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JPS648664B2 - - Google Patents
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JPS648664B2 - - Google Patents

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Publication number
JPS648664B2
JPS648664B2 JP11769382A JP11769382A JPS648664B2 JP S648664 B2 JPS648664 B2 JP S648664B2 JP 11769382 A JP11769382 A JP 11769382A JP 11769382 A JP11769382 A JP 11769382A JP S648664 B2 JPS648664 B2 JP S648664B2
Authority
JP
Japan
Prior art keywords
weight
tetrahydrofuran
chloride resin
present
vinyl chloride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11769382A
Other languages
Japanese (ja)
Other versions
JPS598743A (en
Inventor
Nobuaki Okuda
Mamoru Kamikado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP11769382A priority Critical patent/JPS598743A/en
Publication of JPS598743A publication Critical patent/JPS598743A/en
Publication of JPS648664B2 publication Critical patent/JPS648664B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は架橋処理をすることなく、耐熱変形
性、耐ハンダ特性にすぐれ、肉薄の成形加工が容
易な塩化ビニル系樹脂組成物に関する。 近年、各種電気・電子機器、自動車等は小型
化、軽量化が進み、それに伴つて使用される電
線、チユーブ、フイルム等の薄肉化が強く要望さ
れるようになつてきている。 従来、薄肉化による耐熱変形性、耐ハンダ特性
の劣化を補う為に、塩化ビニル系樹脂組成物を放
射線照射架橋又は架橋剤によつて化学的に架橋し
た製品が上市されている。 しかしながら、放射線照射による架橋方法の場
合は、工業用電子線照射装置等の大規模な設備投
資を必要とし、照射コストが高くつくという不利
益があり、一方架橋剤による化学的な架橋方法の
場合は、成形加工の際に成形機内部での早期架橋
を防止する為に注意深い温度コントロールを必要
とし、又、成形加工後に成形品を加熱等の処理を
して架橋せしめる必要があり、製造工程が煩雑に
なるという欠点がある。 本発明者等は、これらの欠点を解消する為に鋭
意検討を行つた結果、テトラヒドロフランに不溶
なポリ塩化ビニルゲル分及びテトラヒドロフラン
可溶分からなるポリ塩化ビニル系樹脂にマレイン
酸系ポリエステルを添加することによつてのみ所
期の目的を達成することを見出し、本発明に至つ
た。 本発明の目的は、架橋処理をすることなく、通
常の成形加工をするだけで安価に放射線照射架橋
又は架橋剤による化学架橋と同等の耐熱変形性、
耐ハンダ特性を有し肉薄成形加工が可能な塩化ビ
ニル系樹脂組成物を提供するものである。 すなわち、テトラヒドロフランに不溶なポリ塩
化ビニルゲル分5〜90重量%及び残部がテトラヒ
ドロフラン可溶分からなるポリ塩化ビニル系樹脂
100重量部に対して、原料の二塩基酸の一部又は
全部がマレイン酸であるポリエステル組成物を、
0.1〜20重量部添加してなることを特徴とする塩
化ビニル系樹脂組成物である。 本明細書に於いて用いられている“テトラヒド
ロフランに不溶なゲル分”とは、ソツクスレー抽
出器を用いて熱テトラヒドロフランで22時間抽出
し、350メツシユフイルターにて分離される抽出
残渣を意味する。 本発明で使用するテトラヒドロフランに不溶な
ポリ塩化ビニルゲル分を含む塩化ビニル系樹脂
は、特開昭54―80354号公報にも記載されている
ように、塩化ビニルまたは塩化ビニルを主体と
し、これと共重合しうる単量体との混合物を、該
塩化ビニル単量体当り0.01〜10重量%の、分子内
に二個以上のエチレン性二重結合を有する少なく
とも1種の共重合しうる多官能性単量体の存在
下、0〜50℃の範囲の温度で、重量系の全単量体
の少なくとも60重量%が重合するまで、重合する
まで重合を行うことによつて得られ、テトラヒド
ロフランに不溶なゲル分5〜90重量%及び残部が
テトラヒドロフラン可溶分からなることを特徴と
しており、次に挙げる共重合体を含むものであ
る。 すなわち、塩化ビニルと共重合しうる単量体と
しては、脂肪酸ビニルエステル、ビニリデンハラ
イド、アクリル酸アルキルエステル、メタクリル
酸アルキルエステル、アクリロニトリル、アルキ
ルビニルエーテル、スチレン及びその誘導体等が
挙げられる。 本発明の範囲外のポリ塩化ビニル系樹脂、すな
わち、テトラヒドロフランに不溶なゲル分5重量
%未満のもの、あるいはゲル分を含まない一般の
ポリ塩化ビニル系樹脂は本発明の主旨を損わない
限り、本発明に使用されるポリ塩化ビニル系樹脂
とブレンドして使用しても差支えないが、単独で
使用した場合には、耐熱変形性、耐ハンダ特性を
満足しなかつた。 テトラヒドロフランに不溶なゲル分90重量%を
越えるものは、耐熱変形性は良くなるが、組成物
を混練する場合にまとまりが悪く、特に加工上に
問題があり好ましくない。 次に本発明の特徴の1つは、原料の二塩基酸の
一部又は全部がマレイン酸であるポリエステルを
添加することによつて、成形品の外観を改良する
ことである。 原料の二塩基酸は、マレイン酸単独又はマレイ
ン酸とその他の二塩基酸の併用であり、具体的に
はアジピン酸、アゼライン酸、セバシン酸、フタ
ル酸等が挙げられる。又、一方の原料であるグリ
コールの例としては、エチレングリコール、1,
2―プロピレングリコール、1,3―ブタンジオ
ール、1,4―ブタンジオール、1,6―ヘキサ
ンジオールTMPD(2,2,6―トリメチル―
1,3―ペンタンジオール)等が挙げられる。本
発明に使用されるマレイン酸系ポリエステルは前
記の二塩基酸とグリコールを適宜組合せ、更には
一般にチエーンストツパーと呼ばれる中・高級ア
ルコール又は脂肪酸を反応させて得られる。 マレイン酸系ポリエステルの添加量は、本発明
に使用されるポリ塩化ビニル系樹脂100重量部に
対して0.1〜20重量部好ましくは、1〜10重量部
である。マレイン酸系ポリエステルの添加量を多
くすると、ゲル化促進効果が増し成形品の外観改
良に寄与するが、20重量部添加すればその効果は
充分で、それ以上の添加は無意味であり、又、
0.1重量部未満であればゲル化促進効果が期待で
きない。 本発明の樹脂組成物には、必要に応じて塩化ビ
ニル系樹脂組成物に通常配合される安定剤、充填
剤、滑剤、改質剤、着色剤等を添加することがで
き、その使用量は特に限定されない。又、マレイ
ン酸系ポリエステルと併用される可塑剤について
も塩化ビニル系樹脂組成物に通常配合される可塑
剤を使用することができ、その使用量も特に限定
はしないが、本発明の目的から言つてトータル可
塑剤量が25〜70重量となるようにすることが望ま
しい。 以下実施例及び比較により、本発明を具体的に
説明する。なお配合剤の単位は重量部表示とし
た。 実施例1〜5及び比較例1〜3 直径0.5mmの導体(メツキなし銅単線)上に表
1に示した実施例1〜5及び比較例1〜3の組成
物を押出し、被覆厚み0.25mmの電線を作成した。
