JPH0147035B2 - - Google Patents
Info
- Publication number
- JPH0147035B2 JPH0147035B2 JP1129880A JP1129880A JPH0147035B2 JP H0147035 B2 JPH0147035 B2 JP H0147035B2 JP 1129880 A JP1129880 A JP 1129880A JP 1129880 A JP1129880 A JP 1129880A JP H0147035 B2 JPH0147035 B2 JP H0147035B2
- Authority
- JP
- Japan
- Prior art keywords
- mask body
- insulating material
- conductive metal
- thin conductive
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000011810 insulating material Substances 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- YWFDDXXMOPZFFM-UHFFFAOYSA-H rhodium(3+);trisulfate Chemical compound [Rh+3].[Rh+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O YWFDDXXMOPZFFM-UHFFFAOYSA-H 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
この発明は可撓性のある絶縁材料製帯状フイル
ム上に電路を形成する方法に関するものであつ
て、可撓性のある絶縁材料製帯状フイルム上にご
く薄い導電金属層を形成する第一工程と、電路を
形成する必要のある部分を除去した少なくとも表
面が絶縁材料であるマスク体に前記ごく薄い導電
金属層を形成した可撓性のある絶縁材料製帯状フ
イルムに張力を加えると共に密着させる第二工程
と、前記マスク体側から前記ごく薄い導電金属層
上にメツキ液をふきつけて金属メツキ層を形成す
る第三工程と、前記可撓性のある絶縁材料製帯状
フイルムを引張り移動させることによつて前記マ
スク体から取りはずした後、表面に露出したごく
薄い導電金属層を除去する第四工程とから成る可
撓性のある絶縁材料製帯状フイルム上への電路形
成方法としたものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming an electric path on a flexible film strip made of an insulating material. The first step is to apply tension to the flexible insulating material strip film on which the very thin conductive metal layer is formed on the mask body, which has at least the surface made of insulating material, from which the portion where the electric path needs to be formed has been removed. a second step of applying and adhering the conductive metal layer, a third step of spraying a plating liquid onto the very thin conductive metal layer from the mask body side to form a metal plating layer, and a step of forming the flexible insulating material band-shaped film. a fourth step of removing the very thin conductive metal layer exposed on the surface after removing it from the mask body by pulling and moving it; This is what I did.
プリント板は一般に絶縁基板の一方又は両方に
銅箔を全面にわたつて貼りつけ、この銅箔面の必
要な個所を残してエツチングすることにより電路
を形成するのであるが、電路以外の銅箔の部分は
塩化第２鉄のような薬液にて除去されるので不経
済で資源の無駄使いであつた。資源節減のため絶
縁基板上に必要な個所のみ銅をメツキするプリン
ト板電路形成方法は既に知られているが、この方
法においても必要な個所だけメツキにより金属板
面を形成するためには、その他の部分にマスキン
グ材を塗布又は印刷するか、シリコンゴムのよう
な軟質のパツキン材を貼りつける必要があり、マ
スキング材を用いる方法にあつては、マスキング
材の塗布または印刷の工程とこれを剥離する工程
が必要であり、時間もさることながら工程が複雑
になるという欠点があつた。またパツキン材を用
いる方法にあつては位置決め精度の問題もあり複
雑な電子回路の電路形成には使用できなかつた。 Generally, printed circuit boards are made by pasting copper foil over the entire surface of one or both of the insulating substrates, and etching the copper foil surface leaving the necessary areas to form electrical circuits. This was uneconomical and a waste of resources because the parts were removed with a chemical solution such as ferric chloride. A method for forming printed circuit board circuits in which copper is plated only where necessary on an insulating substrate in order to save resources is already known. It is necessary to apply or print a masking material to the area, or apply a soft packing material such as silicone rubber to the area, and in the case of a method using a masking material, there is a process of applying or printing the masking material and peeling it off. The disadvantage is that the process is not only time consuming but also complicated. Furthermore, the method using packing material has problems with positioning accuracy and cannot be used to form electrical circuits in complex electronic circuits.
