JPH0213290B2 - - Google Patents
Info
- Publication number
- JPH0213290B2 JPH0213290B2 JP14975582A JP14975582A JPH0213290B2 JP H0213290 B2 JPH0213290 B2 JP H0213290B2 JP 14975582 A JP14975582 A JP 14975582A JP 14975582 A JP14975582 A JP 14975582A JP H0213290 B2 JPH0213290 B2 JP H0213290B2
- Authority
- JP
- Japan
- Prior art keywords
- image forming
- metal
- solution
- compound
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 26
- 239000011230 binding agent Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- -1 metal complex compound Chemical class 0.000 claims description 12
- 150000002736 metal compounds Chemical class 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 7
- 239000011118 polyvinyl acetate Substances 0.000 claims description 7
- 239000003112 inhibitor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000080 wetting agent Substances 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 description 28
- 239000000243 solution Substances 0.000 description 28
- 150000001875 compounds Chemical class 0.000 description 21
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 18
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 11
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 8
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 8
- 239000003638 chemical reducing agent Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 235000019441 ethanol Nutrition 0.000 description 6
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 5
- JBANFLSTOJPTFW-UHFFFAOYSA-N azane;boron Chemical compound [B].N JBANFLSTOJPTFW-UHFFFAOYSA-N 0.000 description 5
- 229910000085 borane Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000011592 zinc chloride Substances 0.000 description 4
- 235000005074 zinc chloride Nutrition 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000002738 chelating agent Substances 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910001385 heavy metal Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000012279 sodium borohydride Substances 0.000 description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000001119 stannous chloride Substances 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KSCNHKPMMKUPLO-UHFFFAOYSA-N ($l^{1}-boranylamino)boron Chemical compound [B]N[B] KSCNHKPMMKUPLO-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- UOFGSWVZMUXXIY-UHFFFAOYSA-N 1,5-Diphenyl-3-thiocarbazone Chemical compound C=1C=CC=CC=1N=NC(=S)NNC1=CC=CC=C1 UOFGSWVZMUXXIY-UHFFFAOYSA-N 0.000 description 1
- HYRIDYFBEXCCIA-UHFFFAOYSA-N 1-(4-azidophenyl)ethanone Chemical compound CC(=O)C1=CC=C(N=[N+]=[N-])C=C1 HYRIDYFBEXCCIA-UHFFFAOYSA-N 0.000 description 1
- BMNGOGRNWBJJKB-UHFFFAOYSA-N 1-azidopyrene Chemical compound C1=C2C(N=[N+]=[N-])=CC=C(C=C3)C2=C2C3=CC=CC2=C1 BMNGOGRNWBJJKB-UHFFFAOYSA-N 0.000 description 1
- ZWNKPAOFDBSRQF-UHFFFAOYSA-M 2,5-dibutoxy-4-morpholin-4-ylbenzenediazonium;zinc;chloride Chemical compound [Cl-].[Zn].C1=C([N+]#N)C(OCCCC)=CC(N2CCOCC2)=C1OCCCC ZWNKPAOFDBSRQF-UHFFFAOYSA-M 0.000 description 1
- JTIPDOHDMDCDOV-UHFFFAOYSA-N 2,5-diethoxy-4-[(4-methoxybenzoyl)amino]benzenediazonium;zinc;chloride Chemical compound [Cl-].[Zn].CCOC1=CC([N+]#N)=C(OCC)C=C1NC(=O)C1=CC=C(OC)C=C1 JTIPDOHDMDCDOV-UHFFFAOYSA-N 0.000 description 1
- SGNIRKRLLBIBFE-UHFFFAOYSA-M 2,5-diethoxy-4-morpholin-4-ylbenzenediazonium;zinc;chloride Chemical compound [Cl-].[Zn].C1=C([N+]#N)C(OCC)=CC(N2CCOCC2)=C1OCC SGNIRKRLLBIBFE-UHFFFAOYSA-M 0.000 description 1
- GBFAOLUTYLPAHH-UHFFFAOYSA-M 2,5-dimethoxy-4-(4-methylphenyl)sulfanylbenzenediazonium;zinc;chloride Chemical compound [Cl-].[Zn].COC1=CC([N+]#N)=C(OC)C=C1SC1=CC=C(C)C=C1 GBFAOLUTYLPAHH-UHFFFAOYSA-M 0.000 description 1
- MLIWQXBKMZNZNF-UHFFFAOYSA-N 2,6-bis[(4-azidophenyl)methylidene]-4-methylcyclohexan-1-one Chemical compound O=C1C(=CC=2C=CC(=CC=2)N=[N+]=[N-])CC(C)CC1=CC1=CC=C(N=[N+]=[N-])C=C1 MLIWQXBKMZNZNF-UHFFFAOYSA-N 0.000 description 1
