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JPH0145416B2 - - Google Patents
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JPH0145416B2 - - Google Patents

Info

Publication number
JPH0145416B2
JPH0145416B2 JP6989282A JP6989282A JPH0145416B2 JP H0145416 B2 JPH0145416 B2 JP H0145416B2 JP 6989282 A JP6989282 A JP 6989282A JP 6989282 A JP6989282 A JP 6989282A JP H0145416 B2 JPH0145416 B2 JP H0145416B2
Authority
JP
Japan
Prior art keywords
phenolic resin
base material
copper
type phenolic
hexamethylenetetramine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6989282A
Other languages
Japanese (ja)
Other versions
JPS58187346A (en
Inventor
Toshimaro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP6989282A priority Critical patent/JPS58187346A/en
Publication of JPS58187346A publication Critical patent/JPS58187346A/en
Publication of JPH0145416B2 publication Critical patent/JPH0145416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は、積層板あるいは銅張り積層板の製造
法に関する。 従来、フエノール樹脂積層板あるいは銅張り積
層板の製造に際しては、レゾール型フエノール樹
脂をメタノール、アセトン、トルエン、メチルエ
チルケトンなどの有機溶剤に希釈したワニスを、
リンター紙、クラフト紙などの積層品用基材に含
浸した後熱風循還乾燥炉中で前記有機溶剤を揮
散、乾燥させていた。このため、多量の有機溶剤
を必要とし、有機溶剤の揮散、乾燥のためのエネ
ルギーコストおよび廃ガス処理コストを要してい
た。また、溶剤は可燃性のため危険な作業環境に
あつた。 本発明は、上記の従来の欠点を除去し、溶剤の
使用と乾燥工程を削減することによつて、製造工
程を効率化した積層板あるいは銅張り積層板の製
造方法を提供することを目的とする。 上記目的を達成するために本発明は、フエノー
ル樹脂初期縮合物を含浸したセルローズ系紙基材
に、乾性油変性ノボラツク型フエノール樹脂とヘ
キサメチレンテトラミンからなる樹脂組成物を加
熱溶融状態で塗付し、この基材の複数枚を重ね合
せて加熱加圧成形することを特徴とするものであ
る。 また、前記重ね合せた基材の少なくとも一方の
表面に銅箔を載置して加熱加圧成形するものであ
る。 本発明で用いるフエノール樹脂初期縮合物は、
フエノール類とホルムアルデヒド類を苛性ソー
ダ、苛性カリ、水酸化バリウムなどの金属アルカ
リ、トリメチルアミン、トリエチルアミン、ジメ
チルアミン、ジエチルアミンなどのアミン化合物
に代表される塩基性触媒下で反応させて得た1〜
2核体の初期縮合物である。この初期縮合物をリ
ンター紙、またはクラフト紙などのセルローズ系
紙基材に含浸させると親水性があるため基材内部
まで浸透する。 本発明に用いる乾性油変性ノボラツク型フエノ
ール樹脂は、フエノール類と乾性油を酸性触媒存
在下で反応させて得られる乾性油―フエノール類
付加物にホルムアルデヒド類を反応させるか、あ
るいはフエノール類とホルムアルデヒド類を酸性
触媒存在下で反応させて得られるノボラツク型フ
エノール樹脂に乾性油を反応させて得る。乾性油
変性ノボラツク型フエノール樹脂の軟化点は、こ
れを基材に加熱溶融状態で塗付する工程に於いて
ゲル化を防ぐため、100℃以下が望ましい。 本発明に於いては、乾性油変性ノボラツク型フ
エノール樹脂に硬化剤としてヘキサメチレンテト
ラミンを添加するが、添加量は乾性油変性ノボラ
ツク型フエノール樹脂100重量部に対し3〜15重
量部が適当である。基材に塗付するに際し、乾性
油変性ノボラツク型フエノール樹脂―ヘキサメチ
レンテトラミン混合組成物の加熱溶融温度は110
℃以下が望ましい。 実施例 フエノール680g、桐油350gにパラトルエンス
ルフオン酸0.5gを加え80〜85℃にて120分間反応
させた後、85%パラフオルムアルデヒド195gを
加え70〜75℃にて150分間反応させた。減圧脱水
後、軟化点65℃の桐油変性ノボラツク型フエノー
ル樹脂を得た。得られた桐油変性ノボラツク型フ
エノール樹脂を85℃に加熱溶融し、ヘキサメチレ
ンテトラミンを桐油変性ノボラツク型フエノール
樹脂100重量部に対し10重量部添加して攪拌混合
した後、これを、予めフエノール樹脂初期縮合物
を10重量%含浸乾燥したクラフト紙に塗付した。
得られた塗工紙の樹脂付着量は52重量%であつ
た。 上記塗工紙8枚とその片側表面に35μ厚銅箔を
重ね合わせた構成物を圧力110Kg/cm2、温度170℃
で55分間成形し銅張り積層板を得た。 比較例 フエノール680g、桐油350gにパラトルエンス
ルフオン酸0.5g、メタノール50gを加え80〜85
℃にて120分間反応させた後、25%アンモニア水
20g、85%パラフオルムアルデヒド250gを加え
80〜85℃にて270分間反応させた。次いで、減圧
脱水した後トルエンで希釈し樹脂濃度50重量%の
桐油変性フエノール樹脂ワニスを得た。予めフエ
ノール樹脂初期縮合物を10重量%含浸乾燥したク
ラフト紙に前記桐油変性フエノール樹脂ワニスを
含浸乾燥して樹脂付着量51重量%の塗工紙を得
た。 上記塗工紙8枚とその片側表面に35μ厚銅箔を
重ね合せた構成物を圧力110Kg/cm2、温度170℃で
55分間成形し銅張り積層板を得た。 実施例および比較例の銅張り積層板の性能を第
1表に示す。
The present invention relates to a method for manufacturing a laminate or a copper-clad laminate. Conventionally, when manufacturing phenolic resin laminates or copper-clad laminates, a varnish made by diluting resol-type phenolic resin with an organic solvent such as methanol, acetone, toluene, or methyl ethyl ketone was used.
After impregnating a base material for a laminate such as linter paper or kraft paper, the organic solvent is volatilized and dried in a hot air circulation drying oven. Therefore, a large amount of organic solvent is required, and energy costs for volatilization and drying of the organic solvent and waste gas treatment costs are required. Additionally, the solvent was flammable, creating a dangerous work environment. An object of the present invention is to provide a method for manufacturing a laminate or copper-clad laminate that eliminates the above-mentioned conventional drawbacks and streamlines the manufacturing process by reducing the use of solvents and drying steps. do. In order to achieve the above object, the present invention applies a resin composition consisting of a drying oil-modified novolak type phenolic resin and hexamethylenetetramine in a heated molten state to a cellulose paper base material impregnated with a phenolic resin initial condensate. , is characterized in that a plurality of sheets of this base material are superimposed and molded under heat and pressure. Further, a copper foil is placed on at least one surface of the stacked base materials and then heated and press-molded. The phenolic resin initial condensate used in the present invention is