また上記欠点を改善するものとして電路を形成
する必要のある部分を除去した磁性材料製マスク
体をごく薄い導電金属層を形成した絶縁基板上に
置き、絶縁基板を介して前記マスク体を磁石で吸
着するとともに、このマスク体の上から前記ごく
薄い導電金属層上に金属メツキ層を形成し、前記
マスク体を絶縁基板から取りはずした後表面に露
出したごく薄い導電金属層を除去する方法を出願
人は提案したがマスク体を何度も絶縁基板上に密
着させたり取りはずしたりしなければならないの
で、量産性に欠ける点がある。 In order to improve the above-mentioned drawbacks, a mask body made of a magnetic material from which the part necessary to form an electric path has been removed is placed on an insulating substrate on which a very thin conductive metal layer is formed, and the mask body is attached with a magnet through the insulating substrate. At the same time as adsorption, a metal plating layer is formed on the extremely thin conductive metal layer from above the mask body, and after the mask body is removed from the insulating substrate, the extremely thin conductive metal layer exposed on the surface is removed. Although some people have proposed this method, it is not suitable for mass production because the mask body must be brought into close contact with and removed from the insulating substrate many times.
さらに、この形成された電路に選択的に耐蝕性
メツキ、半田メツキ、厚メツキをすることを考え
た場合、上述の方法ではさらに複雑な工程が要求
され、製造時間も長くなるという欠点があつた。 Furthermore, when considering selectively applying corrosion-resistant plating, solder plating, or thick plating to the formed electrical circuits, the above-mentioned method has the drawback of requiring more complicated processes and lengthening the manufacturing time. .
本発明は上述した欠点を解消するものであり、
この発明の目的とするところは、ごく薄い導電金
属層を形成した可撓性のある絶縁材料製帯状フイ
ルムを、この帯状フイルムに張力を加えると共に
マスク体に密着させ、このマスク体側からメツキ
液をふきつけ前記帯状フイルム上に必要な回路パ
ターンのみを形成するようにし、銅のような金属
材料を節約することができ、更に可撓性のある絶
縁材料製帯状フイルム上に電路を簡単かつ能率よ
く形成することができるようにした可撓性のある
絶縁材料製帯状フイルム上への電路形成方法を提
供するにある。 The present invention eliminates the above-mentioned drawbacks,
The object of this invention is to apply tension to a flexible strip-shaped film made of an insulating material on which a very thin conductive metal layer is formed, and bring it into close contact with a mask body, and then apply plating liquid from the mask body side. Only the necessary circuit patterns are formed on the strip film by wiping, which saves metal materials such as copper, and furthermore, electrical circuits can be easily and efficiently formed on the strip film made of flexible insulating material. An object of the present invention is to provide a method for forming an electric circuit on a flexible strip-shaped film made of an insulating material, which enables the formation of an electric circuit on a flexible strip-like film made of an insulating material.
本発明を以下第１図乃至第１０図に示した実施
例にもとづき詳述する。 The present invention will be described in detail below based on the embodiments shown in FIGS. 1 to 10.
第１図において１は可撓性のある絶縁材料製帯
状フイルムである。例えばポリエステルフイルム
やポリイミド樹脂製フイルムなどである。この帯
状フイルム１の電路を形成する面１ａを中性洗剤
などでよく洗浄し、必要に応じてこの１ａ面に凹
凸を形成した後、この帯状フイルム１の表面１ａ
に0.1μ〜1μ程度のごく薄い導電金属層１ｂを形成
する。このごく薄い導電金属層１ｂは表面に電気
メツキをするためのもととなる導電体としてもう
けているものである。このごく薄い導電金属層１
ｂは無電解銅メツキによる方法であつてもよく、
銅の蒸着や溶射の方法によつてもよい。無電解銅
メツキを行う場合のメツキ溶の組成は例えば次の
ようなものである。 In FIG. 1, reference numeral 1 denotes a flexible strip-shaped film made of an insulating material. Examples include polyester film and polyimide resin film. After thoroughly cleaning the surface 1a of this strip-shaped film 1 that forms an electric path with a neutral detergent or the like and forming irregularities on this 1a surface as necessary, the surface 1a of this strip-shaped film 1 is
A very thin conductive metal layer 1b with a thickness of about 0.1 μm to 1 μm is formed. This extremely thin conductive metal layer 1b is provided as a conductor to be used as a base for electroplating the surface. This extremely thin conductive metal layer 1
b may be a method using electroless copper plating,
Copper vapor deposition or thermal spraying may also be used. The composition of the plating solution used in electroless copper plating is, for example, as follows.