- UZNOMHUYXSAUPB-UHFFFAOYSA-N 2,6-bis[(4-azidophenyl)methylidene]cyclohexan-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C=C(CCC1)C(=O)C1=CC1=CC=C(N=[N+]=[N-])C=C1 UZNOMHUYXSAUPB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- DSZPZWURRJLJEC-UHFFFAOYSA-M 4-(diethylamino)benzenediazonium;zinc;chloride Chemical compound [Cl-].[Zn].CCN(CC)C1=CC=C([N+]#N)C=C1 DSZPZWURRJLJEC-UHFFFAOYSA-M 0.000 description 1
- VZISKCDGGHZKJQ-UHFFFAOYSA-N 4-benzamido-2,5-diethoxybenzenediazonium;zinc;chloride Chemical compound [Cl-].[Zn].CCOC1=CC([N+]#N)=C(OCC)C=C1NC(=O)C1=CC=CC=C1 VZISKCDGGHZKJQ-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- WNEJLZDEDLSCQY-UHFFFAOYSA-N B.CPC Chemical compound B.CPC WNEJLZDEDLSCQY-UHFFFAOYSA-N 0.000 description 1
- WQSBEGCSKGQEFI-UHFFFAOYSA-N B.C[SbH]C Chemical compound B.C[SbH]C WQSBEGCSKGQEFI-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- CQVDKGFMVXRRAI-UHFFFAOYSA-J Cl[Au](Cl)(Cl)Cl Chemical compound Cl[Au](Cl)(Cl)Cl CQVDKGFMVXRRAI-UHFFFAOYSA-J 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- BYSNPKWWANMRSZ-UHFFFAOYSA-M [Cl-].[Zn].OCCNC1=C(C=CC=C1)[N+]#N Chemical compound [Cl-].[Zn].OCCNC1=C(C=CC=C1)[N+]#N BYSNPKWWANMRSZ-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical class [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 description 1
- VDTVZBCTOQDZSH-UHFFFAOYSA-N borane N-ethylethanamine Chemical compound B.CCNCC VDTVZBCTOQDZSH-UHFFFAOYSA-N 0.000 description 1
- LBCGPWDWIQGOCW-UHFFFAOYSA-N borane phenylphosphane Chemical compound B.Pc1ccccc1 LBCGPWDWIQGOCW-UHFFFAOYSA-N 0.000 description 1
- WVMHLYQJPRXKLC-UHFFFAOYSA-N borane;n,n-dimethylmethanamine Chemical compound B.CN(C)C WVMHLYQJPRXKLC-UHFFFAOYSA-N 0.000 description 1
- BGECDVWSWDRFSP-UHFFFAOYSA-N borazine Chemical compound B1NBNBN1 BGECDVWSWDRFSP-UHFFFAOYSA-N 0.000 description 1
- JSMKGDKUJCZXJD-UHFFFAOYSA-N boron;2,6-dimethylpyridine Chemical compound [B].CC1=CC=CC(C)=N1 JSMKGDKUJCZXJD-UHFFFAOYSA-N 0.000 description 1
- QELVBRYVPXJQMT-UHFFFAOYSA-N boron;ethane-1,2-diamine Chemical compound [B].NCCN QELVBRYVPXJQMT-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- NNTOJPXOCKCMKR-UHFFFAOYSA-N boron;pyridine Chemical compound [B].C1=CC=NC=C1 NNTOJPXOCKCMKR-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- WAULEAXRWFUEKD-UHFFFAOYSA-N copper;2-pyridin-2-ylpyridine Chemical compound [Cu].N1=CC=CC=C1C1=CC=CC=N1.N1=CC=CC=C1C1=CC=CC=N1 WAULEAXRWFUEKD-UHFFFAOYSA-N 0.000 description 1
- AQEDFGUKQJUMBV-UHFFFAOYSA-N copper;ethane-1,2-diamine Chemical compound [Cu].NCCN AQEDFGUKQJUMBV-UHFFFAOYSA-N 0.000 description 1
- QCJIZTUNXRABAQ-UHFFFAOYSA-N copper;tetraethylazanium Chemical compound [Cu+2].CC[N+](CC)(CC)CC QCJIZTUNXRABAQ-UHFFFAOYSA-N 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- JGUQDUKBUKFFRO-CIIODKQPSA-N dimethylglyoxime Chemical compound O/N=C(/C)\C(\C)=N\O JGUQDUKBUKFFRO-CIIODKQPSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- SGNSAMGUMVFALJ-UHFFFAOYSA-N n,n'-dichloroethane-1,2-diamine Chemical compound ClNCCNCl SGNSAMGUMVFALJ-UHFFFAOYSA-N 0.000 description 1
- JZHAIDXYCAASST-UHFFFAOYSA-N n,n'-dichloroethane-1,2-diamine;platinum Chemical compound [Pt].ClNCCNCl JZHAIDXYCAASST-UHFFFAOYSA-N 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- JKDRQYIYVJVOPF-FDGPNNRMSA-L palladium(ii) acetylacetonate Chemical compound [Pd+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O JKDRQYIYVJVOPF-FDGPNNRMSA-L 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Description
【発明の詳細な説明】
本発明は物理現像により可視画像を得る型の画
像形成材料に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an imaging material of the type that obtains a visible image by physical development.
物理現像は潜像をなす金属現像核を被還元性の
金属イオンと還元剤を含む現像液で処理して、成
長した金属粒子からなる可視画像を与える過程を
言う。 Physical development is a process in which metal development nuclei forming a latent image are treated with a developer containing reducible metal ions and a reducing agent to produce a visible image consisting of grown metal particles.
