JPH0131585B2 - - Google Patents
Info
- Publication number
- JPH0131585B2 JPH0131585B2 JP11991881A JP11991881A JPH0131585B2 JP H0131585 B2 JPH0131585 B2 JP H0131585B2 JP 11991881 A JP11991881 A JP 11991881A JP 11991881 A JP11991881 A JP 11991881A JP H0131585 B2 JPH0131585 B2 JP H0131585B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- disk
- shielding plate
- thermocouple
- disks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000523 sample Substances 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000002076 thermal analysis method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 239000012925 reference material Substances 0.000 description 3
- 238000004455 differential thermal analysis Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000013558 reference substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
- G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
- G01N25/4846—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a motionless, e.g. solid sample
- G01N25/4853—Details
- G01N25/486—Sample holders
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Description
【発明の詳細な説明】
本発明は示差熱分析装置に関する。示差熱分析
装置は通常試料側デイスクと参照側デイスクとを
同一平面上に並べた形になつているが、この形に
よると加熱炉が大きくなるので、加熱炉を小型化
するため試料側デイスクと参照側デイスクとを上
下方向に並べた型の示差熱分析計が提案されてい
る。本発明は特にこの後者の加熱炉を小型化した
熱分析装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a differential thermal analysis apparatus. Differential thermal analyzers usually have a sample side disk and a reference side disk arranged on the same plane, but this configuration requires a large heating furnace, so in order to downsize the heating furnace, the sample side disk and the reference side disk are arranged side by side. A differential thermal analyzer has been proposed in which reference side disks are arranged vertically. The present invention particularly relates to a thermal analysis apparatus in which the latter heating furnace is miniaturized.
上述した試料側デイスクと参照側デイスクを上
下方向に配置した熱分析装置では、炉からの輻射
熱が直接試料に影響を与えるため試料セルと参照
セルとで加熱炉からの熱輻射の効果が異り、特に
高温領域で試料が収縮したり変色したりすると測
定出力のベースラインが曲り易いと云う欠点があ
る。本発明はこの種の熱分析装置における上述し
た欠点を解消することを目的とする。 In the thermal analysis device described above in which the sample side disk and the reference side disk are arranged vertically, the radiant heat from the furnace directly affects the sample, so the effect of heat radiation from the heating furnace is different between the sample cell and the reference cell. However, there is a drawback that the baseline of the measurement output tends to be distorted, especially when the sample shrinks or changes color in a high temperature region. The present invention aims to eliminate the above-mentioned drawbacks of this type of thermal analysis device.
本発明は上下に配置された試料用及び参照用の
両デイスクの上方及び下方に夫々適宜間隔をあけ
て上側遮熱板と下側遮蔽板を設け、下側に位置す
るデイスクに溶接される熱電対のリード線を上側
に位置するデイスクに溶接される熱電対のリード
線と略同じ長さにしてたるみを持たせ、たるみ分
を側方に曲出させたことを特徴とする示差熱分析
装置を提供する。上記した遮熱板は加熱炉からの
輻射熱が試料或は参照セルに直接入射するのを防
ぎ、試料及び参照物質共に炉内雰囲気によつて加
熱されるようにして両者の外囲条件を均一化する
ものである。下側に位置するデイスクに溶接する
熱電対のリード線は真直であれば上側のデイスク
の熱電対のリード線より短かくなるが、そうする
とリード線の熱伝導の影響が上下デイスクで異つ
てくるので、下側のデイスクの熱電対のリード線
にはたるみを持たせて両方の熱電対のリードの長
さを略同じにして熱伝導の効果を均一化してあ
る。このような構成によつて上下両デイスクの外
囲条件が均一化されているので、本発明によばれ
高温に到るまで安定したベースラインが得られ
る。以下実施例によつて本発明を説明する。 In the present invention, an upper heat shield plate and a lower shield plate are provided at appropriate intervals above and below both sample and reference disks arranged one above the other, and a thermoelectric plate is welded to the lower disk. A differential thermal analysis device characterized in that the lead wires of the pair are made approximately the same length as the lead wires of the thermocouple welded to the upper disk to have some slack, and the slack is bent to the side. I will provide a. The heat shield plate described above prevents the radiant heat from the heating furnace from directly entering the sample or reference cell, and allows both the sample and reference material to be heated by the atmosphere inside the furnace, making the surrounding conditions of both uniform. It is something to do. If the thermocouple lead wire welded to the lower disk is straight, it will be shorter than the thermocouple lead wire of the upper disk, but if this is done, the effect of heat conduction of the lead wire will be different between the upper and lower disks. The lead wires of the thermocouples on the lower disk are slackened so that the lengths of the leads of both thermocouples are approximately the same to equalize the heat conduction effect. With such a configuration, the surrounding conditions of both the upper and lower disks are made uniform, so that according to the present invention, a stable baseline can be obtained up to high temperatures. The present invention will be explained below with reference to Examples.
