JPH0125682B2 - - Google Patents
Info
- Publication number
- JPH0125682B2 JPH0125682B2 JP23495683A JP23495683A JPH0125682B2 JP H0125682 B2 JPH0125682 B2 JP H0125682B2 JP 23495683 A JP23495683 A JP 23495683A JP 23495683 A JP23495683 A JP 23495683A JP H0125682 B2 JPH0125682 B2 JP H0125682B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- green sheet
- carrier
- holes
- release agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 9
- 239000006082 mold release agent Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000007606 doctor blade method Methods 0.000 claims description 2
- 238000010297 mechanical methods and process Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000012644 addition polymerization Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Producing Shaped Articles From Materials (AREA)
Description
本発明は、積層セラミツクコンデンサ等に使用
するグリーンシートへ印刷法により内部電極を形
成する際もしくはその後の積層時に使用する光透
過による位置合せ用のガイドホール、配線基板を
作成する場合に使用される配線パターンをグリー
ンシート層間で導通させるために必要なビアホー
ル等のスルーホールを有するグリーンシートの製
造方法に関するものである。
従来グリーンシートへのスルーホールの形成
は、グリーンシート作成後機械的方法により直接
グリーンシートの所定の位置に必要な形状の穴を
パンチングするという製造工程をとつていた。
又位置合せ用のガイドとしては印刷時に所定の
位置にマーカーを印刷していた。
前者のスルーホール作成に於ては、ロール状の
セラミツクシートを取扱いやすい所定の形状に仮
切断し所定の位置に機械的方法でパンチングする
方式が一般的であるが、この場合グリーンシート
に結合剤が含まれる為打ち抜かれたシート片がス
ルーホール内やシート上に付着し、除去し難いと
いう問題があつた。
後者に於ては、マーカーを印刷する為マーカー
のにじみが問題になり目合せ精度に欠ける場合が
あつた。
本発明はこの様な欠点を除去することを目的と
するもので、グリーンシート作成前にあらかじめ
キヤリアーの所定の位置の離型剤を所定面積だけ
機械的に剥離除去しておき、その上にドクターブ
レイド法によりグリーンシートを作製し、その
後、グリーンシートをキヤリアーから剥離するこ
とを特徴とする。グリーンシートの剥離の際、キ
ヤリアー上の離型剤を剥離した部分に対応するグ
リーンシートの部分がキヤリアーに付着したまま
残りグリーンシートにスルーホールが形成され
る。本発明によれば、従来のようなグリーンシー
トのくずの問題が少なく、またスルーホールの径
の再現性に富むので、比較的安易にスルーホー
ル、ガイドホールの形成がなされるとの利点があ
る。
以下本発明の積層セラミツクコンデンサ製造の
実施例について詳細に説明する。
第１図ａを参照して、100ｍポリエステルフイ
ルムからなるキヤリアシート１上にはシリコーン
系離型剤２が塗布してある。
この種キヤリアシートに用いられているシリコ
ーン系離型剤は公知であり、剥離紙用シリコーン
とよばれ、大きく分けて、縮重合型、付加重合
型、および湿気硬化型がある。
これら縮重合型や付加重合型の離型剤は、溶剤
に溶かしてキヤリアシート上に塗布され、その
後、乾燥させると、この離型剤はキヤリアシート
上に付着した薄い固形相を形成する。この離型剤
の固形相は、針で突いたりやすりで擦ることによ
つて除去することができる。
このキヤリアシート１上の所定位置に、針先を
0.2φに加工したタングステンカーバイト針３をあ
てて回転し、離型剤２を部分的に剥離する。その
後静電除去機とクリーナーとにより浮遊離型剤を
除去した。こうして部分的に離型剤を剥離したキ
ヤリアシート上に、第１図ｂに示すように、ドク
ターブレイド法によりセラミツクグリーンシート
４の成膜（膜厚≦0.2mm）を行なつた。セラミツ
クス素材としては、Pb〔（Nb1/2、Fe1/2）0.67
（W1/3、Fe2/3）0.33〕O3を組成とする複合ペロブス
カイト系誘電材料を用い、これを混合、予焼、湿
式紛砕した紛末とPVB、BPBGとをエチルセロ
ソルブに分散させてスリラーとして成膜に用い
た。その後、第１図ｃに示すように、キヤリアシ
ートからグリーンシート４を剥離すると離型剤剥
離部に対応するグリーンシート部分５がキヤリア
シート上に付着して残り、グリーンシート４にス
ルーホール６が形成された。こうして得たグリー
ンシート４上に、スルーホール６を利用して（例
えば、光センサ位置決め装置を用いて）位置決め
した印刷機でAg／Pd（重量比80／20）内部電極
ペーストを所定の形状、厚みに印刷し、更にスル
ーホール６を利用して（例えば光センサ位置決め
装置を用いて）位置決めしながら自動パンチング
積層装置で所定枚数の積層を行なつた。
この積層体を所定形状に切断、焼成し、生チツ
プを得た。この生チツプに外部電極を焼付けし積
層セラミツクコンデンサを作成した。このコンデ
ンサの電気的特性、及びコンデンサの内部観察を
行つた。その結果を次表に示す。尚表には従来の
目合せ法（印刷時にマーカー印刷→目視によるマ
ーカー目合せ、パンチング、積層）によるコンデ
ンサの評価結果も併せて示した。
The present invention is used when forming internal electrodes by printing on green sheets used in multilayer ceramic capacitors, etc., or when creating guide holes and wiring boards for positioning through light transmission used during subsequent lamination. The present invention relates to a method of manufacturing a green sheet having through-holes such as via holes necessary for making a wiring pattern conductive between green sheet layers. Conventionally, through-holes were formed in a green sheet using a manufacturing process in which, after the green sheet was created, holes of the required shape were punched directly at predetermined positions in the green sheet using a mechanical method. Also, as a guide for alignment, markers are printed at predetermined positions during printing. In the former method of creating through holes, it is common to temporarily cut a rolled ceramic sheet into a predetermined shape that is easy to handle, and then mechanically punch it in a predetermined position.In this case, a bonding agent is applied to the green sheet. There was a problem in that the punched sheet pieces adhered to the through holes and onto the sheet and