze layer uniform by adjusting the firing conditions and the thickness of the glaze layer, but these methods, for example, reduce the protrusion of the glaze layer by about 10 μm. Although it can be suppressed up to this point, it cannot be made completely uniform. Further, even if it is possible to suppress the swelling of the edges of the glaze layer, there is a drawback that the edges of the glaze layer are no longer sharp and become sloped surfaces, a so-called phenomenon of glaze dripping. In view of the above circumstances, the inventors of the present invention have investigated various ways to obtain a glazed substrate with a uniform glaze layer thickness. The present inventors have discovered that the object of the present invention can be achieved by processing a substrate in a specific manner, and have completed the present invention. That is, the gist of the present invention is to form a glaze layer on one side of a ceramic substrate having extensions at both ends in the longitudinal direction and grooves on the front and back surfaces of the boundary between the two extensions, and then forming the glaze layer. The method of manufacturing a glazed substrate is characterized in that the extended portions at both ends are broken by applying stress from the side surfaces. Hereinafter, the present invention will be explained with reference to the accompanying drawings. FIG.
The figure is an explanatory side view of a similar glazed substrate after breaking the extensions. As shown in FIG. 1, the ceramic substrate used in the present invention has a ceramic substrate main body 1 and extensions 2a and 2b extending to both ends of the ceramic substrate in the longitudinal direction, and the main body 1 and extensions 2a and 2b are made of the same material. It is constructed in one piece. The ceramic substrate is usually made of known materials such as alumina, beryllia, or SiC. Additionally, the thickness of the ceramic substrate is usually
It is about 0.8 to 2.0 mm. The extensions 2a, 2b of the ceramic substrate are later broken, and only the main body 1 is the final product, as shown in FIG. The length of the extension parts 2a, 2b is usually
Each length is 5 to 15% of the ceramic substrate body 1, and specifically, for example, about 10.0 to 30.0 mm. In the present invention, an extension part 2 is added to the boundary between the main body 1 and the extension parts 2a and 2b of the ceramic substrate in a later process.
Grooves 4a, 4b are provided to facilitate breaking a, 2b. These grooves 4a, 4b
is provided over the entire width direction of the ceramic substrate. Moreover, these grooves 4a and 4b are formed in both extension parts 2.
The front and back surfaces of the boundary between a and 2b, that is, 4
It is necessary to provide one in each location. If this groove was only on one side of the ceramic substrate,
The break treatment is not performed well in the later process, making it impossible to obtain a high-quality grace board.The size of the grooves 4a and 4b is usually 0.03 to 0.2 mm in width.
Preferably 0.08~0.15mm, and depth 0.04
~0.5 mm, preferably 0.1 to 0.2 mm; if this size is too large or small, it is not preferable because good breaking treatment cannot be achieved. Generally, the grooves 4a and 4b can be formed in the ceramic substrate by either a laser processing method or a method in which the grooves are formed during the production of the green sheet, but in the case of the present invention, The former method is particularly preferred. The glaze layer 3 is formed on the surface of the ceramic substrate as described above, and the glaze layer 3 is formed by a conventional method, for example, by coating or printing a glass component on the ceramic substrate and then firing it. can be done. In the present invention, the glaze layer 3 is provided not only on the ceramic substrate body 1 but also on the extensions 2a and 2b at both ends of the ceramic substrate, and has an appropriate width. Examples of the glass component include known glass components containing Sio ₂ , BaO, Al ₂ O ₃ and the like as main components. The thickness of the glaze layer is usually 0.01 to 0.15 mm, preferably 0.03 to 0.1 mm, and is usually obtained by baking at a temperature of 800 to 1200° C. for a holding time of 1 to 3 hours. On the other hand, the firing treatment of ceramic substrates is usually carried out at a temperature of 1500 to 1600°C for a holding time of 1 to 3 hours. Both ends of the glaze layer 3 formed by this process become thicker to some extent and a raised portion 5 is formed. However, in the present invention, since the extensions 2a and 2b of the ceramic substrate are broken, the remaining glaze layer on the ceramic substrate body 1 has no raised parts and has a uniform thickness. In the present invention, both extensions 2a and 2b of the glazed substrate are broken after the firing process, but this breaking process requires applying stress from the glaze layer side. In other words, if the stress is applied from the opposite side and the break occurs, chipping and cracking will occur in the glazed portion, which is undesirable, but if the break occurs from the glaze layer side, the glaze will not be damaged. , resulting in a clean break cross section. Break treatment is usually done by fixing the main body part of the glaze substrate, and then applying 3 to 15
It is carried out by applying a stress of Kg/cm ² . The glazed substrate obtained in this way has a uniform glaze layer thickness, and there is no chipping or cracking in the glaze layer, so the heating resistors can be arranged more accurately, making it an extremely good product. It is. Therefore, it can be suitably used, for example, as a head for a thermal printer, as well as a glaze substrate for facsimile and telex machines. Next, the present invention will be explained in more detail with reference to examples, but the present invention is not limited to the description of the following examples unless it exceeds the gist thereof. Examples 1 to 2 An alumina substrate (purity 97%) having a length of 290 mm, a width of 50 mm, and a thickness shown in Table 1 is provided with a groove of the size shown in Table 1 at a position 10 mm from both longitudinal ends. was provided on the front and back sides in the entire transverse direction using a laser processing method, and an alumina substrate having extensions and grooves at both ends was created. Next, glass was applied to the alumina substrate from end to end in a width of 50 mm and a thickness of 0.05 mm according to a conventional method, and then fired at a temperature of 1050°C for 3 hours. A glaze layer was formed. Thereafter, the central portion of the alumina substrate was fixed, and a stress of 12 kg/cm ² was applied from the surface of the extension to break both extensions. The glazed substrate thus obtained had a glaze layer with a uniform thickness without any bulges or drips of glaze at the edges of the glaze layer. Further, when this manufacturing test was repeated and the glaze layer of each obtained glazed substrate was observed, no chipping or cracking occurred as shown in Table 1. Comparative Example 1 Table 1 shows the results of repeated manufacturing tests using the same method as in Example 1, except that grooves were provided only on the front surface of the alumina substrate and grooves on the back surface were omitted. . Comparative Example 2 Table 1 shows the results of a manufacturing test conducted in exactly the same manner as in Example 1, except that the extended portion of the alumina substrate was broken by applying stress from the back side.

