JPH0241198B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component mounting method in which electronic components are mounted on a printed circuit board in a state in which it is vertically and slidably supported.

In the conventional electronic component mounting method, the printed circuit board is transferred horizontally, and a mounting head for mounting the electronic component is provided above the board transfer path, and the electronic component is mounted from above. For this reason, a large space is required in the horizontal direction, and if it is necessary to mount electronic components on the bottom surface of the printed circuit board, the printed circuit board must be reversed. Therefore, it is theoretically impossible to attach electronic components to both sides of the printed circuit board at once, and the mechanism for reversing the printed circuit board becomes complicated.

In view of the above points, the present invention has a structure in which a printed circuit board is vertically slidably supported and transferred, and mounting heads for mounting electronic components are arranged on both sides of the transfer path of the printed circuit board. The present invention aims to provide an electronic component mounting method that reduces the horizontal space and allows electronic components to be mounted on both sides of a printed circuit board.

Embodiments of the electronic component mounting method according to the present invention will be described below with reference to the drawings.

1 to 3, an upper guide rail 2 and a lower guide rail 3 are provided to vertically and slidably support a printed circuit board 1. As shown in FIGS. The upper surface guide rail 2 is attached to the upper frame 4 via an adjustment bolt 5 so that its vertical position can be adjusted.
The lower guide rail 3 is fixed on the base surface 6. A leaf spring 9 is provided on the upper guide rail 2 to prevent the printed circuit board 1 from wobbling.
In addition, a printed circuit board 1 is attached to the lower guide rail 3.
An endless band, for example a chain 7, runs along the chain 7, and engaging members 8 are attached to the chain 7 at regular intervals to engage with the rear end of the substrate. Board positions A and B, where the printed circuit board 1 is positioned and stopped, are positions where electronic components are mounted, and the board is positioned so that it fits into the positioning holes 10 of the printed circuit board 1 at these positions. A pin 11 is arranged along the lower guide rail 3. Positioning hole 10 and positioning pin 1
1 constitutes a positioning means for locating (positioning) the printed circuit board 1.

On the left side of board position A, as shown in Figure 2,
A mounting head mechanism 2 having a mounting head 20 for inserting electronic components with lead wires, irregularly shaped electronic components, etc.
1 is provided. Further, on the right side of the substrate position A facing this, a clinch mechanism 22 for bending (clinching) the lead wires of the electronic components is disposed.

On the right side of the board position B, as shown in Figure 3,
Mounting head 3 for mounting chip-shaped electronic components
0 is provided.

FIG. 4 shows an example of the mounting head 20,
A pair of clamping members 23 that clamp the lead wires of the electronic component 40, and a push rod 2 that pushes the main body of the electronic component 40.
4.

FIG. 5 shows an example of the mounting head 30, which includes:
It is provided with a suction pin 32 for vacuum suctioning the chip-shaped electronic component 50, a spring 33 that biases the pin 32 in a protruding direction, and a vacuum suction path 34.

Note that both the mounting head mechanisms 21 and 31 are of an in-line type, and the mounting position of the electronic component on the printed circuit board 1 is constant.

In the above configuration, when the printed circuit board 1 is vertically transported to the board position A by the intermittent running of the chain 7, the board positioning pins 11 fit into the positioning holes 10 on the board side, and the printed circuit board 1 is positioned. Make a delivery. Next, the mounting head 20 receives the electronic components 40 sequentially from the component supply section 25.
A predetermined insertion operation is performed from the left side of the printed circuit board 1, and the lead wire of the electronic component 40 is inserted into the hole of the printed circuit board 1 as shown in FIG. At the same time, the lead wire of the electronic component 40 is bent by the clinch mechanism 22 on the right side. As a result, the electronic component 40 has been attached to the first specific position on the left side of the printed circuit board 1.

Similarly, when the printed circuit board 1 is vertically transferred to the board position B by the intermittent running of the chain 7, the board positioning pins 11 fit into the positioning holes 10 on the board side, and the printed circuit board 1 is positioned. Let's do it. Next, the mounting head 30, which has received the chip-shaped electronic components 50 sequentially from the component supply section 35, performs a predetermined mounting operation from the right side of the printed circuit board 1 to place the electronic components 50 onto the printed circuit board 1 as shown in FIG.
Attach to. As a result, the electronic component 50 has been mounted to the second specific position on the right side of the printed circuit board 1. This operation at substrate position B is normally performed at the same time as the operation at substrate position A.

According to the above embodiment, since the printed circuit board 1 is transported vertically, it does not take up much space in the horizontal direction.
In addition, mounting heads 20 are mounted on the left and right sides of the printed circuit board 1.
By arranging the mounting heads 30, it is possible to mount electronic components on both sides of the board without reversing the board, and work efficiency can be improved.

As shown in FIG. 6, instead of the leaf spring, a pulley 62 is provided on the shaft 61 that engages with the long hole 60 of the top guide rail 2, and the pulley 62 is pushed downward (in the direction of pressing the printed circuit board 1) by the spring 63. A structure that biases the body may also be used.

Further, although the mounting head mechanism 21 and the mounting head mechanism 31 are shown to be index type in which a plurality of heads are rotatably provided, they may be a single head type using one head.

Furthermore, the detection of the substrate positions A and B can be automated using, for example, a position detection element.

Furthermore, in order to prevent the printed circuit board 1 from bending during the mounting operation at the board positions A and B, a bending prevention device may be added to support the board in automation.

As explained above, according to the electronic component mounting method of the present invention, a printed circuit board is vertically slidably supported and moved, and mounting heads for mounting electronic components are provided on both sides of the printed circuit board transfer path. By arranging the electronic components, it is possible to reduce the horizontal space, and also make it possible to mount electronic components on both sides of the printed circuit board, thereby making it possible to improve the mounting efficiency.

[Brief explanation of the drawing]

FIG. 1 is a schematic front view of an embodiment of the electronic component mounting method according to the present invention, FIG. 2 is a side view at board position A, FIG. 3 is a side view at board position B, and FIG.
FIG. 5 is a perspective view showing an example of the mounting head at board position A, FIG. 5 is a side sectional view showing an example of the mounting head at board position B, and FIG. 6 is a front view showing another example of the configuration of the upper guide rail portion. It is. 1... Printed circuit board, 2... Top guide rail, 3... Bottom guide rail, 7... Chain,
20, 30... mounting head, 40, 50... electronic component.

Claims (1)

[Scope of Claims] 1. A printed circuit board is slidably supported and transported vertically by the upper guide rail and the lower guide rail, and a mounting board for mounting electronic components is provided on one side of the transport path of the printed circuit board. A first mounting head for mounting electronic components is disposed on the other side, and a second mounting head for mounting electronic components is disposed on the other side, and when the first positioning means reaches the first board stop position, one side of the printed circuit board is An electronic component is mounted at a first specific position by the first mounting head, and at a second board stopping position by a second positioning means, the electronic component is mounted at a second specific position on the other side of the printed circuit board. An electronic component mounting method characterized in that electronic components are mounted using the second mounting head. 2. The electronic component mounting method according to claim 1, wherein either the first or second mounting head inserts an electronic component with a lead wire into a printed circuit board.