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JPS649759B2 - - Google Patents
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JPS649759B2 - - Google Patents

Info

Publication number
JPS649759B2
JPS649759B2 JP57200923A JP20092382A JPS649759B2 JP S649759 B2 JPS649759 B2 JP S649759B2 JP 57200923 A JP57200923 A JP 57200923A JP 20092382 A JP20092382 A JP 20092382A JP S649759 B2 JPS649759 B2 JP S649759B2
Authority
JP
Japan
Prior art keywords
chip
tube
chips
drop
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57200923A
Other languages
Japanese (ja)
Other versions
JPS5990999A (en
Inventor
Shigeru Kubota
Ikuji Kano
Masahiro Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP57200923A priority Critical patent/JPS5990999A/en
Publication of JPS5990999A publication Critical patent/JPS5990999A/en
Publication of JPS649759B2 publication Critical patent/JPS649759B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Feeding Of Articles To Conveyors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)

Description

【発明の詳細な説明】 近時、各種の自動チツプマウント装置を使用し
て、抵抗器、コンデンサー等の筒形(円筒形、円
柱形等)乃至板形(角板形、円板形等)の小型電
子部品(以下単にチツプと略記する。)を自動的
にプリント基板上に正確に配置(マウント)し、
該状態のまゝチツプをプリント基板上に適宜結着
することが行われている。
[Detailed Description of the Invention] Recently, various automatic chip mounting devices have been used to mount resistors, capacitors, etc., from cylindrical shapes (cylindrical shapes, cylindrical shapes, etc.) to plate shapes (square plate shapes, disk shapes, etc.). automatically places (mounts) small electronic components (hereinafter simply referred to as chips) on printed circuit boards,
In this state, the chip is appropriately bonded onto a printed circuit board.

該自動チツプマウント装置の大略は、プリント
基板におけるチツプの配置位置に合わせて多数の
チツプ装填孔を設定した治具盤を別設し、該治具
盤の各チツプ装填孔毎にチツプを送給装填して、
該チツプを装填した治具盤を設定位置に移行し、
該位置にて治具盤に装填されたチツプを、治具盤
の各装填孔の位置に合わせて構成された多数の吸
着口を備えたサクシヨンヘツドの各吸着口に吸着
して、その配置状態のまゝプリント基板上に移行
し、吸着を解いて、チツプマウント箇所に予めじ
接着剤を塗着してある該プリント基板上に各チツ
プを前記治具盤の配置位置と同一状態に正確にマ
ウント接着し、次で接着剤を乾燥処理したのち、
そのマウント状態のまゝ、ハンダ槽等へ移送し各
チツプをプリント基板上に適宜結着するものであ
る。
The automatic chip mount system basically consists of a separate jig board with a large number of chip loading holes set according to the placement positions of the chips on the printed circuit board, and chips being fed to each chip loading hole on the jig board. Load it and
Move the jig board loaded with the chip to the set position,
At this position, the chips loaded on the jig board are sucked into each suction port of the suction head, which is equipped with a large number of suction ports configured to correspond to the positions of the respective loading holes on the jig board, and the chips are checked in the arrangement state. Transfer the chips to the printed circuit board, release the suction, and mount each chip accurately on the printed circuit board, on which adhesive has been applied to the chip mounting points in advance, in the same position as the jig board. After gluing and then drying the adhesive,
The chips are transferred in their mounted state to a soldering bath or the like, and each chip is appropriately bonded onto a printed circuit board.

本発明装置は、上記自動チツプマウント装置の
内、板形(角板形、円板形)の小形電子部品(以
下単にチツプと記す。)の自動チツプマウント装
置において、治具盤の各チツプ装填孔毎にチツプ
を供給装填する装置であるチツプ分離供給装填装
置に係るものであり、また上記チツプを細巾長尺
なキヤリヤーテープに等間隔毎に設置(テーピン
グ)したチツプテープを巻取つたテープリールを
目的多数備え、その個々のテープリールから引き
出したチツプテープからチツプを1個宛分離し、
これを治具盤へ供給装填せんとするものである
が、この場合治具盤への目的供給個数(例、180
個)を一ケ所に備えて行うようなことは、設置ス
ペース等の面から到底不可能である。
The device of the present invention is used to load each chip on a jig board in an automatic chip mount device for plate-shaped (square plate-shaped, disc-shaped) small electronic components (hereinafter simply referred to as chips) among the automatic chip mount devices described above. It relates to a chip separation, supply and loading device which is a device for supplying and loading chips to each hole, and it is also a tape that winds up a chip tape in which the chips are placed (taped) at equal intervals on a long and narrow carrier tape. It is equipped with a number of reels for different purposes, and separates one chip from the chip tape pulled out from each tape reel.
The purpose is to supply and load this to the jig panel, but in this case, the target number of pieces to be supplied to the jig panel (for example, 180
It is completely impossible to do this with all the equipment (individuals) in one place due to installation space and other considerations.

