JPH0149031B2 - - Google Patents
Info
- Publication number
- JPH0149031B2 JPH0149031B2 JP10500285A JP10500285A JPH0149031B2 JP H0149031 B2 JPH0149031 B2 JP H0149031B2 JP 10500285 A JP10500285 A JP 10500285A JP 10500285 A JP10500285 A JP 10500285A JP H0149031 B2 JPH0149031 B2 JP H0149031B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- wiring board
- auxiliary
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器に使用される、補助用分割基
板を有するプリント配線板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing a printed wiring board having an auxiliary divided board used in electronic equipment.
従来の技術
従来の補助用分割基板を有するプリント配線板
は、第２図に示す構成であつた。１はプリント配
線回路を有するメインのプリント配線板であり、
２は分割すべき補助用分割基板である。その補助
用分割基板２の両端はプリント配線板１の外端に
延びるスリツト３，３′があり、補助用分割用基
板２とプリント配線板１の間はミシン目状打抜孔
４が設けられていた。2. Description of the Related Art A conventional printed wiring board having an auxiliary divided substrate has a structure shown in FIG. 1 is a main printed wiring board with a printed wiring circuit;
2 is an auxiliary dividing board to be divided. Both ends of the auxiliary dividing board 2 have slits 3, 3' extending to the outer ends of the printed wiring board 1, and perforated punch holes 4 are provided between the auxiliary dividing board 2 and the printed wiring board 1. Ta.
上記補助用分割基板２は、メインのプリント配
線板１に電子部品を実装する工程において、電子
部品の挿入または装着する工程、次に半田付また
は半田リフローする工程等において、基板のそ
り、電子部品の加重等によるストレスが加わるこ
とによつて生じるプリント配線板の変形や破損を
防止するため、補強基板として利用されていた。 The above-mentioned auxiliary divided board 2 is used to prevent warping of the board during the process of mounting electronic components on the main printed wiring board 1, the process of inserting or mounting the electronic components, the next process of soldering or solder reflow, etc. It was used as a reinforcing board to prevent deformation and damage to printed wiring boards caused by stress caused by loading.
発明が解決しようとする問題点
上記の補助用分割基板２とプリント配線板１の
間のミシン目状打抜孔４とその補助用分割基板２
の両端でプリント配線板１の外端に延びるスリツ
ト３，３′の加工は通常プレス打抜により同時に
形成されることから、上記ミシン目状打抜孔４の
間でクラツク、ヒビ割れ等が生じるという問題が
あつた。そのために前述の電子部品実装工程で補
助用分割基板２が割れてしまうことがあり、極端
な場合には、プレス打抜直後に補助用分割基板２
が割れて完全に分離してしまうことがあつた。Problems to be Solved by the Invention Perforation-shaped punched holes 4 between the above-mentioned auxiliary divided board 2 and printed wiring board 1 and the auxiliary divided board 2
Since the slits 3 and 3' extending to the outer end of the printed wiring board 1 at both ends are usually formed at the same time by press punching, cracks, cracks, etc. may occur between the perforated punched holes 4. There was a problem. For this reason, the auxiliary divided board 2 may break during the above-mentioned electronic component mounting process, and in extreme cases, the auxiliary divided board 2 may be broken immediately after press punching.
Sometimes it cracked and separated completely.
本発明は以上のような従来の欠点を除去するも
のであり、クラツクやひび割れのないプリント配
線板の製造方法に関するものである。 The present invention eliminates the above-mentioned conventional drawbacks and relates to a method of manufacturing a printed wiring board that is free from cracks and cracks.
問題点を解決するための手段
本発明は補助用分割基板とメインのプリント配
線板の間のミシン目状打抜孔の形成と同時に、補
助用分割基板内に捨て孔を打抜形成することによ
り、上記問題点を解決することができるものであ
る。Means for Solving the Problems The present invention solves the above-mentioned problems by punching and forming sacrificial holes in the auxiliary divided board at the same time as forming perforated holes between the auxiliary divided board and the main printed wiring board. It is something that can solve the problem.
作 用
本発明は上述のように、ミシン目状打抜孔を加
工と同時に補助用分割基板内に捨て孔を形成する
ため、ミシン目状打抜孔にプレスのストレスが生
じて補助用分割基板を外側に押し出す力が発生す
るが、上記捨て孔を加工する金型のポンチは補助
用分割基板を外側に移動しないように固定する働
きをするから、ミシン目状打抜孔間へのクラツク
の発生、ヒビ割れ、さらには分離することがなく
なるのである。Function As described above, in the present invention, since the perforation-like punched holes are processed and the waste holes are formed in the auxiliary divided substrate at the same time, press stress is generated in the perforated punched holes and the auxiliary divided substrate is moved outward. However, since the punch of the mold used to form the above-mentioned waste holes serves to fix the auxiliary divided substrate so that it does not move outward, cracks may occur between the perforated punched holes. This prevents cracking and even separation.