1~ obtained by reacting phenols and formaldehydes under a basic catalyst represented by a metal alkali such as caustic soda, caustic potash, or barium hydroxide, or an amine compound such as trimethylamine, triethylamine, dimethylamine, or diethylamine.
It is an initial condensate of dinuclear bodies. When this initial condensate is impregnated into a cellulose paper base material such as linter paper or kraft paper, it penetrates into the interior of the base material due to its hydrophilic properties. The drying oil-modified novolak type phenolic resin used in the present invention can be obtained by reacting formaldehyde with a drying oil-phenol adduct obtained by reacting phenols and drying oil in the presence of an acidic catalyst, or by reacting formaldehyde with a drying oil-phenol adduct obtained by reacting phenols and drying oil in the presence of an acidic catalyst. It is obtained by reacting a novolak-type phenolic resin obtained by reacting the above in the presence of an acidic catalyst with a drying oil. The softening point of the drying oil-modified novolac type phenolic resin is preferably 100°C or lower in order to prevent gelation during the process of applying it to a base material in a heated molten state. In the present invention, hexamethylenetetramine is added as a curing agent to the drying oil-modified novolak type phenolic resin, and the appropriate amount is 3 to 15 parts by weight per 100 parts by weight of the drying oil-modified novolak type phenolic resin. . When applying to the substrate, the heating melting temperature of the dry oil-modified novolac type phenolic resin-hexamethylenetetramine mixed composition is 110
Desirably below ℃. Example 0.5 g of paratoluenesulfonic acid was added to 680 g of phenol and 350 g of tung oil, and the mixture was reacted at 80 to 85°C for 120 minutes. Then, 195 g of 85% paraformaldehyde was added, and the mixture was reacted at 70 to 75°C for 150 minutes. After dehydration under reduced pressure, a tung oil-modified novolak type phenolic resin with a softening point of 65°C was obtained. The obtained tung oil-modified novolak type phenolic resin was heated and melted at 85°C, and 10 parts by weight of hexamethylenetetramine was added to 100 parts by weight of the tung oil-modified novolak type phenolic resin and mixed with stirring. The condensate was applied to dry kraft paper impregnated with 10% by weight.
The resin adhesion amount of the obtained coated paper was 52% by weight. A composition consisting of 8 sheets of the above coated paper and a 35μ thick copper foil layered on one side of the paper was heated at a pressure of 110Kg/cm 2 and a temperature of 170℃.
A copper-clad laminate was obtained by molding for 55 minutes. Comparative example Add 0.5 g of paratoluenesulfonic acid and 50 g of methanol to 680 g of phenol and 350 g of tung oil, and add 80 to 85 g.
After reacting for 120 minutes at °C, add 25% ammonia water.
20g, add 250g of 85% paraformaldehyde
The reaction was carried out at 80-85°C for 270 minutes. Next, the mixture was dehydrated under reduced pressure and diluted with toluene to obtain a tung oil modified phenolic resin varnish having a resin concentration of 50% by weight. Kraft paper, which had been previously impregnated with 10% by weight of a phenolic resin initial condensate and dried, was impregnated with the tung oil-modified phenolic resin varnish and dried to obtain coated paper with a resin adhesion of 51% by weight. A composition consisting of 8 sheets of the above coated paper and a 35μ thick copper foil layered on one side of the paper was heated at a pressure of 110Kg/cm 2 and a temperature of 170℃.
A copper-clad laminate was obtained by molding for 55 minutes. Table 1 shows the performance of the copper-clad laminates of Examples and Comparative Examples.

