JPH0124874B2 - - Google Patents
Info
- Publication number
- JPH0124874B2 JPH0124874B2 JP3983185A JP3983185A JPH0124874B2 JP H0124874 B2 JPH0124874 B2 JP H0124874B2 JP 3983185 A JP3983185 A JP 3983185A JP 3983185 A JP3983185 A JP 3983185A JP H0124874 B2 JPH0124874 B2 JP H0124874B2
- Authority
- JP
- Japan
- Prior art keywords
- filler
- layer
- thin film
- film layer
- electroforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
「対象技術分野」
この発明は電鋳型およびその製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] This invention relates to an electroforming mold and a method for manufacturing the same.
「従来装置およびその問題点」
従来、表面に凹部を有する母型から電鋳型を製
造するばあい、通常の電流密度で電着を行うと、
第２図に示すように、局部的、とくに凸部２に電
着層が厚く形成され、そのために凹部３における
電着層の成長が阻害される。したがつてその電鋳
工程における電流密度を通常の電流密度より低く
設定しているが、反面電着層の形成に多くの日数
を要する欠点がある。また電流密度を低くしても
なお凹凸部２，３の電着層が不均一となることは
避けられず、このため電鋳工程の後に機械加工を
施す必要があり、いきおい多くの日時を必要とす
る。"Conventional equipment and its problems" Conventionally, when producing an electroforming mold from a mother mold with concave portions on its surface, if electrodeposition is performed at a normal current density,
As shown in FIG. 2, the electrodeposited layer is formed thick locally, particularly in the convex portions 2, and therefore growth of the electrodeposited layer in the concave portions 3 is inhibited. Therefore, the current density in the electroforming process is set lower than the usual current density, but on the other hand, it has the disadvantage that it takes many days to form the electrodeposited layer. Furthermore, even if the current density is lowered, it is unavoidable that the electrodeposited layer on the uneven parts 2 and 3 will be non-uniform, and for this reason, it is necessary to perform machining after the electroforming process, which requires a lot of time and effort. shall be.
また電着層の不均一を補正する目的で、第３図
に示すように補助電極８を用いることもなされて
いるが、歯型などの複雑な凹凸形状を有する電鋳
型の製造においては母型を回転させて電着を行う
ため、補助電極の作成ならびに取付装置にかえつ
て多くの時間を費す欠点がある。 In addition, for the purpose of correcting non-uniformity of the electrodeposition layer, an auxiliary electrode 8 is used as shown in Fig. 3. Since electrodeposition is carried out by rotating the electrode, there is a disadvantage that a lot of time is spent on the preparation of the auxiliary electrode and the attachment device.
「目的」
この発明は歯型のように複雑な凹凸部を有する
電鋳型の製造において、電着層の形成が遅い凹部
にも高速で電着を施すことを目的とするものであ
る。"Purpose" The purpose of the present invention is to perform electrodeposition at high speed even in the recesses where the formation of the electrodeposition layer is slow, in the production of electroforming molds having complex uneven parts such as tooth patterns.
「実施例」
以下図によつてこの発明の一実施例について説
明する。"Embodiment" An embodiment of the present invention will be described below with reference to the drawings.
すなわち第１図において電鋳型の母型１はたと
えばギア等の歯型用のもので、その表面には複数
の凸部２および凹部３が形成されている。そして
その母型１の表面にはまず厚さが0.2〜１mmの電
着薄膜層４が形成され、その厚さは母型１の形状
あるいはその大きさで異なり、またその電着薄膜
層４を形成するばあい、母型１が電気メツキを施
すことが可能な形状であるならば、電気メツキの
方が能率的に有利であるが、電気メツキを施すこ
とが困難なばあい、あるいはそのメツキ工程に比
較的長い時間を要するものにあつては、無電解メ
ツキにより形成することができる。次に電着薄膜
層４の表面において凹部３内には充填剤５が充填
され、これによつて母型１の表面はほぼ均一に整
形される。ここで充填剤５の主剤はエポキシ樹脂
に金属粉末たとえばニツケル、銅、アルミニウム
等の粉末を重量比にして５〜50％混合することに
より組成される。なおエポキシ樹脂は母型１の材
質がたとえば金属により構成され、かつ高温加熱
が可能なばあいには熱硬化性のエポキシ樹脂が適
す。またエポキシ樹脂中に混入される金属粉末は
熱伝導性が高く、かつ導電性を有するため、活性
化を容易にするとともに、充填剤５の熱膨張をこ
の表面に施されるメツキ層に近づける効果を有す
る。次に凹部３に充填した充填剤５を硬化させる
が、この際充填剤に導電性を与えるために、その
表面を塩化パラジウム（Pdcl2）、塩化錫（Sncl2）
等で表面を活性化し、その表面に厚さが約0.01〜
0.1mm程度のメツキ層６を形成する。なおこのメ
ツキ層は無電解メツキにより行うことが望まし
い。そしてこのメツキ層を形成した状態において
は母型１の表面には凹凸がなくなるため、次にス
ルフアミン酸ニツケル浴のような高電流の流せる
メツキ浴を使用して電着加工を行うことによりそ
の表面に電着層７を形成する。これによつて表面
の均一な電鋳母型が完成する。 That is, in FIG. 1, an electroforming master mold 1 is used for, for example, a tooth mold of a gear, and has a plurality of convex portions 2 and concave portions 3 formed on its surface. First, an electrodeposited thin film layer 4 with a thickness of 0.2 to 1 mm is formed on the surface of the matrix 1, and the thickness varies depending on the shape or size of the matrix 1. When forming, if the matrix 1 has a shape that allows electroplating, electroplating is more efficient, but if it is difficult to electroplat If the process requires a relatively long time, it can be formed by electroless plating. Next, a filler 5 is filled into the recesses 3 on the surface of the electrodeposited thin film layer 4, so that the surface of the matrix 1 is shaped substantially uniformly. Here, the main ingredient of the filler 5 is composed of an epoxy resin and a metal powder such as nickel, copper, aluminum powder, etc. mixed in a weight ratio of 5 to 50%. Note that thermosetting epoxy resin is suitable as the epoxy resin when the material of the matrix 1 is made of metal, for example, and when high temperature heating is possible. In addition, since the metal powder mixed into the epoxy resin has high thermal conductivity and electrical conductivity, it facilitates activation and has the effect of bringing the thermal expansion of the filler 5 closer to the plating layer applied to the surface. has. Next, the filler 5 filled in the recess 3 is hardened, but in order to give the filler conductivity, its surface is coated with palladium chloride (Pdcl 2 ) and tin chloride (Sncl 2 ).
