JPH0229106B2 - SETSUCHAKUZAISOSEIBUTSU - Google Patents
SETSUCHAKUZAISOSEIBUTSUInfo
- Publication number
- JPH0229106B2 JPH0229106B2 JP9903482A JP9903482A JPH0229106B2 JP H0229106 B2 JPH0229106 B2 JP H0229106B2 JP 9903482 A JP9903482 A JP 9903482A JP 9903482 A JP9903482 A JP 9903482A JP H0229106 B2 JPH0229106 B2 JP H0229106B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- chlorinated
- adhesive
- molecular weight
- polyethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 15
- 229920000573 polyethylene Polymers 0.000 claims description 13
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 12
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 150000003505 terpenes Chemical class 0.000 claims description 10
- 235000007586 terpenes Nutrition 0.000 claims description 10
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 9
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 9
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000002994 raw material Substances 0.000 description 7
- -1 cellosolves Chemical class 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000004709 Chlorinated polyethylene Substances 0.000 description 4
- 239000007900 aqueous suspension Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920001195 polyisoprene Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical class C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000012812 sealant material Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は接着特性及び耐熱性の改善された接着
剤組成物に関する。
スチレン−ブタジエン−スチレンブロツク共重
合物(以下SBSと略称する)またはスチレン−イ
ソプレン−スチレンブロツク共重合物(以下SIS
と略称する)は、物理的にクロスリンクした独特
な構造を有し、有機溶剤に対する易溶性、ストレ
ス−ストレイン物性、高い凝集力、高弾性を有す
るのでホツトメルト型接着剤、コーテイング材、
シーラント材等として利用されている。
本発明者らは、上記SBSまたはSISの接着剤と
しての性能上の改善を図るべく種々検討を行つた
結果、これにテルペン樹脂および特定分子量の塩
素化ポリエチレンまたは塩素化エチレン−酢酸ビ
ニル共重合物を配合した組成物が接着強度を著し
く向上させ、また耐熱性においても優れた性質を
与えることを見出し、本発明に至つたものであ
る。すなわち、本発明は、(a)SBSまたはSIS、(b)
テルペン樹脂及び(c)分子量10000〜100000のポリ
エチレンもしくはエチレン−酢酸ビニル共重合物
を塩素化した塩素化エチレン系ポリマーを含む接
着剤組成物である。本発明のSBSまたはSISとし
ては、ポリブタジエンもしくはポリイソプレンに
スチレンモノマーを共重合せしめたブロツク共重
合物がよく、通常ポリブタジエンもしくはポリイ
ソプレン70〜86重量%にスチレンモノマー30〜14
重量%共重合せしめたもので、得られたブロツク
共重合物の20℃における10重量%トルエン溶液粘
度が10〜100センチポイズのものが好ましく用い
られる。
テルペン樹脂は、一般にエラストマーへの相溶
性に優れ粘着性があるので粘着助剤として広く用
いられているが、本発明においては、その目的上
軟化点70〜100℃で20℃における40重量%トルエ
ン溶液粘度が1〜20センチポイズのものが好まし
く用いられる。
本発明に用いられる塩素化エチレン系ポリマー
としては、分子量10000〜100000のポリエチレン
もしくはエチレン−酢酸ビニル共重合物を原料と
して、これを残存結晶をなくすように調節しなが
ら塩素化したゴム状物が好ましい。
このゴム状物の溶解性パラメーター(SP値)
は濁点滴定法による測定値は9.1〜10.0であつて、
上記SBSまたはSISのポリスチレン部分のSP値
8.9、ポリブタジエン部分のSP値8.4、ポリイソプ
レン部分のSP値8.1と近い値を有しているので有
機溶剤存在下でのこれらの相溶性は非常に良好で
あつた。なお、ここにいうSP値とは相溶性を示
す目安となるもので、両者のSP値が近似すると
き両者は相溶性があると推定される。
本発明に用いられる塩素化エチレン系ポリマー
は比較的分子量が高いため熱的に安定であり、し
かも引張強度が大きく、高い伸び率を有してい
る。従つて、これをSBSもしくはSISにブレンド
した場合、これがSBSもしくはSISの高凝集力を
緩和する役目を果たし、それらの接着時における
耐熱性とハクリ強度を向上させるものと考えられ
る。
本発明の塩素化エチレン系ポリマーの原料分子
量が10000未満のものでは、引張強さ、伸び率等
のゴム弾性は低下し、更には熱安定性も劣るため