近年、銀塩の資源的有限性、並びに、価格の高
騰及び変動から非銀塩感光材料が見直されている
が非銀塩を用いたものは未だ例が少ないものであ
る。例えばFe3+がFe2+となる反応を利用し、
Fe2+により貴金属イオンを還元して金属現像核
とし、物理現像を行なう方法やキノン類、水素供
与体及び核形成可能な金属化合物を用い、露光に
より生成したハイドロキノン類の還元力を利用し
て金属化合物から金属現像核を形成し、物理現像
を行なつて銅を析出させる方法(昭和57年度写真
学会年次大会予稿集)等がその例として挙げられ
る。しかしこれらはいずれもせいぜいプリント基
板に使用されているに過ぎないものである。 In recent years, non-silver salt photosensitive materials have been reconsidered due to the limited resources of silver salts and the rise and fluctuation of prices, but there are still very few examples of materials using non-silver salts. For example, using the reaction in which Fe 3+ becomes Fe 2+ ,
A method of reducing noble metal ions with Fe 2+ to form metal development nuclei and performing physical development, or using quinones, hydrogen donors, and metal compounds capable of forming nuclei, and utilizing the reducing power of hydroquinones generated by exposure to light. An example of this is a method in which metal development nuclei are formed from a metal compound and copper is precipitated by physical development (Proceedings of the 1981 Photographic Society Annual Conference). However, all of these are used for printed circuit boards at most.
本発明者等は物理現像用の画像形成材料として
還元されて金属現像核となる金属化合物とジアゾ
基又はアジド基を有する化合物とを含有する親水
性バインダー層を有する画像形成材料を開示して
いる(特願昭55−182661号)。かかる画像形成材
料においては、金、白金、パラジウム、銀、鉄、
銅などの金属化合物の還元による生成物を現像核
として物理現像を行なう際に、それ自身光分解性
であるジアゾ基又はアジド基を有する化合物を用
いるとそれらの化合物により現像が有効に抑制さ
れるものである。この画像形成材料を用いてパタ
ーン露光、還元及び物理現像を行なうことにより
透過光学濃度が4.0以上ある可視画像が得られ、
階調のある黒色画像も必要に応じて形成でき、各
成分が溶解系であるため解像力が高く、減力可能
である等の利点有するため、この画像形成材料は
リスフイルムの代替物或いはマスク材などに利用
できるものである。以上のように種々の利点を有
する反面、この画像形成材料を形成する画像形成
層は親水性バインダーからなるため、基体の表面
との接着力が充分でなかつたり、耐湿性が充分で
ない等の欠点がある。更に耐湿性の向上のために
硬膜処理を行なうと、経時的な硬膜の進行、画像
形成能の低下の問題が生じる。又、親水性バイン
ダーを用いて画像形成層形成用塗料を作成する際
の気泡の発生や増粘等の問題も有している。 The present inventors have disclosed an image forming material for physical development that has a hydrophilic binder layer containing a metal compound that is reduced to become metal development nuclei and a compound having a diazo group or an azide group. (Special Application No. 182661, 1982). Such image forming materials include gold, platinum, palladium, silver, iron,
When performing physical development using a product resulting from the reduction of a metal compound such as copper as a development nucleus, if a compound having a diazo group or an azide group, which itself is photodegradable, is used, the development can be effectively suppressed by these compounds. It is something. By performing pattern exposure, reduction and physical development using this image forming material, a visible image with a transmitted optical density of 4.0 or more can be obtained,
Black images with gradations can be formed as needed, and since each component is a dissolved system, it has high resolution and can be reduced in force.This image forming material can be used as a substitute for lithographic film or as a mask material. It can be used for etc. Although it has various advantages as described above, since the image forming layer forming this image forming material is made of a hydrophilic binder, it has disadvantages such as insufficient adhesive strength with the surface of the substrate and insufficient moisture resistance. There is. Furthermore, if hardening treatment is performed to improve moisture resistance, problems arise such as progression of hardening over time and reduction in image forming ability. Furthermore, there are also problems such as generation of bubbles and thickening when a coating material for forming an image forming layer is prepared using a hydrophilic binder.
本発明者等は上記従来技術の欠点に鑑みて研究
の結果、バインダーを親油性のバインダーにする
ことにより上記従来の欠点が解消しうることを見
い出して本発明に到達したものである。即ち本発
明は基体の表面に画像形成層が形成され、該画像
形成層は還元されて金属現像核となる金属錯化合
物若しくは金属化合物、現像抑制剤及び湿潤剤を
含有するポリ酢酸ビニル系樹脂バインダー層から
なる画像形成材料をその要旨とするものである。 The present inventors conducted research in view of the above-mentioned drawbacks of the prior art, and found that the above-mentioned drawbacks of the prior art can be overcome by using a lipophilic binder as the binder, and have thus arrived at the present invention. That is, the present invention comprises a polyvinyl acetate resin binder in which an image forming layer is formed on the surface of a substrate, and the image forming layer is reduced to become a metal complex compound or metal compound, a development inhibitor, and a wetting agent. The gist thereof is an image forming material consisting of layers.
以下に本発明について詳細に説明する。 The present invention will be explained in detail below.
本発明の画像形成材料1は第1図に示すように
基体2の表面に画像形成層3を有するものであ
る。 The image forming material 1 of the present invention has an image forming layer 3 on the surface of a substrate 2, as shown in FIG.
基体2としては、ガラス、木、紙、プラスチツ
クフイルム、織布、不織布等の任意の固体材料が
用いられるが、なかでもポリエステルフイルム、
トリアセテートフイルムなどのプラスチツクフイ
ルムが特に好ましく用いられる。これら支持体1
には、必要に応じて、コロナ放電処理、プライマ
ー処理などの接着性改良のための前処理をしてか
ら、画像形成層3を設ける。 As the substrate 2, any solid material such as glass, wood, paper, plastic film, woven fabric, non-woven fabric can be used, among which polyester film,
Plastic films such as triacetate films are particularly preferably used. These supports 1
If necessary, the image forming layer 3 is provided after pretreatment for improving adhesion such as corona discharge treatment and primer treatment.