CuSO4・5H2O 10gr／
NiC2・6H2O 2gr／
NaOH 10gr／
37％ホルマリン
Ｋ・Na（C4H4O6）・H2O
80gr／
NaCO3 20gr／
水 １
前述のメツキ溶に帯状フイルムを浸漬するか、
前記１ａ面に前述のメツキ液をふきつけることに
よつてごく薄い導電金属層を形成する。CuSO 4・5H 2 O 10gr/ NiC 2・6H 2 O 2gr/ NaOH 10gr/ 37% Formalin K・Na (C 4 H 4 O 6 )・H 2 O
80gr/NaCO 3 20gr/Water 1 Immerse the strip film in the above-mentioned methane solution, or
A very thin conductive metal layer is formed by spraying the plating solution on the surface 1a.
２は円筒状に形成されたマスク体であり、この
円筒外側面には、前記可撓性のある絶縁材料製帯
状フイルム上に電路を形成する必要のある部分を
除去する複数の切欠３ａで構成する電略パターン
３が複数設けてある。３ｂ，３ｂは前記円筒状マ
スク体２の両端開口部３ｃ，３ｃに装着される補
強体であり、貫通孔３ｄ，３ｄを備えた支軸３
ｅ，３ｅを有する。４はメツキ液を送るパイプで
あり前記貫通孔３ｄを通つて前記円筒状マスク体
２の内部に伸び、この先端部４ａに複数のメツキ
液吹出孔５，５…を有する。６はポンプでありメ
ツキ液７を貯えた槽８からメツキ液をくみ出し、
パイプ４の先端部４ａのメツキ液吹出孔５，５か
らメツキ液７を吹き出す。なお、第９図乃至第１
０図に示す如く、パイプ４の先端部４ａにメツキ
液７の飛散防止板４ｂ，４ｂを設けてもよい。９
はメツキ液７受皿であり、前記円筒状マスク体２
から出るメツキ液を集めて槽８にもどす役目をす
る。前記貫通孔３ｄとパイプ４の間にはギヤツプ
が存在し、支軸３ｅが回転してもパイプ４は回転
しない。 Reference numeral 2 denotes a mask body formed in a cylindrical shape, and the outer surface of the cylinder is composed of a plurality of notches 3a for removing portions where an electric path is required to be formed on the flexible insulating material strip film. A plurality of electronic pattern patterns 3 are provided. 3b, 3b are reinforcing bodies attached to both end openings 3c, 3c of the cylindrical mask body 2, and a support shaft 3 provided with through holes 3d, 3d.
It has e, 3e. A pipe 4 for sending the plating liquid extends into the cylindrical mask body 2 through the through hole 3d, and has a plurality of plating liquid blowing holes 5, 5, . . . at its tip 4a. 6 is a pump which pumps out the plating liquid from the tank 8 which stores the plating liquid 7;
The plating liquid 7 is blown out from the plating liquid blowing holes 5, 5 at the tip 4a of the pipe 4. In addition, Figures 9 to 1
As shown in FIG. 0, plates 4b, 4b for preventing the plating liquid 7 from scattering may be provided at the tip 4a of the pipe 4. 9
is a plating liquid 7 saucer, and the cylindrical mask body 2
Its role is to collect the plating liquid coming out of the tank and return it to tank 8. A gap exists between the through hole 3d and the pipe 4, and the pipe 4 does not rotate even if the support shaft 3e rotates.
なお前記円筒状マスク体はセラミツクで形成す
るか金属板の表面にごく薄い絶縁被膜を設けたも
のとし、少くとも表面が絶縁材料であつてメツキ
の付着しないものとする。 The cylindrical mask body is made of ceramic or has a very thin insulating coating provided on the surface of a metal plate, and at least the surface is made of an insulating material and is not plated.
