JPH0112664B2 - - Google Patents
Info
- Publication number
- JPH0112664B2 JPH0112664B2 JP5950984A JP5950984A JPH0112664B2 JP H0112664 B2 JPH0112664 B2 JP H0112664B2 JP 5950984 A JP5950984 A JP 5950984A JP 5950984 A JP5950984 A JP 5950984A JP H0112664 B2 JPH0112664 B2 JP H0112664B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- coating
- weight
- parts
- transparent conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 57
- 239000011248 coating agent Substances 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 20
- 239000004695 Polyether sulfone Substances 0.000 claims description 13
- 229920006393 polyether sulfone Polymers 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920002492 poly(sulfone) Polymers 0.000 claims description 5
- -1 vinyl compound Chemical class 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 229910003437 indium oxide Inorganic materials 0.000 claims description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 239000011247 coating layer Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000007822 coupling agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- OGBWMWKMTUSNKE-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CCCCCC(OC(=O)C(C)=C)OC(=O)C(C)=C OGBWMWKMTUSNKE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
本発明は溶融押出法により得られたポリエーテ
ルスルホンまたはポリスルホンフイルムを用いた
透明導電性フイルムの製造法に係るものであり、
更に詳しくはフイルム上の小くとも片面に、エチ
レン性二重結合を有するシランカツプリング剤お
よび多官能ビニル化合物、光増感剤および溶剤を
主要成分とする塗布液を塗布し乾燥後紫外線照射
により反応硬化せしめ然る後該硬化物層上に透明
導電層を形成して透明導電性フイルムを製造する
方法に関するものである。
近年液晶を用いる表示素子の伸長は著じるしい
ものがあり、このため透明電極の重要性が増しつ
つある。従来液晶表示素子に用いられる電極は、
薄いガラス板上に導電性薄膜を形成した謂ゆるネ
サガラスが用いられ、該導電性薄膜をエツチング
することにより電極回路を形成するという方法が
広く行なわれて来た。然しながら素子の薄型化、
軽量化、量産化が要求され透明高分子フイルム上
に導電性薄膜を形成した透明電極の検討が広範に
行なわれる様になり、一部実用化され始めてい
る。
一方高分子フイルムを用いた透明導性フイルム
は薄型化、軽量化、量産化、高強度化の観点から
は優れてはいるものの直接フイルム上に導電層を
形成した場合、ガラスに比較して問題点を有して
いることも事実である。即ち
○イ 液晶の配向処理を目的とした電極面のラビン
グ処理工程での導電薄膜の耐摩耗性が悪く表面
抵抗が増大する。
○ロ 実用化もしくは実用化に近い高分子フイルム
として一軸配向ポリエステルフイルムを用いた
透明導電フイルムが有るが耐熱性が劣るのに加
えて光学異方性を有する支持体であるため光学
軸を偏光板軸と厳密に一致させることが非常に
困難である。また軸方向の揃つたフイルムを得
ることも同様困難である。
○ハ 非旋光性フイルムとして謂ゆるキヤストフイ
ルムが考えられるが非常に生産性に劣る。
○ニ 導電層薄膜との密着性が悪く耐湿熱信頼性に
劣り、回路加工時に断線が生じ易い。
等である。
これら欠点を除去するため本願発明者らは種々
の高分子フイルム類を検討し、耐熱性を有し非旋
光性フイルムであり且つ透明性の良好な押出し法
で得られるポリエーテルスルホンおよびポリスル
ホンフイルムが優れていることを見いだし選択し
た。しかしながらポリエーテルスルホンまたはポ
リスルホンフイルム上に単純に導電性薄膜を形成
した場、合該薄膜とフイルムの密着性が著じるし
く劣ることに起因して導電性の耐湿劣化が大きく
使用に耐えない、耐摩耗性が悪く断線が生じ易
い、折り曲げ性が悪く回路加工時、素子組立時に
断線不良が生じ易いといつた欠点が生じた。
本発明者らは密着性に起因するこれら欠点を解
消する方法として常法によりビニルシラン、アク
リルシラン処理を試みた。この結果スパツター法
で形成せしめる導電膜との密着性は著じるしく向
上することを見い出した。しかしながらこれら化
合物は単官能モノマーである為加熱等の処理によ
つて重合固定せしめようとした場合直鎖構造の謂
ゆる熱可塑性樹脂しか得られないために処理皮膜
は低融点の皮膜にならざるを得ず、スパツター
時、ラビング剤の加熱処理等の熱工程時に不安定
であり変形をきたし導電膜層に微細なシワを生ず
ると微細なクラツクが生じるといつた現象を見い
出した。本願発明者らは本現象、欠点を克服すべ
く鋭意検討を行ない本願発明に到達した。即ち塗
膜自体を3次元架橋せしめ変形し難い安定な塗膜
を形成せしめるという方法を見い出したものであ
る。以下に本発明の詳細につき述べる。
本発明に用いられるフイルムは溶融押出し法で
得られたポリエーテルスルホン(以下PESフイル
ムと称する)またはポリスルホン(以下PSフイ
ルムと称する)フイルムで有り、該フイルムは耐
熱性、透明性に優れており更に旋光性の無い透明
電極用フイルムとしては非常に優れたフイルムで
ある。次にPESフイルムまたはPSフイルム上に
塗布する塗液を調整する。まずカツプリング剤と
してはビニルシランおよび/またはアクリルシラ
ン等の分子内にエチレン性炭素―炭素2重結合を
有する謂ゆるビニル系シランカツプリング剤はす
べて使用可能であり、これらカツプリング剤の溶
液も適宜使用可能である。
次いで該カツプリング剤に2ケ以上のエチレン
性2重結合を有する多官能ビニル化合物を配合す
るこれら化合物としてはエポキシジアクリレー
ト、ウレタンジアクリレート、ポリエステルジア
クリレート、トリメチロールプロパントリアクリ
レート、ポリエチレングリコールジアクリレート