画像形成層3は、親油性バインダー層中に、還
元されて金属現像核となる金属錯化合物若しく金
属化合物および現像抑制剤を分散、好ましくは溶
解させてなる。 The image forming layer 3 is formed by dispersing, preferably dissolving, in a lipophilic binder layer, a metal complex compound or a metal compound which is reduced to become metal development nuclei, and a development inhibitor.
バインダーとしてはポリ酢酸ビニル樹脂、酢酸
ビニル/アクリル酸エステル共重合樹脂、アクリ
ル酸/酢酸ビニル共重合樹脂、エチレン/酢酸ビ
ニル共重合樹脂、カルボン酸基やスルホン酸基を
含む変性酢酸ビニル樹脂等の油溶性のポリ酢酸ビ
ニル系樹脂が好ましく使用される。 As a binder, polyvinyl acetate resin, vinyl acetate/acrylic acid ester copolymer resin, acrylic acid/vinyl acetate copolymer resin, ethylene/vinyl acetate copolymer resin, modified vinyl acetate resin containing carboxylic acid group or sulfonic acid group, etc. Oil-soluble polyvinyl acetate resins are preferably used.
上記のバインダーには更にバインダー層の湿潤
性を保持するためにグリセリン、、ポリエチレン
グリコール、ポリエチレンオキサイド等の湿潤剤
をバインダー100重量部に対し0.1〜10重量部加
え、このようにすることにより現像速度や現像浴
温度をコントロールする。 In order to maintain the wettability of the binder layer, 0.1 to 10 parts by weight of a wetting agent such as glycerin, polyethylene glycol, polyethylene oxide, etc. is added to the above binder per 100 parts by weight of the binder. and developer bath temperature.
次に還元されて金属現像核となる金属錯化合物
若しくは金属化合物について説明する。 Next, the metal complex compound or metal compound that is reduced and becomes a metal development nucleus will be explained.
まず、還元されて金属現像核となる金属錯化合
物としてはパラジウム、金、銀、白金、銅等の貴
なる金属の錯化合物が用いられ、これらの金属の
イオンに対し電子ドナーとなる配位子としては通
常知られているものを用いることができ、例えば
錯化合物として次のようなものを挙げることがで
きる;
ビス(エチレンジアミン)パラジウム()
塩、ジクロロエチレンジアミンパラジウム()
塩、ジクロロ(エチレンジアミン)白金()
塩、テトラクロロジアミン白金()塩、ジクロ
ロビス(エチレンジアミン)白金()塩、テト
ラエチルアンモニウム銅()、ビス(エチレン
ジアミン銅()塩。 First, complex compounds of noble metals such as palladium, gold, silver, platinum, and copper are used as metal complex compounds that are reduced and become metal development nuclei, and ligands that serve as electron donors to ions of these metals are used. Commonly known compounds can be used as complex compounds, such as the following: bis(ethylenediamine) palladium ()
Salt, dichloroethylenediamine palladium ()
Salt, dichloro(ethylenediamine) platinum ()
salt, tetrachlorodiamine platinum () salt, dichlorobis(ethylenediamine) platinum () salt, tetraethylammonium copper (), bis(ethylenediamine copper () salt.
更に金属の錯化合物を形成する配位子として
は、2カ所以上で配位して環状構造をとるいわゆ
るキレート化剤を用いると、形成される金属錯化
合物の安定性が高いために好適である。キレート
化剤としては第1級、第2級若しくは第3級アミ
ン類、オキシム類、イミン類、ケトン類を挙げる
ことができ、より具体的には次のようなものを挙
げることができる;
ジメチルグリオキシム、ジチゾン、オキシン、
アセチルアセトン、グリシン、エチレンジアミン
四酢酸、ニトリロ三酢酸、ウラミル二酢酸。 Furthermore, as a ligand that forms a metal complex compound, it is preferable to use a so-called chelating agent that coordinates at two or more places and forms a cyclic structure because the stability of the metal complex compound formed is high. . Examples of the chelating agent include primary, secondary, or tertiary amines, oximes, imines, and ketones, and more specifically, the following: dimethyl glyoxime, dithizone, oxin,
Acetylacetone, glycine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, uramyldiacetic acid.
上記のキレート化剤を用いたものとしてはビス
(2,2′―ビピリジン)パラジウム()塩、ビ
ス(アセチルアセトナート)パラジウム()、
ビス(N,N―ジエチルジエチレンアミン)銅
()塩、ビス(2,2′ビピリジン)銅()塩、
ビス(1,10―フエナントロリン)銅()塩、
ビス(ジメチルグリオキシマート)銅()、ビ
ス(アセチルアセトナート)銅()、ビス(ア
セチルアセトナート)白金()などが好まし
い。 Those using the above chelating agent include bis(2,2'-bipyridine) palladium () salt, bis(acetylacetonato) palladium (),
Bis(N,N-diethyldiethyleneamine) copper () salt, bis(2,2'bipyridine) copper () salt,
Bis(1,10-phenanthroline) copper() salt,
Bis(dimethylglyoximate)copper(), bis(acetylacetonato)copper(), bis(acetylacetonato)platinum(), and the like are preferred.
還元されて金属現像核を与える金属化合物とし
ては、パラジウム、金、銀、白金、銅等の貴なる
金属の塩化物、硝酸塩などの水溶性塩、たとえば
無電解メツキのアクチベーター液中に含まれる塩
化パラジウム、硝酸銀、4塩化水素金などの塩も
用いられ、特にパラジウムの塩が好ましく用いら
れる。 Metal compounds that are reduced to give metal development nuclei include water-soluble salts such as chlorides and nitrates of noble metals such as palladium, gold, silver, platinum, and copper, such as those contained in the activator solution for electroless plating. Salts such as palladium chloride, silver nitrate, and gold tetrachloride may also be used, and palladium salts are particularly preferably used.