第３図において１０は可撓性のある絶縁材料製
帯状フイルム１の１ａ面にごく薄い導電金属層１
ｂを形成したものを巻きつけたドラムでありこの
帯状フイルム１の他端をドラム１１で巻きとるこ
とによつてこの帯状フイルム１に張力層Ｐ，Ｐを
加え、しわがよらないようにすると共にこの張力
Ｐ，Ｐの合力が円筒状マスク体２の枢軸方向にも
加わるようにしてこの帯状フイルム１を円筒状マ
スク体２の表面に密着させている。ドラム１０と
１１の回転軸１０ａ，１１ａを結ぶ線１２より上
方に前記円筒状マスク体２の支軸３ｅを配置する
ことが望ましい。ドラム１１をモーター（図外）
で回転させこの帯状フイルム１を巻き取るように
する。なおドラム１１の回転は連続回転でも間欠
的な回転であつてもよい。ドラム１０にはブレー
キを設け、あまり早く回転しないようにすること
により常に帯状フイルムが引張られた状態にして
おく。なお第３図に示す如くドラム１１を間欠的
に回転する場合、静止時にゴムの如き弾性体Ａで
前記可撓性のある絶縁材料製フイルム１をマスク
体２に押しつけるようにしてもよい。 In FIG. 3, 10 is a very thin conductive metal layer 1 on the 1a side of the flexible insulating material strip film 1.
By winding the other end of the film strip 1 with the drum 11, tension layers P, P are applied to the film strip 1 to prevent it from wrinkling. The band-shaped film 1 is brought into close contact with the surface of the cylindrical mask body 2 so that the resultant force of the tensions P and P is also applied in the axis direction of the cylindrical mask body 2. It is desirable that the support shaft 3e of the cylindrical mask body 2 is disposed above the line 12 connecting the rotating shafts 10a and 11a of the drums 10 and 11. Drum 11 is connected to a motor (not shown)
to wind up the strip-shaped film 1. Note that the drum 11 may be rotated continuously or intermittently. A brake is provided on the drum 10 to prevent it from rotating too quickly, thereby keeping the strip film in tension at all times. When the drum 11 is rotated intermittently as shown in FIG. 3, the flexible film 1 made of an insulating material may be pressed against the mask body 2 by an elastic body A such as rubber when it is stationary.
而してドラム１１をゆつくりと回転させること
によつて可撓性のある絶縁材料製帯状フイルム１
のごく薄い導電金属層１ｂが形成された面１ａが
円筒状マスク体２の表面に密着する。この円筒状
マスク体の表面には複数の切欠３ａで構成する電
路パターン３が設けられており、この切欠３ａを
介して、槽８からポンプにてくみあげられたメツ
キ液７がメツキ液吹出孔５から吹き出されて前記
帯状フイルム１のごく薄い導電金属層１ｂに吹き
付けられる。このとき、例えば、表面に電気メツ
キを施工すべきごく薄い導電金属層１ｂを（−）
極とし、槽８内に設けた例えば銅板を（＋）極と
して両者間に電源を印加し、メツキ液を介して通
電することにより、前記電路パターン３と同じ形
状で前記ごく薄い導電金属層１ｂ上に金属メツキ
層１３が形成される。この場合のメツキ液７の組
成は、例えば次のような組成である。 By slowly rotating the drum 11, the flexible insulating material strip film 1 is removed.
The surface 1a on which the very thin conductive metal layer 1b is formed is in close contact with the surface of the cylindrical mask body 2. An electric circuit pattern 3 consisting of a plurality of notches 3a is provided on the surface of this cylindrical mask body, and the plating liquid 7 pumped up from the tank 8 by a pump is passed through the plating liquid blowing hole 5 through the notch 3a. It is blown out from the film and sprayed onto the extremely thin conductive metal layer 1b of the strip-shaped film 1. At this time, for example, a very thin conductive metal layer 1b to be electroplated on the surface (-)
For example, a copper plate provided in the tank 8 is used as a (+) pole, and by applying a power between the two and supplying electricity through the plating liquid, the extremely thin conductive metal layer 1b is formed in the same shape as the electrical circuit pattern 3. A metal plating layer 13 is formed thereon. The composition of the plating liquid 7 in this case is, for example, as follows.
CuSO4・5H2O 250gr／
H2SO4 60gr／
次いで第４図イ，ロに示す如く金属メツキ層１
３が形成されてなくて表面に露出したごく薄い導
電金属層１ｂを塩化第２鉄溶液などのエツチング
液で溶出除去し、可撓性のある絶縁材料製帯状フ
イルム１上に金属メツキ層１３で電路を形成す
る。このエツチング液１４はドラム１１で巻き取
る前の工程でノズル１５から吹き出させるように
すると量産的である。CuSO 4・5H 2 O 250gr/ H 2 SO 4 60gr/ Next, metal plating layer 1 as shown in Figure 4 A and B
The very thin conductive metal layer 1b which is not formed and is exposed on the surface is removed by elution with an etching solution such as ferric chloride solution, and a metal plating layer 13 is formed on the flexible insulating material strip film 1. Form an electric path. If this etching liquid 14 is blown out from a nozzle 15 in a step before being wound up on the drum 11, mass production can be achieved.
