JPH0145415B2 - - Google Patents
Info
- Publication number
- JPH0145415B2 JPH0145415B2 JP6777482A JP6777482A JPH0145415B2 JP H0145415 B2 JPH0145415 B2 JP H0145415B2 JP 6777482 A JP6777482 A JP 6777482A JP 6777482 A JP6777482 A JP 6777482A JP H0145415 B2 JPH0145415 B2 JP H0145415B2
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- base material
- resin
- heated
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
本発明は、積層板あるいは銅張り積層板の製造
法に関する。従来、フエノール樹脂積層板あるい
は銅張り積層板の製造に際しては、レゾール型フ
エノール樹脂をメタノール、アセトン、トルエ
ン、メチルエチルケトンなどの有機溶剤に希釈し
たワニスを、リンター紙、クラフト紙などの積層
品用基材に含浸した後、熱風循還乾燥炉中で前記
有機溶剤を揮散、乾燥させていた。このため、多
量の有機溶剤を必要とし、有機溶剤の揮散、乾燥
のためのエネルギーコストおよび廃ガス処理コス
トを要していた。また、溶剤は可燃性のため危険
な作業環境にあつた。
本発明は、上記の従来の欠点を除去し、溶剤の
使用と乾燥工程を削減することによつて、製造工
程を効率化した積層板あるいは銅張り積層板の製
造法を提供することを目的とする。
上記目的を達成するために本発明は、フエノー
ル樹脂初期縮合物を含浸させたセルローズ系紙基
材に、乾性油変性ノボラツク型フエノール樹脂と
エポキシ樹脂からなる樹脂組成物を加熱溶融状態
で塗付し、この基材の複数枚を重ね合せて加熱加
圧成形することを特徴とするものである。
また、前記重ね合せた基材の少なくとも一方の
表面に銅箔を載置して加熱加圧成形するものであ
る。
本発明で用いるフエノール樹脂初期縮合物は、
フエノール類とホルムアルデヒド類を苛性ソー
ダ、苛性カリ、水酸化バリウムなどの金属アルカ
リ、トリメチルアミン、トリエチルアミン、ジメ
チルアミン、ジエチルアミンなどのアミン化合物
に代表される塩基性触媒下で反応させて得た1〜
2核体の初期縮合物である。この初期縮合物をリ
ンター紙、またはクラフト紙などのセルローズ系
紙基材に含浸させると親水性があるため基材内部
まで浸透する。
本発明に用いる乾性油変性ノボラツク型フエノ
ール樹脂は、フエノール類と乾性油を酸性触媒存
在下で反応させて得られる乾性油―フエノール類
付加物にホルムアルデヒド類を反応させるか、あ
るいはフエノール類とホルムアルデヒド類を酸性
触媒下で反応させて得られるノボラツク型フエノ
ール樹脂に乾性油を反応させて得る。乾性油変性
ノボラツク型フエノール樹脂の軟化点は、これを
基材に加熱溶融状態で塗付する工程においてゲル
化するのを防ぐため、100℃以下が望ましい。
本発明に於ては、乾性油変性ノボラツク型フエ
ノール樹脂に硬化剤としてエポキシ樹脂を添加す
るが、エポキシ樹脂としては、ビスフエノール系
エポキシ樹脂、ノボラツク系エポキシ樹脂、シク
ロヘキセン、シクロペンタジエンのような脂環式
化合物から得られるエポキシ樹脂など従来公知の
エポキシ樹脂が用いられる。添加量は、乾性油変
性ノボラツク型フエノール樹脂のフエノール性水
酸基1当量に対し0.6〜1.2当量が適当である。ま
た、必要に応じてアミン化合物、イミダゾール化
合物、チアゾール化合物などの硬化促進剤を添加
することができる。基材に塗付するに際し、乾性
油変性ノボラツク型フエノール樹脂―エポキシ樹
脂混合組成物の加熱溶融温度は100℃以下が望ま
しい。
実施例
フエノール680g、桐油350gにパラトルエンス
ルフオン酸0.5gを加え、80〜85℃にて120分間反
応させた後、85%パラフオルムアルデヒド195g
を加え70〜75℃にて150分間反応させた。減圧脱
水後、軟化点65℃の桐油変性ノボラツク型フエノ
ール樹脂を得た。得られた桐油変性ノボラツク型
フエノール樹脂160重量部、エポキシ樹脂(エピ
コート#828)140重量部、ベンジルジメチルアミ
ン1重量部を70℃で混合溶融した後、これを、予
めフエノール樹脂初期縮合物を10重量%含浸乾燥
したクラフト紙に塗付した。得られた塗工紙の樹
脂付着量は51重量%であつた。
上記塗工紙8枚とその片側表面に35μ厚銅箔を
重ね合わせた構成物を圧力110Kg/cm2、温度170℃
で55分間成形し銅張り積層板を得た。
比較例
フエノール680g、桐油350gにパラトルエンス
ルフオン酸0.5g、メタノール50gを加え80〜85
℃にて120分間反応させた後、25%アンモニア水
20g、85%パラフオルムアルデヒド250gを加え
80〜85℃にて270分間反応させた。次いで、減圧
脱水した後、トルエンで希釈し樹脂濃度50重量%
の桐油変性フエノール樹脂ワニスを得た。予めフ
エノール樹脂初期縮合物を10重量%含浸乾燥した
クラフト紙に前記桐油変性フエノール樹脂ワニス
を含浸乾燥して樹脂付着量51重量%の塗工紙を得
た。
上記塗工紙8枚とその片側表面に35μ厚銅箔を
重ね合せた構成物を圧力110Kg/cm2、温度170℃で
55分間成形し銅張り積層板を得た。
実施例および比較例の銅張り積層板の性能を第
1表に示す。
The present invention relates to a method for manufacturing a laminate or a copper-clad laminate. Conventionally, when manufacturing phenolic resin laminates or copper-clad laminates, a varnish made by diluting resol-type phenolic resin with an organic solvent such as methanol, acetone, toluene, or methyl ethyl ketone is used as a base material for laminates such as linter paper or kraft paper. After impregnation, the organic solvent was volatilized and dried in a hot air circulation drying oven. Therefore, a large amount of organic solvent is required, and energy costs for volatilization and drying of the organic solvent and waste gas treatment costs are required. Additionally, the solvent was flammable, creating a dangerous work environment. An object of the present invention is to provide a method for manufacturing a laminate or copper-clad laminate that eliminates the above-mentioned conventional drawbacks and streamlines the manufacturing process by reducing the use of solvents and drying steps. do. In order to achieve the above object, the present invention applies a resin composition consisting of a drying oil-modified novolak type phenolic resin and an epoxy resin in a heated and molten state to a cellulose paper base impregnated with a phenolic resin initial condensate. , is characterized in that a plurality of sheets of this base material are superimposed and molded under heat and pressure. Further, a copper foil is placed on at least one surface of the stacked base materials and then heated and press-molded. The phenolic resin initial condensate used in the present invention is