又、金属化合物を用いるときは上述した金属化
合物(市販される無電解メツキ用のアクチベータ
ー液をそのまま用いることができる)を、現像抑
制剤であるジアゾ基又はアジド基を有する化合物
とともに適宜な溶剤で溶解したバインダー溶液と
混合して、塗布に適した粘度10〜1000センチポイ
ズ程度の液とし、これを支持体1上に塗布し、乾
燥することにより、通常0.1〜30μの塗膜として得
られる。バインダーを溶解する溶剤としては適宜
なものを使用できるが、メチルアルコール、エチ
ルアルコール、イソプロピルアルコール等の低級
アルコール、アセトン、メチルエチルケトン等の
ケトン、酢酸エチル、酢酸nブチル等のエステ
ル、メチルセロソルブ等の極性の高い溶剤が好ま
しく使用される。 In addition, when using a metal compound, the above-mentioned metal compound (a commercially available activator solution for electroless plating can be used as it is) is mixed with a compound having a diazo group or an azide group as a development inhibitor in an appropriate solvent. The mixture is mixed with a binder solution dissolved in the solution to form a liquid with a viscosity of about 10 to 1000 centipoise suitable for coating, and this is coated onto the support 1 and dried to obtain a coating film of usually 0.1 to 30 μm. Any suitable solvent can be used to dissolve the binder, including lower alcohols such as methyl alcohol, ethyl alcohol, and isopropyl alcohol, ketones such as acetone and methyl ethyl ketone, esters such as ethyl acetate and n-butyl acetate, and polar solvents such as methyl cellosolve. Solvents with a high pH are preferably used.
現像抑制剤としてはジアゾ基又はアジド基を有
する化合物を用い、ジアゾ基を有する化合物とし
てはジアゾ基を有する塩化亜鉛複塩若しくはホウ
フツ化塩、又はこれらの化合物とパラホルムアル
デヒドより得られる縮合化合物であるジアゾ樹脂
等が好ましく用いられる。より具体的にはp―
N,N―ジエチルアミノベンゼンジアゾニウム塩
化亜鉛複塩、p―N―エチル―N―βヒドロキシ
エチルアミノベンゼンジアゾニウム塩化亜鉛複
塩、4―モルフオリノ―2,5―ジエトキシベン
ゼンジアゾニウム塩化亜鉛複塩、4―モルフオリ
ノ―2,5―ジブトキシベンゼンジアゾニウム塩
化亜鉛複塩、4―ベンゾイルアミノ―2,5―ジ
エトキシベンゼンジアゾニウム塩化亜鉛複塩、4
―(4′―メトキシベンゾイルアミノ)―2,5―
ジエトキシベンゼンジアゾニウム塩化亜鉛複塩、
4―(p―トルイルメルカプト)―2,5―ジメ
トキシベンゼンジアゾニウム塩化亜鉛複塩、4―
ジアゾ―4′―メトキシジフエニルアミン塩化亜鉛
複塩、4―ジアゾ―3―メトキシ―ジフエニルア
ミン塩化亜鉛複塩等、若しくは以上のような塩化
亜鉛複塩の代わりにホウフツ化塩も使用できる。
アジド基を有する化合物としてはp―アジドアセ
トフエノン、4,4′―ジアジドカルコン、2,6
―ビス―(4′―アジドベンザル)―アセトン、
2,6―ビス―(4′―アジドベンザル)―シクロ
ヘキサノン、2,6―ビス―(4′―アジドベンザ
ル)―4―メチルシクロヘキサノン、2,6―ビ
ス―(4′―アジドスチリル)―アセトン、アジド
ピレン等が使用できる。或いはジアゾ基若しくは
アジド基を有する限り上記以外の化合物を使用す
ることもでき、又、上記したジアゾ基若しくはア
ジド基を有する化合物を任意に2種以上併用する
ことも差支えない。 As the development inhibitor, a compound having a diazo group or an azide group is used, and the compound having a diazo group is a zinc chloride double salt or a borofluoride salt having a diazo group, or a condensation compound obtained from these compounds and paraformaldehyde. Diazo resin and the like are preferably used. More specifically, p-
N,N-diethylaminobenzenediazonium zinc chloride double salt, p-N-ethyl-N-β hydroxyethylaminobenzenediazonium zinc chloride double salt, 4-morpholino-2,5-diethoxybenzenediazonium zinc chloride double salt, 4- Morpholino-2,5-dibutoxybenzenediazonium zinc chloride double salt, 4-benzoylamino-2,5-diethoxybenzenediazonium zinc chloride double salt, 4
-(4'-methoxybenzoylamino)-2,5-
diethoxybenzenediazonium zinc chloride double salt,
4-(p-tolylmercapto)-2,5-dimethoxybenzenediazonium zinc chloride double salt, 4-
Diazo-4'-methoxydiphenylamine zinc chloride double salt, 4-diazo-3-methoxy-diphenylamine zinc chloride double salt, etc., or instead of the above-mentioned zinc chloride double salt, borofluoride salt can also be used.