好ましくない。
また原料分子量が100000をこえるものは、得ら
れた塩素化物の溶液粘度が極端に高くなり、作業
性を害する他、SBSもしくはSISへの配合量も小
さくなり、本発明の目的とする効果も望み得な
い。
塩素化エチレン系ポリマーの塩素含量は、通常
30〜50重量%のものが好ましい。この範囲より少
ないものでは有機溶剤に対する溶解性に問題があ
り、こえるものでは耐熱性が低下するので好まし
くない。
また塩素化エチレン系ポリマーの原料がエチレ
ン−酢酸ビニル共重合物の場合、共重合物中の酢
酸ビニル含量は、ゴム弾性、熱安定性の点から20
重量%以下のものが好ましい。
本発明組成物の各成分割合は、(a)SBSまたは
SIS100重量部、(b)テルペン樹脂30〜150重量部、
(c)塩素化エチレン系ポリマー2〜30重量部の範囲
が適当である。(b)成分のテルペン樹脂が上記範囲
外では接着強度が低下する。
また(c)成分の塩素化エチレン系ポリマーが2重
量部未満では改良好果が小さく、30重量部をこえ
ると接着強度、耐熱性が共に低下するようになる
ので好ましくない。
本発明組成物には通常使用される如き各種の配
合剤を添加することができる。
例えば充填材として炭酸カルシウム、タルク、
クレー、マイカ、アスベスト、アルミナ、エロジ
ル等があり、無機顔料、有機顔料による着色も可
能である。
本発明組成物はこれを有機溶剤に溶解して使用
される。
有機溶剤としてはベンゼン、トルエン、キシレ
ン等の芳香族化合物をベースとしてこれにケトン
類、アルコール類、セロソルブ類、炭化水素系溶
剤を少量添加したものが用いられる。
本発明組成物の用途としては接着剤の他、プラ
イマー塗料、シーリング材などとして利用され
る。
以下実施例によつて説明する。
なお、各例におけるピール強度、耐熱温度は以
下の試験法による。
ピール強度
厚さ0.4mmで大きさ20mm×150mmのポリアセター
ル板を接着部分20mm×40mmを有するL型板とし、
これを2枚用いてこの接着部分に各例組成物を塗
布し、溶剤を揮散させた後両者を重ねて常温で30
Kg/cm2の圧力を加えて接着させた。
引張試験機にて常温でこの2枚のL型板を上下
に引張り、接着面との90°ハクリ強度を測定した。
耐熱温度
ピール強度測定の場合と同様にして2枚のL型
板を接着させた。エアーオーブン中でこの2枚の
L型板にて上下に30gの一定荷重をかけ、この状
態で昇温速度1℃/分で加温していき、接着部分
が15mmハクリしたときの温度を耐熱温度として示
した。
実施例1〜6、比較例1〜5
表1に示す各組成物をトルエンに溶解させて各
例とも30重量%溶液とした。
これら接着剤溶液を用いてピール強度および耐
熱温度を測定し表1に併わせて示した。なお、各
例に用いた塩素化ポリエチレンは、分子量50000
のポリエチレンを原料として水性懸濁下で塩素化
した塩素含有量45重量%のゴム状ポリマーであ
り、SISは、シエル化学社製「カリフレツクス
TR1107」(20℃における10重量%トルエン溶液
粘度60センチポイズ)、テルペン樹脂は日本ゼオ
ン社製合成テルペン樹脂「クイントンA−100」
(軟化点100℃)である。
The present invention relates to adhesive compositions with improved adhesive properties and heat resistance. Styrene-butadiene-styrene block copolymer (hereinafter referred to as SBS) or styrene-isoprene-styrene block copolymer (hereinafter referred to as SIS)
) has a unique physically cross-linked structure, easy solubility in organic solvents, stress-strain physical properties, high cohesive strength, and high elasticity, making it suitable for hot melt adhesives, coating materials,
It is used as a sealant material, etc. As a result of various studies aimed at improving the performance of the above-mentioned SBS or SIS as an adhesive, the present inventors found that terpene resin and chlorinated polyethylene of a specific molecular weight or chlorinated ethylene-vinyl acetate copolymer were added to the adhesive. The inventors have discovered that a composition containing the following significantly improves adhesive strength and also provides excellent heat resistance, leading to the present invention. That is, the present invention provides (a) SBS or SIS; (b)
It is an adhesive composition containing a terpene resin and (c) a chlorinated ethylene polymer obtained by chlorinating polyethylene or ethylene-vinyl acetate copolymer with a molecular weight of 10,000 to 100,000. The SBS or SIS of the present invention is preferably a block copolymer made by copolymerizing polybutadiene or polyisoprene with a styrene monomer, and usually 70-86% by weight of polybutadiene or polyisoprene and 30-14% by weight of styrene monomer.