そこで本発明は、まず、テープリールの設置数
はスペース及び必要とされるチツプの種類数の許
す最大限度数(例、60個即ち60種)を垂直に積上
げ配置することゝし、これに対して、テープリー
ルと同数(例、60個)のホイールを中心軸上に一
定角度宛(1駒宛)回転自在に水平架設して、各
ホイールと各テープリールを水平位置に相対設置
し、各ホイールにチツプテープを掛けまわすと共
に、該チツプテープからチツプを1個宛分離する
分離供給部材をホイール内側の定位置に備え、そ
の分離したチツプを落下供給する落下チユーブを
各ホイール毎に1本宛樹立した落下チユーブ樹立
板を前記各ホイールと同時一体的に一定角度宛回
転するようにし、一回の分離供給落下数×一定角
度宛回転数(例、60個×3回=180個)のチツプ
を下位のデイストリビユータに落下供給するよう
にし、 そして、チツプを治具盤まで落下送給するデイ
ストリビユータの落下チユーブはその本数が多く
てもスペース的に小さくてすむので、該デイスト
リビユータには、治具盤の目的チツプ装填孔数と
して予想される最大数と同数の落下チユーブ
(例、180本)を設置して、チツプ分離供給ホイー
ル部及び落下チユーブ樹立板の定角度宛(例、
4.5゜)回転毎に、ホイール数(即ちテープリール
数)若しくはそれ以下の任意数のチツプを落下チ
ユーブ樹立板の落下チユーブ→デイストリビユー
タ→治具盤のチツプ装填孔の順に分離供給装填
し、もつて、ホイール数に、同一治具盤へのチツ
プ装填のために行う一定角度宛回転の回数(例、
3回)を乗じた数(60×3=180)のチツプを分
離供給装填し得るようにしたものである。
Therefore, in the present invention, first, the maximum number of tape reels to be installed is vertically stacked and arranged as allowed by the space and the number of types of chips required (for example, 60 pieces, or 60 types); Then, the same number of wheels as tape reels (for example, 60 wheels) are installed horizontally on the central axis so that they can freely rotate at a certain angle (for one frame), and each wheel and tape reel are installed horizontally relative to each other. Chip tape was wrapped around the wheel, and a separating and supplying member for separating individual chips from the chip tape was provided at a fixed position inside the wheel, and one drop tube was established for each wheel to supply the separated chips. The falling tube establishment plate is simultaneously rotated at a certain angle with each wheel, and the chips of the number of separated and supplied drops x number of rotations at a certain angle (for example, 60 pieces x 3 times = 180 pieces) are lowered. Even if there are a large number of drop tubes in the distributor that feed the chips to the jig board, the space required is small. , install the same number of drop tubes (e.g. 180) as the expected maximum number of intended chip loading holes on the jig board, and place them at a fixed angle (e.g.,
4.5°) For each rotation, the number of chips equal to or less than the number of wheels (i.e., the number of tape reels) is separated and loaded in the order of the falling tube of the falling tube establishment plate → the distributor → the chip loading hole of the jig board, In addition, the number of wheels must be added to the number of rotations per constant angle for loading chips onto the same jig board (for example,
3 times) (60 x 3 = 180) chips can be separately supplied and loaded.

なお、デイストリビユータは、チツプの供給装
填対象となる治具盤(即ちプリント基板)の変更
等に伴つて、それに合わせて落下チユーブの本数
及び配置だけを変更した同基本構成のものと適宜
交換して用いる。
In addition, due to changes in the jig board (i.e. printed circuit board) to which chips are fed and loaded, the distributor may be replaced as appropriate with one of the same basic configuration with only the number and arrangement of drop tubes changed accordingly. and use it.