Compounds having an azide group include p-azidoacetophenone, 4,4'-diazidechalcone, 2,6
-Bis-(4′-azidobenzal)-acetone,
2,6-bis-(4'-azidobenzal)-cyclohexanone, 2,6-bis-(4'-azidobenzal)-4-methylcyclohexanone, 2,6-bis-(4'-azidostyryl)-acetone, azidopyrene, etc. can be used. Alternatively, compounds other than those mentioned above may be used as long as they have a diazo group or an azide group, and two or more of the above-mentioned compounds having a diazo group or an azide group may be used in combination.
画像形成層3中には、上記したバインダー100
部に対して:金属化合物若しくは金属錯化合物を
0.1〜100部、特に1〜10部、ジアゾ基若しくはア
ジド基を有する化合物を1〜100部、特に20〜50
部の割合で含ませることが好ましい。 The image forming layer 3 contains the binder 100 described above.
For part: metal compound or metal complex compound
0.1 to 100 parts, especially 1 to 10 parts, 1 to 100 parts, especially 20 to 50 parts of a compound having a diazo group or an azide group.
It is preferable to include it in a proportion of 1.5 parts.
なおジアゾ基を有する化合物を用いるときは該
化合物を安定化させる安定剤を用いるとよく、有
機カルボン酸や有機スルホン酸を具体例として挙
げることができ、より実際的にはp―トルエンス
ルホン酸などを用いるとよい。 When using a compound having a diazo group, it is recommended to use a stabilizer to stabilize the compound, and specific examples include organic carboxylic acids and organic sulfonic acids, and more practically, p-toluenesulfonic acid and the like. It is recommended to use
前記した画像形成材料を用いる画像形成法につ
いて説明すると、まず画像形成層3にたとえば第
2図に示すように透過原稿4を介して、パターン
露光を行う。これにより、露光部3Aにおいて、
選択的に且つ露光量に応じた程度にジアゾ基若し
くはアジド基を有する化合物を分解させる。 To explain the image forming method using the above-mentioned image forming material, first, the image forming layer 3 is subjected to pattern exposure through a transparent original 4 as shown in FIG. 2, for example. As a result, in the exposure section 3A,
A compound having a diazo group or an azide group is selectively decomposed to a degree depending on the amount of exposure.
光源としては前記したジアゾ基若しくはアジド
基を有する化合物を分解できる光源ならば任意の
ものが用いられる。 As the light source, any light source can be used as long as it is capable of decomposing the above-described compound having a diazo group or an azide group.
次いでこのようにしてパターン露光により、ジ
アゾ基若しくはアジド基を有する化合物がパター
ン状に分壊された潜像を有する画像形成層3に還
元剤水溶液を浸漬により接触させて画像形成層3
中にほぼ一様に金属現像核を発生させる。還元剤
としては、塩化第1スズ、硫酸第1スズ、水素化
ホウ素ナトリウム、ジメチルアミンボラザン、ジ
エチルアミンボラザン、トリメチルアミンボラザ
ン、その他ボラザン誘導体、ボラン、ジボラン、
メチルジボラン等のボラン誘導体、ヒドラジン等
を用いることができる。特に好ましくは、酸性塩
化第1スズ溶液、硫酸第1スズ溶液(Weiss液)
あるいは市販の無電解メツキ用のセンシタイザー
液などが用いられるが、一般には強力な還元剤で
あればすべて使用できる。 Then, by pattern exposure, an aqueous reducing agent solution is brought into contact with the image forming layer 3 having a latent image in which a compound having a diazo group or an azide group is broken down in a pattern by immersion.
Metal development nuclei are generated almost uniformly inside. Examples of reducing agents include stannous chloride, stannous sulfate, sodium borohydride, dimethylamine borazane, diethylamine borazane, trimethylamine borazane, other borazane derivatives, borane, diborane,
Borane derivatives such as methyldiborane, hydrazine, etc. can be used. Particularly preferably, acidic stannous chloride solution, stannous sulfate solution (Weiss solution)
Alternatively, a commercially available sensitizer solution for electroless plating can be used, but generally any strong reducing agent can be used.
更に、このようにして得られた金属現像核とジ
アゾ基を有する化合物の選択的分解による潜像を
有する画像形成層に物理現像液を浸漬により接触
させて第3図に示すごとく露光部に金属現像核を
中心として現像液中の金属が還元により析出し
た、可視像3Bを形成する。 Furthermore, a physical developer is brought into contact with the image forming layer having a latent image formed by the selective decomposition of the metal development nucleus and the compound having a diazo group obtained in this manner by immersion, so that metal is formed in the exposed areas as shown in FIG. A visible image 3B is formed in which the metal in the developer is precipitated by reduction around the development nuclei.
物理現像液としては、水溶性の被還元性重金属
塩および還元剤を含む水溶液が必要に応じて加温
した状態で使用される。 As the physical developer, an aqueous solution containing a water-soluble reducible heavy metal salt and a reducing agent is used, if necessary, in a heated state.
被還元性重金属塩としては、例えばニツケル、
コバルト、鉄及びクロム等のVIb族金属、銅等の
Ib族金属の水溶性塩が単独で又は混合して使用さ
れる。 Examples of reducible heavy metal salts include nickel,
Group VIb metals such as cobalt, iron and chromium, copper etc.
Water-soluble salts of Group Ib metals are used alone or in mixtures.
これら被還元性重金属塩は物理現像液中に、た
とえば10〜100g/の割合で含まれる。 These reducible heavy metal salts are contained in the physical developer at a rate of, for example, 10 to 100 g/g.