Activate the surface with etc., and make the surface have a thickness of about 0.01 ~
A plating layer 6 of about 0.1 mm is formed. Note that this plating layer is preferably formed by electroless plating. When this plating layer is formed, the surface of the mother mold 1 has no irregularities, so the surface is then processed by electrodeposition using a plating bath that can flow a high current, such as a nickel sulfamate bath. An electrodeposition layer 7 is formed thereon. As a result, an electroformed mold with a uniform surface is completed.
「効果」
この発明は上述のように母型の凹部内にエポキ
シ樹脂に金属粉末を重量比にして５〜50％混合し
た充填剤を充填するとともに、この充填剤の表面
に電着層を施すようにしているので、導電性がよ
く、充填剤とこの表面に施されるメツキ層との熱
膨張をたがいに近づけることができ、したがつて
電鋳時間が著るしく短縮される。とくにこの発明
によるとその工程時間は従来の３分の１ないし２
分の１に短縮することができる。また従来のよう
に電鋳加工の後、別に機械加工を行う必要もない
ため、電鋳設備の回転性が良く、しかも電気代お
よびメツキ薬品の節約と相まつて電鋳加工能率が
大幅に向上する利点がある。"Effects" As described above, this invention fills the concave portion of the matrix with a filler made of a mixture of epoxy resin and metal powder at a weight ratio of 5 to 50%, and also forms an electrodeposited layer on the surface of this filler. As a result, the conductivity is good and the thermal expansion of the filler and the plating layer applied to the surface can be made close to each other, and the electroforming time is therefore significantly shortened. In particular, according to this invention, the process time is one-third to two times the conventional time.
It can be shortened to one-fold. In addition, unlike conventional methods, there is no need to perform separate machining after electroforming, so the rotatability of electroforming equipment is improved, and the efficiency of electroforming is greatly improved by saving electricity costs and plating chemicals. There are advantages.
第１図はこの発明における電鋳加工方法の一実
施例を示す正断面図、第２図および第３図は従来
の加工方法を示す正断面図である。
１……母型、２……凸部、３……凹部、４……
電着薄膜層、５……充填剤、６……メツキ層、７
……電着層。
FIG. 1 is a front sectional view showing an embodiment of the electroforming method according to the present invention, and FIGS. 2 and 3 are front sectional views showing a conventional processing method. 1... Mother mold, 2... Convex part, 3... Concave part, 4...
Electrodeposited thin film layer, 5... Filler, 6... Plating layer, 7
...Electrodeposited layer.
Claims (1)
成し、この電着薄膜層の表面において、上記凹部
内にエポキシ樹脂に金属粉末を重量比にして５〜
50％混合した充填剤を充填し、かつこの充填剤の
表面を活性化し、さらにこの充填剤の表面に電着
層を施すことを特徴とする電鋳型の製造方法。 ２ 凹凸部を有する母型の表面に電着薄膜層を形
成し、この電着薄膜層の表面において、上記凹部
内にエポキシ樹脂に金属粉末を重量比にして５〜
50％混合した充填剤を充填し、かつこの充填剤の
表面に電着層を施すことを特徴とする電鋳型。[Scope of Claims] 1. An electrodeposited thin film layer is formed on the surface of a matrix having uneven parts, and on the surface of the electrodeposited thin film layer, a metal powder is added to the epoxy resin in a weight ratio of 5 to 5 in the recessed parts.
A method for producing an electroforming mold, which comprises filling a 50% mixed filler, activating the surface of the filler, and further applying an electrodeposition layer to the surface of the filler. 2. An electrodeposited thin film layer is formed on the surface of the matrix having uneven parts, and on the surface of the electrodeposited thin film layer, a metal powder is added to the epoxy resin in a weight ratio of 5 to 5 in the recessed parts.
An electroforming mold characterized by being filled with a 50% mixed filler and applying an electrodeposition layer to the surface of this filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3983185A JPS61199093A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3983185A JPS61199093A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61199093A JPS61199093A (en) | 1986-09-03 |
| JPH0124874B2 true JPH0124874B2 (en) | 1989-05-15 |
Family
ID=12563912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3983185A Granted JPS61199093A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199093A (en) |
-
1985
- 1985-02-28 JP JP3983185A patent/JPS61199093A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61199093A (en) | 1986-09-03 |
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