JPH0213813B2 - - Google Patents
Info
- Publication number
- JPH0213813B2 JPH0213813B2 JP56136385A JP13638581A JPH0213813B2 JP H0213813 B2 JPH0213813 B2 JP H0213813B2 JP 56136385 A JP56136385 A JP 56136385A JP 13638581 A JP13638581 A JP 13638581A JP H0213813 B2 JPH0213813 B2 JP H0213813B2
- Authority
- JP
- Japan
- Prior art keywords
- current collector
- electrode
- plate
- collector plate
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
Landscapes
- Die Bonding (AREA)
Description
【発明の詳細な説明】 本発明は、半導体装置の改良に関する。[Detailed description of the invention] The present invention relates to improvements in semiconductor devices.
従来、例えばメサ構造の半導体素子を備えた圧
接型の半導体装置は、第１図及び第２図に示す如
く、支持板１に装着された半導体素子２のエミツ
タ電極３上に略皿型の集電板４ａと平板状の集電
板４ｂを順次載置し、これをシリコンラバー等か
らなる弾性部材５を支持板１の側面に介して放熱
容器６内に収容し、集電板４ｂと支持板１に電極
７を外囲器８で圧接した構造を有している。 Conventionally, a press-contact type semiconductor device including a semiconductor element having a mesa structure, for example, has a substantially dish-shaped cluster on an emitter electrode 3 of a semiconductor element 2 mounted on a support plate 1, as shown in FIGS. 1 and 2. An electric plate 4a and a flat current collector plate 4b are placed one after another, and this is housed in a heat dissipation container 6 with an elastic member 5 made of silicone rubber or the like interposed on the side surface of the support plate 1, and the current collector plate 4b and the support plate are placed together. It has a structure in which an electrode 7 is pressed against a plate 1 by an envelope 8.
而して、集電板４ａ，４ｂは電極７とエミツタ
電極３の間に移動自在に介在されているため、組
立て後に種々の性能検査試験を施したり、或は、
電極７の平面度を高めるために旋削処理を施す
と、集電板４ａ，４ｂが移動してエミツタ電極３
とベース電極間で電気的に短絡が生じ、半導体装
置９の信頼性を著しく低下する問題があつた。 Since the current collector plates 4a and 4b are movably interposed between the electrode 7 and the emitter electrode 3, various performance inspection tests can be performed after assembly, or
When the electrode 7 is turned to improve its flatness, the current collector plates 4a and 4b move and the emitter electrode 3
There was a problem in that an electrical short circuit occurred between the base electrode and the base electrode, significantly reducing the reliability of the semiconductor device 9 .
本発明は、かかる点に鑑みてなされたもので、
エミツタ・ベース間で電気的短絡が発生するのを
防止して信頼性の向上を図つた半導体装置を提供
するものである。 The present invention has been made in view of these points,
An object of the present invention is to provide a semiconductor device in which reliability is improved by preventing electrical short circuits from occurring between an emitter and a base.
以下、本発明の実施例について図面を参照して
説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第３図は、本発明の一実施例の要部拡大図であ
る。図中２０は、支持板２１上に装着された半導
体素子である。半導体素子２０の表面に形成され
たエミツタ電極上には、略皿型の集電板２２ａ及
び平板状の集電極２２ｂが順次載置されている。
この半導体素子２０等は、支持板２１の側面にシ
リコンラバー等からなる弾性部材２３を介して放
熱容器２４内に収容されている。集電極２２ｂ及
び支持板２１には、電極２５が外囲器２６によつ
て圧接されている。略皿型の集電板２２ａの側面
と弾性部材２３との間には、集電板２２ａを囲む
リング状の固定部材２７が介在されている。 FIG. 3 is an enlarged view of essential parts of an embodiment of the present invention. 20 in the figure is a semiconductor element mounted on the support plate 21. On the emitter electrode formed on the surface of the semiconductor element 20, a substantially dish-shaped current collector plate 22a and a flat plate-shaped collector electrode 22b are sequentially placed.
The semiconductor element 20 and the like are housed in a heat dissipation container 24 via an elastic member 23 made of silicone rubber or the like on the side surface of a support plate 21. An electrode 25 is pressed into contact with the collector electrode 22b and the support plate 21 by an envelope 26. A ring-shaped fixing member 27 that surrounds the current collector plate 22a is interposed between the side surface of the substantially dish-shaped current collector plate 22a and the elastic member 23.