以下、本発明の構成につき説明すると、本発明
装置は、 同時一体的に一定角度宛回転するチツプ分離供
給ホイール部A及び落下チユーブ樹立板Bと、落
下チユーブ樹立板Bと治具盤Dとの間の定位置に
設置し交換自在なデイストリビユータCとを上下
連設し、チツプ分離供給ホイール部Aの側方に各
ホイール1と水平相対して同数のテープリールR
を設置して成り、 チツプ分離供給ホイール部Aは、中心軸2上
に、周面にチツプテープ3を掛けまわす複数のホ
イール1を一定角度宛回転自在に水平に架設し、
各ホイール1の内側の定位置(後記落下チユーブ
4先端と相対する位置)にチツプテープ3のチツ
プtを落下チユーブ4内へ1個宛分離供給する例
えばカム板で作動するピン等の分離供給部材5を
設置し、 同中心軸2の下端に設置した落下チユーブ樹立
板B上に上記ホイール1と同数の落下チユーブ4
(例、金属細等のみから、または金属細等と可撓
管を接続して成る。)を樹立配設すると共に、
個々の落下チユーブ4の先端を各1個のホイール
1の周面の設置位置に近接して位置せしめ、 前記チツプ分離供給ホイール部Aと落下チユー
ブ4を樹立配設した落下チユーブ樹立板Bを中心
軸2を中心として同時一体的に一定角度宛、設定
回数回転したのち、一挙に原位置に回転復元する
ように構成し、 チツプ供給分離ホイール部Aの側方に、その各
ホイール1と水平相対して、テープリールRを設
置し、該リールRから引き出したチツプテープ3
を各ホイール1周面に掛けまわし、ホイール1の
一定角度回転(1駒送り)毎に1個のチツプが落
下チユーブ4先端の相対位置に移送されるように
設け、 デイストリビユータCは、上記中心軸2の軸線
Yを中心として上、下板6,7を平行対設し、上
板6に上記落下チユーブ樹立板Bの落下チユーブ
4と同数の落下チユーブ8aの上端を、落下チユ
ーブ樹立板Bの同心円R1上に設置した各落下チ
ユーブ4下端と相対し、連通するように該軸線Y
を中心する同心円R2上に設置すると共に、この
落下チユーブ8aの上端設置位置を基本位置とし
て、同一同心円R2上における一定回転角度毎の
対称位置にも落下チユーブ8b,8c…上端を開
口設置し、即ち、基本位置の数に、一定角度回転
の回数を乗じた本数の落下チユーブを設置し、こ
れら各落下チユーブ8a,8b,8c…下端を、
下板7の、治具盤Dにおけるチツプ装填孔9と相
対する位置に開口設置して設け、また、該デイス
トリビユータCは同基本構成のデイストリビユー
タCと交換自在に構成し、 チツプ分離供給ホイール部Aの各ホイール1に
掛けまわしたチツプテープ3のチツプtがピン等
の分離供給部材5により1個宛分離供給されて、
各落下チユーブ4先端に転入落下され、該チユー
ブ4下端からデイストリビユータCの落下チユー
ブ8aの上端に転入落下されたのち、該チユーブ
8a下端から治具盤Dのチツプ装填孔9内に装填
されるようにし、 また、チツプ分離供給ホイール部A及び落下チ
ユーブ樹立板Bを同時一体的に一定角度宛回転す
ると共に、該回転とは別に、チツプ分離供給ホイ
ール部の各ホイール1を一定角度(一駒)宛回転
して、分離供給部材5を作動する毎に、デイスト
リビユータCにおける一定回転角度毎の対称位置
に設置した落下チユーブ8b群、8c群にチツプ
が供給されて、治具盤Dの他のチツプ装填孔9に
対するチツプtの落下装填が上記と同様にして行
われるようにし、上記チツプ分離供給ホイール部
及び落下チユーブ樹立板は、設定回数回転後、一
挙に原位置に回転復元し、続いて、次々とデイス
トリビユータC下に送給される新規の治具盤に対
して上記の作用が繰り返されるようにしたもので
ある。
The structure of the present invention will be explained below. The device of the present invention consists of a chip separation and supply wheel part A and a falling tube establishment plate B, which rotate integrally at a certain angle, and a falling tube establishment plate B and a jig board D. A replaceable distributor C installed at a fixed position between the chips is arranged vertically, and the same number of tape reels R are horizontally opposed to each wheel 1 on the side of the chip separation supply wheel section A.
The chip separation and supply wheel section A has a plurality of wheels 1, each of which has a chip tape 3 wrapped around the circumferential surface, installed horizontally on a central shaft 2 so as to be rotatable at a certain angle.
Separation supply member 5, such as a pin operated by a cam plate, which separates and supplies the chips t of the chip tape 3 one by one into the drop tube 4 at a fixed position inside each wheel 1 (a position facing the tip of the drop tube 4 described later) The same number of falling tubes 4 as the wheels 1 are placed on the falling tube standing plate B installed at the lower end of the concentric shaft 2.
(For example, made of only metal thin wire, etc., or made of metal thin wire, etc. and connecting flexible pipes.), and
The tips of the individual drop tubes 4 are located close to the installation position on the circumferential surface of each wheel 1, and the tip of the chip separation supply wheel section A and the drop tube 4 are arranged in an established manner with the drop tube establishment plate B as the center. It is constructed so that it rotates simultaneously and integrally at a certain angle a set number of times around axis 2, and then returns to its original position all at once. Then, the tape reel R is installed, and the chip tape 3 pulled out from the reel R is
is provided around the circumferential surface of each wheel so that one chip is transferred to the relative position of the tip of the drop tube 4 each time the wheel 1 rotates by a certain angle (one frame feed). Upper and lower plates 6 and 7 are arranged parallel to each other around the axis Y of the central shaft 2, and the upper ends of the same number of falling tubes 8a as the falling tubes 4 of the above-mentioned falling tube establishment plate B are connected to the upper plate 6 as a falling tube establishment plate. The axis Y is opposite to and communicates with the lower end of each drop tube 4 installed on the concentric circle R1 of B.
At the same time, with the upper end installation position of this drop tube 8a as the basic position, drop tubes 8b, 8c... are installed at symmetrical positions at fixed rotation angles on the same concentric circle R2 , with the upper ends open. In other words, the number of drop tubes equal to the number of basic positions multiplied by the number of constant angle rotations is installed, and the lower ends of each of these drop tubes 8a, 8b, 8c...
The lower plate 7 is provided with an opening at a position facing the chip loading hole 9 in the jig board D, and the distributor C is configured to be replaceable with a distributor C having the same basic configuration, so that the chips can be separated. The chips t of the chip tape 3 wrapped around each wheel 1 of the supply wheel section A are separated and supplied one by one by a separation supply member 5 such as a pin,
Chips are transferred and dropped from the tip of each drop tube 4, transferred and dropped from the bottom end of the tube 4 to the top end of the drop tube 8a of the distributor C, and then loaded into the chip loading hole 9 of the jig board D from the bottom end of the tube 8a. In addition, the chip separation and supply wheel section A and the falling tube establishment plate B are rotated simultaneously and integrally at a certain angle, and apart from this rotation, each wheel 1 of the chip separation and supply wheel section is rotated at a certain angle (a constant angle). Each time the separation supply member 5 is operated, the chips are supplied to the drop tube groups 8b and 8c installed at symmetrical positions at fixed rotation angles on the distributor C, and then the chips are supplied to the jig board D. The chips t are dropped and loaded into the other chip loading holes 9 in the same manner as described above, and the chip separation and supply wheel section and the drop tube establishment plate rotate and return to their original positions at once after rotating a set number of times. Then, the above operation is repeated for new jig boards that are successively fed under the distributor C.