【表】 第1表から明らかなように、本発明による銅張
り積層板の性能は、従来製造法の銅張り積層板に
比べて加熱収縮率は小さく、曲げ強さ、絶縁抵
抗、吸水量、打抜加工性は同等である。 尚、銅箔を貼りつけない積層板についても、上
記実施例と同じ性能を有している。 本発明によれば、乾性油変性フエノール樹脂の
塗工工程では溶剤を使用せず、加熱溶融状態で塗
付を行なうので乾燥工程が不用となる。また、こ
れに伴つてエネルギーコストおよび廃ガス処理コ
ストを削減できる。更に従来のレゾール型樹脂と
異なりノボラツク型樹脂を使用するため、硬化収
縮および硬化過程での揮発分発生が少なく、従つ
て、加熱による寸法変化および反り、ねじれの少
ない銅張り積層板および積層板が得られる。
[Table] As is clear from Table 1, the performance of the copper-clad laminate according to the present invention is that the heat shrinkage rate is smaller than that of the copper-clad laminate manufactured using conventional methods, and the performance of the copper-clad laminate according to the present invention is lower in terms of bending strength, insulation resistance, water absorption, and The punching workability is the same. Note that a laminate without copper foil attached has the same performance as the above example. According to the present invention, no solvent is used in the coating process of the drying oil-modified phenolic resin, and the coating is carried out in a heated molten state, thereby eliminating the need for a drying process. Additionally, energy costs and waste gas treatment costs can be reduced accordingly. Furthermore, unlike conventional resol-type resins, novolac-type resins are used, so there is less curing shrinkage and volatile matter generation during the curing process, resulting in copper-clad laminates and laminates with less dimensional change, warping, and twisting due to heating. can get.

Claims (1)

【特許請求の範囲】 1 フエノール樹脂初期縮合物を含浸したセルロ
ーズ系紙基材に、乾性油変性ノボラツク型フエノ
ール樹脂とヘキサメチレンテトラミンからなる樹
脂組成物を加熱溶融状態で塗付し、この基材の複
数枚を重ね合わせて更に少なくとも一方の表面に
は銅箔を載置して加熱加圧成形することを特徴と
する銅張り積層板の製造法。 2 フエノール樹脂初期縮合物を含浸したセルロ
ーズ系紙基材に、乾性油変性ノボラツク型フエノ
ール樹脂とヘキサメチレンテトラミンからなる樹
脂組成物を加熱溶融状態で塗付し、この基材の複
数枚を重ね合せて加熱加圧成形することを特徴と
する積層板の製造法。
[Scope of Claims] 1. A resin composition consisting of a dry oil-modified novolac type phenolic resin and hexamethylenetetramine is applied in a heated molten state to a cellulose paper base impregnated with a phenolic resin initial condensate, and this base material 1. A method for producing a copper-clad laminate, which comprises stacking a plurality of sheets of the above, further placing copper foil on at least one surface, and molding under heat and pressure. 2. A resin composition consisting of a dry oil-modified novolak type phenolic resin and hexamethylenetetramine is applied in a heated molten state to a cellulose paper base material impregnated with a phenolic resin initial condensate, and multiple sheets of this base material are stacked together. A method for producing a laminate, which is characterized by heating and pressure forming.
JP6989282A 1982-04-26 1982-04-26 Manufacture of laminated board Granted JPS58187346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6989282A JPS58187346A (en) 1982-04-26 1982-04-26 Manufacture of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6989282A JPS58187346A (en) 1982-04-26 1982-04-26 Manufacture of laminated board

Publications (2)

Publication Number Publication Date
JPS58187346A JPS58187346A (en) 1983-11-01
JPH0145416B2 true JPH0145416B2 (en) 1989-10-03

Family

ID=13415824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6989282A Granted JPS58187346A (en) 1982-04-26 1982-04-26 Manufacture of laminated board

Country Status (1)

Country Link
JP (1) JPS58187346A (en)

Also Published As

Publication number Publication date
JPS58187346A (en) 1983-11-01

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