JPS648793B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a through-hole printed wiring board testing method and testing device for testing continuity using contacts. This allows inspection of printed through-hole printed wiring boards.

The development of printed wiring boards has been remarkable in recent years, and they are installed not only in computing equipment such as computers, but also in control equipment for machine tools and various production machines, and are used as the core of these electrical circuits. . On the one hand, printed wiring boards have responded to the development of ICs and LSIs, and as ICs and LSIs have become more sophisticated, they have become more complex and denser. Printed wiring boards that have become more complex and more dense can be manufactured one after another due to advances in photographic technology, printing technology, and plating technology.
However, since the technology for inspecting manufactured printed wiring boards is not as rapid as the progress of the above-mentioned technology, there is an overflow in the stable supply of highly reliable printed wiring boards. In the past, visual inspection was relied on for inspection, but as printed wiring boards become more complex and denser, visual inspection has its limits, and there is a strong desire for mechanization and automation in this field.

As a means of automatically inspecting printed wiring boards, since most of the parts mounted on printed wiring boards, such as ICs, LSIs, resistors, and capacitors, are standardized, it is possible to inspect these parts as a group. Considering this, the applicant previously filed a patent application in 1973.
It is proposed as No.-79960 (Japanese Unexamined Patent Publication No. 51-9260). In addition, the conductor parts, or lands, on printed wiring boards are designed based on grid points at regular intervals, so these can be combined to create a versatile adapter with a large number of contact groups. It becomes possible to test the conduction state with considerable accuracy. However, since printed wiring boards are designed according to individual purposes, lands may be located at locations other than the above-mentioned lattice points, and in such cases, inspection cannot be performed using the above-mentioned method.

Other disadvantages of the method of testing continuity using contacts include the high cost of the contacts;
Another problem is that the number of lands on printed wiring boards to be inspected tends to increase more and more. Although inspection is possible by using an adapter with contacts in the number and position that matches the printed wiring board design of the individual design, the adapter is quite expensive, and moreover, a dedicated adapter must be prepared each time the design changes. However, there is a problem that it is not practical for inspecting high-density printed wiring boards, which are generally manufactured in small quantities and in a wide variety of products.

The present invention was made in view of these circumstances, and the gist of the invention is to provide a method for testing through-hole printed wiring boards that uses contacts to test the conductivity of all lattice points within a certain area. A main adapter with a contact placed thereon and a sub-adapter with a contact placed at a position other than a grid point within the area and/or a position outside the area are simultaneously brought close to each other from the front and back of the through-hole printed wiring board to be inspected. The first invention is a method for testing a through-hole printed wiring board, characterized in that the test is carried out by bringing the respective contacts into contact with each other. In the device, a main adapter in which contacts are arranged at all grid points within a certain area is arranged so as to be movable up and down above the wiring board support base to be inspected, and the main adapter has contacts arranged at all grid points within the area and/or at positions other than the grid points within the area and/or outside the area. A sub-adapter with a contact placed at the position is fixedly placed below the through-hole printed wiring board on the wiring board support base to be tested, and the support base for the wiring board to be tested is installed horizontally movably. A second invention provides a through-hole printed wiring board inspection device characterized by:

A detailed description will be given below based on the drawings.

The present invention relates to a method and apparatus for testing the conductivity of a through-hole printed wiring board using a large number of contacts, and these methods mainly include an adapter equipped with contacts, a support for the wiring board to be tested, and a scanning device. A control device consisting of a section, a comparison section, a display section, etc. is used.

FIG. 1 shows a model of a through-hole printed wiring board 1 to be inspected in the present invention.
2 to 8 and 13 are lands whose front and back sides are connected by through holes. Reference numerals 10 to 12 are wirings connecting between lands, with solid lines showing the wiring state on the front surface and dotted lines showing the wiring state on the back surface. Most of the lands on such a through-hole printed wiring board 1 are located, for example, at lattice points with an interval of 2.54 mm in length and width, but as an exception, lands 13 are not located on these lattice points. To explain the inspection method for the through-hole printed wiring board 1 to be inspected, the conventional method will first be explained with reference to FIGS. 6 and 7. As mentioned above, it is practically difficult to manufacture adapters that match each through-hole printed wiring board to be inspected each time. (or (G) or (C) or (L)) is determined, and two types of adapters are prepared in which contactors (E) are arranged at all grid points within this area. One of these adapters is shown in d, which covers the area shown in FIG. 7A or B. Further, although not shown, other adapters that cover FIG. 7C and D are also prepared. In the figure, the symbol ``nu'' indicates a masking sheet for insulating unnecessary lattice points, and is used as necessary. In this method, when the left half of the through-hole printed wiring board A is first inspected as shown in Figure 6, the conduction state of the land is sent as a signal to the control device (not shown) through the contact hole in contact with the land. Sent. The control device compares the sent signal with the normal conduction state stored in advance, determines the conductivity of the through-hole printed wiring board to be tested, and displays the result.
The right half is similarly inspected as described above. In addition, using a separately prepared horizontally long adapter (not shown), Figures 7C and 7D are similarly inspected, and through these four steps, the through-hole printed wiring board to be inspected in Figure 1 is inspected. Ru. However, the problem here is that lands 13 and 3 in Figure 1
This is Landro, Ha, which corresponds to . When inspected in the first step, the landro is not on the grid point, so the contactor does not detect it. Also, since the land is not in contact during this process, it is not possible to inspect the continuity of the wiring 9 connecting land 2 and land 3 in Fig. 1, and even if the adapter 2 moves to the right half The same thing is true, and the same thing cannot be detected even if another adapter is inspected as shown in FIG. 7C and D. As described above, in the conventional method, when a land is located at a position other than a grid point, or when a certain area is defined and it is necessary to check continuity with a land located outside this area, this test is performed. It has an essential flaw that it cannot be done.