等の多官能アクリレート類、ブチレングリコール
ジメタクリレート、ネオペンチルグリコールジメ
タクリレート、ヘキサンジオールジメタクリレー
ト、トリメチロールプロパントリメタクリレート
等の多官能メタクリレート類、ジアリルフタレー
ト、トリアリールイソシアヌレート、トリアリー
ルトリメリテート等の多官能アリール化合物、等
が適宜用いられる。
またエチレン性二重結合を有するシランカツプ
リング剤に対する多官能ビニル化合物の配合割合
が重要であり、該シランカツプリング剤100重量
部に対して後者はブチルセルソルブ325重量部10
〜100重量部の範囲で配合される。10重量部以下
の場合塗膜は熱的に軟弱となり改良効果が発現せ
ず100重量部以上の場合導電膜に対する密着性が
低下してしまいカツプリング剤の効果が半減して
しまう。次いで光増感剤が配合されるが増感剤と
してはベンゾフエノン、ベンゾインメチルエーテ
ル、ベンゾインエチルエーテル等一般的光増感剤
が単独もしくは併用使用される。
次いでかくして得られた配合物を溶剤を用いて
希釈するがこの場合配合物に対して良溶媒であり
且つPESフイルムおよびPSフイルムに対しては
貧溶媒で且つ親和性を有する溶媒を選定すること
が肝要であり、この様な溶媒としてセロソルブ
類、カービトール類に属する溶剤が好んで用いら
れる。またPESフイルムに対しても良溶媒である
溶剤を若干添加することも均一塗布達成のための
有効な手段である。また希釈率については塗布厚
み、塗布作業性の観点から適宜決定される。また
着色防止剤、レベリング剤、消泡剤、ブルーイン
グ剤、濡れ改良剤等の添加も本発明達成のため有
効な手段である。
かくして得られた塗布液をPESフイルムの少く
とも片面にデイツプ法、バーコーター法、ロール
コーター法、スプレー法、スピンコート法等の常
法により塗布する。塗布厚みは均一塗布を前提と
して可及的に薄膜であることが望ましいが1〜
5μm程度が本目的のために一般的である。次いで
乾燥により溶剤を除去し塗膜を形成した後塗膜面
に紫外線を照射し架橋硬化塗膜とする。得られた
フイルムの塗膜上に次いで透明導電層を形成す
る。この場合酸化インジウム、酸化錫、酸化カド
ミウム等の酸化物を単独もしくは併用使用しスパ
ツタリング法やイオンプレテイング法で形成され
る。かくして得られた透明導電性フイルムは導電
層が支持体層と強固に一体化しているため耐摩耗
性、回路加工性、耐湿性、耐溶剤性に優れカツプ
リング剤の単独使用の場合と異なり強固な3次元
架橋塗膜が形成されるため耐熱性に優れた工業的
意義の大きい透明導電フイルムであつた。以下に
実施例を示す。
実施例
γ―メタクリロキシプロピルトリメトキシシラ
ン 100重量部
トリメチロールプロパントリアクリレート
30重量部
ネオペンチルグリコールジアクリレート
20重量部
ベンゾインイソブチルエーテル 5重量部
ブチルセロソルブ 500重量部
上記組成物を室温にて混合して均一な溶液を得
た。100μm厚のPESフイルムの片面上に前記溶液
をロールコーター法により均一に塗布し、80℃に
て加熱して溶剤を除去した後80W/cmの高圧水銀
灯1灯にて照射距離15cmで10秒間照射した。得ら
れた硬化塗膜の厚みは5μmであつた。この塗膜上
にスパツター法により酸化インジウム、酸化錫の
透明導電層を厚み300Åにて形成させた。得られ
た透明導電性フイルムの諸特性を第1表に記す。
比較例 1
γ―メタクリロキシプロピルトリメトキシシラ
ン 100重量部
ベンゾインイソブチルエーテル 3重量部
上記組成物を室温にて均一に混合した後、該組
成物を100μm厚のPESフイルムの片面上にロール
コーター法により均一に塗布して3μm厚のコーテ
イング層を設けた。
実施例と同様な条件にて紫外線照射によるコー
テイング層の硬化及び該コーテイング層上にスパ
ツター法による透明導電層の形成をした。得られ
た透明導電性フイルムの諸特性を第1表に記す。
比較例 2
γ―メタクリロキシプロピルトリメトキシシラ
ン 10重量部
メチルメタクリレート 30重量部
2―ヒドロキシエチルメタクリレート 20重量部
トリメチロールプロパントリアクリレート
30重量部
ネオペンチルグリコールジアクリレート
10重量部
ベンゾインイソブチルエーテル 3重量部
ブチルセロソルブ 350重量部
上記組成物を室温にて混合して均一な溶液を得
た。該組成物を100μ厚のPESフイルムの片面上
にロールコーター法により均一に塗布した後、80
℃にて加熱して溶剤を除去したところ4μm厚のコ
ーテイング層が得られた。
実施例と同様な条件にて紫外線照射によるコー
テイング層の硬化及び該コーテイング層上にスパ
ツター法による透明導電層の形成を行なつた。得
られた透明導電性フイルムの諸特性を第1表に記
す。
The present invention relates to a method for producing a transparent conductive film using polyether sulfone or polysulfone film obtained by melt extrusion method,
More specifically, a coating solution containing a silane coupling agent having an ethylenic double bond, a polyfunctional vinyl compound, a photosensitizer, and a solvent as main components is applied to at least one side of the film, and after drying, the film is exposed to ultraviolet rays. The present invention relates to a method for manufacturing a transparent conductive film by forming a transparent conductive layer on the cured material layer after reaction curing. In recent years, there has been a remarkable growth in display elements using liquid crystals, and for this reason, the importance of transparent electrodes is increasing. The electrodes conventionally used in liquid crystal display elements are
A method has been widely used in which so-called Nesa glass, which is a thin glass plate on which a conductive thin film is formed, is used, and electrode circuits are formed by etching the conductive thin film. However, as the device becomes thinner,
