JPH0195039A - Metal base laminate - Google Patents
Metal base laminateInfo
- Publication number
- JPH0195039A JPH0195039A JP62252002A JP25200287A JPH0195039A JP H0195039 A JPH0195039 A JP H0195039A JP 62252002 A JP62252002 A JP 62252002A JP 25200287 A JP25200287 A JP 25200287A JP H0195039 A JPH0195039 A JP H0195039A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal base
- base plate
- insulating layer
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は産業機器、電子機器などの各種産業用に用い
らｈる金属ベース積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal-based laminate used for various industrial applications such as industrial equipment and electronic equipment.
一般に金属ベース積層板は高温、高電圧下で使用される
ため、金属板が基材として用いられている。Since metal-based laminates are generally used at high temperatures and high voltages, metal plates are used as the base material.
第３図はこの従来の金属ベース基板を示す断面図で０図
において（１１はアルミニウム等の薄い金属板で基材を
なしている。（２）はこの金属板（１）の表面上に置か
れた接着絶縁層で０例えばガラスクロスにエポキシ等の
熱硬化樹脂が含浸され半硬化している。（３１はこの接
着絶縁層（２）上に付着された銅などの金属箔である。Figure 3 is a cross-sectional view showing this conventional metal base substrate. In the adhesive insulating layer (2), for example, glass cloth is impregnated with a thermosetting resin such as epoxy and semi-cured. (31 is a metal foil such as copper adhered to the adhesive insulating layer (2).
従来の金属ベース積層板は以上のように構成され２次の
ように製造される。A conventional metal-based laminate is constructed as described above and manufactured in a secondary manner.
すなわちまず金属板（１）を用意し、この上に接着絶縁
層（２）を積層し、金属箔（３）をさらに積層し、加熱
加圧成形することによシ一体に成形する。That is, first, a metal plate (1) is prepared, an adhesive insulating layer (2) is laminated thereon, a metal foil (3) is further laminated, and the metal plate (1) is integrally formed by heating and pressing.
従来の金属ベース積層板は以上のように積層されている
ため、高温、高電圧下で使用に耐えるものとなっている
が、金属板とガラスクロスの熱膨張率の差のため、ある
いは金属板自身が熱変形し。Conventional metal-based laminates are laminated as described above, making them durable for use under high temperatures and high voltages. However, due to the difference in thermal expansion coefficient between the metal plate and glass cloth, itself is deformed by heat.
金属箔で構成される電気回路パターンが剥離したり、ｆ
形、断線する等の問題が発生していた。The electrical circuit pattern made of metal foil may peel off or
There were problems with the shape, wire breakage, etc.
この発明は上記のような問題点を解消するためになされ
たもので、熱変形を押えた金属ベース積層板を提供する
ことを目的とする。This invention was made to solve the above-mentioned problems, and an object thereof is to provide a metal-based laminate that suppresses thermal deformation.
この発明に係る金属ベース積層板は、熱膨張率の異なる
複数の金属帯体を並列に配置し、かつその端部接合部を
溶接して一体とした金属ベース板と、この金属ベース板
に接着絶縁層を介して付着した金属箔とからな′るもの
である。The metal base laminate according to the present invention includes a metal base plate in which a plurality of metal strips having different coefficients of thermal expansion are arranged in parallel and integrated by welding their end joints, and a metal base plate is bonded to the metal base plate. It consists of metal foil attached via an insulating layer.
この発明における金属ベース積層板は熱による金属ベー
ス板の変形が少ないため、絶縁層との剥離、金属箔のは
がれによる不良を防止する。Since the metal base laminate of the present invention is less deformed by heat, defects due to separation from the insulating layer and peeling of the metal foil are prevented.
以下この発明による一実施例を図によシ説明する。 An embodiment according to the present invention will be explained below with reference to the drawings.
第１図はこの発明の一実施例による金属ベース積層板を
示す断面図、第２図はこの金属ベース積層板に用いられ
る金属ベース板を示す平面図である。FIG. 1 is a sectional view showing a metal base laminate according to an embodiment of the present invention, and FIG. 2 is a plan view showing a metal base plate used in this metal base laminate.
図において＋２＋、 ＋３１は従来例において説明した
ものと同じ〒あシ説明は省略する。（４）はこの積層板
のペースとなる金属ベース板で、熱膨張係数の異なる第
１の金属帯体（５）および第２の金属帯体（６１が交互
にレーザービーム溶接等によシ平面状に接合されている
。なおこの第１金属帯体（５）としては例えば１８重量
％のクロムと８重量俤のニッケル残シ鉄とからなるニッ
ケル・クロム鋼帯（熱膨張係数１７Ｘ１０ ）が用
いられる。また第２金属帯体（６）としては例えば３６
重量％のニッケルと６４重量％の鉄とからなるアンバー
（熱膨張係数１×１０ ）が用いられる。また（７）は
上記第１の金属帯体（５）と第２の金属帯体（６１とを
接合する接合部である。In the figure, +2+ and +31 are the same as those explained in the conventional example.Explanation will be omitted. (4) is a metal base plate that serves as the pace of this laminated plate, in which a first metal strip (5) and a second metal strip (61) having different coefficients of thermal expansion are alternately attached to a flat surface by laser beam welding or the like. The first metal strip (5) is, for example, a nickel-chromium steel strip (thermal expansion coefficient: 17 x 10) consisting of 18% by weight of chromium and 8% by weight of nickel-residue iron. For example, the second metal band (6) may be 36 mm.
