JPH0216390B2 - - Google Patents
Info
- Publication number
- JPH0216390B2 JPH0216390B2 JP57074045A JP7404582A JPH0216390B2 JP H0216390 B2 JPH0216390 B2 JP H0216390B2 JP 57074045 A JP57074045 A JP 57074045A JP 7404582 A JP7404582 A JP 7404582A JP H0216390 B2 JPH0216390 B2 JP H0216390B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel plating
- solder
- rosin
- minutes
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】
本発明はニツケルメツキ浴に関する。さらに詳
しくは、本発明ははんだ濡れ性の改善されたニツ
ケルメツキ浴に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a nickel plating bath. More specifically, the present invention relates to a nickel plating bath with improved solder wettability.
電子部品の端子に施されたメツキ部分にはんだ
を融着するが、そのメツキははんだ濡れ性の良い
事（はんだのかたまりやピンホールのない事）が
要求されている。はんだ濡れ性を向上させる方法
として、一般にはフラツクスが使用されている。
しかし、メツキされた端子をフラツクス処理する
ことは工程が増えるのみならず、フラツクスによ
る端子以外の部分の汚損を起こすなど望ましいこ
とではない。例えば、はんだ濡れ性を改善した無
電解ニツケルメツキ法としてリン化合物又はホウ
素化合物を使用する方法もあるが、これらの方法
では必ずしも十分なはんだ濡れ性は得られていな
い。 Solder is fused to the plating on the terminals of electronic components, but the plating must have good solder wettability (no solder lumps or pinholes). Flux is generally used as a method to improve solder wettability.
However, flux treatment of plated terminals not only increases the number of steps but also causes staining of parts other than the terminals due to the flux, which is not desirable. For example, there is a method of using a phosphorus compound or a boron compound as an electroless nickel plating method that improves solder wettability, but these methods do not necessarily provide sufficient solder wettability.
また塩化亜鉛、塩化第１錫、アジピン酸、オレ
イン酸、ステアリン酸等を使用する方法がある。
この方法によれば十分なはんだ濡れ性は得られる
が、反面ニツケルメツキ浴のPHを変えたり、PHを
一定に保つ緩衝剤の働きを阻害するという欠点が
ある。 There are also methods using zinc chloride, stannous chloride, adipic acid, oleic acid, stearic acid, and the like.
Although this method provides sufficient solder wettability, it has the disadvantage that it changes the pH of the nickel plating bath and inhibits the buffering agent that keeps the pH constant.
本発明はこれらの欠点のないニツケルメツキ浴
を提供することを目的とするものである。 The object of the present invention is to provide a nickel plating bath that does not have these drawbacks.
本発明は、ロジン又はロジン変性材料をニツケ
ルメツキ液１に対し0.05〜100ｇ含有せしめて
なるニツケルメツキ浴に関する。 The present invention relates to a nickel plating bath comprising 0.05 to 100 g of rosin or rosin-modified material per 1 part of the nickel plating solution.
さらに詳しくは、本発明はロジン又はロジン変
性材料をニツケルメツキ液１に対し0.05〜100
ｇ含有させてニツケルメツキとフラツクス効果を
程する成分をニツケルメツキ被膜に析出もしくは
含有させ、従来別工程で行なつていたフラツクス
処理工程を省き、端子以外の部分の汚損をなく
し、ニツケルメツキに十分なはんだ濡れ性を付与
しようとするものである。 More specifically, the present invention uses rosin or rosin-modified material in an amount of 0.05 to 100 per 1 part Nickelmetzki solution.
By precipitating or containing a component in the nickel plating film to improve the nickel plating and flux effect, it eliminates the flux treatment process that was conventionally performed as a separate process, eliminates contamination of parts other than the terminals, and achieves sufficient solder wetting for nickel plating. It is an attempt to give a sense of gender.