而して、このように構成された半導体装置２８
によれば、集電板２２ａと弾性部材２３間に介在
した固定部材２７によつて集電板２２ａの移動が
阻止できるので、組立後に種々の性能検査試験や
電極２５の平面度を高めるための旋削処理を施し
た際に、集電板２２ａの移動によるエミツタ電極
とベース電極間での電気的短絡の発生を防止でき
る。 Thus, the semiconductor device 28 configured in this manner
According to the above, since the movement of the current collecting plate 22a can be prevented by the fixing member 27 interposed between the current collecting plate 22a and the elastic member 23, various performance inspection tests and tests to improve the flatness of the electrode 25 can be carried out after assembly. When performing the turning process, it is possible to prevent an electrical short circuit between the emitter electrode and the base electrode due to movement of the current collector plate 22a.
その結果、半導体装置２８の信頼性を高めて歩
留を向上させることができる。因に、実施例の半
導体装置２８でのエミツターベース間の短絡の発
生率は約３％であるのに対し、第１図及び第２図
に示す固定部材のない従来の半導体装置９でのエ
ミツターベース間の短絡の発生率は約15％である
ことが試験によつて確認された。 As a result, the reliability of the semiconductor device 28 can be increased and the yield can be improved. Incidentally, the incidence of short circuits between the emitter bases in the semiconductor device 28 of the embodiment is about 3%, whereas in the conventional semiconductor device 9 without a fixing member shown in FIGS. Tests have confirmed that the incidence of short circuits between emitter bases is approximately 15%.
以上説明した如く、本発明に係る半導体装置に
よれば、集電板の移動を固定部材によつて阻止す
るようにしたので、エミツターベース間での短絡
の発生を防止して電気的信頼性の向上を図り、歩
留を高めることができる等顕著な効果を有するも
のである。 As explained above, according to the semiconductor device according to the present invention, since the movement of the current collector plate is prevented by the fixing member, short circuits between the emitter bases are prevented and electrical reliability is improved. It has remarkable effects such as being able to improve the yield and increase the yield.
第１図は、従来の半導体装置の正面図、第２図
は、同半導体装置の要部拡大図、第３図は、本発
明の一実施例の要部拡大図である。
２０…半導体素子、２１…支持板、２２ａ…集
電板、２２ｂ…集電極、２３…弾性部材、２４…
放熱容器、２５…電極、２６…外囲器、２７…固
定部材、２８…半導体装置。
FIG. 1 is a front view of a conventional semiconductor device, FIG. 2 is an enlarged view of main parts of the same semiconductor device, and FIG. 3 is an enlarged view of main parts of an embodiment of the present invention. 20... Semiconductor element, 21... Support plate, 22a... Current collector plate, 22b... Collector electrode, 23... Elastic member, 24...
Heat radiation container, 25... Electrode, 26... Envelope, 27... Fixing member, 28 ... Semiconductor device.
Claims (1)
体素子の表面の電極上に載置された集電板と、前
記支持板の側面に弾性部材を介して前記支持板、
前記半導体素子、及び前記集電板を収容し、か
つ、前記集電板及び前記支持板に対向する領域を
開口した放熱容器と、前記集電板と前記支持板に
電極を介して圧接された外囲器とを有する半導体
装置において、弾性部材と集電板の間に固定部材
を介在せしめたことを特徴とする半導体装置。1. A semiconductor element mounted on a support plate, a current collector plate placed on an electrode on the surface of the semiconductor element, and a current collector plate mounted on a side surface of the support plate via an elastic member,
a heat dissipation container accommodating the semiconductor element and the current collector plate and having an open area facing the current collector plate and the support plate; and a heat dissipation container that is pressed into contact with the current collector plate and the support plate via an electrode 1. A semiconductor device having an envelope, characterized in that a fixing member is interposed between an elastic member and a current collector plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56136385A JPS5837928A (en) | 1981-08-31 | 1981-08-31 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56136385A JPS5837928A (en) | 1981-08-31 | 1981-08-31 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5837928A JPS5837928A (en) | 1983-03-05 |
| JPH0213813B2 true JPH0213813B2 (en) | 1990-04-05 |
Family
ID=15173911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56136385A Granted JPS5837928A (en) | 1981-08-31 | 1981-08-31 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837928A (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111462U (en) * | 1978-01-25 | 1979-08-06 | ||
| JPS5558541A (en) * | 1978-10-24 | 1980-05-01 | Mitsubishi Electric Corp | Semiconductor device |
| JPS5594064U (en) * | 1978-12-21 | 1980-06-30 |
-
1981
- 1981-08-31 JP JP56136385A patent/JPS5837928A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5837928A (en) | 1983-03-05 |
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