The present invention relates to a vinyl chloride resin composition that has excellent heat deformation resistance and solder resistance properties and can be easily molded into thin walls without crosslinking. In recent years, various electric/electronic devices, automobiles, etc. have become smaller and lighter, and as a result, there has been a strong demand for thinner electric wires, tubes, films, etc. used. Conventionally, in order to compensate for the deterioration in heat deformation resistance and solder resistance due to thinning, products have been put on the market in which vinyl chloride resin compositions are chemically crosslinked by radiation crosslinking or by a crosslinking agent. However, cross-linking methods using radiation irradiation require large-scale equipment investment such as industrial electron beam irradiation equipment, and have the disadvantage of high irradiation costs, while chemical cross-linking methods using cross-linking agents requires careful temperature control during molding to prevent premature crosslinking inside the molding machine, and it is also necessary to heat or otherwise crosslink the molded product after molding, which slows down the manufacturing process. The disadvantage is that it becomes complicated. The inventors of the present invention conducted intensive studies to eliminate these drawbacks, and as a result, they decided to add a maleic acid polyester to a polyvinyl chloride resin consisting of a polyvinyl chloride gel component that is insoluble in tetrahydrofuran and a tetrahydrofuran soluble component. It was discovered that only by doing so could the intended purpose be achieved, leading to the present invention. The purpose of the present invention is to achieve heat deformation resistance equivalent to that of radiation crosslinking or chemical crosslinking using a crosslinking agent at low cost by simply performing ordinary molding processing without performing crosslinking treatment.
The object of the present invention is to provide a vinyl chloride resin composition that has solder resistance and can be processed into thin-walled molding. That is, a polyvinyl chloride resin consisting of 5 to 90% by weight of polyvinyl chloride gel insoluble in tetrahydrofuran and the remainder soluble in tetrahydrofuran.
For 100 parts by weight, a polyester composition in which part or all of the raw dibasic acid is maleic acid,
This is a vinyl chloride resin composition characterized in that it contains 0.1 to 20 parts by weight. As used herein, the term "gel fraction insoluble in tetrahydrofuran" refers to the extraction residue extracted with hot tetrahydrofuran for 22 hours using a Soxhlet extractor and separated using a 350 mesh filter. The vinyl chloride resin containing a polyvinyl chloride gel component that is insoluble in tetrahydrofuran used in the present invention is mainly composed of vinyl chloride or vinyl chloride, as described in JP-A-54-80354. A mixture with a polymerizable monomer is mixed with at least one copolymerizable polyfunctional monomer having two or more ethylenic double bonds in the molecule in an amount of 0.01 to 10% by weight based on the vinyl chloride monomer. Insoluble in tetrahydrofuran, obtained by carrying out the polymerization in the presence of polymers at temperatures ranging from 0 to 50 °C until at least 60% by weight of the total monomers in the system have been polymerized. It is characterized by having a gel content of 5 to 90% by weight and the remainder consisting of a tetrahydrofuran