なお前記金属メツキ層１３上に部分に耐蝕性の
あるメツキ層、ハンダメツキ層、あるいは部分的
に通電容量を増すため同じ銅メツキ層を厚く施す
などする場合には第２の円筒状マスク体１６を設
け、この第２の円筒状マスク体１６の表面に円筒
状マスク体１の表面に設けた電路パターン３の一
部分のみを残した第２の電路パターン１７を形成
し、この第２の円筒状マスク体１６の内側からそ
れぞれ目的にかなつたメツキ液、例えば耐蝕性メ
ツキ液、半田メツキ液などを吹きつける。而して
金属メツキ層１３上に選択的に第２の金属メツキ
層１８を形成し、金属メツキ層１３もしくは第２
の金属メツキ層１８が形成されておらず表面に露
出したごく薄い導電金属層１０を前述のエツチン
グ液で除去する。 Note that when a corrosion-resistant plating layer, a solder plating layer, or the same thick copper plating layer is partially applied on the metal plating layer 13 to increase current carrying capacity, the second cylindrical mask body 16 is used. A second electric circuit pattern 17 is formed on the surface of the second cylindrical mask body 16 in which only a part of the electric circuit pattern 3 provided on the surface of the cylindrical mask body 1 remains. A plating solution suitable for each purpose, such as a corrosion-resistant plating solution or a solder plating solution, is sprayed from inside the body 16. Then, the second metal plating layer 18 is selectively formed on the metal plating layer 13, and the second metal plating layer 18 is selectively formed on the metal plating layer 13 or the second metal plating layer 18.
The very thin conductive metal layer 10 exposed on the surface where the metal plating layer 18 is not formed is removed using the aforementioned etching solution.
第２の金属メツキ層１８として半田メツキ層と
する場合のメツキ液は例えば次の組成である。 A plating solution used as a solder plating layer as the second metal plating layer 18 has, for example, the following composition.
ホウフツ化第一錫 200gr／
ホウフツ化鉛 40gr／
ホウフツ化水素酸 240gr／
ホルマリン(37%) 10cc／
その他光沢を出すための添加物少量
第２の金属メツキ層１８としてロジウムメツキ
層とする場合のメツキ液は例えば次の組成であ
る。 Stannous borofluoride 200gr / Lead borofluoride 40gr / Hydrobofluoric acid 240gr / Formalin (37%) 10cc / Small amount of other additives to give shine Plating when using a rhodium plating layer as the second metal plating layer 18 The liquid has, for example, the following composition.
ロジウム濃度1gr／、硫酸濃度80gr／
に調整した硫酸ロジウムメツキ液
なおマスク体として円筒状に形成した例を挙げ
たが、第７図に示す如く平板上のマスク体１９と
してもよい。表面には複数の切欠３′ａで構成す
る電路パターン３′を複数設けてある。そして表
面１ａにごく薄い導電金属層１ｂを形成したもの
を巻きつけたドラム１０′と、巻き取りドラム１
１′を設け、一定ピツチで巻きとり、静止時、前
記マスク体１９の裏面側から槽８′からポンプ
６′をくみあげたメツキ液７′を吹きつけるように
したものであり、前記ごく薄い金属メツキ層１ｂ
上に金属メツキ層１３′が形成された後、ドラム
１１′を回転させ一定ピツチ巾巻き取る。２０，
２０はローラーである。 Rhodium sulfate plating solution adjusted to a rhodium concentration of 1 gr/, and a sulfuric acid concentration of 80 gr/.Although an example in which the mask body is formed in a cylindrical shape has been given, the mask body 19 may be formed on a flat plate as shown in FIG. A plurality of electric circuit patterns 3' each consisting of a plurality of notches 3'a are provided on the surface. Then, there is a drum 10' around which a very thin conductive metal layer 1b is formed on the surface 1a, and a winding drum 1.
1', the mask body 19 is wound at a constant pitch, and when the mask body 19 is at rest, a plating liquid 7' pumped up from a tank 8' by a pump 6' is sprayed from the back side of the mask body 19. Plating layer 1b
After the metal plating layer 13' is formed on top, the drum 11' is rotated to wind it up at a constant pitch. 20,
20 is a roller.
