JPH0216599B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for transporting a printed circuit board vertically and slidably to a vertical table movable horizontally and vertically, and transmitting an electronic signal from at least one side of the vertical table. The present invention relates to an electronic component mounting method for mounting components.

In the conventional electronic component mounting method, the printed circuit board is transferred horizontally, and a mounting head for mounting the electronic component is provided above the board transfer path, and the electronic component is mounted from above. For this reason, a large space is required in the horizontal direction, and if it is necessary to mount electronic components on the bottom surface of the printed circuit board, the printed circuit board must be reversed. Therefore, it is theoretically impossible to attach electronic components to both sides of the printed circuit board at once, and the mechanism for reversing the printed circuit board becomes complicated.

In view of the above-mentioned points, the present invention has been developed to sequentially transfer a printed circuit board to a plurality of vertical tables that are movable horizontally and vertically by supporting the printed circuit board vertically in a slidable manner, and to read the printed circuit board at each vertical table. An electronic component that reduces horizontal space and allows electronic components to be mounted on both sides of a printed circuit board by inserting attached electronic components, chip-shaped electronic components, or other irregularly shaped electronic components. The purpose is to provide a mounting method.

Embodiments of the electronic component mounting method according to the present invention will be described below with reference to the drawings.

In FIGS. 1 to 3, an input board transfer path 2 and an output board transfer path 3 are installed to vertically and slidably support a printed circuit board 1, and three horizontal and Vertical tables 4A, 4B, and 4C that are vertically movable are arranged.

As shown in FIGS. 2 and 3, the loading-side substrate transfer path 2 includes an upper idle rail 12 and a lower guide rail 13.
is attached to the upper frame 14 via adjustment bolts 15 so that its vertical position can be adjusted, and the lower guide rail 1
3 is fixed on the base surface 16. A leaf spring 19 is provided on the upper guide rail 12 to prevent the printed circuit board 1 from wobbling. Further, an endless band, for example a chain 17, runs along the printed circuit board 1 on the lower guide rail 13, and the chain 17 has engaging members 18 that engage with the rear end of the circuit board at regular intervals. installed.

Note that the substrate transfer path 3 on the unloading side also has a similar configuration.

As shown in FIGS. 2 and 4, a vertical table (hereinafter referred to as an a Z slider 25 screwed onto the ball screw 24; and a ball screw 26 provided slidably in the horizontal direction with respect to the Z slider 25.
The X slider 27 screwed into the support plate 28, the upper guide rail 12A and the lower guide rail 13A
The table body 29 is fixed to the table body 29. The ball screw 24 is driven by a DC motor 30, and the ball screw 26 is driven by another motor (not shown), and as the Z slider 25 and the X slider 27 move, the table main body fixed to the X slider 27 is driven. 29 supports the printed circuit board 1 at an arbitrary position. Positioning holes 10 of the printed circuit board 1 held by the table body 29 for positioning the printed circuit board 1 with respect to the XZ table 4A
A board positioning pin 11 is disposed along the lower guide rail 13A so as to fit into the board positioning pin 11. Furthermore, a pencil cylinder 31 is provided on the back side of the support plate 28.
is provided so that the engaging member 18 can be rotated without being caught on the support plate 28.
Note that the table main body 29 is also provided with a mechanism for setting the printed circuit board 1 at a reference position and ejecting the printed circuit board 1 after parts have been mounted. Also, the printed circuit board 1 is also attached to the top guide rail 12A.
A leaf spring 19A is provided to prevent rattling.

On the left side of the table body 29 of the XZ table 4A, there is an insertion head for inserting leaded electronic components such as capacitors, as shown in FIGS. 1 and 4, so as to face the printed circuit board 1 held by the XZ table 4A. An insertion head mechanism 36 having 35 is provided. Further, on the right side of the table main body 29 facing this, a clinch mechanism 37 for bending (clinching) lead wires of electronic components is disposed.

As shown in FIGS. 1 and 5, a dispenser 38 is provided on the right side of the table main body 29 of the XZ table 4B and is movable back and forth for applying adhesive to the chip-shaped electronic component mounting position of the printed circuit board 1. . Further, a mounting head mechanism 41 having a mounting head 40 for mounting a chip-shaped electronic component is provided in parallel thereto. In addition, XZ table 4B
The configuration itself may be the same as the XZ table 4A.

As shown in FIGS. 1 and 6, on the left side of the table body 29 of the XZ table 4C, irregularly shaped electronic components such as a variable resistor and a trimmer capacitor are placed so as to face the printed circuit board 1 held by the XZ table 4C. An insertion head mechanism 46 is provided having an insertion head 45 for inserting the. Further, on the right side of the table main body 29 facing this, a clinch mechanism 47 that bends (clinches) the leads of the irregularly shaped electronic component is disposed. Note that the configuration of the XZ table 4C itself may be the same as the XZ table 4A.

FIG. 7 shows an example of the insertion head 35,
A pair of clamping members 51 that clamp the lead wires of the electronic component 50, and a push rod 5 that pushes the main body of the electronic component 50.
2.

FIG. 8 shows an example of the mounting head 40,
It includes a suction pin 56 for vacuum suctioning the chip-shaped electronic component 55, a spring 57 that biases the pin 56 in a direction to project, and a vacuum suction path 58.

In the above configuration, in the carry-in board transfer path 2, the rear end of the printed circuit board 1 is pushed by the engagement member 18 due to the intermittent running of the chain 17, and moves forward by a certain amount.
The printed circuit board 1 is fed into the XZ table 4A in a vertical state.