尚、第1図は、本発明装置の全体構成例とその
周辺機器を示し、符号10は落下チユーブ樹立板
Bの各落下チユーブ4に取付けた落下センサー
で、チツプテープ3から分離供給部材5によつて
落下チユーブ4に1個宛正確に供給されたか否か
を検出するもの、15はチツプを分離した空テー
プを巻取るリールである。
FIG. 1 shows an example of the overall configuration of the device of the present invention and its peripheral equipment. Reference numeral 10 denotes a drop sensor attached to each drop tube 4 of the drop tube establishment board B, and a drop sensor 10 is attached to each drop tube 4 of the drop tube establishment plate B. 15 is a reel for winding up the empty tape from which the chips have been separated.

11はラインセンサーで、治具盤Dの全チツプ
装填孔9中にチツプtが装填されているか否かを
検出するものである。
Reference numeral 11 denotes a line sensor which detects whether or not chips t are loaded in all chip loading holes 9 of the jig board D.

12はサクシヨンヘツドで、治具盤Dから装填
チツプtを全部1度に吸着し、治具盤Dの復帰後
下降してプリント基板E上にチツプtをマウント
するものである。
Reference numeral 12 denotes a suction head, which picks up all the chips t to be loaded from the jig board D at once and descends after the jig board D returns to mount the chips t onto the printed circuit board E.

チツプtをマウント(接着剤による接着)した
プリント基板Eはこの後、搬送装置13によつ
て、接着剤乾燥炉→半田槽へ送られて、チツプマ
ウントを完了する。
The printed circuit board E on which the chip t is mounted (bonded with adhesive) is then conveyed from the adhesive drying furnace to the solder tank by the conveying device 13 to complete the chip mounting.

なお、本発明装置は、その現実的実施例におい
ては、治具盤(即ち、プリント基板と同配置)の
チツプ装填孔数が例えば最大限180個を想定して、
チツプ分離供給ホイール部Aのホイール1数(テ
ープリールRも同数)を60個、これに合わせて落
下チユーブ樹立板Bの落下チユーブ4を60本と
し、デイストリビユータCの落下チユーブ8a,
8b,8c…を治具盤Dのチツプ装填孔9の数
(例、180個)と位置に合わせて配列設置して、前
記チツプ分離供給ホイール部A及び落下チユーブ
樹立板Bの一定角度宛回転の数例えば3回で、
180本のデイストリビユータCの落下チユーブ8
a,8b,8cから180個の治具盤Dのチツプ装
填孔9へ供給落下装填するように構成している。
In addition, in a practical embodiment of the device of the present invention, it is assumed that the number of chip loading holes on the jig board (i.e., arranged in the same manner as the printed circuit board) is, for example, 180 at most.
The number of wheels in the chip separation supply wheel section A (the same number for the tape reel R) is 60, the number of falling tubes 4 on the falling tube establishment plate B is 60, and the number of falling tubes 8a on the distributor C is 60.
8b, 8c... are arranged and installed according to the number (e.g., 180) and position of the chip loading holes 9 on the jig board D, and the chip separation and supply wheel section A and the falling tube establishment plate B are rotated at a certain angle. For example, 3 times,
Falling tube 8 of 180 distributors C
The chips are supplied to the chip loading holes 9 of the jig board D from 180 chips a, 8b, and 8c and are loaded by dropping.