本発明において、ロジン又はロジン変性材料
は、酸化物の溶解あるいは、水素や水蒸気、その
他の化合物の発生によつてはんだ付けにおける母
材金属の表面を清浄にし溶融はんだの濡れ性を向
上させる物質であり、これらの物質の含有量はフ
ラツクス効果との関係で使用するニツケルメツキ
液１に対し0.05〜100ｇ含有せしめるものとし、
0.1〜80ｇ加えればニツケルメツキ浴の寿命が長
いと共にフラツクスの付着量が適正（厚くもな
く、薄くもない）となるので好ましい。なおロジ
ン変性材料としてはアビエチン酸メチル、アビエ
チン酸ジエチレングリコール等が用いられる。 In the present invention, rosin or rosin-modified material is a substance that cleans the surface of base metal during soldering and improves the wettability of molten solder by dissolving oxides or generating hydrogen, water vapor, or other compounds. In relation to the flux effect, the content of these substances shall be 0.05 to 100 g per 1 nickel metal solution used.
It is preferable to add 0.1 to 80 g because the life of the nickel plating bath will be long and the amount of flux deposited will be appropriate (not thick or thin). Note that methyl abietate, diethylene glycol abietate, etc. are used as the rosin modified material.
本発明のメツキ浴は無電解、電解のいずれのメ
ツキ浴にも適用でき、また還元剤、PH調整剤、緩
衝剤、錯化剤、促進剤、安定剤、改良剤などをメ
ツキ浴中に添加することも金属表面の活性化を阻
害しない限り何ら制限するものではない。 The plating bath of the present invention can be applied to both electroless and electrolytic plating baths, and reducing agents, PH adjusters, buffers, complexing agents, accelerators, stabilizers, improvers, etc. can be added to the plating bath. There is no restriction on what can be done as long as activation of the metal surface is not inhibited.
以下実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例 １
硫酸ニツケル240ｇ／、塩化ニツケル45ｇ／
を４の蒸留水に溶解し無光沢メツキ液を作成
し、次いでこの無光沢メツキ液にロジンアルコー
ル溶液（ロジン含有率50％）を50ｇ加えて電解ニ
ツケルメツキ浴とした。Example 1 Nickel sulfate 240g/, nickel chloride 45g/
was dissolved in distilled water from step 4 to prepare a matte plating solution, and then 50 g of rosin alcohol solution (rosin content 50%) was added to this matte plating solution to prepare an electrolytic nickel plating bath.
上記とは別に試薬１級35％の塩酸２に蒸留水
２を加えて酸処理浴とした。 Separately from the above, 2 parts of distilled water was added to 2 parts of 35% first class reagent hydrochloric acid to prepare an acid treatment bath.
さらに上記とは別にレツドシユーマ２に蒸留
水２を加えて活性化浴とした。 Furthermore, in addition to the above, distilled water 2 was added to the red bath 2 to form an activation bath.
次に大きさ10cm角、厚さ１mmの銅板をアセトン
で洗浄し、流水で20分間水洗したのち前述の酸処
理浴に２分間浸漬し、次いで流水中で10分間水洗
した。さらに前述の活性化浴に10分間浸漬後、流
水中で５分間水洗して活性化処理した銅板とし
た。 Next, a copper plate measuring 10 cm square and 1 mm thick was washed with acetone, rinsed with running water for 20 minutes, immersed in the aforementioned acid treatment bath for 2 minutes, and then rinsed with running water for 10 minutes. Further, the copper plate was immersed in the above-mentioned activation bath for 10 minutes, and then washed in running water for 5 minutes to obtain an activated copper plate.
次に前述の電解ニツケルメツキ浴を50℃に加温
し、さらにこの浴中に活性化処理した銅板を浸漬
し動かしながら電流密度4A／ｄm2で10分間ニツ
ケルメツキした後流水中で20分間水洗し、次いで
アセトンに浸漬したのち乾燥してニツケルメツキ
処理した。 Next, the above-mentioned electrolytic nickel plating bath was heated to 50°C, and the activated copper plate was immersed in this bath and nickel plated at a current density of 4 A/dm 2 for 10 minutes while moving, and then washed in running water for 20 minutes. Next, it was immersed in acetone, dried, and treated with nickel plating.