1~ obtained by reacting phenols and formaldehydes under a basic catalyst represented by a metal alkali such as caustic soda, caustic potash, or barium hydroxide, or an amine compound such as trimethylamine, triethylamine, dimethylamine, or diethylamine.
It is an initial condensate of dinuclear bodies. When this initial condensate is impregnated into a cellulose paper base material such as linter paper or kraft paper, it penetrates into the interior of the base material due to its hydrophilic properties. The drying oil-modified novolak type phenolic resin used in the present invention can be obtained by reacting formaldehyde with a drying oil-phenol adduct obtained by reacting phenols and drying oil in the presence of an acidic catalyst, or by reacting formaldehyde with a drying oil-phenol adduct obtained by reacting phenols and drying oil in the presence of an acidic catalyst. A novolac type phenolic resin obtained by reacting the following under an acidic catalyst is obtained by reacting a drying oil with a drying oil. The softening point of the drying oil-modified novolac type phenolic resin is preferably 100°C or lower in order to prevent it from gelling during the process of applying it to a base material in a heated molten state. In the present invention, an epoxy resin is added as a curing agent to a drying oil-modified novolak type phenolic resin.As the epoxy resin, alicyclic resins such as bisphenol epoxy resin, novolak type epoxy resin, cyclohexene, and cyclopentadiene are used. A conventionally known epoxy resin such as an epoxy resin obtained from a compound of the formula formula can be used. The appropriate amount to be added is 0.6 to 1.2 equivalents per equivalent of phenolic hydroxyl group of the drying oil-modified novolak type phenolic resin. Further, a curing accelerator such as an amine compound, an imidazole compound, a thiazole compound, etc. can be added as necessary. When applying it to a substrate, the heating and melting temperature of the dry oil-modified novolac type phenolic resin-epoxy resin mixed composition is preferably 100°C or less. Example 0.5 g of paratoluenesulfonic acid was added to 680 g of phenol and 350 g of tung oil, and after reacting at 80 to 85°C for 120 minutes, 195 g of 85% paraformaldehyde was obtained.
was added and reacted at 70 to 75°C for 150 minutes. After dehydration under reduced pressure, a tung oil-modified novolak type phenolic resin with a softening point of 65°C was obtained. 160 parts by weight of the obtained tung oil-modified novolak type phenolic resin, 140 parts by weight of epoxy resin (Epicoat #828), and 1 part by weight of benzyldimethylamine were mixed and melted at 70°C. It was applied to kraft paper which had been impregnated with % by weight and dried. The resin adhesion amount of the obtained coated paper was 51% by weight. A composition consisting of 8 sheets of the above coated paper and a 35μ thick copper foil layered on one side of the paper was heated at a pressure of 110Kg/cm 2 and a temperature of 170℃.