しかし乍ら、上記例えば3回の一定角度回転で
180個供給装填可能であつても、治具盤Dの構成
等によつて、1回目は60個、2回目は58個、そし
て3回目は45個というように供給装填する落下チ
ユーブ8a,8b,8c及び装填孔9の数及び位
置を選択自在にコントロール可能である。このコ
ントロールは、例えば、チツプ分離供給ホイール
部Aの個々のホイール1の1駒送り、即ちチツプ
tを落下チユーブ4先端に移送する作動を、個々
のホイール1毎に回転または停止(移送しない)
するようにコンピユーターのプログラムによつて
操作することによつて、如何様にでも可能であ
る。
However, for example, with three constant angle rotations,
Even if 180 pieces can be fed and loaded, depending on the configuration of the jig board D, etc., the drop tubes 8a and 8b may be fed and loaded with 60 pieces the first time, 58 pieces the second time, and 45 pieces the third time. , 8c and the number and position of the loading holes 9 can be selectively controlled. This control can, for example, rotate or stop (not transfer) the operation of feeding the individual wheels 1 of the chip separation and supply wheel section A one frame, that is, the operation of transferring the chips t to the tip of the drop tube 4, for each individual wheel 1.
By operating a computer program to do so, any number of actions are possible.

また、ホイール及びテープリールの設置数及び
落下チユーブの数なども目的によつて全く任意で
あるが、特に、デイストリビユータCは治具盤
((即ちプリント基板)が変更される度に、そのチ
ツプ数(即ち落下チユーブの数)も殊にそのチツ
プ装填孔の配置が全く相違したものとなるので、
その都度交換するものであるが、この交換した場
合においても基本的に同構成であれば、そのまゝ
本発明装置に交換設置して、上記一定角度回転の
回転の変更や上記同様のコントロールによつて、
所期の分離、供給、装填を有効に行いうる。
In addition, the number of installed wheels and tape reels and the number of falling tubes are completely arbitrary depending on the purpose. The number of chips (i.e. the number of falling tubes) is also completely different, especially the arrangement of the chip loading holes.
Although it is replaced each time, if the configuration is basically the same, it can be installed as a replacement in the device of the present invention and used to change the rotation of the constant angle rotation described above or to perform the same control as described above. Then,
The desired separation, supply, and loading can be performed effectively.

更に、落下チユーブ樹立板Bとデイストリビユ
ータCとの中間にシヤツター板14を設置し、上
方のチツプ分離供給ホイール部A及び落下チユー
ブ樹立板Bの一定角度回転毎に分離供給落下して
きたチツプを、一サイクル分(例、3回回転分、
60個×3回=180個)を、該シヤツター板上に貯
溜し、時期をみて、シヤツター板をずらせて、
180個全部を一斉にデイストリビユータCへ落下
供給することも可能である。
Furthermore, a shutter plate 14 is installed between the falling tube establishment plate B and the distributor C, and the chips that have fallen are separated and supplied every time the upper chip separation and supply wheel section A and the falling tube establishment plate B rotate at a certain angle. , for one cycle (e.g., for 3 rotations,
60 pieces x 3 times = 180 pieces) are stored on the shutter plate, and depending on the timing, shift the shutter plate,
It is also possible to drop and supply all 180 pieces to the distributor C at the same time.

次に、上記実施例では説明が繁雑となるので、
以下第1,2図に示した、本発明装置の簡略な実
施例構成及び作用図に従つて説明すると、第2図
のイはチツプ分離供給ホイール部A、と落下チユ
ーブ樹立板B、ロはデイストリビユータC、ハは
治具盤Dを示し、 (1) チツプ分離供給ホイール部Aの積重ね設置さ
れた3個のホイール1の周面に近接して設置さ
れた落下チユーブ樹立板Bの3本の落下チユー
ブ4に、チツプtが1個宛ピン等の分離供給部
材5の作用で分離供給される。
Next, since the explanation in the above example is complicated,
The explanation will be given below in accordance with the simplified embodiment structure and operation diagram of the present invention apparatus shown in FIGS. 1 and 2. In FIG. Distributor C, C indicates jig board D, (1) 3 of the falling tube establishment plate B installed close to the circumferential surface of the three wheels 1 stacked in the chip separation supply wheel section A; Chips t are separated and supplied to the book drop tube 4 by the action of a separating and supplying member 5 such as a one-by-one pin.

落下チユーブ樹立板Bに対する落下チユーブ
4下端開口部の設置は、次のデイストリビユー
タCの上板6との関係において、一定角度宛回
転する作用関係から、同心円R1上に等間隔に
設置する。
The lower end openings of the drop tubes 4 should be installed at equal intervals on the concentric circle R 1 in relation to the upper plate 6 of the next distributor C, since they rotate at a certain angle in relation to the drop tube establishment plate B. .