上記する如くこの発明に係る可撓性のある絶縁
材料製帯状フイルム上への電路形成方法によれ
ば、可撓性のある絶縁材料製帯状フイルム上にご
く薄い導電金属層を形成する第一工程と、電路を
形成する必要のある部分を除去した少くとも表面
が絶縁材料であるマスク体に前記ごく薄い導電金
属層を形成した可撓性のある絶縁材料製帯状フイ
ルムに張力を加えると共に密着させる第二工程
と、前記マスク体側から前記ごく薄い導電金属層
上にメツキ液をふきつけて金属メツキ層を形成す
る第三工程と、前記可撓性のある絶縁材料製帯状
フイルムを引張り移動させることによつて前記マ
スク体から取りはずした後、表面に露出したごく
薄い導電金属層を除去する第四工程とから成るこ
とを特徴とするものであるから、可撓性のある絶
縁材料製帯状フイルム上に必要な回路パターンの
みをメツキにより形成することができるので、銅
のような金属材料を節約することができ、しかも
マスク体を円筒状とした場合、マスク体と可撓性
のある絶縁材料製帯状フイルムとが同じスピード
で移動するためマスク体と絶縁材料製帯状フイル
ムを密着したり離したりすることなく連続的に製
造できるので極めて能率的であり、さらには絶縁
材料製帯状フイルム上に形成された電路に選択的
に半田メツキを行い半田付性を付与したり、耐蝕
メツキを行い耐蝕性を付与したり、銅メツキを行
い通電容量を増したりすることができるので、能
率的かつ材料の節約になるなどすぐれた効果を奏
する。 As described above, according to the method for forming an electric path on a flexible strip-like film made of an insulating material according to the present invention, the first step is to form a very thin conductive metal layer on a flexible strip-shaped film made of an insulating material. Then, tension is applied to the flexible insulating material band-shaped film on which the very thin conductive metal layer is formed on the mask body, which has at least the surface made of an insulating material, from which the portion necessary to form an electric path has been removed, and is brought into close contact with the mask body. a second step, a third step of forming a metal plating layer by spraying plating liquid onto the very thin conductive metal layer from the mask body side, and pulling and moving the flexible insulating material strip film. Therefore, the method is characterized by comprising a fourth step of removing the very thin conductive metal layer exposed on the surface after removing it from the mask body. Since only the necessary circuit patterns can be formed by plating, metal materials such as copper can be saved, and if the mask body is made cylindrical, the mask body and the flexible strip made of insulating material can be saved. Since the film moves at the same speed, the mask body and the strip film made of insulating material can be manufactured continuously without bringing them into close contact with each other or separating them, making it extremely efficient. Electrical circuits can be selectively soldered to give them solderability, corrosion-resistant plated to give them corrosion resistance, and copper plated to increase current carrying capacity, making it efficient and saving on materials. It has excellent effects such as:
第１図は可撓性のある絶縁材料製帯状フイルム
１の部分斜視図、第２図は円筒状マスク体の分解
斜視図およびメツキ液吹きつけ機構の概略説明
図、第３図は製造工程図、第４図イはごく薄い導
電金属層上に金属メツキ層１３を形成した帯状フ
イルム１の断面図、第４図ロは表面に露出したご
く薄い導電金属層１ｂのみを除去した状態の帯状
フイルム１の断面図、第５図は第２の円筒状マス
ク体の分解斜視図であり、第６図イは金属メツキ
層１３上に選択的に第２の金属メツキ層１８を形
成した状態の帯状フイルム１の断面図を示し、第
６図ロは表面に露出したごく薄い導電金属層１ｂ
を除去した状態の帯状フイルム１の断面図、第７
図はマスク体の他の実施例を示す斜視図、第８図
は第７図に示すマスク体を使用した製造工程図を
示す。第９図は第３図におけるマスク体の断面
図、第１０図はパイプ４の先端部４ａの他の実施
例を示す斜視図である。
１：可撓性のある絶縁材料製帯状フイルム、１
ｂ：ごく薄い導電金属層、２，１９：マスク体、
１７：第２のマスク体、１３：金属メツキ層、１
８：第２の金属メツキ層。
Fig. 1 is a partial perspective view of a band-shaped film 1 made of flexible insulating material, Fig. 2 is an exploded perspective view of a cylindrical mask body and a schematic explanatory view of the plating liquid spraying mechanism, and Fig. 3 is a manufacturing process diagram. , FIG. 4A is a cross-sectional view of a strip-shaped film 1 with a metal plating layer 13 formed on a very thin conductive metal layer, and FIG. 4B is a strip-shaped film with only the very thin conductive metal layer 1b exposed on the surface removed. 1 and 5 are exploded perspective views of the second cylindrical mask body, and FIG. A cross-sectional view of the film 1 is shown, and FIG. 6B shows a very thin conductive metal layer 1b exposed on the surface.