A block copolymer obtained by weight% copolymerization having a viscosity of a 10% by weight toluene solution at 20°C of 10 to 100 centipoise is preferably used. Terpene resins are generally used as adhesion aids because of their excellent compatibility with elastomers and their adhesive properties. A solution having a viscosity of 1 to 20 centipoise is preferably used. The chlorinated ethylene-based polymer used in the present invention is preferably a rubber-like material obtained by chlorinating polyethylene or ethylene-vinyl acetate copolymer with a molecular weight of 10,000 to 100,000 while adjusting the raw material to eliminate residual crystals. . Solubility parameter (SP value) of this rubbery substance
The measured value by turbidity titration method is 9.1 to 10.0,
SP value of polystyrene part of SBS or SIS above
8.9, the SP value of the polybutadiene portion was 8.4, and the SP value of the polyisoprene portion was close to 8.1, so their compatibility in the presence of an organic solvent was very good. Note that the SP value referred to here is a measure of compatibility, and when the SP values of the two are similar, it is presumed that the two are compatible. The chlorinated ethylene polymer used in the present invention has a relatively high molecular weight, so it is thermally stable, and has high tensile strength and high elongation. Therefore, when this is blended with SBS or SIS, it is thought to play a role in mitigating the high cohesive force of SBS or SIS, and improve the heat resistance and peeling strength when adhering them. If the raw material molecular weight of the chlorinated ethylene polymer of the present invention is less than 10,000, the rubber elasticity such as tensile strength and elongation rate will be lowered, and furthermore, the thermal stability will be poor, which is not preferable. In addition, if the raw material molecular weight exceeds 100,000, the viscosity of the solution of the obtained chlorinated product will be extremely high, which will impair workability and will also reduce the amount to be added to SBS or SIS, which will not achieve the desired effect of the present invention. I don't get it. The chlorine content of chlorinated ethylene polymers is usually
30 to 50% by weight is preferred. If the amount is less than this range, there will be a problem in solubility in organic solvents, and if it exceeds this range, the heat resistance will decrease, which is not preferable. In addition, if the raw material for the chlorinated ethylene polymer is an ethylene-vinyl acetate copolymer, the vinyl acetate content in the copolymer should be 20% from the viewpoint of rubber elasticity and thermal stability.
Preferably, it is less than % by weight. The ratio of each component of the composition of the present invention is (a) SBS or
SIS 100 parts by weight, (b) terpene resin 30 to 150 parts by weight,
(c) A suitable range of 2 to 30 parts by weight of the chlorinated ethylene polymer. If the terpene resin of component (b) is outside the above range, the adhesive strength will decrease. Further, if the amount of the chlorinated ethylene polymer (c) is less than 2 parts by weight, the improvement effect will be small, and if it exceeds 30 parts by weight, both adhesive strength and heat resistance will decrease, which is not preferable. Various commonly used additives can be added to the composition of the present invention. For example, calcium carbonate, talc,
There are clay, mica, asbestos, alumina, Erosil, etc., and it is also possible to color with inorganic pigments and organic pigments. The composition of the present invention is used by dissolving it in an organic solvent. The organic solvent used is based on an aromatic compound such as benzene, toluene, or xylene, to which a small amount of ketones, alcohols, cellosolves, or hydrocarbon solvents are added. In addition to adhesives, the composition of the present invention can also be used as a primer coating, a sealant, and the like. This will be explained below using examples. In addition, the peel strength and heat resistance temperature in each example are based on the following test method. Peel strength A polyacetal plate with a thickness of 0.4 mm and a size of 20 mm x 150 mm is made into an L-shaped plate with an adhesive part of 20 mm x 40 mm.
Using two sheets of this, apply the composition of each example to the adhesive part, and after volatilizing the solvent, overlap them and let them stand for 30 minutes at room temperature.
Adhesion was achieved by applying a pressure of Kg/cm 2 . These two L-shaped plates were pulled up and down at room temperature using a tensile tester, and the 90° peel strength with the adhesive surface was measured. Heat Resistant Temperature Two L-shaped plates were bonded together in the same manner as in the case of peel strength measurement. A constant load of 30g is applied on the top and bottom of these two L-shaped plates in an air oven, and in this state, the temperature is heated at a rate of 1℃/min.The temperature when the adhesive part is peeled off by 15mm is the heat resistance. Shown as temperature. Examples 1 to 6, Comparative Examples 1 to 5 Each composition shown in Table 1 was dissolved in toluene to form a 30% by weight solution. Using these adhesive solutions, the peel strength and heat resistance temperature were measured and are also shown in Table 1. The chlorinated polyethylene used in each example has a molecular weight of 50,000.
SIS is a rubber-like polymer with a chlorine content of 45% by weight that is chlorinated in aqueous suspension using polyethylene as a raw material.
TR1107” (viscosity of 10% by weight toluene solution at 20°C 60 centipoise), terpene resin is Nippon Zeon’s synthetic terpene resin “Quinton A-100”
(softening point 100℃).
【表】
実施例7〜8、比較例6
塩素化ポリエチレンとして、分子量20000のポ
リエチレンを水性懸濁下に塩素化した塩素含有量
40重量%のゴム状塩素化物を使用し、SBSとし
て、シエル化学社製「カリフレツクスTR1101」
(20℃における10重量%トルエン溶液粘度80セン
チポイズ)、テルペン樹脂として、日本ゼオン社
製合成テルペン樹脂「クイントンB−170」(軟化
点70℃)を用いた以外は実施例1〜6と同様にし
てピール強度、耐熱温度を測定し、その結果を表
2に示した。[Table] Examples 7 to 8, Comparative Example 6 Chlorine content when polyethylene with a molecular weight of 20,000 is chlorinated in aqueous suspension as chlorinated polyethylene
"Califlex TR1101" manufactured by Ciel Chemical Co., Ltd. is used as SBS using 40% by weight of rubbery chlorinated material.
(Viscosity of 10% by weight toluene solution at 20°C: 80 centipoise); The same procedure as in Examples 1 to 6 was used except that the synthetic terpene resin “Quinton B-170” manufactured by Nippon Zeon Co., Ltd. (softening point: 70°C) was used as the terpene resin. The peel strength and heat resistance temperature were measured, and the results are shown in Table 2.
【表】
実施例 9〜10
塩素化ポリエチレンの代わりに、分子量30000
のエチレン−酢酸ビニル共重合物(酢酸ビニル含
量10重量%)を原料として水性懸濁下に塩素化し
た塩素含量40重量%のゴム状塩素化物を用いた以
外は実施例1〜6と同様にして物性試験を行い、
その結果を表3に示した。[Table] Examples 9-10 Instead of chlorinated polyethylene, molecular weight 30000
The procedure was the same as in Examples 1 to 6, except that a rubbery chlorinated product having a chlorine content of 40% by weight, which was obtained by chlorinating an ethylene-vinyl acetate copolymer (vinyl acetate content: 10% by weight) under aqueous suspension as a raw material, was used. We conducted physical property tests using
The results are shown in Table 3.
【表】
比較例 7
分子量8000と150000のポリエチレンを水性懸濁
下に塩素化した塩素含量35重量%の塩素化物にお
いて、分子量8000のものは、原料ポリエチレンの
融点が低くて塩素化が非常に困難であり、得られ
た塩素化物もプラスチツク状であつて接着性向上
効果も低いものであつた。
また分子量150000のものはトルエン溶液粘度が
極端に高く、実用的粘度まで下げるには組成物含
量を5重量%程度まで上げねばならず接着剤とし
ての実用性に乏しいものであつた。[Table] Comparative Example 7 Among the chlorinated products with a chlorine content of 35% by weight obtained by chlorinating polyethylene with a molecular weight of 8,000 and 150,000 in aqueous suspension, it is extremely difficult to chlorinate the polyethylene with a molecular weight of 8,000 because the melting point of the raw material polyethylene is low. The obtained chlorinated product was also plastic-like and had a low adhesion-improving effect. In addition, those with a molecular weight of 150,000 had an extremely high toluene solution viscosity, and in order to lower the viscosity to a practical level, the composition content had to be increased to about 5% by weight, making it impractical as an adhesive.
Claims (1)
ク共重合物またはスチレン−イソプレン−スチ
レンブロツク共重合物 (b) テルペン樹脂 (c) 分子量10000〜100000のポリエチレンもしく
はエチレン−酢酸ビニル共重合物を塩素化した
塩素化エチレン系ポリマー 上記(a)、(b)、(c)、各成分を含む接着剤組成物。[Scope of Claims] 1 (a) Styrene-butadiene-styrene block copolymer or styrene-isoprene-styrene block copolymer (b) Terpene resin (c) Polyethylene or ethylene-vinyl acetate copolymer with a molecular weight of 10,000 to 100,000 A chlorinated ethylene polymer obtained by chlorinating a substance. An adhesive composition containing each of the above components (a), (b), and (c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9903482A JPH0229106B2 (en) | 1982-06-08 | 1982-06-08 | SETSUCHAKUZAISOSEIBUTSU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9903482A JPH0229106B2 (en) | 1982-06-08 | 1982-06-08 | SETSUCHAKUZAISOSEIBUTSU |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58215470A JPS58215470A (en) | 1983-12-14 |
| JPH0229106B2 true JPH0229106B2 (en) | 1990-06-27 |
Family
ID=14236102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9903482A Expired - Lifetime JPH0229106B2 (en) | 1982-06-08 | 1982-06-08 | SETSUCHAKUZAISOSEIBUTSU |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229106B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5605906B2 (en) * | 2008-12-16 | 2014-10-15 | 株式会社カネカ | Curable composition |
| CN109354813A (en) * | 2018-10-23 | 2019-02-19 | 蚌埠心里程教育科技有限公司 | The ageing-resistant protection cover material of a kind of electronic equipment shell |
-
1982
- 1982-06-08 JP JP9903482A patent/JPH0229106B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58215470A (en) | 1983-12-14 |
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