soluble component, and contains the following copolymers. That is, examples of monomers copolymerizable with vinyl chloride include fatty acid vinyl esters, vinylidene halides, acrylic acid alkyl esters, methacrylic acid alkyl esters, acrylonitrile, alkyl vinyl ethers, styrene, and derivatives thereof. Polyvinyl chloride resins outside the scope of the present invention, i.e., those that are insoluble in tetrahydrofuran and have a gel content of less than 5% by weight, or general polyvinyl chloride resins that do not contain a gel content, are used as long as they do not impair the gist of the present invention. Although it may be used in a blend with the polyvinyl chloride resin used in the present invention, when used alone, the heat deformation resistance and solder resistance properties were not satisfied. If the gel content exceeds 90% by weight and is insoluble in tetrahydrofuran, the heat deformation resistance will be improved, but the composition will not come together well when kneaded, and this will cause problems in processing, so it is not preferable. Next, one of the features of the present invention is that the appearance of the molded article is improved by adding a polyester in which part or all of the dibasic acid as a raw material is maleic acid. The raw dibasic acid is maleic acid alone or a combination of maleic acid and other dibasic acids, and specific examples include adipic acid, azelaic acid, sebacic acid, and phthalic acid. Examples of glycols that are one of the raw materials include ethylene glycol, 1,
2-propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol TMPD (2,2,6-trimethyl-
1,3-pentanediol) and the like. The maleic acid-based polyester used in the present invention is obtained by appropriately combining the dibasic acid and glycol described above, and further reacting them with a medium or higher alcohol or fatty acid, which is generally called a chain stopper. The amount of maleic acid polyester added is preferably 0.1 to 20 parts by weight, preferably 1 to 10 parts by weight, per 100 parts by weight of the polyvinyl chloride resin used in the present invention. Increasing the amount of maleic polyester added increases the gelation promoting effect and contributes to improving the appearance of the molded product, but adding 20 parts by weight is sufficient, and adding more than that is meaningless. ,
If it is less than 0.1 part by weight, no gelation promoting effect can be expected. The resin composition of the present invention may contain stabilizers, fillers, lubricants, modifiers, colorants, etc., which are usually added to vinyl chloride resin compositions, as necessary, and the amount used may be Not particularly limited. Furthermore, as for the plasticizer used in combination with the maleic acid polyester, a plasticizer that is commonly added to vinyl chloride resin compositions can be used, and the amount used is not particularly limited, but from the purpose of the present invention, It is desirable that the total amount of plasticizer is 25 to 70% by weight. The present invention will be specifically explained below with reference to Examples and comparisons. In addition, the unit of the compounding agent was expressed as parts by weight. Examples 1 to 5 and Comparative Examples 1 to 3 The compositions of Examples 1 to 5 and Comparative Examples 1 to 3 shown in Table 1 were extruded onto a conductor (unplated copper single wire) with a diameter of 0.5 mm, and the coating thickness was 0.25 mm. electric wire was created.