第1図は本発明の一実施例を示す。1は加熱炉
である。2は試料側デイスク、3は参照側デイス
ク、4は参照側デイスクの下方に設置された遮熱
板、5は試料側デイスクの上方に配置された遮熱
板で、これら上下の遮熱板は支柱6によつて結合
され、下方の遮蔽板4の下側ボス部分が碍子7の
上端に嵌着されて全体が支持されている。デイス
ク2,3には夫々熱電対のリード線8,9が溶接
され、これらのリード線の下端は碍子7の4個の
孔に別々に挿通されており、デイスク2,3を支
持する支柱を兼ねている。下側の参照側デイスク
3に溶接された熱電対のリード線9にはたるみが
持たせてあり、側方へ曲出10してある。このた
め2つのデイスク2,3は熱電対のリード線によ
る熱伝導に関して同じ条件になつている。11は試
料側デイスク2上に載せられる試料セルであり、
12は参照側デイスク3に載せられる基準物質で
熱電対8のリード線に対する逃げのため切込み1
3が設けてある。なお輻射熱の影響は上方から試
料に作用するものが大きいので、場合によつては
遮蔽板は上方のものだけでもよい。 FIG. 1 shows an embodiment of the invention. 1 is a heating furnace. 2 is a sample side disk, 3 is a reference side disk, 4 is a heat shield plate installed below the reference side disk, 5 is a heat shield plate placed above the sample side disk, and these upper and lower heat shield plates are They are connected by struts 6, and the lower boss portion of the lower shielding plate 4 is fitted onto the upper end of the insulator 7, so that the entire structure is supported. Thermocouple lead wires 8 and 9 are welded to the disks 2 and 3, respectively, and the lower ends of these lead wires are individually inserted into four holes in the insulator 7 to connect the struts that support the disks 2 and 3. Also serves as. The lead wire 9 of the thermocouple welded to the lower reference side disk 3 is slackened and bent laterally 10. Therefore, the two disks 2 and 3 have the same conditions regarding heat conduction by the thermocouple lead wires. 11 is a sample cell placed on the sample side disk 2;
12 is a reference material placed on the reference side disk 3, and there is a notch 1 for escape from the lead wire of the thermocouple 8.
3 is provided. Note that the influence of radiant heat is large when it acts on the sample from above, so in some cases, only the upper shielding plate may be used.
第2図は熱電対8,9の結線を模型的に示した
ものである。加熱炉からの輻射熱によるベースラ
インの曲りは試料セルに直接蓋をかぶせることに
よつても或る程度改善できる。しかしこのように
すると試料からの揮発ガスが逃げにくくなり、ま
た試料と雰囲気との接触が不良となつて試料の温
度特性そのものが試料解放状態と異つたものとな
る。本発明の場合遮蔽板は試料から離れて配置さ
れ試料周囲の雰囲気の流通を妨げないから上述し
たような問題が起らない。本発明に係る示差熱分
析装置は上述したような構成で遮蔽板によつて炉
からの輻射熱が直接試料に影響するのが防がれて
試料と参照物質との外部条件が均一化され、電熱
対の熱的影響も試料及び参照物質に対して同等化
されているので、小型化された装置でありながら
高温に到るまでベースラインの安定性が高くまた
生化学、食品化学関係の試料では0℃以下の温度
で熱分析が行われるが遮蔽板は炉内対流に対し抵
抗となるのでそのような低温領域での対流による
ノイズが減少すると云う効果も得られる。なお上
記実施例では上下の遮蔽板が支柱によつて結合さ
れる構造となつているが、上方の遮蔽板に脚を設
けて下の遮蔽板上に乗せるようにしてもよく、更
には上方の遮蔽板を小孔を多数穿孔した孔あき板
でカツプ状に構成して上下デイスク全体にかぶせ
るようにしてもよい。このようにすると上下デイ
スクは遮蔽板で囲まれた小空間内に置かれた状態
となつて、炉内対流による温度のゆらぎがなくな
り、遮蔽板内は小空間になつているからその雰囲
気温度は均一で、遮蔽板は孔あき板であるから遮
蔽板内は完全な隔離空間ではなく、炉内雰囲気と
の若干の交流があり、直接の輻射は遮蔽しつゝ炉
内平均温度に追従し得るのである。 FIG. 2 schematically shows the connection of thermocouples 8 and 9. The curvature of the baseline due to radiant heat from the heating furnace can be improved to some extent by directly covering the sample cell with a lid. However, if this is done, it becomes difficult for volatile gases from the sample to escape, and contact between the sample and the atmosphere becomes poor, resulting in the temperature characteristics of the sample itself being different from those in the sample open state. In the case of the present invention, the shielding plate is placed apart from the sample and does not impede the circulation of the atmosphere around the sample, so the above-mentioned problem does not occur. The differential thermal analyzer according to the present invention has the above-described configuration, and the shielding plate prevents the radiant heat from the furnace from directly affecting the sample, equalizes the external conditions between the sample and the reference material, and The thermal effects of the pair are equalized for the sample and the reference substance, so even though it is a compact