[Table] From the results in Table 1, it can be seen that the method of the present invention does not cause chipping or cracking of the glaze layer, but when the grooves are provided only on one side or from the back side, as in the comparative method, If you do,
It can be seen that chipping and cracking occur in the glaze layer.

[Brief explanation of drawings]

FIG. 1 is a side view illustratively showing an example of the glazed substrate according to the present invention before breaking the extension part;
FIG. 2 is an illustrative side view of a similar glazed substrate after the extensions have been broken. DESCRIPTION OF SYMBOLS 1... Ceramic substrate body, 2a, 2b... Extension part, 3... Glaze layer, 4a, 4b... Groove, 5... Raised part.

Claims (1)

[Claims] 1. Forming a glaze layer on one side of a ceramic substrate having extensions at both ends in the longitudinal direction and grooves on the front and back surfaces of the boundary between the two extensions,
A method for producing a glazed substrate, characterized in that the extended portions at both ends are broken by applying stress from the surface on the glaze layer side. 2. The method according to claim 1, wherein the material of the ceramic substrate is alumina, beryllia, or SiC. 3 The width of the groove provided on the ceramic substrate is 0.03 to 0.2 mm,
The method according to claim 1, wherein the depth is 0.04 to 0.5 mm. 4. The method according to claim 1 or 3, wherein the grooves in the ceramic substrate are formed by laser processing.