were difficult to remove. In the latter case, since the markers are printed, there are cases where the markers bleed and the accuracy of the alignment is lacking. The purpose of the present invention is to eliminate such drawbacks. Before creating a green sheet, the mold release agent at a predetermined position on the carrier is mechanically peeled off and removed by a predetermined area, and then a doctor is applied on top of the release agent. The method is characterized in that a green sheet is produced by a braiding method, and then the green sheet is peeled off from a carrier. When the green sheet is peeled off, a portion of the green sheet corresponding to the portion of the carrier from which the mold release agent has been peeled off remains attached to the carrier and a through hole is formed in the green sheet. According to the present invention, there is less problem of green sheet debris as in the past, and the reproducibility of the through hole diameter is high, so there is an advantage that through holes and guide holes can be formed relatively easily. . Examples of manufacturing a multilayer ceramic capacitor according to the present invention will be described in detail below. Referring to FIG. 1a, a silicone mold release agent 2 is coated on a carrier sheet 1 made of a 100 m polyester film. Silicone release agents used in this type of carrier sheet are known and are called release paper silicones, and are broadly classified into condensation type, addition polymerization type, and moisture curing type. These condensation polymerization type and addition polymerization type mold release agents are dissolved in a solvent and applied onto a carrier sheet, and then dried to form a thin solid phase adhered to the carrier sheet. This solid phase of mold release agent can be removed by pricking or sanding. Place the needle tip in the specified position on this carrier sheet 1.
A tungsten carbide needle 3 machined to 0.2φ is applied and rotated to partially peel off the mold release agent 2. Thereafter, the floating mold release agent was removed using a static eliminator and a cleaner. On the carrier sheet from which the release agent had been partially removed in this way, a ceramic green sheet 4 was formed (thickness ≦0.2 mm) by the doctor blade method, as shown in FIG. 1b. As a ceramic material, Pb [(Nb 1/2 , Fe 1/2 ) 0.67
(W 1/3 , Fe 2/3 ) 0.33 ] Using a composite perovskite dielectric material whose composition is O 3 , this is mixed, pre-fired, wet-milled powder, PVB, and BPBG are dispersed in ethyl cellosolve. This was used as a thriller for film formation. Thereafter, as shown in FIG. 1c, when the green sheet 4 is peeled off from the carrier sheet, the green sheet portion 5 corresponding to the part where the release agent has been removed remains attached to the carrier sheet, and through holes 6 are formed in the green sheet 4. Been formed. On the green sheet 4 obtained in this way, Ag/Pd (weight ratio 80/20) internal electrode paste is applied to a predetermined shape using a printing machine that is positioned using the through holes 6 (for example, using an optical sensor positioning device). After printing to a certain thickness, a predetermined number of sheets were laminated using an automatic punching and laminating apparatus while positioning them using the through holes 6 (for example, using an optical sensor positioning device). This laminate was cut into a predetermined shape and fired to obtain raw chips. External electrodes were baked onto this raw chip to create a multilayer ceramic capacitor. The electrical characteristics of this capacitor and the inside of the capacitor were observed. The results are shown in the table below. The table also shows the evaluation results of capacitors using conventional alignment methods (marker printing during printing → visual marker alignment, punching, and lamination).
