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JPH0124875B2 - - Google Patents
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JPH0124875B2 - - Google Patents

Info

Publication number
JPH0124875B2
JPH0124875B2 JP19063286A JP19063286A JPH0124875B2 JP H0124875 B2 JPH0124875 B2 JP H0124875B2 JP 19063286 A JP19063286 A JP 19063286A JP 19063286 A JP19063286 A JP 19063286A JP H0124875 B2 JPH0124875 B2 JP H0124875B2
Authority
JP
Japan
Prior art keywords
core
reinforcing frame
mother
metal reinforcing
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19063286A
Other languages
Japanese (ja)
Other versions
JPS6347391A (en
Inventor
Keiji Aihara
Hirotoshi Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Priority to JP19063286A priority Critical patent/JPS6347391A/en
Publication of JPS6347391A publication Critical patent/JPS6347391A/en
Publication of JPH0124875B2 publication Critical patent/JPH0124875B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 「対象技術分野」 この発明は電鋳母型およびその製造方法に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION [Technical field of interest] This invention relates to an electroforming mold and a method for manufacturing the same.

「従来技術」 電鋳母型の表面は一般に複雑な形状を有し、こ
のため機械加工が困難であるにもかかわらず精密
さが要求される。そこで母芯の表面にメツキを施
すことにより電鋳母型を得るようにしているが、
その表面に形成された凹凸部にメツキを施すばあ
いにはその性質上かなりの日時を要する。すなわ
ち凹凸部は電流密度を低くして、かつ長い時間を
かけてメツキし、このメツキの層の表面が平滑に
なつた段階で、あらためて電流密度を増大させ補
強のためのメツキ層を高速で形成するのが普通で
あるが、その補強のためのメツキ層は一般に十数
ミリメートルに達し、その厚さ分のメツキを行う
のに数日から十数日も要する欠点がある。
"Prior Art" The surface of an electroformed mother mold generally has a complicated shape, which requires precision even though machining is difficult. Therefore, an electroformed mother mold is obtained by plating the surface of the mother core, but
Due to its nature, plating the uneven portions formed on the surface requires a considerable amount of time and time. In other words, uneven areas are plated at a low current density and over a long period of time, and when the surface of this plating layer becomes smooth, the current density is increased again to form a reinforcing plating layer at high speed. However, the plating layer for reinforcement is generally about 10-odd millimeters thick, and it has the disadvantage that it takes several days to more than 10-odd days to plating that thickness.

「目的」 この発明はこのような従来の欠点にかんがみ、
十分な機械的強度、耐熱性および耐圧性を有する
電鋳母型を短時間で形成することを目的とするも
のである。
"Purpose" This invention takes into account the drawbacks of the conventional technology,
The purpose is to form an electroforming mother mold having sufficient mechanical strength, heat resistance, and pressure resistance in a short time.

「概要」 この発明は母芯の表面にその凹凸部を覆うよう
にメツキを施すとともに、その母芯をこの母芯に
ほぼ外接する内径を有する金属補強枠に挿入し、
この補強枠と母芯との間に形成された空間部に充
填剤を充填し、さらにこの充填剤を活性化し、こ
の充填剤、母芯および金属補強枠の表面にこれら
を包み込むようにメツキを施したものである。
"Summary" This invention applies plating to the surface of a base core so as to cover its uneven parts, and inserts the base core into a metal reinforcing frame having an inner diameter that almost circumscribes the base core.
A filler is filled into the space formed between the reinforcing frame and the base core, the filler is activated, and plating is applied to the surfaces of the filler, base core, and metal reinforcing frame so as to enclose them. This is what was done.

「実施例」 以下図によつてこの発明の一実施例について説
明する。
"Embodiment" An embodiment of the present invention will be described below with reference to the drawings.

すなわち第1図および第2図において母芯1は
たとえばアルミニウム材を機械加工することによ
り形成され、その外周表面には多数の凹部2およ
び凸部3が設けられる。たとえば母芯1がピニオ
ン歯車のばあいにはその外周に山と谷からなる凹
凸部が形成される。
That is, in FIGS. 1 and 2, the mother core 1 is formed by machining an aluminum material, for example, and has a large number of recesses 2 and protrusions 3 on its outer peripheral surface. For example, if the core 1 is a pinion gear, an uneven portion consisting of peaks and valleys is formed on its outer periphery.

まずこの母芯の表面にはとくにその凹凸部2,
3を覆うようにメツキを所定の厚さたとえば1〜
2mm施す。このメツキは電流密度が低く、かつ十
分な時間をかけて緩やかに行われる。これによつ
て第1のメツキ層5が形成され、かつこの第1の
メツキ層により凹凸部2,3は滑らかに覆われ
る。
First of all, on the surface of this core, there are especially uneven parts 2,
3 to a predetermined thickness, for example 1~
Apply 2mm. This plating is performed slowly with a low current density and over a sufficient period of time. As a result, the first plating layer 5 is formed, and the uneven portions 2 and 3 are smoothly covered with this first plating layer.