実施例
第１図は本発明の一実施例による補助用分割基
板を有するプリント配線板の平面図であり、第１
図において、６はプリント配線回路を有するメイ
ンのプリント配線板であり、７は分割すべき補助
用分割基板である。８，８′はスリツトであり、
９はミシン目状打抜孔であり、１０が捨て孔であ
る。Embodiment FIG. 1 is a plan view of a printed wiring board having an auxiliary divided board according to an embodiment of the present invention.
In the figure, 6 is a main printed wiring board having a printed wiring circuit, and 7 is an auxiliary dividing board to be divided. 8, 8' are slits,
9 is a perforation-like punched hole, and 10 is a sacrificial hole.
プリント配線板６は絶縁基板上に周知の方法で
導体回路を形成したものである。通常は１つある
いは複数のプリント配線回路を有するワークサイ
ズで生産されたものに部品取付用孔、ミシン目状
打抜孔スリツト及び外形線を同時に打抜加工を施
こすことにより、第１図に示す形状のプリント配
線板１が得られた。その時、補助用分割基板７の
両端がプリント配線板６の外端に延びるスリツト
８，８′を有する場合において、プリント配線回
路中の部品取付孔、ミシン目状打抜孔９、スリツ
ト８，８′及び外形線を同時に打抜加工できる金
型に補助用分割基板７中に捨て孔１０を設けるた
めのポンチを追加した。このようにすれば、上記
打抜加工において、補助用分割基板７はプリント
配線板６との間のミシン目状打抜孔９により外側
にストレスが加わるが、捨て孔１０により補助用
分割基板７は外側への移動がなくなり、固定され
るから、ミシン目状打抜孔９間へのクラツクの発
生、ヒビ割れがなくなる。 The printed wiring board 6 is an insulating substrate on which a conductor circuit is formed by a well-known method. Normally, parts are produced in a work size with one or more printed wiring circuits, and by simultaneously punching holes for mounting parts, perforation-like punched hole slits, and outline lines, as shown in Figure 1. A shaped printed wiring board 1 was obtained. At that time, in the case where both ends of the auxiliary divided board 7 have slits 8, 8' extending to the outer ends of the printed wiring board 6, the component mounting holes in the printed wiring circuit, the perforated punched holes 9, the slits 8, 8' A punch for forming a hole 10 in the auxiliary divided substrate 7 was added to the mold that can simultaneously punch out the outer shape and outline. In this way, in the punching process, stress is applied to the outside of the auxiliary divided board 7 due to the perforated punching holes 9 between it and the printed wiring board 6, but the auxiliary divided board 7 is Since outward movement is eliminated and it is fixed, cracks between the perforated holes 9 and cracks are eliminated.
発明の効果
以上のように本発明によれば、補助用分割基板
に捨て孔を設けるからミシン目状打抜孔加工によ
るクラツク、ヒビ割れが防止できるため、プリン
ト配線板の歩留が著しく向上するものであり、工
業上利用価値の大なるものである。Effects of the Invention As described above, according to the present invention, the yield of printed wiring boards is significantly improved because the spare holes are provided in the auxiliary divided substrate, so cracks and cracks caused by perforation-like punching can be prevented. Therefore, it has great industrial utility value.
第１図は本発明のプリント配線板の製造方法の
一実施例によるプリント配線板を示す平面図であ
り、第２図は従来の方法によるプリント配線板を
示す断面図である。
６……メインのプリント配線板、７……補助用
分割基板、８，８′……スリツト、９……ミシン
目状打抜孔、１０……捨て孔。
FIG. 1 is a plan view showing a printed wiring board according to an embodiment of the printed wiring board manufacturing method of the present invention, and FIG. 2 is a sectional view showing a printed wiring board according to a conventional method. 6... Main printed wiring board, 7... Auxiliary divided board, 8, 8'... Slit, 9... Perforated punched hole, 10... Discarded hole.
Claims (1)
間にミシン目状打抜孔を設けると同時に、補助用
分割基板内に捨て孔を設けることを特徴とするプ
リント配線板の製造方法。1. A method for manufacturing a printed wiring board, characterized by providing perforated punch holes between an auxiliary divided board and a main printed wiring board, and at the same time providing a waste hole in the auxiliary divided board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105002A JPS61263294A (en) | 1985-05-17 | 1985-05-17 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105002A JPS61263294A (en) | 1985-05-17 | 1985-05-17 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61263294A JPS61263294A (en) | 1986-11-21 |
| JPH0149031B2 true JPH0149031B2 (en) | 1989-10-23 |
Family
ID=14395874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60105002A Granted JPS61263294A (en) | 1985-05-17 | 1985-05-17 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61263294A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105581B2 (en) * | 1990-10-29 | 1995-11-13 | 日立エーアイシー株式会社 | Method for manufacturing printed wiring board |
-
1985
- 1985-05-17 JP JP60105002A patent/JPS61263294A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61263294A (en) | 1986-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |