JPH0223324B2 - - Google Patents
Info
- Publication number
- JPH0223324B2 JPH0223324B2 JP59238935A JP23893584A JPH0223324B2 JP H0223324 B2 JPH0223324 B2 JP H0223324B2 JP 59238935 A JP59238935 A JP 59238935A JP 23893584 A JP23893584 A JP 23893584A JP H0223324 B2 JPH0223324 B2 JP H0223324B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- dicing
- adhesive
- adhesive tape
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体基板表面を砥石等でダイシン
グする方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of dicing the surface of a semiconductor substrate with a grindstone or the like.
従来、半導体基板をダイシングする場合、第５
図に示すように、半導体基板１の表面をフランジ
３で回転が与えられる砥石２で直接ダイシングす
るか、第６図に示すように、半導体基板１の表面
に樹脂またはワツクス４等を塗布してから砥石２
でダイシングしていた。
Conventionally, when dicing a semiconductor substrate, the fifth
As shown in the figure, the surface of the semiconductor substrate 1 is directly diced with a grindstone 2 rotated by a flange 3, or as shown in FIG. Kara whetstone 2
I was dicing it.
しかしながら前者は半導体基板１の表面には、
半導体素子が形成されており、数μｍの凹凸があ
るため切粉が表面に固着し易く、後者は、ダイシ
ング後個々のチツプ表面についている樹脂または
ワツクス４を落すために有機溶材で洗浄除去せね
ばならないが、この洗浄は個々のチツプにばらば
らにしてから行なうため互いにぶつかつてチツプ
にキズをつけるという不都合があつた。
However, in the former case, on the surface of the semiconductor substrate 1,
Semiconductor elements are formed thereon, and chips are likely to stick to the surface due to irregularities of several micrometers, and the latter must be removed by cleaning with an organic solvent to remove the resin or wax 4 attached to the surface of each chip after dicing. However, since this cleaning was carried out after separating the chips into individual chips, there was an inconvenience that the chips could be damaged by hitting each other.
本発明の目的は、半導体基板表面に切粉を固着
させることなく、ダイシングする方法を提供する
ことにある。 An object of the present invention is to provide a method for dicing a semiconductor substrate without causing chips to adhere to the surface of the semiconductor substrate.
本発明によれば、半導体基板表面に紫外線硬化
型の糊材の接着剤を用いた粘着テープを張り付
け、その後に砥石によりダイシングを行い、しか
る後に紫外線を照射して前記接着材を硬化させる
ダイシング方法を得る。
According to the present invention, a dicing method includes pasting an adhesive tape using an ultraviolet curable glue on the surface of a semiconductor substrate, then dicing with a grindstone, and then irradiating ultraviolet rays to harden the adhesive. get.
半導体基板表面に張り付ける粘着テープの接着
材を紫外線硬化型の糊材にすることにより、ダイ
シング後に紫外線を照射し接着材を硬化させて接
着力を弱めることが出きるためにダイシング後に
粘着テープを簡単に除去出きる。 By using an ultraviolet curing adhesive for the adhesive tape that is attached to the surface of the semiconductor substrate, it is possible to irradiate ultraviolet rays after dicing to harden the adhesive and weaken the adhesive strength. Can be easily removed.
以下に、本発明を図面を参照しながらより詳細
に説明する。
The present invention will be explained in more detail below with reference to the drawings.
第１図は、本発明に係るダイシング方法を説明
したものである。半導体基板１に粘着テープ５を
固着し、フランジ３で位置が固定されかつ回転力
の与えられたダイヤモンド砥石２を高速回転させ
て粘着テープ５の上から半導体基板１をダイシン
グする。この時粘着テープ５の粘着材は紫外線硬
化型のものを用いる。 FIG. 1 explains the dicing method according to the present invention. An adhesive tape 5 is fixed to a semiconductor substrate 1, and a diamond grindstone 2 fixed in position by a flange 3 and given rotational force is rotated at high speed to dice the semiconductor substrate 1 from above the adhesive tape 5. At this time, the adhesive material for the adhesive tape 5 is an ultraviolet curing type.
次に、第２図に示すように、半導体基板１の表
面から紫外線照射装置６を用いて紫外線７を照射
することにより粘着テープ５の接着材を硬化さ
せ、接着力を低下させる。 Next, as shown in FIG. 2, the surface of the semiconductor substrate 1 is irradiated with ultraviolet rays 7 using an ultraviolet irradiation device 6 to harden the adhesive of the adhesive tape 5 and reduce its adhesive strength.
次に、第３図に示すように別の粘着テープ８を
張り付けダイシングにより分割された粘着テープ
５を第４図に示すように引き剥し、切粉の全く固
着しない清浄な表面の半導体基板１の表面を得る
ことが出きる。 Next, as shown in FIG. 3, another adhesive tape 8 is applied and the adhesive tape 5 divided by dicing is peeled off as shown in FIG. You can get the surface.
このように、本発明によれば表面を清浄に保つ
て半導体基板１を簡単にダイシングできる。
As described above, according to the present invention, the semiconductor substrate 1 can be easily diced while keeping the surface clean.
第１図から第４図は本発明の一実施例に係るダ
イシング方法を説明する各工程での断面図であ
る。第５図および第６図はそれぞれ従来から使用
されている半導体基板のダイシング方法を説明す
る断面図である。
１……半導体基板、２……ダイヤモンド砥石、
３……フランジ、４……ワツクス等、５，８……
粘着テープ、６……紫外線照射装置、７……紫外
線。
FIGS. 1 to 4 are cross-sectional views at each step for explaining a dicing method according to an embodiment of the present invention. FIGS. 5 and 6 are cross-sectional views each illustrating a conventional method of dicing a semiconductor substrate. 1...Semiconductor substrate, 2...Diamond grindstone,
3...Flange, 4...Wax etc., 5,8...
Adhesive tape, 6... Ultraviolet irradiation device, 7... Ultraviolet light.
Claims (1)
剤を用いた粘着テープを張り付け、その後に砥石
によりダイシングを行い、しかる後に紫外線を照
射して前記接着材を硬化させることを特徴とする
ダイシング方法。1. A dicing method characterized by pasting an adhesive tape using an ultraviolet curable glue on the surface of a semiconductor substrate, then dicing with a grindstone, and then irradiating ultraviolet rays to cure the adhesive. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59238935A JPS61116504A (en) | 1984-11-13 | 1984-11-13 | Dicing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59238935A JPS61116504A (en) | 1984-11-13 | 1984-11-13 | Dicing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61116504A JPS61116504A (en) | 1986-06-04 |
| JPH0223324B2 true JPH0223324B2 (en) | 1990-05-23 |
Family
ID=17037463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59238935A Granted JPS61116504A (en) | 1984-11-13 | 1984-11-13 | Dicing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61116504A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0622213U (en) * | 1992-08-21 | 1994-03-22 | 伊藤景パック産業株式会社 | Display carrying box |
| JP2004338137A (en) * | 2003-05-13 | 2004-12-02 | Fuji Photo Film Co Ltd | Material processing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63205209A (en) * | 1987-02-20 | 1988-08-24 | 太陽誘電株式会社 | Method of cutting ceramic wiring substrate |
| JPS6461208A (en) * | 1987-09-01 | 1989-03-08 | Fsk Kk | Cutting method of wafer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0616527B2 (en) * | 1983-07-29 | 1994-03-02 | 関西日本電気株式会社 | Adhesive sheet for semiconductor wafer dicing |
-
1984
- 1984-11-13 JP JP59238935A patent/JPS61116504A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0622213U (en) * | 1992-08-21 | 1994-03-22 | 伊藤景パック産業株式会社 | Display carrying box |
| JP2004338137A (en) * | 2003-05-13 | 2004-12-02 | Fuji Photo Film Co Ltd | Material processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61116504A (en) | 1986-06-04 |
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