【表】
上記表から明らかなように、本発明法によるも
のは目合せに優れかつ電気的特性不良率を下げる
ことができる。前述したグリーンシートのスルー
ホール位置に内部電極を印刷し積層、切断焼成す
ると確実に導電性を有することから、本発明法は
配線パターンのビアホール等の形成にも適してい
る。
以上の説明は積層セラミツクコンデンサについ
て説明したが、アルミナ等を用いたセラミツクス
のシートでも同様に可能であることは言うまでも
ない。[Table] As is clear from the above table, the method of the present invention has excellent alignment and can reduce the defective rate of electrical properties. The method of the present invention is also suitable for forming via holes in wiring patterns because internal electrodes are printed at the through-hole positions of the green sheet, laminated, cut, and fired to ensure conductivity. Although the above explanation has been made regarding a laminated ceramic capacitor, it goes without saying that a ceramic sheet using alumina or the like can be used in the same manner.
第１図は本発明の実施例を示す断面図で、ａ図
はキヤリアシートの離型剤の部分剥離工程を示す
図、ｂ図は、グリーンシート成膜工程を示す図、
ｃ図はグリーンシート剥離工程を示す図である。
１……キヤリアシート、２……離型剤、３……
カーバイト針、４……グリーンシート、６……ス
ルーホール。
FIG. 1 is a cross-sectional view showing an embodiment of the present invention, FIG.
Figure c is a diagram showing the green sheet peeling process. 1... Carrier sheet, 2... Mold release agent, 3...
Carbide needle, 4...Green sheet, 6...Through hole.
Claims (1)
かじめ機械的方法により剥離除去し、その上に無
機セラミツク紛末と有機結合剤及び可塑剤等を含
むスラリーをドクターブレイド法により成膜乾燥
してグリーンシートを形成し、その後上記キヤリ
アシートから該グリーンシートを剥離することに
よつて、予めキヤリアシート上の離型剤を剥離し
た部分に対応するグリーンシートの部分をキヤリ
アに付着したままに残し、これによつてグリーン
シートの所定の位置にスルーホールを形成するこ
とを特徴とするスルーホールを有するグリーンシ
ートの製造方法。1. The mold release agent at a predetermined position on the carrier sheet is peeled off and removed in advance by a mechanical method, and a slurry containing inorganic ceramic powder, an organic binder, a plasticizer, etc. is formed on top of it using a doctor blade method and dried to form a green film. By forming a sheet and then peeling the green sheet from the carrier sheet, a portion of the green sheet corresponding to the portion from which the release agent on the carrier sheet has been peeled is left attached to the carrier; 1. A method for manufacturing a green sheet having through holes, the method comprising forming through holes at predetermined positions of a green sheet by using a method of manufacturing a green sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23495683A JPS60127106A (en) | 1983-12-15 | 1983-12-15 | Manufacture of ceramic green sheet with through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23495683A JPS60127106A (en) | 1983-12-15 | 1983-12-15 | Manufacture of ceramic green sheet with through-hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60127106A JPS60127106A (en) | 1985-07-06 |
| JPH0125682B2 true JPH0125682B2 (en) | 1989-05-18 |
Family
ID=16978888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23495683A Granted JPS60127106A (en) | 1983-12-15 | 1983-12-15 | Manufacture of ceramic green sheet with through-hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60127106A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62202705A (en) * | 1985-11-05 | 1987-09-07 | 株式会社 麗光 | Ceramic film |
-
1983
- 1983-12-15 JP JP23495683A patent/JPS60127106A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60127106A (en) | 1985-07-06 |
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