(2) デイストリビユータCは、その上板6に3本
の落下チユーブ8aの上端を、落下チユーブ樹
立板Bの落下チユーブ4下端と連通するよう
に、同心円R2上に設置し、この3本の落下チ
ユーブ8aの設置位置を基本位置として、同
心円R2上に、この基本位置から一定回転角
度(30゜)毎の対称位置、にも3本宛落下
チユーブ8b,8c上端を設置して、計9本の
落下チユーブ8a,8b,8c上端を設置し、
これら9本の落下チユーブ8a,8b,8c下
端は、下板7の、治具盤Dのチツプ装填孔9と
相対した位置に設置する。
(2) Distributor C is installed on the concentric circle R 2 so that the upper ends of the three drop tubes 8a communicate with the lower ends of the drop tubes 4 of the drop tube establishment plate B on the upper plate 6, and With the installation position of the book drop tube 8a as the basic position, the upper ends of the three book drop tubes 8b and 8c are also installed on the concentric circle R 2 at symmetrical positions at fixed rotation angles (30 degrees) from this basic position. , install the upper ends of a total of nine drop tubes 8a, 8b, 8c,
The lower ends of these nine drop tubes 8a, 8b, 8c are installed in the lower plate 7 at positions facing the chip loading holes 9 of the jig board D.

(3) 上記構成によつて、チツプ分離供給ホイール
部Aの3個のホイール1から1個宛分離供給さ
れるチツプtは、落下チユーブ樹立板Bの3本
の落下チユーブ4を落下し、まず、デイストリ
ビユータCの各落下チユーブ8を落下し、治
具盤Dの各チツプ装填孔9内に装填される。
(3) With the above configuration, the chips t separated and supplied from the three wheels 1 of the chip separation and supply wheel section A fall through the three falling tubes 4 of the falling tube establishment plate B, and first , drop tubes 8 of distributor C, and are loaded into chip loading holes 9 of jig board D.

(4) 次に、チツプ分離供給ホイール部A及び落下
チユーブ樹立板Bを一定角度(30゜)回転する
と、落下チユーブ樹立板Bの各落下チユーブ4
下端がデイストリビユータCの各落下チユー
ブ8bと相対するので、こゝで分離供給部材5
を作動してチツプtを分離供給すると、該チツ
プtは上記同様に落下し治具盤Dの各チツプ
装填孔9に装填される。
(4) Next, when the chip separation supply wheel section A and the falling tube establishment plate B are rotated by a certain angle (30 degrees), each falling tube 4 of the falling tube establishment plate B is rotated.
Since the lower end faces each drop tube 8b of the distributor C, the separation supply member 5
When the chips t are separated and supplied, the chips t fall in the same manner as described above and are loaded into each chip loading hole 9 of the jig board D.

(5) 再に、チツプ分離供給ホイール部A及び落下
チユーブ樹立板Bを一定角度(30゜)回転する
と、落下チユーブ樹立板Bの各落下チユーブ4
下端がデイストリビユータCの各落下チユー
ブ8cと相対するので、こゝで同じく分離供給
部材5を作動してチツプを分離供給すると、該
チツプtは上記同様に落下し治具盤Dの各チ
ツプ装填孔9に装填される。
(5) When the chip separation supply wheel section A and the falling tube standing plate B are rotated by a certain angle (30 degrees) again, each falling tube 4 of the falling tube standing plate B is rotated.
Since the lower end faces each drop tube 8c of the distributor C, when the separating and supplying member 5 is operated to separate and supply chips, the chips t fall in the same manner as described above and drop to each chip on the jig board D. The loading hole 9 is loaded.

(6) 上記、3回の一定角度回転による供給装填
で、目的チツプ装填孔に全てチツプを装填し終
つた治具盤Dは次工程へ移行し、デイストリビ
ユータC直下には新規の治具盤Dが供給され、
また、チツプ分離供給ホイール部A及び落下チ
ユーブ樹立板Bは同時一体的に、一挙に、原位
置に回転復帰して、新規の治具盤に対して上記
の作用を繰り返すものである。
(6) The jig board D, which has finished loading all the chips into the target chip loading holes through the above-mentioned supply loading by rotating at a constant angle three times, moves to the next process, and a new jig is placed directly under the distributor C. Board D is supplied,
Further, the chip separation and supply wheel section A and the falling tube establishment plate B are simultaneously and integrally rotated back to their original positions, and the above-mentioned action is repeated on a new jig board.

(7) また、上記例においても、前述の如く、個々
のホイール1の1駒送り回転の続行乃至停止に
よるコントロール及び一定角度回転回数の変更
等によつて、チツプの供給数及び、その装填位
置(チツプ装填孔)を選択調節可能なことがわ
かる。
(7) Also, in the above example, as described above, the number of chips to be supplied and the loading position can be controlled by controlling the continuation or stopping of the one-frame feed rotation of each wheel 1 and by changing the number of rotations at a certain angle. (Chip loading hole) can be selectively adjusted.