還元剤としては、例えば次亜リン酸、次亜リン
酸ナトリウム、水素化ホウ素ナトリウム、ヒドラ
ジン、ホルマリン、ジエチルアミンボラン、ジメ
チルアミンボラン、トリメチルアミンボラン、ボ
ラン、ジボラン、メチルジボラン、ジボラザン、
ボラゼン、ボラジン、t―ブチルアミンボラザ
ン、ピリジンボラン、2,6―ルチジンボラン、
エチレンジアミンボラン、ヒドラジンジボラン、
ジメチルホスフインボラン、フエニルホスフイン
ボラン、ジメチルアルジンボラン、フエニルアル
ジンボラン、ジメチルスチビンボラン、ジエチル
スチビンボランなどが使用できる。 Examples of reducing agents include hypophosphorous acid, sodium hypophosphite, sodium borohydride, hydrazine, formalin, diethylamine borane, dimethylamine borane, trimethylamine borane, borane, diborane, methyldiborane, diborazane,
Borazene, borazine, t-butylamine borazane, pyridine borane, 2,6-lutidine borane,
Ethylenediamineborane, hydrazinediborane,
Dimethylphosphine borane, phenylphosphine borane, dimethylaldine borane, phenylaldine borane, dimethylstibine borane, diethylstivine borane, etc. can be used.
これら還元剤は、物理現像液中に、たとえば
0.1〜50g/の割合で用いられる。 These reducing agents can be added to the physical developer, e.g.
It is used at a rate of 0.1 to 50g/.
以上の本発明の画像形成材料はポリ酢酸ビニル
樹脂系のバインダー層を有しているので硬膜処理
をすることなく耐湿性、耐水性がすぐれており、
画像形成能の低下が見られないものであり、又、
このような画像形成材料を作成する際にはバイン
ダーの非水溶液を用いることが出来るので塗料の
安定性が良好で増粘や気泡の発生等の不都合が生
じないものである。 Since the image forming material of the present invention has a polyvinyl acetate resin binder layer, it has excellent moisture resistance and water resistance without being hardened.
No decrease in image forming ability is observed, and
When producing such an image forming material, since a non-aqueous solution of the binder can be used, the stability of the coating material is good and problems such as thickening and generation of bubbles do not occur.
以下に本発明をより具体的に説明するための実
施例を掲げる。 Examples for explaining the present invention more specifically are listed below.
以下の実施例1〜3において塩化パラジウム溶
液とは以下の組成のものを指す。 In Examples 1 to 3 below, the palladium chloride solution refers to one having the following composition.
塩化パラジウム溶液
(塩化パラジウム ……1.0g
濃塩酸 ……50g
エタノール ……1)
実施例 1
感光液
(ポリ酢酸ビニル樹脂(日本合相化学工業製、
ゴーセニールA50―Z5) ……20重量部
ジアゾモノマー(大東化学製、DH―
300BF4、10%MEK溶液) ……5.0重量部
塩化パラジウム溶液 ……10重量部
ポリエチレングリコール(M.W.=1500)5
%MEK溶液 ……1重量部
P―トルエンスルホン酸(安定化剤)5%エ
タノール溶液 ……1重量部)
上記組成の感光液を厚み100μmのポリエステル
フイルム(東レ製、ルミラー、#100)にワイヤ
ーパーNo.36を用いて塗布し80℃のオーブンで乾燥
し、塗膜厚み4μmの感光層を有する感材を作成し
た。Palladium chloride solution (Palladium chloride...1.0g Concentrated hydrochloric acid...50g Ethanol...1) Example 1 Photosensitive solution (Polyvinyl acetate resin (manufactured by Nippon Gosho Chemical Industry Co., Ltd.)
Gosenil A50-Z5)...20 parts by weight diazo monomer (Daito Chemical, DH-
300BF 4 , 10% MEK solution) ...5.0 parts by weight Palladium chloride solution ...10 parts by weight polyethylene glycol (MW = 1500) 5
%MEK solution...1 part by weight P-toluenesulfonic acid (stabilizer) 5% ethanol solution...1 part by weight) A photosensitive solution with the above composition was applied to a 100 μm thick polyester film (Toray, Lumirror, #100) using a wire. It was coated using Par No. 36 and dried in an oven at 80°C to produce a photosensitive material having a photosensitive layer with a coating thickness of 4 μm.
作成した感材の感光層に超高圧水銀灯(波長
405nm、75W)を用いネガフイルムを介して30秒
間密着露光し、次いで下記組成で示される物理現
像液であるTMP化学ニツケル(奥野製薬製)を、
〔TMP化学ニツケル〕
(硫酸ニツケル ……9.0g
次亜リン酸ナトリウム ……7.0g
アンモニウム飽和溶液 ……6.5g
クエン酸ソーダ ……10.0g
水 ……67.5g)
20℃で使用して、これに100秒間浸漬すること
により300線/インチ、4%の網点の画像が再現
された。 An ultra-high pressure mercury lamp (wavelength
405nm, 75W) through a negative film for 30 seconds, and then apply TMP Chemical Nickel (manufactured by Okuno Pharmaceutical), a physical developer with the following composition, to [TMP Chemical Nickel] (nickel sulfate...9.0g). Sodium hypophosphite 7.0g Ammonium saturated solution 6.5g Sodium citrate 10.0g Water 67.5g % halftone image was reproduced.
又、上記で作成した感材を25℃、80%RHの条
件で1週間以上放置しても画像形成能の低下がな
く、解像度も変化がなく、従つて耐湿性のすぐれ
たものであつた。 Furthermore, even when the photosensitive material prepared above was left at 25°C and 80% RH for more than one week, there was no decrease in image forming ability, no change in resolution, and therefore it had excellent moisture resistance. .