The printed board 1 on the XZ table 4A is set at a predetermined position on the table body 29, and the board positioning pins 11 fit into the positioning holes 10 on the board side to position the printed board 1. Next, the insertion head 35, which has received the electronic components 50 with leads sequentially from the component supply section 34, performs a predetermined insertion operation from the left side of the printed circuit board 1 to print the lead wires of the electronic components 50 as shown in FIG. Insert it into the hole on board 1. Along with this, the right clinch mechanism 37
Accordingly, the lead wires of the electronic component 50 are bent. Such operations are repeatedly performed at necessary locations on the printed circuit board 1.

The printed circuit board 1 on which the leaded electronic component 50 has been inserted is then sent to the XZ table 4B.
The printed board 1 on the XZ table 4B is set at a predetermined position on the table body 29, and the board positioning pins 11 fit into the positioning holes 10 on the board side to position the printed board 1. Then, place the dispenser 3 at the mounting position of the chip-shaped electronic component 55.
8, adhesive is applied to the substrate surface. Thereafter, the chip-shaped electronic components 5 are sequentially supplied from the component supply section 42.
The mounting head 40 having received the supply of the printed circuit board 1 repeatedly performs a predetermined mounting operation from the right side of the printed circuit board 1 as shown in FIG.

The printed circuit board 1 on which the chip-shaped electronic component 55 has been mounted is further fed to the XZ table 4C. The printed board 1 on the XZ table 4C is set at a predetermined position on the table body 29, and the board positioning pins 11 fit into the positioning holes 10 on the board side to position the printed board 1. Then,
The insertion head 45, which has been sequentially supplied with irregularly shaped electronic components from the component supply section 44, performs a predetermined insertion operation from the left side of the printed circuit board 1, and inserts the leads of the irregularly shaped electronic components into the holes of the printed circuit board 1. At the same time, the right clinch mechanism 47 bends the leads of the irregularly shaped electronic component. Such operations are repeatedly performed at necessary locations on the printed circuit board 1.

The printed circuit boards 1 that have been inserted into the XZ table 4C are sequentially discharged to the unloading board transfer path 3.

According to the above embodiment, since the printed circuit board 1 is transported in a vertical state, there is an advantage that it does not take up much space in the horizontal direction. In addition, the printed circuit board 1 is held vertically on the XZ tables 4A, 4B, and 4C, and the insertion heads 35 and 45 are placed on the left side thereof, and the dispenser 38 and the mounting head 40 are placed on the right side, respectively, to invert the board. It is possible to mount electronic components on both sides of the board without any trouble, and work efficiency can be improved.

As shown in FIG. 9, instead of the leaf spring, a pulley 62 is provided on the shaft 61 that engages with the elongated hole 60 of the upper guide rails 12, 12A, and the pulley 62 is moved downward (to hold down the printed circuit board 1) with a spring 63. The printed circuit board 1 may be supported using a structure that biases the printed circuit board 1 in the direction (direction).

Furthermore, a device 70 for inspecting whether components have been reliably mounted on the printed circuit board 1 can be provided in the middle of the unloading board transfer path 3, as shown by the dashed line in FIG.

As explained above, according to the electronic component mounting method of the present invention, a printed circuit board is slidably supported vertically and sequentially transferred to a plurality of vertical tables movable in horizontal and vertical directions. In addition, electronic components with leads are mounted on each vertical table.
By performing the mounting of chip-shaped electronic components or other irregularly shaped electronic components, it is possible to reduce the horizontal space and enable the mounting of electronic components on both sides of the printed circuit board, which in turn improves the mounting efficiency. can be made possible.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view of an embodiment of the electronic component mounting method according to the present invention, and FIG.
A front view showing the XZ table, Fig. 3 is a side sectional view of a substrate transfer path equipped with an upper guide rail and a lower guide rail, Fig. 4 is a side sectional view at the XZ table 4A position, and Fig. 5 is a side sectional view of the XZ table 4B. 6 is a side sectional view at the XZ table 4C position, FIG. 7 is a perspective view showing an example of the insertion head, FIG. 8 is a side sectional view showing an example of the mounting head, and FIG. 9 is a side sectional view showing an example of the insertion head. It is a front view which shows another example of a structure of an upper surface guide rail part. 1...Printed circuit board, 2...Input side board transfer path, 3...Output side board transfer path, 4A, 4B, 4C
...XZ table, 12,12A...Top guide rail, 13,13A...Bottom guide rail, 1
7... Chain, 35, 45... Insertion head, 3
8...Dispenser, 40...Mounting head, 50
...Electronic component with leads, 55... Chip-shaped electronic component.

Claims (1)

[Claims] 1. A plurality of horizontal lines are provided between the loading-side transfer path that supports the printed circuit board vertically and slidably, and the unloading-side transfer path that similarly supports the printed circuit board vertically and slidably. An insertion head for inserting electronic components with leads into at least one side of each vertical table, a mounting head for mounting chip-shaped electronic components, and an insertion head for inserting other irregularly shaped electronic components. A head or a dispenser for applying adhesive is provided, and printed circuit boards are sequentially transferred from the carry-in transfer path to each vertical table, and electronic components with leads are inserted, chip-shaped electronic components are mounted, or other operations are performed on each vertical table. An electronic component mounting method characterized in that after inserting the irregularly shaped electronic component, the electronic component is sent to the unloading side transfer path.