以上の如く、本発明装置は小スペースに積重ね
設置したテープリールとホイールから、その一定
角度宛の回転毎にホイール相当数のチツプを繰り
返し分離供給しうるものであるので、極めてコン
パクトな本装置によつて、極めて多数のチツプマ
ウント箇処を有するプリント基板へのチツプマウ
ント処理工程を有効に行いうる多大の効果があ
る。
As described above, the device of the present invention is capable of repeatedly separating and supplying the same number of chips as the wheel from tape reels and wheels stacked in a small space at each rotation at a certain angle, making this device extremely compact. Therefore, there is a great effect that the chip mounting process on a printed circuit board having an extremely large number of chip mounting points can be carried out effectively.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明装置の一構成例の概略正面図及
び平面図、第2図は本発明装置の各部の構成例と
作用の説明図で、イはチツプ分離供給ホイール部
及び落下チユーブ樹立板、ロはデイストリビユー
タ、ハは治具盤を示す図、第3図は他の構成例の
デイストリビユータの平面図である。 付号、A……チツプ分離供給ホイール部、B…
…落下チユーブ樹立板、C……デイストリビユー
タ、D……治具盤、E……プリント基板、Y……
中心軸の軸線、t……チツプ、R1,R2……中心
軸線Yを中心とする同心円、R……テープリー
ル、1……ホイール、2……中心軸、3……チツ
プテープ、4……落下チユーブ(落下チユーブ樹
立板の)、5……ピン等の分離供給部材、6……
デイストリビユータの上板、7……下板、8a,
8b,8c……落下チユーブ(デイストリビユー
タの)、9……チツプ装填孔、10……落下セン
サー、11……ラインセンサー、12……サクシ
ヨンヘツド、13……搬送装置、14……シヤツ
ター板、15……空テープ巻取りリール。
Figure 1 is a schematic front view and plan view of an example of the configuration of the apparatus of the present invention, Figure 2 is an explanatory diagram of an example of the configuration and operation of each part of the apparatus of the present invention, and (A) is a chip separation and supply wheel section and a falling tube establishment plate. , B shows the distributor, C shows the jig board, and FIG. 3 is a plan view of another example of the distributor. Number, A...Chip separation supply wheel section, B...
...Falling tube establishment board, C... Distributor, D... Jig board, E... Printed circuit board, Y...
Axis of the central axis, t...chip, R 1 , R 2 ... concentric circles centered on the central axis Y, R... tape reel, 1... wheel, 2... center axis, 3... tip tape, 4... ...Falling tube (of the falling tube establishment board), 5...Separation supply member such as pin, 6...
Distributor upper plate, 7...lower plate, 8a,
8b, 8c...Drop tube (of the distributor), 9...Chip loading hole, 10...Drop sensor, 11...Line sensor, 12...Suction head, 13...Transport device, 14...Shutter plate, 15...Empty tape take-up reel.

Claims (1)