In contrast, the method of the present application uses a main adapter 15 and a sub adapter 17 as shown in FIG.
The present invention is characterized in that the through-hole printed wiring board 1 to be inspected is simultaneously inspected from both the front and back sides. That is, the main adapter used in the present invention is
For example, as shown in FIG. 3, two types are prepared, each having a size that covers half the area of the through-hole printed wiring board 1 to be inspected, and contacts 14 and 14' are located at all grid points at predetermined intervals. is configured to do so. First main adapter 15
covers an area that vertically divides the through-hole printed wiring board 1 to be inspected, and is shown in FIG.
The second main adapter 15' covers an area bisected in the horizontal direction, and is designed to be inspected as shown in FIG. 4C and D. Also,
The sub adapter 17 in this embodiment is approximately the same size as the through-hole printed wiring board 1 to be tested in terms of shape, but has a position corresponding to the land 13 other than the above-mentioned lattice points and a land 3 outside the predetermined area. The structure includes contacts 19 and 18 at respective positions. Note that 16 in FIG. 2 is a masking sheet for insulating unnecessary lattice points.

In this example, inspection is performed using A in FIG. 4 as the first step, B as the second step, C as the third step, and D as the fourth step. As shown, the first main adapter 15 descends from above and approaches the through-hole printed wiring board 1 to test the conductivity of the required lands on the surface of the through-hole printed wiring board 1 to be tested. At the same time, the lands 13 and 3 are detected from the back surface of the through-hole printed wiring board 1 to be inspected using the contacts 19 and 18 of the sub adapter 17. Next, as shown in FIG. 4B, the through-hole printed wiring board 1 to be inspected is moved so that the main adapter 15 is located in the right half, and the same inspection is carried out. Similarly, the second
The upper half as shown in FIG. 4C and the lower half as shown in FIG. 4D are each inspected using the main adapter 15' of FIG. By the above method, the through-hole printed wiring board 1 to be inspected shown in FIG. ′,
Additionally, lands located within the area other than the lattice points and/or at positions outside the above area are contacted by the sub adapter 17, so that the connection between lands 6 and lands 13, which could not be achieved with the conventional method, can be achieved. Alternatively, the state of the connection 9 between land 2 and land 3 can be inspected at the same time, and all the lands of the through-hole printed wiring board can be inspected simultaneously. In the above example, two types of main adapters 15 and 15' are used, but since these main adapters have contacts arranged at all grid points at predetermined intervals, they can be used for various types of through-hole printed wiring to be inspected. It is versatile enough to be used as a board. Although the sub adapter 17 often has to be prepared according to each through-hole printed wiring board to be inspected, the number of contacts is extremely small and does not affect practical use.

The configuration of the main adapter 15 used in the present invention is as follows:
It is determined by the shape of the through-hole printed wiring board 1 to be inspected, the grid point spacing, etc. In this case, it is desirable to unify as much as possible and provide versatility. Further, the setting of the fixed area is determined based on the inspection process and the like, but it is required to cover a wiring area of at least one side length. In the above example, two types of main adapters 15 and 15' are prepared, but any one that has an area that covers at least one side of the through-hole printed wiring board 1 to be inspected and that has contacts arranged at all grid points can also be used. For example, one main adapter 15 may be used for inspection in the horizontal direction or the vertical direction. Also, the size of the area covered by the main adapter is the size of the through-hole printed wiring board 1,
Determined by shape. Generally, the circuit of the through-hole printed wiring board 1 is in a state where the circuit extends vertically and horizontally, so inspection using the main adapter is performed by moving it in the horizontal and vertical directions, that is, the X direction and the Y direction. Of course, only one direction needs to be inspected. The contacts 14 or 19, 18 used in the present invention are made of a metal with good conductivity, such as copper or brass, and generally have a built-in spring so that they can expand and contract. Further, the main adapter 15 or the sub adapter 17 is configured to support the contact with an insulating material.