7th cross-sectional view of the strip-shaped film 1 with removed
The figure is a perspective view showing another embodiment of the mask body, and FIG. 8 shows a manufacturing process diagram using the mask body shown in FIG. 7. 9 is a sectional view of the mask body in FIG. 3, and FIG. 10 is a perspective view showing another embodiment of the tip 4a of the pipe 4. 1: Flexible insulating material strip film, 1
b: very thin conductive metal layer, 2, 19: mask body,
17: second mask body, 13: metal plating layer, 1
8: Second metal plating layer.
Claims (1)
く薄い導電金属層を形成する第一工程と、電路を
形成する必要のある部分を除去した少くとも表面
が絶縁材料であるマスク体に前記ごく薄い導電金
属層を形成した可撓性のある絶縁材料製帯状フイ
ルムに張力を加えると共に密着させる第二工程
と、前記マスク体側から前記ごく薄い導電金属層
上にメツキ液をふきつけて金属メツキ層を形成す
る第三工程と、前記可撓性のある絶縁材料製帯状
フイルムを引張り移動させることによつて前記マ
スク体から取りはずした後、表面に露出したごく
薄い導電金属層を除去する第四工程とから成るこ
とを特徴とする可撓性のある絶縁材料製帯状フイ
ルム上への電路形成方法。 ２ マスク体を円筒状マスク体に形成するととも
に、この円筒状マスク体の円筒外側面に電路を形
成する必要のある部分を除去したパターンを形成
し、この円筒状マスク体を前記可撓性のある絶縁
材料製帯状フイルムの移動にともなつて回転する
ように軸支するとともにこの円筒状マスク体の円
筒の内側から外側に向つてメツキ液をふきつける
ようにしたことを特徴とする特許請求範囲第１項
記載の可撓性のある絶縁材料製帯状フイルム上へ
の電路形成方法。[Claims] 1. A first step of forming a very thin conductive metal layer on a flexible strip-shaped film made of an insulating material, and at least a surface made of an insulating material from which a portion where an electric path needs to be formed is removed. A second step of applying tension to a flexible strip-shaped film made of an insulating material on which the extremely thin conductive metal layer is formed on a certain mask body and bringing it into close contact; and applying a plating liquid onto the extremely thin conductive metal layer from the mask body side. A third step is to form a metal plating layer by wiping, and after the strip film made of flexible insulating material is removed from the mask body by pulling and moving, a very thin conductive metal layer exposed on the surface is removed. A method for forming an electric circuit on a flexible strip-shaped film made of an insulating material, the method comprising a fourth step of removing. 2 Form the mask body into a cylindrical mask body, form a pattern on the outer surface of the cylinder of this cylindrical mask body by removing a portion where an electric path needs to be formed, and attach this cylindrical mask body to the flexible mask body. The claim of the patent is characterized in that a band-shaped film made of an insulating material is pivoted so as to rotate as it moves, and a plating liquid is sprayed from the inside of the cylinder of this cylindrical mask body toward the outside. 2. A method for forming an electric circuit on a flexible insulating material strip film according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129880A JPS56108298A (en) | 1980-01-31 | 1980-01-31 | Method of forming electric path on flexible insulating material band film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129880A JPS56108298A (en) | 1980-01-31 | 1980-01-31 | Method of forming electric path on flexible insulating material band film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56108298A JPS56108298A (en) | 1981-08-27 |
| JPH0147035B2 true JPH0147035B2 (en) | 1989-10-12 |
Family
ID=11774082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1129880A Granted JPS56108298A (en) | 1980-01-31 | 1980-01-31 | Method of forming electric path on flexible insulating material band film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56108298A (en) |
-
1980
- 1980-01-31 JP JP1129880A patent/JPS56108298A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56108298A (en) | 1981-08-27 |
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