A copper-clad laminate was obtained by molding for 55 minutes. Comparative example Add 0.5 g of paratoluenesulfonic acid and 50 g of methanol to 680 g of phenol and 350 g of tung oil, and add 80 to 85 g.
After reacting for 120 minutes at °C, add 25% ammonia water.
20g, add 250g of 85% paraformaldehyde
The reaction was carried out at 80-85°C for 270 minutes. Next, after dehydrating under reduced pressure, diluted with toluene to a resin concentration of 50% by weight.
A tung oil modified phenolic resin varnish was obtained. Kraft paper, which had been previously impregnated with 10% by weight of a phenolic resin initial condensate and dried, was impregnated with the tung oil-modified phenolic resin varnish and dried to obtain coated paper with a resin adhesion of 51% by weight. A composition consisting of 8 sheets of the above coated paper and a 35μ thick copper foil layered on one side of the paper was heated at a pressure of 110Kg/cm 2 and a temperature of 170℃.
A copper-clad laminate was obtained by molding for 55 minutes. Table 1 shows the performance of the copper-clad laminates of Examples and Comparative Examples.
【表】
第1表から明らかなように、本発明による銅張
り積層板の性能は、従来製造法の積層板に比べて
絶縁抵抗が大きく、吸水量、加熱収縮率がともに
小さく、曲げ強さ、打抜加工性は同等である。
尚、銅箔を貼りつけない積層板についても、上
記実施例と同じ性能を有している。
本発明によれば、乾性油変性フエノール樹脂の
塗工工程では溶剤を使用せず、加熱溶融状態で塗
付を行なうので乾燥工程が不用となる。また、こ
れに伴なつてエネルギーコストおよび廃ガス処理
コストを削減できる。更に、乾性油変性ノボラツ
ク型フエノール樹脂をエポキシ樹脂を用いて硬化
させるため、硬化収縮および硬化過程での揮発分
発生が少なく、従つて、電気性能、耐水性が向上
すると共に加熱による寸法変化が少なくなるので
反り、ねじれの少ない銅張り積層板および積層板
が得られる。[Table] As is clear from Table 1, the performance of the copper-clad laminate according to the present invention is that it has higher insulation resistance, lower water absorption and heat shrinkage, and lower bending strength than conventionally manufactured laminates. , the punching workability is the same. Note that a laminate without copper foil attached has the same performance as the above example. According to the present invention, no solvent is used in the coating process of the drying oil-modified phenolic resin, and the coating is carried out in a heated molten state, thereby eliminating the need for a drying process. Additionally, energy costs and waste gas treatment costs can be reduced accordingly. Furthermore, since the dry oil-modified novolak type phenolic resin is cured using an epoxy resin, there is less curing shrinkage and volatile matter generation during the curing process, resulting in improved electrical performance and water resistance, and less dimensional change due to heating. Therefore, copper-clad laminates and laminates with less warpage and twisting can be obtained.
Claims (1)
ーズ系紙基材に、乾性油変性ノボラツク型フエノ
ール樹脂とエボキシ樹脂からなる樹脂組成物を加
熱溶融状態で塗付し、この基材の複数枚を重ね合
わせて更に少なくとも一方の表面には銅箔を載置
して加熱加圧成形することを特徴とする銅張り積
層板の製造法。 2 フエノール樹脂初期縮合物を含浸したセルロ
ーズ系紙基材に、乾性油変性ノボラツク型フエノ
ール樹脂とエポキシ樹脂からなる樹脂組成物を加
熱溶融状態で塗付し、この基材の複数枚を重ね合
せて加熱加圧成形することを特徴とする積層板の
製造法。[Scope of Claims] 1. A resin composition consisting of a dry oil-modified novolak type phenolic resin and an epoxy resin is applied in a heated molten state to a cellulose paper base material impregnated with a phenolic resin initial condensate, and the base material is heated and molten. A method for manufacturing a copper-clad laminate, which comprises stacking a plurality of sheets, further placing copper foil on at least one surface, and forming the sheets under heat and pressure. 2. A resin composition consisting of a drying oil-modified novolac type phenolic resin and an epoxy resin is applied in a heated molten state to a cellulose paper base material impregnated with a phenolic resin initial condensate, and multiple sheets of this base material are stacked together. A method for manufacturing a laminate, characterized by heating and pressure forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6777482A JPS58183251A (en) | 1982-04-22 | 1982-04-22 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6777482A JPS58183251A (en) | 1982-04-22 | 1982-04-22 | Manufacture of laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58183251A JPS58183251A (en) | 1983-10-26 |
| JPH0145415B2 true JPH0145415B2 (en) | 1989-10-03 |
Family
ID=13354623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6777482A Granted JPS58183251A (en) | 1982-04-22 | 1982-04-22 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58183251A (en) |
-
1982
- 1982-04-22 JP JP6777482A patent/JPS58183251A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58183251A (en) | 1983-10-26 |
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