なお小形部品のばあいには第1のメツキ層5の
厚さは母芯1の凹部の深さに対してその半分位が
望ましい。
In the case of small parts, the thickness of the first plating layer 5 is desirably about half the depth of the recess of the base core 1.

次に第1のメツキ層5を施した母心1にほぼ外
接する内径を有する金属補強枠7を用意する。こ
の補強枠の外径寸法は母型全体の仕上り寸法より
所定の寸法だけ、たとえば2〜3mm小さく設定さ
れる。またこの金属補強枠の軸心線方向の長さ、
すなわち厚みは母芯1の軸心線方向の長さに比し
短く設定される。そしてこの金属補強枠内には母
芯1をその外周がその枠の内周とほぼ接するよう
に挿入する。この状態においては金属補強枠7と
母芯1との間に、この母芯の凹部による空間部が
形成される。
Next, a metal reinforcing frame 7 having an inner diameter substantially circumscribing the core 1 coated with the first plating layer 5 is prepared. The outer diameter dimension of this reinforcing frame is set smaller than the finished dimension of the entire matrix by a predetermined dimension, for example, 2 to 3 mm. Also, the length of this metal reinforcing frame in the axial direction,
That is, the thickness is set to be shorter than the length of the core 1 in the axial direction. The mother core 1 is inserted into this metal reinforcing frame so that its outer periphery is substantially in contact with the inner periphery of the frame. In this state, a space is formed between the metal reinforcing frame 7 and the core 1 due to the concave portion of the core.

続いてこの空間部にセラミツクセメントからな
る充填剤を充填し、これによつて充填層11を形
成する。この状態において母芯1と金属補強枠7
とはたがいに連結される。
Subsequently, this space is filled with a filler made of ceramic cement, thereby forming a filled layer 11. In this state, the base core 1 and the metal reinforcing frame 7
are connected to each other.

またこの金属補強枠の母芯1と交差する面にお
いて、この母芯とともに形成される角部に両者を
たがいに滑らかに連結するわん曲部8が形成され
る。このわん曲部は角部から外方に向けて充填層
11を膨出することにより形成される。なおこの
わん曲部はその角部において金属補強枠7自体に
凹曲面を形成してもよく、そのわん曲部を形成す
る方法は母芯1の形状あるいは大きさにより適宜
選択される。
Further, on a surface of the metal reinforcing frame that intersects with the base core 1, a curved portion 8 is formed at a corner formed together with the base core to smoothly connect the two to each other. This curved portion is formed by bulging the filling layer 11 outward from the corner. Note that this curved portion may be formed by forming a concave curved surface on the metal reinforcing frame 7 itself at the corner thereof, and the method for forming the curved portion is appropriately selected depending on the shape or size of the core 1.

次に充填層11の表面を塩化錫あるいは塩化パ
ラジウム等により活性化し、さらにその表面に無
電解メツキを薄く施すことにより充填層11は導
電性が与えられる。
Next, the surface of the filling layer 11 is activated with tin chloride, palladium chloride, or the like, and further electroless plating is applied thinly to the surface, thereby imparting electrical conductivity to the filling layer 11.

次に母芯1、充填層11および金属補強枠7の
表面にこれら全体を包み込むように電気メツキを
所定の寸法たとえば1〜2mm施す。これによつて
第2のメツキ層12が形成される。
Next, electroplating is applied to the surfaces of the core 1, the filling layer 11, and the metal reinforcing frame 7 to a predetermined size, for example, 1 to 2 mm, so as to completely envelop them. As a result, the second plating layer 12 is formed.

このようにして得られた成形体において第2の
メツキ層12を旋盤により金属補強枠7の外周に
沿つて所定の寸法だけ研削する。またその成形体
の軸心線と交差する両側面において第2のメツキ
層12を所定の寸法だけ研削するとともに、母芯
1の一部を研削し、この母芯を露出させる。
In the molded body thus obtained, the second plating layer 12 is ground by a predetermined dimension along the outer periphery of the metal reinforcing frame 7 using a lathe. Further, the second plating layer 12 is ground by a predetermined dimension on both side surfaces intersecting the axis of the molded body, and a part of the core 1 is ground to expose the core.

次にその成形体をカセイソーダ液に浸漬して母
芯1を溶解する。これによつて電鋳母型が完成す
る。
Next, the molded body is immersed in a caustic soda solution to dissolve the mother core 1. This completes the electroforming master mold.