In response to demands for weight reduction and mass production, transparent electrodes in which a conductive thin film is formed on a transparent polymer film have been widely studied, and some have begun to be put into practical use. On the other hand, although transparent conductive films made from polymer films are superior in terms of thinness, weight reduction, mass production, and high strength, there are problems when forming a conductive layer directly on the film compared to glass. It is also true that there are points. That is, B. The abrasion resistance of the conductive thin film during the rubbing process of the electrode surface for the purpose of alignment treatment of liquid crystal is poor and the surface resistance increases. ○B A transparent conductive film using a uniaxially oriented polyester film is a polymer film that has been put into practical use or is close to being put into practical use, but in addition to its poor heat resistance, the optical axis is a polarizing film because the support has optical anisotropy. It is very difficult to match the axis exactly. It is also difficult to obtain a film that is aligned in the axial direction. ○C A so-called cast film can be considered as a non-optically active film, but it is extremely low in productivity. ○D Poor adhesion with the conductive layer thin film, poor humidity and heat resistance reliability, and wire breakage is likely to occur during circuit processing. etc. In order to eliminate these drawbacks, the present inventors investigated various polymer films, and found that polyether sulfone and polysulfone films, which are heat-resistant, non-optically active films and can be obtained by extrusion and have good transparency, have been developed. I found something good and chose it. However, if a conductive thin film is simply formed on polyether sulfone or polysulfone film, the adhesion between the thin film and the film is significantly poor, and the moisture resistance of the conductivity deteriorates significantly, making it unusable. It has disadvantages such as poor wear resistance and easy disconnection, and poor bendability and easy disconnection when processing circuits and assembling elements. The present inventors attempted vinyl silane and acrylic silane treatment using conventional methods as a method to eliminate these defects caused by adhesion. As a result, it has been found that the adhesion to the conductive film formed by the sputtering method is significantly improved. However, since these compounds are monofunctional monomers, when attempting to polymerize and fix them through treatments such as heating, only a so-called thermoplastic resin with a linear structure can be obtained, so the treated film must be a film with a low melting point. However, we have discovered a phenomenon in which the conductive film layer is unstable and deformed during thermal processes such as sputtering and heat treatment of the rubbing agent, causing minute wrinkles in the conductive film layer and causing minute cracks. The inventors of the present application have conducted intensive studies to overcome this phenomenon and its drawbacks, and have arrived at the