【表】 *1 大日本インキ化学工業(株)製
マレイン酸系ポリエステルを主成分とする組成

その特性を表2に示した。
[Table] *1 Manufactured by Dainippon Ink & Chemicals Co., Ltd. Composition whose main component is maleic acid polyester Its properties are shown in Table 2.

【表】 の形状保持の度合を目視で観察した。
実施例6及び比較例4,5 表3に示した実施例6及び比較例4,5の組成
物を押出成形し、外径15mm、肉厚0.3mmのチユー
ブを作成した。
[Table] The degree of shape retention was visually observed.
Example 6 and Comparative Examples 4 and 5 The compositions of Example 6 and Comparative Examples 4 and 5 shown in Table 3 were extruded to form tubes with an outer diameter of 15 mm and a wall thickness of 0.3 mm.

【表】 その特性を表4に示した。【table】 Its characteristics are shown in Table 4.

【表】 実施例7及び比較例6 表5に示した実施例7及び比較例6の組成物を
押出成形し、厚み0.3mmのフイルムを作成した。
[Table] Example 7 and Comparative Example 6 The compositions of Example 7 and Comparative Example 6 shown in Table 5 were extrusion molded to produce films with a thickness of 0.3 mm.

【表】【table】

【表】 その特性を表6に示した。【table】 Its characteristics are shown in Table 6.

【表】 以上のように本発明に係る塩化ビニル系樹脂組
成物は良好な成形加工性を示すと共に、優れた耐
熱変形性、耐ハンダ特性を示すものであり、又架
橋処理が不要というメリツトを考え合わせれば工
業的利用価値は非常に大きい。
[Table] As described above, the vinyl chloride resin composition according to the present invention exhibits good molding processability, as well as excellent heat deformation resistance and solder resistance, and also has the advantage of not requiring crosslinking treatment. When considered together, the industrial value is extremely large.

Claims (1)

【特許請求の範囲】[Claims] 1 テトラヒドロフランに不溶なポリ塩化ビニル
ゲル分5〜90重量%及び残部がテトラヒドロフラ
ン可溶分からなるポリ塩化ビニル系樹脂100重量
部に対して、原料の二塩基酸の一部又は全部がマ
レイン酸であるポリエステルを0.1〜20重量部添
加してなることを特徴とする塩化ビニル系樹脂組
成物。
1 Polyester in which part or all of the dibasic acid as a raw material is maleic acid, based on 100 parts by weight of a polyvinyl chloride resin consisting of 5 to 90% by weight of polyvinyl chloride gel insoluble in tetrahydrofuran and the remainder soluble in tetrahydrofuran. A vinyl chloride resin composition characterized by adding 0.1 to 20 parts by weight of.
JP11769382A 1982-07-08 1982-07-08 Vinyl chloride-based resin composition Granted JPS598743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11769382A JPS598743A (en) 1982-07-08 1982-07-08 Vinyl chloride-based resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11769382A JPS598743A (en) 1982-07-08 1982-07-08 Vinyl chloride-based resin composition

Publications (2)

Publication Number Publication Date
JPS598743A JPS598743A (en) 1984-01-18
JPS648664B2 true JPS648664B2 (en) 1989-02-14

Family

ID=14717955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11769382A Granted JPS598743A (en) 1982-07-08 1982-07-08 Vinyl chloride-based resin composition

Country Status (1)

Country Link
JP (1) JPS598743A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63297446A (en) * 1987-05-29 1988-12-05 Tatsuta Electric Wire & Cable Co Ltd Watertight mixture

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615323A (en) * 1979-07-17 1981-02-14 Dainippon Ink & Chem Inc Manufacture of soft vinyl chloride synthetic resin sheet

Also Published As

Publication number Publication date
JPS598743A (en) 1984-01-18

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