【特許請求の範囲】 1 同時一体的に一定角度宛回転するチツプ分離
供給ホイール部及び落下チユーブ樹立板と、落下
チユーブ樹立板と治具盤との間の定位置に設置し
交換自在なデイストリビユータとを上下連設し、
チツプ分離供給ホイール部の側方に各ホイールと
水平相対して同数のテープリールを設置して成
り、 チツプ分離供給ホイール部は、中心軸上に複数
のホイールを一定角度宛回転自在に水平に架設
し、各ホイールの内側の定位置にチツプテープの
チツプを落下チユーブ内へ1個宛分離供給するピ
ン等の分離供給部材を設置し、 同中心軸の下端に設置した落下チユーブ樹立板
上に上記ホイールと同数の落下チユーブを樹立配
設すると共に、個々の落下チユーブの先端を各1
個のホイールの周面に近接して位置せしめ、 前記チツプ分離供給ホイール部と落下チユーブ
を樹立配設した落下チユーブ樹立板とを中心軸を
中心として同時一体的に一定角度宛、設定回数回
転したのち、一挙に原位置に回転復元するように
構成し、 チツプ供給分離ホイール部の側方に、その各ホ
イールと水平相対して、テープリールを設置し、
該リールから引き出したチツプテープを各ホイー
ル周面に掛けまわし、ホイールの一定角度回転毎
に1個のチツプが落下チユーブ先端の相対位置に
移送されるように設け、 デイストリビユータは、中心軸の軸線を中心と
して上、下板を平行対設し、上板に上記落下チユ
ーブ樹立板の落下チユーブと同数の落下チユーブ
の上端を、落下チユーブ樹立板の各落下チユーブ
下端と相対し、連通するように該軸線を中心とす
る同心円上に設置すると共に、この落下チユーブ
上端設置位置を基本位置として、同一同心円上に
おける一定回転角度毎の対称位置にも落下チユー
ブ上端を開口設置し、即ち、基本位置の数に、一
定角度回転の回数を乗じた本数の落下チユーブを
設置し、これら各落下チユーブ下端を、下板の、
治具盤におけるチツプ装填孔と相対する位置に開
口設置して設け、また、該デイストリビユータは
同基本構成のデイストリビユータと交換自在に構
成し、 チツプ分離供給ホイール部の各ホイールに掛け
たチツプテープのチツプが分離供給部材により分
離供給されて1個宛落下チユーブ先端に転入落下
され、該チユーブ下端からデイストリビユータの
落下チユーブ上端に転入落下されたのち、該チユ
ーブ下端から治具盤のチツプ装填孔内に装填され
るようにし、また、チツプ分離供給ホイール部及
び落下チユーブ樹立板を同時一体的に一定角度宛
回転すると共に各ホイールを一定角度宛回転して
分離供給部材を作動する毎に、デイストリビユー
タにおける一定回転角度毎の対称位置の落下チユ
ーブにチツプが供給されて、治具盤の他のチツプ
装填孔に対するチツプの落下装填が上記と同様に
して行われるようにし、チツプ分離供給部及び落
下チユーブ樹立板は設定回数回転後、一挙に原位
置に回転復元するようにしたことを特徴とする、
チツプ自動分離供給装填装置。
[Scope of Claims] 1. A chip separation supply wheel section and a falling tube establishment plate that rotate integrally at a certain angle at the same time, and a freely replaceable distribe installed at a fixed position between the falling tube establishment plate and the jig board. Connect the user and the user vertically,
The same number of tape reels are installed horizontally opposite each wheel on the side of the chip separation supply wheel section. Then, a separating supply member such as a pin is installed at a fixed position inside each wheel to separate and supply chips from the chip tape into the drop tube one by one. Establish and arrange the same number of drop tubes as
is positioned close to the circumferential surface of the chip separation and supply wheel, and rotates the chip separation and supply wheel part and a drop tube erecting plate on which the drop tube is established, simultaneously and integrally about a central axis at a predetermined angle a set number of times. Afterwards, it is constructed so that it can be rotated back to its original position all at once, and a tape reel is installed on the side of the chip supply separation wheel section horizontally opposite each of the wheels.
The chip tape pulled out from the reel is wrapped around the circumferential surface of each wheel so that one chip is transferred to a relative position at the tip of the drop tube every time the wheel rotates at a certain angle, and the distributor is connected to the axis of the central axis. The upper and lower plates are arranged parallel to each other with the upper plate as the center, and the upper ends of the same number of falling tubes as the falling tubes on the falling tube establishing plate are placed on the upper plate so as to face and communicate with the lower ends of each falling tube on the falling tube establishing plate. In addition to installing the drop tube on a concentric circle centered on the axis, the top end of the drop tube is also opened at symmetrical positions at fixed rotation angles on the same concentric circle, with the top end installation position of the drop tube as the basic position. Install a number of drop tubes equal to the number multiplied by the number of rotations at a certain angle, and connect the bottom end of each drop tube to the bottom of the lower plate.
The distributor is provided with an opening at a position facing the chip loading hole on the jig board, and the distributor is configured to be interchangeable with a distributor of the same basic configuration, and is hung on each wheel of the chip separation and supply wheel section. The chips of the chip tape are separated and supplied by the separation supply member, transferred and dropped one by one to the tip of the drop tube, transferred and dropped from the bottom end of the tube to the top end of the drop tube of the distributor, and then transferred from the bottom end of the tube to the tip of the jig board. The chips are loaded into the loading hole, and each time the chip separating and supplying member is operated, the chip separation and supplying wheel section and the falling tube establishment plate are simultaneously rotated integrally to a certain angle, and each wheel is rotated to a certain angle. , the chips are supplied to the drop tubes at symmetrical positions at every fixed rotation angle in the distributor, and the chips are dropped and loaded into other chip loading holes of the jig board in the same manner as above, and the chips are separated and supplied. The part and the falling tube establishment plate are configured to rotate and return to their original positions all at once after rotating a set number of times.
Automatic chip separation, feeding and loading device.
JP57200923A 1982-11-16 1982-11-16 Automatic chip separating and supplying charger Granted JPS5990999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57200923A JPS5990999A (en) 1982-11-16 1982-11-16 Automatic chip separating and supplying charger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57200923A JPS5990999A (en) 1982-11-16 1982-11-16 Automatic chip separating and supplying charger

Publications (2)

Publication Number Publication Date
JPS5990999A JPS5990999A (en) 1984-05-25
JPS649759B2 true JPS649759B2 (en) 1989-02-20

Family

ID=16432519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57200923A Granted JPS5990999A (en) 1982-11-16 1982-11-16 Automatic chip separating and supplying charger

Country Status (1)

Country Link
JP (1) JPS5990999A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01122819A (en) * 1987-11-02 1989-05-16 Honda Motor Co Ltd Bolt supplier
US5391828A (en) * 1990-10-18 1995-02-21 Casio Computer Co., Ltd. Image display, automatic performance apparatus and automatic accompaniment apparatus
JP7327434B2 (en) * 2021-03-24 2023-08-16 カシオ計算機株式会社 Program, method, information processing device, and performance data display system

Also Published As

Publication number Publication date
JPS5990999A (en) 1984-05-25

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