実施例 2
感光液
(アクリリル酸/酢酸ビニル共重合樹脂(日本
合成化学工業製、コーポニールPC―50M
(H)20%エタノール溶液 ……20重量部
ジアゾモノマー(レスペケミカル製、No.
11′BF4)10%MEK溶液) ……3.0重量部
塩化パラジウム溶液 ……10重量部
ポリエチレンオキシド(製鉄化学製,PEO
―3)1%メタノール溶液 ……2.0重量部
P―トルエンスルホン酸5%エタノール溶液
……1.0重量部)
上記組成の感光液の調製直後の粘度は50C.P.S.
であり、調製後8時間経過後の粘度は60C.P.S.で
あり、実質上粘度の向上は殆んどなかつた。Example 2 Photosensitive liquid (acrylic acid/vinyl acetate copolymer resin (manufactured by Nippon Gosei Kagaku Kogyo Co., Ltd., Coponil PC-50M)
(H) 20% ethanol solution...20 parts by weight diazo monomer (manufactured by Respé Chemical, No.
11'BF 4 ) 10% MEK solution) ...3.0 parts by weight Palladium chloride solution ...10 parts by weight Polyethylene oxide (Steel Chemical Co., Ltd., PEO
-3) 1% methanol solution...2.0 parts by weight P-toluenesulfonic acid 5% ethanol solution
...1.0 parts by weight) The viscosity of the photosensitive liquid with the above composition immediately after preparation is 50C.PS.
The viscosity 8 hours after preparation was 60 C.PS, and there was virtually no improvement in viscosity.
上記で得られた感光液を用いて実施例1と同様
にして感材を作成した後、感材に実施例1と同様
な露光を行ない、次いで実施例1で示した組成の
物理現像液であるTMP化学ニツケル(奥野製薬
製)を、35℃で使用して、これに60秒間浸漬して
現像を行ない、300線/インチ、4%の網点の画
像が再現された。 A photosensitive material was prepared in the same manner as in Example 1 using the photosensitive solution obtained above, and then the photosensitive material was exposed in the same manner as in Example 1, and then a physical developer having the composition shown in Example 1 was used. Using a certain TMP chemical nickel (manufactured by Okuno Pharmaceutical Co., Ltd.) at 35°C, the image was developed by immersing it in it for 60 seconds, and an image with 300 lines/inch and 4% halftone dots was reproduced.
実施例 3
感光液
(変性ポリ酢酸ビニル樹脂(日本合成化学製、
PH―50M)20%メチルエチルケトン溶液
……20重量部
ジアゾモノマー(大東化学製、DH―
300BF4、)10%メチルエチルケトン溶液
……5.0重量部
パラジウム溶液 ……10重量部
ポリエチレングリコール(M.W.=1500)5
%メチルエチルケトン溶液 ……1.5重量部
P―トルエンスルホン酸 ……1.0重量部)
上記感光液を用い、以下実施例1と同様に感材
を作成し、現像時間は90秒として画像を形成した
ところ、300線/インチ、4%の網点の画像が形
成された。Example 3 Photosensitive liquid (modified polyvinyl acetate resin (manufactured by Nippon Gosei Chemical Co., Ltd.)
PH-50M) 20% methyl ethyl ketone solution
...20 parts by weight of diazo monomer (manufactured by Daito Chemical Co., Ltd., DH-
300BF 4 ,) 10% methyl ethyl ketone solution
...5.0 parts by weight palladium solution ...10 parts by weight polyethylene glycol (MW=1500) 5
% methyl ethyl ketone solution...1.5 parts by weight P-toluenesulfonic acid...1.0 parts by weight) Using the above photosensitive solution, a photosensitive material was prepared in the same manner as in Example 1, and an image was formed with a developing time of 90 seconds. A 300 lines/inch, 4% halftone image was produced.
第1図は本発明の画像形成材料を示す断面図、
第2図及び第3図は第1図に示す画像形成材料を
用いて画像を形成する工程を示す断面図である。
1……画像形成材料、2……基材、3……画像
形成層(3A……露光部、3B……可視部)、4
……透過原稿。
FIG. 1 is a sectional view showing the image forming material of the present invention;
2 and 3 are cross-sectional views showing the process of forming an image using the image forming material shown in FIG. 1. FIG. 1... Image forming material, 2... Base material, 3... Image forming layer (3A... exposed area, 3B... visible area), 4...
...transparent manuscript.
Claims (1)
形成層は還元されて金属現像核となる金属錯化合
物若しくは金属化合物、現像抑制剤及び湿潤剤を
含有するポリ酢酸ビニル系樹脂バインダー層から
なる画像形成材料。1. An image forming layer is formed on the surface of the substrate, and the image forming layer is composed of a polyvinyl acetate resin binder layer containing a metal complex compound or metal compound that is reduced to become metal development nuclei, a development inhibitor, and a wetting agent. Imaging materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14975582A JPS5938740A (en) | 1982-08-28 | 1982-08-28 | Image forming material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14975582A JPS5938740A (en) | 1982-08-28 | 1982-08-28 | Image forming material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5938740A JPS5938740A (en) | 1984-03-02 |
| JPH0213290B2 true JPH0213290B2 (en) | 1990-04-03 |
Family
ID=15482037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14975582A Granted JPS5938740A (en) | 1982-08-28 | 1982-08-28 | Image forming material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938740A (en) |
-
1982
- 1982-08-28 JP JP14975582A patent/JPS5938740A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5938740A (en) | 1984-03-02 |
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