このニツケルメツキ処理した銅板の上に大きさ
９cm角、厚さ0.1mmの高温はんだ（鉛93.5重量％、
錫５重量％、銀1.5重量％）を乗せ水素雰囲気中
で加熱し、この高温はんだをリフロー（流延）し
た。加熱条件は10分間で280℃に昇温後その温度
で20分保持し、さらに５分間で380℃に昇温後そ
の温度で２分保持し、その後５分間で強制的に80
℃まで冷却した。 On top of this nickel-plated copper plate, a 9 cm square, 0.1 mm thick high-temperature solder (lead 93.5% by weight,
5% by weight of tin and 1.5% by weight of silver) was placed and heated in a hydrogen atmosphere, and this high temperature solder was reflowed (cast). The heating conditions were: raised to 280℃ for 10 minutes, held at that temperature for 20 minutes, then raised to 380℃ for another 5 minutes, held at that temperature for 2 minutes, then forcedly heated to 80℃ for 5 minutes.
Cooled to ℃.
はんだ融着後の外観を観察したところ、はんだ
は銅板の上面に均一に流延されており、はんだの
かたまりやピンホール等は見られなかつた。 When the appearance after solder fusion was observed, the solder was uniformly cast on the upper surface of the copper plate, and no solder lumps or pinholes were observed.
比較例 １
実施例１の活性化処理された銅板と実施例１と
同様の無光沢ニツケルメツキ液にロジンアルコー
ル溶液を添加しない電解ニツケルメツキ浴で実施
例１と同様の方法によりニツケルメツキ処理し
た。Comparative Example 1 The activated copper plate of Example 1 was nickel plated in the same manner as in Example 1 using an electrolytic nickel plating bath in which no rosin alcohol solution was added to the same matte nickel plating solution as in Example 1.
このニツケルメツキ処理した銅板を実施例１と
同様の方法及び条件で高温はんだを流延した。は
んだ融着後の外観を観察したところはんだは均一
に拡がらずひけがみられ、直径２〜３mmの円板状
のかたまりやピンホールが発生した。 High-temperature solder was cast on this nickel-plated copper plate using the same method and conditions as in Example 1. When the appearance after solder fusion was observed, the solder did not spread uniformly, and sink marks were observed, and disk-shaped lumps and pinholes with a diameter of 2 to 3 mm were generated.
本発明は、ニツケルメツキ浴中に、ロジン又は
ロジン変性材料をニツケルメツキ液１に対し
0.05〜100ｇ含有させるので、ニツケルメツキ浴
のPHを変えたり、PHを一定に保つ緩衝剤の働きを
阻害することなく、はんだ流延に際してフラツク
ス効果が作用し、ひけなどを抑制しはんだの濡れ
を著しく向上させることができる。 In the present invention, rosin or rosin-modified material is added to nickel plating solution 1 in a nickel plating bath.
Since it contains 0.05 to 100g, it does not change the pH of the nickel plating bath or interfere with the buffering agent that keeps the pH constant, and the flux effect acts during solder casting, suppressing sink marks and significantly reducing solder wetting. can be improved.
Claims (1)
液１に対し0.05〜100ｇ含有せしめてなるニツ
ケルメツキ浴。1. A nickel plating bath comprising 0.05 to 100 g of rosin or rosin-modified material per 1 part of the nickel plating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7404582A JPS58193354A (en) | 1982-04-30 | 1982-04-30 | Plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7404582A JPS58193354A (en) | 1982-04-30 | 1982-04-30 | Plating bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58193354A JPS58193354A (en) | 1983-11-11 |
| JPH0216390B2 true JPH0216390B2 (en) | 1990-04-17 |
Family
ID=13535805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7404582A Granted JPS58193354A (en) | 1982-04-30 | 1982-04-30 | Plating bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58193354A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12383725B2 (en) | 2018-01-10 | 2025-08-12 | Tc1 Llc | Bearingless implantable blood pump |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526252B2 (en) * | 1972-07-04 | 1977-02-21 | ||
| JPS5453629A (en) * | 1977-10-07 | 1979-04-27 | Hitachi Ltd | Resistance chemical plating method |
| JPS56136965A (en) * | 1980-03-27 | 1981-10-26 | Hitachi Ltd | Plating method |
-
1982
- 1982-04-30 JP JP7404582A patent/JPS58193354A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12383725B2 (en) | 2018-01-10 | 2025-08-12 | Tc1 Llc | Bearingless implantable blood pump |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58193354A (en) | 1983-11-11 |
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