present invention. That is, a method has been discovered in which the coating film itself is three-dimensionally crosslinked to form a stable coating film that is difficult to deform. The details of the present invention will be described below. The film used in the present invention is a polyethersulfone (hereinafter referred to as PES film) or polysulfone (hereinafter referred to as PS film) film obtained by melt extrusion method, and the film has excellent heat resistance and transparency. This is an extremely excellent film for transparent electrodes without optical rotation. Next, adjust the coating liquid to be applied onto the PES film or PS film. First, as a coupling agent, all so-called vinyl silane coupling agents having an ethylenic carbon-carbon double bond in the molecule such as vinyl silane and/or acrylic silane can be used, and solutions of these coupling agents can also be used as appropriate. It is. Next, a polyfunctional vinyl compound having two or more ethylenic double bonds is added to the coupling agent. Examples of these compounds include epoxy diacrylate, urethane diacrylate, polyester diacrylate, trimethylolpropane triacrylate, and polyethylene glycol diacrylate. polyfunctional acrylates such as butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, hexanediol dimethacrylate, trimethylolpropane trimethacrylate, polyfunctional methacrylates such as diallyl phthalate, triaryl isocyanurate, triaryl trimellitate, etc. Functional aryl compounds, etc. are used as appropriate. Furthermore, the blending ratio of the polyfunctional vinyl compound to the silane coupling agent having ethylenic double bonds is important;
It is blended in a range of ~100 parts by weight. If the amount is less than 10 parts by weight, the coating film becomes thermally soft and no improvement effect is exhibited, while if it is more than 100 parts by weight, the adhesion to the conductive film decreases and the effect of the coupling agent is halved. Next, a photosensitizer is added, and general photosensitizers such as benzophenone, benzoin methyl ether, and benzoin ethyl ether are used alone or in combination. The mixture thus obtained is then diluted with a solvent; in this case, a solvent that is a good solvent for the formulation, a poor solvent for PES films and PS films, and has an affinity for the mixture must be selected. This is important, and as such solvents, solvents belonging to cellosolves and carbitols are preferably used. Also, adding a small amount of a good solvent to the PES film is also an effective means for achieving uniform coating. Further, the dilution rate is appropriately determined from the viewpoints of coating thickness and coating workability. Further, addition of coloring inhibitors, leveling agents, antifoaming agents, bluing agents, wetting improvers, etc. is also an effective means for achieving the present invention. The coating liquid thus obtained is applied to at least one side of the PES film by a conventional method such as a dip method, a bar coater method, a roll coater method, a spray method, or a spin coat method. It is desirable that the coating thickness be as thin as possible with the premise of uniform coating.