Invar (thermal expansion coefficient 1×10 2 ) consisting of % nickel and 64% iron by weight is used. Further, (7) is a joint portion that joins the first metal strip (5) and the second metal strip (61).
この発明の一実施例による金属ベース積層板は以上のよ
うに構成され２次のように製造される。A metal base laminate according to an embodiment of the present invention is constructed as described above and manufactured in the following manner.
すなわちまず第１金属帯体（５）と第２金属帯体（６）
を所定の大きさに切断し、第２図に示すように交互にか
つ平行に配置する。配置後互いの接合部（７１をレーザ
ービーム（図示しない）等で浴接し一体として金属ベー
ス板（４）を製作する。次にこの金属ベース（４Ｉ上に
接着絶縁層（２）を介して金属箔（３）を積層し、加圧
、加熱することによシ一体に成形する。That is, first, the first metal strip (5) and the second metal strip (6)
are cut to a predetermined size and arranged alternately and in parallel as shown in FIG. After the arrangement, the joints (71) are bath-bonded with a laser beam (not shown) or the like to produce a metal base plate (4) as one piece.Next, a metal The foils (3) are laminated and formed into an integral piece by applying pressure and heating.
この成形作業において金属ベース板（４）は互いに熱膨
張係数が異なる金属帯体を交互に溶接し一体をなしてい
るため、各部の変形が互□いに矯正され。In this forming operation, the metal base plate (4) is formed by alternately welding metal strips having different coefficients of thermal expansion to each other, so that deformations in each part are mutually corrected.
全体として変形を抑制することができる。従って接着絶
縁層（２）および金属箔（３）の変形もなく、相互の剥
離を防止し安定した品質の金属ベース積層板を提供でき
る。Deformation can be suppressed as a whole. Therefore, there is no deformation of the adhesive insulating layer (2) and the metal foil (3), and mutual peeling is prevented, thereby providing a metal base laminate of stable quality.
なお上記実施例では金属ベース板として互いに熱膨張係
数が異なる金属帯体を交互にかつ平行に配置する例につ
いて示したが、互いに熱膨張係数が異なる金属帯体を交
互にかつ全体としてバランスを保ち配置してあればよい
ことは言うまでもない。In the above embodiment, metal strips having different coefficients of thermal expansion are arranged alternately and in parallel as a metal base plate, but it is also possible to alternately arrange metal strips having different coefficients of thermal expansion and maintain balance as a whole. Needless to say, it would be good if they were placed.
以上のようにこの発明によれば金属ベース板として互い
に熱膨張係数の異なる金属帯体を交互に接合溶接したも
のを用いているので、金属ベース板の熱変形を押え、金
属箔の剥離、切断を防止し。As described above, according to the present invention, metal strips having different thermal expansion coefficients are alternately joined and welded as the metal base plate, thereby suppressing thermal deformation of the metal base plate and preventing peeling and cutting of the metal foil. Prevent.
品質の安定した金属ベース積層板を提供するととができ
る効果がある。Providing a metal-based laminate with stable quality has certain effects.
第１図はこの発明の一実施例による金属ベース基板の断
面図、第２図はこの一実施例による金属ベース基板にお
ける金属ベース板を示す平面図。
第３図は従来の金属ベース基板を示す断面図である。
図において（２）は接着絶縁層、（３１は金属ベース板
。
（４）は第１金属帯体、（６１は第２金属帯体を示し、
各図中同一番号は同一または相当物を示す。FIG. 1 is a sectional view of a metal base substrate according to an embodiment of the present invention, and FIG. 2 is a plan view showing a metal base plate in the metal base substrate according to this embodiment. FIG. 3 is a sectional view showing a conventional metal base substrate. In the figure, (2) is an adhesive insulating layer, (31 is a metal base plate), (4) is a first metal strip, (61 is a second metal strip,
The same numbers in each figure indicate the same or equivalent parts.
Claims (1)
化してなる金属ベース積層板において，熱膨張率の異な
る複数の金属帯体を並列に配置し，かつその端部接合部
を溶接して一体とした金属ベース板と，この金属ベース
板に接着絶縁層を介して付着した金属箔とからなる金属
ベース積層板。In a metal base laminate made by integrating metal foil on the surface of a metal plate via an adhesive insulating layer, multiple metal strips with different coefficients of thermal expansion are arranged in parallel and their end joints are welded. A metal base laminate consisting of an integrated metal base plate and a metal foil attached to the metal base plate via an adhesive insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62252002A JPH0195039A (en) | 1987-10-06 | 1987-10-06 | Metal base laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62252002A JPH0195039A (en) | 1987-10-06 | 1987-10-06 | Metal base laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195039A true JPH0195039A (en) | 1989-04-13 |
Family
ID=17231194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62252002A Pending JPH0195039A (en) | 1987-10-06 | 1987-10-06 | Metal base laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195039A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002005001A1 (en) * | 2000-07-10 | 2002-01-17 | Hikari Tech Co., Ltd. | Method of manufacturing multi-core ferrule |
-
1987
- 1987-10-06 JP JP62252002A patent/JPH0195039A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002005001A1 (en) * | 2000-07-10 | 2002-01-17 | Hikari Tech Co., Ltd. | Method of manufacturing multi-core ferrule |
| US6711802B2 (en) | 2000-07-10 | 2004-03-30 | Hikari Tech Co., Ltd. | Method of manufacturing multi-core ferrule |
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