JPH0150109B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a semiconductor device in which a semiconductor chip fixed to a chip eyeliner is molded with resin, and an external terminal is connected to the semiconductor chip with a bonding wire, and the external terminal is drawn out. Regarding.

2. Description of the Related Art Conventionally, for example, there are quad type semiconductor devices in which external terminals are drawn out in four directions, as shown in FIGS. 1 and 2. This semiconductor device 1 is
The semiconductor device body 2 has a semiconductor device body 2 formed by resin molding a semiconductor chip fixed on a chip island. This semiconductor device main body 2 has flat front and back surfaces 2a, 2b, and four side surfaces 2c, 2d,
It is provided with external terminals 3, 3, . . . drawn out from terminals 2e, 2f, respectively. Each of the external terminals 3, 3, . . . is designed to be soldered to a printed wiring pattern (not shown) formed on the circuit board 4. By the way, conventionally when connecting other electronic components such as a capacitor or a resistor to such a semiconductor device 1,
The printed wiring pattern is formed on the circuit board 4 by being routed to another location apart from the semiconductor device 1, and electronic components are soldered onto the printed wiring pattern. For this reason,
When connecting the semiconductor device 1 and electronic components on the circuit board 4, the circuit board 4 is required to have a large area for assembling circuit elements. Therefore, a semiconductor device having such a structure is not desirable in terms of downsizing an electronic device incorporating a circuit board. Furthermore, since the semiconductor device 1 and the electronic components are assembled separately on the circuit board, in order to connect a large number of electronic components to the large number of external terminals 3, 3, etc. of the semiconductor device 1, complicated printing is required on the circuit board. Since it is necessary to form a wiring pattern and the assembly is complicated, the assembly workability is poor and the assembly cost is high.

The present invention makes it possible to connect electronic components to a semiconductor device with a simple operation without having to route and form a printed wiring pattern, even if the circuit board has a narrow assembly area. The purpose of this invention is to enable further miniaturization of electronic devices, improve workability in assembling circuits on circuit boards, and reduce assembly costs.

In order to achieve such objectives, the present invention has the following features:
One end of each external terminal is bent toward the back side of the semiconductor device main body, and the module is elastically held and held between the opposing parts of the bent ends in contact with the back surface of the semiconductor device main body. This is an electrical connection between an external terminal and a module.

Hereinafter, the present invention will be described in detail based on each embodiment shown in the drawings.

FIG. 3 is a plan view of this embodiment, and FIG. 4 is a front view. The semiconductor device 10 of this embodiment is
The semiconductor device main body 11 is formed by resin molding a semiconductor chip fixed on a chip eyeliner (not shown). This semiconductor device main body 11 has flat front and back surfaces 11a and 11b, and four side surfaces 11c, 11d, and 11b that are inclined outward in a dogleg shape.
1e and 11f. Each side 11c, 11
One end of each of the eight external terminals 12, 12, . . . protrudes from d, 11e, 11f, respectively. The other end of each of the external terminals 12, 12, .

In such external terminals 12, 12..., one end thereof has overhanging portions 12a, 12b... extending from each side surface parallel to the front and back surfaces 11a, 11b of the semiconductor device main body 11, and the semiconductor device In the diagram, a predetermined distance from the back surface 11b of the main body 11,
Extended portions 12b, 12b... extending downward and opposed portions 12c, 12c... opposed to the back surface 11b of the semiconductor device main body 11 at a predetermined distance are integrally formed in a U-shape. Become. The opposing portions 12c, 12c, . . . have protruding portions 12d, 12d, .
is formed. A module 13 is held between the facing portions 12c, 12c, . . . of the external terminals 12, 12, .
Here, the distance from the back surface 11b of the semiconductor device main body 11 to the protruding parts 12d, 12d, etc. of the opposing parts 12c, 12c,... of the external terminals 12, 12,... is determined by the thickness of the module 13 in the vertical direction in the figure. is long, so the module 13 has external terminals 12,
12... will be pressed against the back surface 11b due to the elasticity. As a result, the clamping is performed elastically, making it possible to position the module 13 easily and accurately. Moreover, by this clamping, each circuit element in the module 13 can be
It is electrically connected to external terminals 12, 12... For this connection, connection electrodes are formed on the surface of the module 13 that contacts the protrusions 12d, 12d, . . . of the external terminals 12, 12, . 14 is a circuit board. External terminals 12, 1 of this semiconductor device 10
2... are placed on the printed wiring pattern of this circuit board 14 and soldered. At the time of this soldering, the connection electrodes of the module 13 and the protrusions 12d, 12d, . . . can be simultaneously soldered. Therefore, according to this embodiment, a module including a large number of electronic components can be easily connected to a semiconductor device without running printed wiring patterns on a circuit board.

FIG. 5 is a plan view of another embodiment, and FIG. 6 is a front view thereof. In these figures, parts corresponding to those in FIGS. 3 and 4 are given the same reference numerals. What should be noted in the semiconductor device 10' of this embodiment is that one end of the external terminals 12', 12'... has projecting portions 12'a, 12'a... and extending portions 12'b, 12'b. ...and opposing parts 12'c, 12'c
..., the extending portions 12'b, 12'b... are formed in an "S" shape, and the opposing portions 12'c, 1
2'c... are bent outward with respect to the semiconductor device main body 11. The module 13 is adapted to be held between the opposing surfaces of the extending portions 12'b, 12'b. The other configurations are the same as those of the previous embodiment. Therefore, according to this embodiment, the external terminals 12', 1
2'... Even after forming one end of the module 13 as shown in the figure, the module 13 is
It can be held elastically between the opposing surfaces of...

As described above, according to the present invention, the module is held between the bent ends of the external terminals on the back side of the semiconductor device main body, and the external terminals and the module are connected. Even in the case of a circuit board, a large number of electronic components can be easily connected to a semiconductor device without having to route and form printed wiring patterns. Therefore, according to the present invention, electronic components can be mounted with high density on a small circuit board, electronic devices with a built-in circuit board can be further downsized, and circuits on the circuit board can be further downsized. It is possible to improve the assembly workability and reduce the assembly cost.

Furthermore, in the present invention, since the module is placed on the back side of the semiconductor device main body, the connection portion between the module and the external terminal is located extremely close to the circuit board. When soldering to the printed wiring pattern, the external terminals and the module's connection electrodes are soldered at the same time, simplifying the soldering process, which also reduces assembly costs. It is possible to aim for

Although the embodiment has been described using a quad-type semiconductor device in which external terminals are drawn out in four directions, the external terminals may be drawn out in, for example, two opposing directions.

[Brief explanation of drawings]

1 and 2 show a conventional example, FIG. 1 is a plan view, FIG. 2 is a front view, and FIGS. 3 to 6 show an embodiment of the present invention, and FIG. 3 is this embodiment. 4 is a front view thereof, FIG. 5 is a plan view of another embodiment, and FIG. 6 is a front view thereof. DESCRIPTION OF SYMBOLS 10, 10'... Semiconductor device, 11... Semiconductor device main body, 12, 12'... External terminal, 13... Module, 14... Circuit board.

Claims (1)

[Scope of Claims] 1. A semiconductor device body including a semiconductor chip molded in resin and a plurality of external terminals, one end of each external terminal being drawn out from each side of the semiconductor device body, and other In a semiconductor device in which one end of each external terminal is connected to a semiconductor chip, one end of each external terminal is bent toward the back side of the semiconductor device main body, and the back side of the semiconductor device main body is connected between the opposing parts of this bent end. A semiconductor device in which a module is elastically held and held in contact with the module, and the external terminal and the module are electrically connected.