「効果」 この発明は上述のように母芯にその凹凸部を覆
うようにメツキを施し、その母芯をこの母芯にほ
ぼ外接する内径を有する金属補強枠に挿入し、こ
の補強枠と母芯との間に形成された空間部に充填
剤を充填してこれを活性化し、さらに母芯、充填
剤および金属補強枠を包み込むようにメツキを施
し、母芯のみを溶融するようにしているので、十
分な強度と耐熱性および耐圧性を有する電鋳母型
を短時間で得ることができる。
"Effects" As described above, this invention applies plating to the base core so as to cover its uneven parts, inserts the base core into a metal reinforcing frame having an inner diameter that almost circumscribes the base core, and connects the base core with the metal reinforcing frame. A filler is filled in the space formed between the core and the filler is activated, and plating is applied to wrap around the base core, filler, and metal reinforcing frame, so that only the base core is melted. Therefore, an electroformed mother mold having sufficient strength, heat resistance, and pressure resistance can be obtained in a short time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の電鋳母型の製造過程におけ
る一実施例を示す縦断面図、第2図は正断面図で
ある。 1……母芯、2……凹部、3……凸部、5……
第1のメツキ層、7……金属補強枠、11……充
填層、12……第2のメツキ層。
FIG. 1 is a longitudinal sectional view showing an embodiment of the manufacturing process of an electroforming mold according to the present invention, and FIG. 2 is a front sectional view. 1... Mother core, 2... Concave portion, 3... Convex portion, 5...
First plating layer, 7... Metal reinforcing frame, 11... Filling layer, 12... Second plating layer.

Claims (1)

【特許請求の範囲】 1 表面に凹凸部を有する母芯にその凹凸部を覆
うように所定の厚さのメツキを施した後、その母
芯をこの母芯にほぼ外接する内径を有する金属補
強枠に挿入し、この補強枠と上記母芯との間に形
成された空間部に充填剤を充填して上記母芯と上
記金属補強枠とを連結し、続いて上記充填剤を活
性化し、その後この充填剤、上記母芯および金属
補強枠を包み込むようにメツキを施し、上記母芯
と上記金属補強枠を一体化し、さらに上記母芯の
みを溶解することを特徴とする電鋳母型の製造方
法。 2 上記充填剤はセラミツクセメントにより構成
した特許請求の範囲第1項記載の電鋳母型の製造
方法。 3 表面に凹凸部を有する母芯に施され、その凹
凸部を所定の厚みをもつて覆う第1のメツキ層
と、このメツキ層を施した上記母芯の外径とほぼ
外接する内径を有し、かつその母芯を収容する金
属補強枠と、この補強枠と上記母芯との間に充填
され、上記母芯と上記金属補強枠とをたがいに連
結する充填層と、この充填層、上記母芯および上
記金属補強枠の表面に、これらを一体に包み込む
ように形成した第2のメツキ層とを備えた電鋳母
型。 4 上記充填層はセラミツクセメントにより構成
した特許請求の範囲第3項記載の電鋳母型。 5 上記母芯の軸心方向の長さを上記金属補強枠
の軸心方向の長さに比し長く設定するとともに、
上記金属補強枠の上記母芯と交差する面におい
て、上記母芯とともに形成される角部に両者をた
がいに滑らかに連結するわん曲部を形成した特許
請求の範囲第4項記載の電鋳母型。
[Scope of Claims] 1. After applying plating to a predetermined thickness to cover the uneven portions of a core having an uneven surface, the core is reinforced with metal having an inner diameter that substantially circumscribes the core. inserting it into a frame, filling the space formed between the reinforcing frame and the mother core with a filler to connect the mother core and the metal reinforcing frame, and then activating the filler, After that, plating is applied so as to enclose the filler, the mother core and the metal reinforcing frame, the mother core and the metal reinforcing frame are integrated, and only the mother core is melted. Production method. 2. The method of manufacturing an electroforming mother mold according to claim 1, wherein the filler is made of ceramic cement. 3. A first plating layer applied to a base core having an uneven surface and covering the irregularity with a predetermined thickness, and an inner diameter substantially circumscribing the outer diameter of the base core on which the plating layer is applied. and a metal reinforcing frame for accommodating the mother core, a filling layer filled between the reinforcing frame and the mother core and connecting the mother core and the metal reinforcing frame to each other, the filling layer, An electroforming mother mold comprising a second plating layer formed on the surface of the mother core and the metal reinforcing frame so as to integrally wrap them. 4. The electroforming mother mold according to claim 3, wherein the filling layer is made of ceramic cement. 5 The length of the base core in the axial direction is set to be longer than the length of the metal reinforcing frame in the axial direction, and
The electroformed base according to claim 4, wherein a curved part is formed at a corner formed together with the base core on a surface of the metal reinforcing frame that intersects with the base core to smoothly connect the two to each other. Type.
JP19063286A 1986-08-15 1986-08-15 Electroforming matrix and its production Granted JPS6347391A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19063286A JPS6347391A (en) 1986-08-15 1986-08-15 Electroforming matrix and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19063286A JPS6347391A (en) 1986-08-15 1986-08-15 Electroforming matrix and its production

Publications (2)

Publication Number Publication Date
JPS6347391A JPS6347391A (en) 1988-02-29
JPH0124875B2 true JPH0124875B2 (en) 1989-05-15

Family

ID=16261298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19063286A Granted JPS6347391A (en) 1986-08-15 1986-08-15 Electroforming matrix and its production

Country Status (1)

Country Link
JP (1) JPS6347391A (en)

Also Published As

Publication number Publication date
JPS6347391A (en) 1988-02-29

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