Next, the inspection apparatus of the present invention will be explained based on FIG. 5. This figure is an explanatory diagram showing an example of an apparatus to which the method of FIG. 2 is applied. This inspection apparatus mainly includes a main adapter 15, a sub-adapter 17, a support base 20 for a wiring board to be inspected, and a control device 21. As described above, the main adapter 15 has contacts 14 arranged at all grid points within a certain area, and the sub adapter 17 has contacts at positions other than the grid points within the area and/or positions outside the area. I'm arranging my child and getting used to it. The wiring board support stand 20 to be inspected is movable in the horizontal direction, and the relative position of the through-hole printed wiring board 1 to be inspected placed on this support stand 20 with respect to the main adapter 15 can be moved. . The main adapter 15 can be raised and lowered, and the contactor 14
It is designed to descend when contacting the wiring board support base 20, and to rise when moving the wiring board support base 20 to be inspected. As shown in the figure, the sub adapter 17 is fixed to a wiring board support base 20 to be tested so as to support the through-hole wiring board 1 to be tested (however, it moves as the wiring board support base 20 to be tested moves). In addition, 21 is a control device equipped with a scanning section, a comparison section, a display section, etc., and 23 and 22 are main adapter 1.
5 or a connection between the sub adapter 17 and the control device 21.

When performing an inspection using the above-mentioned inspection apparatus, first, the through-hole printed wiring board 1 to be inspected is placed on the sub-adapter 17 with its surface facing up, and then fixed on the wiring board support 20 to be inspected. Next, the wiring board support base 20 to be inspected is moved horizontally and set at a position for the first inspection process, and the main adapter 15 is lowered to bring the contacts 14 into contact. If this is done, the state as shown in FIG. 2 will be obtained, and the area shown in FIG. 4A will be inspected first. Subsequently, the main adapter 15 is raised, the wiring board support stand 20 to be inspected is moved to the left, and the main adapter 15 is lowered again to inspect the area shown in FIG. 4B, but the sub adapter 17 must not be moved. The contact is always in contact.
Next, the second main adapter 15' as shown in FIG. 3B is set, the wiring board support stand 20 to be inspected is moved back and forth, and the areas shown in FIG. 4C and D are inspected in the same manner. The signals detected by the respective contacts are then sent to the control device 21, where they are compared with pre-stored circuit signals and the determined results are displayed. The inspection apparatus of the present invention connects the sub adapter 17 to the wiring board support base 20 to be inspected.
The through-hole printed wiring board 1 to be inspected is placed on top of the board, and the main adapter 15 is raised and lowered from above as appropriate for inspection. The installation and movement of the wiring board support base 20 to be inspected can be carried out rationally, and the mechanism does not become complicated in any way.

Since the present invention has the configuration as described in detail above, by using the main adapter and the sub adapter with the unique configuration, it is possible to simultaneously test the continuity state of the through-hole printed wiring board. Moreover, the main adapter is extremely versatile and can be used for many inspections, reducing manufacturing costs.The sub-adapter can also be obtained at a relatively low price, making it possible to significantly reduce the cost of inspections. Moreover, it has the advantage of providing an efficient and cost-saving inspection device.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a through-hole printed wiring board to be inspected in the present invention, Fig. 2 is a schematic explanatory diagram of the inspection method, Fig. 3 A, B is a bottom view of the main adapter, Fig. 4 A, B, C and D are explanatory diagrams of the inspection process, FIG. 5 is an explanatory diagram of the inspection apparatus of the present invention, FIG. 6 is a schematic explanatory diagram of the conventional inspection method, and FIGS. 7A, B,
C and D are explanatory diagrams of the inspection process. 1... Through-hole printed wiring board to be inspected, 1
4, 18, 19... Contacts, 15, 15'... Main adapter, 17... Sub-adapter, 20... Wiring board support stand to be inspected, 21... Control device.

Claims (1)

[Claims] 1. A method for testing a through-hole printed wiring board that uses contacts to test the continuity state, which includes: a main adapter in which contacts are arranged at all grid points within a certain area; A sub-adapter with contacts arranged at other positions and/or outside the area is simultaneously brought close to the front and back sides of the through-hole printed wiring board to be inspected, and the inspection is carried out by bringing the respective contacts into contact with each other. A method for inspecting a through-hole printed wiring board, characterized by: 2. In a through-hole printed wiring board inspection device that uses contacts to test continuity, the main adapter, which has contacts placed at all grid points within a certain area, can be raised and lowered above the support for the wiring board to be tested. At the same time, a sub-adapter with a contact placed at a position other than the grid point in the area and/or a position outside the area is fixedly placed on the wiring board support stand and below the through-hole printed wiring board. 1. A through-hole printed wiring board inspection device, characterized in that a wiring board support stand to be inspected is horizontally movable.