A thickness of around 5 μm is common for this purpose. Next, the solvent is removed by drying to form a coating film, and the coating surface is then irradiated with ultraviolet rays to form a crosslinked cured coating film. A transparent conductive layer is then formed on the resulting film coating. In this case, oxides such as indium oxide, tin oxide, cadmium oxide, etc. are used alone or in combination and are formed by a sputtering method or an ion plating method. The transparent conductive film obtained in this way has excellent abrasion resistance, circuit processability, moisture resistance, and solvent resistance because the conductive layer is firmly integrated with the support layer, and unlike the case where a coupling agent is used alone, it is strong. Because a three-dimensional crosslinked coating film is formed, this transparent conductive film has excellent heat resistance and is of great industrial significance. Examples are shown below. Example γ-Methacryloxypropyltrimethoxysilane 100 parts by weight Trimethylolpropane triacrylate
30 parts by weight neopentyl glycol diacrylate
20 parts by weight Benzoin isobutyl ether 5 parts by weight Butyl cellosolve 500 parts by weight The above compositions were mixed at room temperature to obtain a homogeneous solution. The above solution was applied uniformly onto one side of a 100 μm thick PES film using a roll coater method, heated at 80°C to remove the solvent, and then irradiated with a single 80 W/cm high pressure mercury lamp at an irradiation distance of 15 cm for 10 seconds. did. The thickness of the obtained cured coating film was 5 μm. A transparent conductive layer of indium oxide and tin oxide was formed on this coating film to a thickness of 300 Å by a sputtering method. Various properties of the obtained transparent conductive film are shown in Table 1. Comparative Example 1 100 parts by weight of γ-methacryloxypropyltrimethoxysilane 3 parts by weight of benzoin isobutyl ether After the above composition was mixed uniformly at room temperature, the composition was coated on one side of a 100 μm thick PES film using a roll coater method. A coating layer with a thickness of 3 μm was provided by uniform application. The coating layer was cured by ultraviolet irradiation under the same conditions as in the examples, and a transparent conductive layer was formed on the coating layer by sputtering. Various properties of the obtained transparent conductive film are shown in Table 1. Comparative Example 2 γ-methacryloxypropyltrimethoxysilane 10 parts by weight Methyl methacrylate 30 parts by weight 2-hydroxyethyl methacrylate 20 parts by weight Trimethylolpropane triacrylate
30 parts by weight neopentyl glycol diacrylate
10 parts by weight Benzoin isobutyl ether 3 parts by weight Butyl cellosolve 350 parts by weight The above compositions were mixed at room temperature to obtain a homogeneous solution. After applying the composition uniformly onto one side of a 100μ thick PES film using a roll coater method,
When the solvent was removed by heating at °C, a coating layer with a thickness of 4 μm was obtained. The coating layer was cured by ultraviolet irradiation and a transparent conductive layer was formed on the coating layer by sputtering under the same conditions as in the examples. Various properties of the obtained transparent conductive film are shown in Table 1.
【表】【table】
【表】
以上のように、比較例1にて得られた透明導電
性フイルムはコーテイング層と導電層との密着性
は良好であるにもかかわらず、耐熱性、耐溶剤性
に著しく劣り、一方、比較例2にて得られた透明
導電性フイルムは耐熱性、耐溶剤性は良好である
にもかかわらず、コーテイング層と導電層との密
着性が劣るため、耐湿性、耐摩耗性が著しく低下
した。これに反し、本発明の実施例によつて得ら
れた透明導電性フイルムは上記欠点を全て解消し
た優れた特性を有するものであつた。[Table] As described above, although the transparent conductive film obtained in Comparative Example 1 had good adhesion between the coating layer and the conductive layer, it was significantly inferior in heat resistance and solvent resistance. Although the transparent conductive film obtained in Comparative Example 2 has good heat resistance and solvent resistance, it has poor moisture resistance and abrasion resistance due to poor adhesion between the coating layer and the conductive layer. decreased. On the contrary, the transparent conductive films obtained in the Examples of the present invention had excellent properties that eliminated all of the above-mentioned drawbacks.