device, the baseline stability is high even up to high temperatures. Although thermal analysis is performed at temperatures below 0° C., the shielding plate acts as a resistance to convection in the furnace, so that it also has the effect of reducing noise due to convection in such a low-temperature region. In the above embodiment, the upper and lower shielding plates are connected by a support, but the upper shielding plate may have legs and be placed on the lower shielding plate. The shielding plate may be configured as a cup-shaped perforated plate having a large number of small holes, so as to cover the entire upper and lower disks. In this way, the upper and lower disks are placed in a small space surrounded by the shielding plate, and temperature fluctuations due to convection inside the furnace are eliminated, and since the inside of the shielding plate is a small space, the ambient temperature is Since the shielding plate is a perforated plate, the inside of the shielding plate is not a completely isolated space, but there is some exchange with the atmosphere inside the furnace, and direct radiation can be shielded while following the average temperature inside the furnace. It is.
第1図は本発明の一実施例装置の一部切欠斜視
図、第2図は同装置における熱電対の結線図であ
る。
1……加熱炉、2……試料側デイスク、3……
参照射デイスク、4……下方遮蔽板、5……上方
遮蔽板、8,9……熱電対のリード線、10……
熱電対9のたるみ部。
FIG. 1 is a partially cutaway perspective view of a device according to an embodiment of the present invention, and FIG. 2 is a wiring diagram of a thermocouple in the same device. 1... Heating furnace, 2... Sample side disk, 3...
Reference radiation disk, 4... Lower shielding plate, 5... Upper shielding plate, 8, 9... Thermocouple lead wire, 10...
Slack part of thermocouple 9.
Claims (1)
を上下に並べて配置し、これら両デイスクの上方
と下方のうち少くとも上方に遮蔽板を配置し、試
料側及び参照側両デイスクに夫々熱電対を溶接
し、下側に位置する方のデイスクの熱電対のリー
ド線に上方のデイスクの熱電対のリード線と略々
同じ長さになるようにたるみを持たせたことを特
徴とする示差熱分析装置。1 In the furnace, arrange the sample disk and reference disk one above the other, place a shielding plate at least above and below both disks, and weld thermocouples to both the sample side and reference side disks, respectively. A differential thermal analyzer characterized in that the lead wire of the thermocouple of the lower disk is slackened so that it has approximately the same length as the lead wire of the thermocouple of the upper disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11991881A JPS5821150A (en) | 1981-07-30 | 1981-07-30 | Apparatus of differential thermal analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11991881A JPS5821150A (en) | 1981-07-30 | 1981-07-30 | Apparatus of differential thermal analysis |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5821150A JPS5821150A (en) | 1983-02-07 |
| JPH0131585B2 true JPH0131585B2 (en) | 1989-06-27 |
Family
ID=14773396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11991881A Granted JPS5821150A (en) | 1981-07-30 | 1981-07-30 | Apparatus of differential thermal analysis |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5821150A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61261618A (en) * | 1985-05-15 | 1986-11-19 | Toyota Motor Corp | Radiator cooling fan controller |
| JP2720751B2 (en) * | 1993-03-25 | 1998-03-04 | 株式会社島津製作所 | Differential thermal analyzer |
| CN201653564U (en) | 2007-03-30 | 2010-11-24 | 安纳蒂茨股份有限公司 | Sensor for thermal analysis and system comprising the same |
| FR2929012B1 (en) * | 2008-03-20 | 2010-04-09 | Setaram Instrumentation | THERMAL MEASUREMENT SENSOR |
-
1981
- 1981-07-30 JP JP11991881A patent/JPS5821150A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5821150A (en) | 1983-02-07 |
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