Claims (1)
ホンまてはポリスルホンの非旋光性フイルムの少
なくとも片面に、分子内にエチレン性二重結合を
有するシランカツプリング剤100重量部に対して
エチレン性二重結合を有する多官能ビニル化合物
を10〜100重量部、光増感剤およびこれらを溶解
する溶剤を主成分とする塗布液を、乾燥後10μm
以下の塗膜となるよう塗布し、100℃以下の温度
で乾燥し、その後紫外線を照射し硬化せしめ、該
塗膜上に蒸着法またはスパツター法により酸化イ
ンジウムを主成分とする導電薄膜を形成すること
を特徴とする透明導電性フイルムの製造方法。1. A silane coupling agent having an ethylenic double bond in the molecule on at least one side of a non-optically active film of polyethersulfone or polysulfone obtained by a melt extrusion method. A coating solution containing 10 to 100 parts by weight of a polyfunctional vinyl compound having
The following coating film is applied, dried at a temperature of 100°C or less, then cured by irradiation with ultraviolet rays, and a conductive thin film mainly composed of indium oxide is formed on the coating film by vapor deposition or sputtering. A method for producing a transparent conductive film, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5950984A JPS60203434A (en) | 1984-03-29 | 1984-03-29 | Manufacture of transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5950984A JPS60203434A (en) | 1984-03-29 | 1984-03-29 | Manufacture of transparent conductive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60203434A JPS60203434A (en) | 1985-10-15 |
| JPH0112664B2 true JPH0112664B2 (en) | 1989-03-01 |
Family
ID=13115294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5950984A Granted JPS60203434A (en) | 1984-03-29 | 1984-03-29 | Manufacture of transparent conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60203434A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63906A (en) * | 1986-06-18 | 1988-01-05 | 住友ベークライト株式会社 | Transparent conducting film |
-
1984
- 1984-03-29 JP JP5950984A patent/JPS60203434A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60203434A (en) | 1985-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6289907A (en) | Transparent conductive film united with polarizing film | |
| JPH0112664B2 (en) | ||
| US5866034A (en) | Heat resistant polymer composition, alignment layer formed using the same and liquid cyrstal display having the alignment layer | |
| CN100545233C (en) | A kind of preparation method of polymer dispersed liquid crystal film | |
| WO2025223074A1 (en) | Suspended-particle dimming device, and preparation method therefor and use thereof | |
| JPS58160924A (en) | Liquid crystal element | |
| JPS60178424A (en) | Liquid crystal display element | |
| JPS59202229A (en) | Production of transparent coating film | |
| WO2021179386A1 (en) | Transparent conductive film having horizontal alignment function, liquid crystal display, and preparation method therefor | |
| JP3153281B2 (en) | Vertical alignment treatment method for liquid crystal molecules | |
| JPH08239456A (en) | Fluorine-containing organic polymer alignment film material and liquid crystal display device using the same | |
| JPS60208240A (en) | Manufacture of transparent conductive film | |
| WO2021004024A1 (en) | Display panel and manufacturing method therefor | |
| JPS5917531A (en) | Substrate material for plastic panel | |
| JPS60255969A (en) | Manufacture of electrically conductive transparent film | |
| JPS63158526A (en) | Liquid crystal display element | |
| CN114958198B (en) | Polymer casting solution, anti-fog coating, and preparation methods and applications thereof | |
| JPS61143727A (en) | electrochromic display element | |
| JPS6261203A (en) | Transparent conductive film | |
| JPS60208239A (en) | Transparent conductive film | |
| JPS6065036A (en) | Preparation of transparent conductive film | |
| JP2968371B2 (en) | Method for producing color filter with protective film and liquid crystal display device | |
| JPH039323A (en) | Electrode substrate for liquid crystal display panel | |
| JPS58129418A (en) | Manufacture of liquid crystal cell | |
| JPS5962833A (en) | Substrate for liquid crystal display device and manufacturing method thereof |