JPH0237610B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in optical memory disks.

Conventionally, as shown in FIG. 1, this optical memory disk has two disc-shaped transparent substrates (hereinafter referred to as "transparent substrates") 1 and 2 with holes 3 and 4 formed in the center thereof.
Information recording layers 5 and 6 are formed on the intermediate circumferential area, and a hole of about 1 μm is made in the information recording layers 5 and 6 by irradiating laser light from the side of the transparent substrates 1 and 2. Information is reproduced by changing the reflectance depending on the presence or absence of holes.

In this optical memory disk, in order to prevent the information recording layers 5 and 6 from deteriorating due to outside air, especially moisture, the ring-shaped inner spacer 7 is arranged on the inner side of the two transparent substrates 1 and 2 when viewed from the holes 3 and 4. From the opening toward the information recording layers 5 and 6, an inner circumferential gap is secured where the adhesive 8 is filled and applied, and a transparent substrate is formed between this inner circumferential gap and the information recording layers 5 and 6. The ring-shaped outer spacer 9 is installed between the two transparent substrates 1 and 2, and is filled with an adhesive 10 toward the information recording layers 5 and 6 from the outer opening seen from the outer periphery of the two transparent substrates 1 and 2. The outer circumferential gap of the area to be coated is secured, and the information recording layer 5,
It is installed in the space between the transparent substrates 1 and 2 between the transparent substrates 1 and 6. Then, the adhesives 8 and 10 are filled and applied to the inner circumferential gap and the outer circumferential gap, respectively, as described above, and the surrounding transparent substrates 1 and 2 and the ring-shaped inner spacer 7 in the inner circumferential gap, and the outer circumferential gap. The peripheral transparent substrates 1 and 2 and the ring-shaped outer spacer 9 were individually fixed to each other.

However, even if a low-viscosity adhesive is filled and applied to the inner and outer circumferential gaps of a conventional optical memory disk, the adhesive sag on the sides of the disc-shaped transparent substrate before it hardens, and the inner and outer circumferential gaps are filled with adhesive. Filling and coating was very difficult. For this reason, even if the adhesive hardens, there is a drawback that, for example, the transparent substrate 1 and the ring-shaped outer spacer 9 are not fixed to each other. Additionally, if this drawback is to be eliminated, a highly viscous adhesive must be used, which limits the types of adhesives that can be used.

The present invention has been made in order to eliminate the above-mentioned drawbacks, and it is possible to easily apply an adhesive to fill the inner and outer circumferential gaps between the transparent substrate and the ring-shaped inner spacer or the ring-shaped outer spacer. The purpose is to increase the adhesion strength of the adhesive, and also to ease the restrictions on the adhesives used.

Hereinafter, one embodiment of the present invention will be described in detail based on FIG. Functional parts that are the same as those shown in FIG. 1 are designated by the same reference numerals.

Transparent substrates 1 and 2 in this example have a diameter of 305 mmφ and a thickness of 1.2 mm.
It is a circular plate made of soda lime glass with a diameter of 35 mm and holes 3 and 4 are drilled in its center. For example, a tellurium film (film thickness: 50 to 200 Å, region width: 88 mm) is placed on the intermediate circumferential region of the transparent substrates 1 and 2.
Two transparent substrates 1 and 2 are arranged with their centers aligned and spaced apart from each other by 0.5 mm, with the information recording layers 5 and 6 facing each other.

Next, the ring-shaped inner spacer 7 and the ring-shaped outer spacer 9 of this example are made of PMMA resin plates with a thickness of 0.5 mm, and are formed by punching or other processing into an inner diameter of 39 mmφ and an outer diameter of 43 mmφ and an inner diameter of 296 mmφ and an outer diameter of 300 mmφ, respectively. and is placed between the surfaces of the transparent substrates 1 and 2, aligned with the centers of the holes 3 and 4 of the transparent substrates 1 and 2, described above.

That is, in the ring-shaped inner spacer 7, an inner wire 11 coated with an adhesive, which will be described later, is inserted from the inner opening of the two transparent substrates 1 and 2 toward the information recording layers 5 and 6 as seen from the holes 3 and 4. (In this example, the distance l ₁ from the holes 3 and 4 to the ring-shaped inner spacer 7 is 2 mm.) where the recording layer 5, The ring-shaped outer spacer 9 is installed in the space between the transparent substrates 1 and 2 between the two transparent substrates 1 and 2.
An outer wire 1 to which an adhesive to be described later is attached is directed toward the recording layers 5 and 6 from the outer opening seen from the outer periphery of the outer wire 1.
2 (in this example, a ring-shaped outer spacer 9 is inserted from the outer periphery of the transparent substrates 1 and 2).
The distance l ₂ to is 2.5 mm. ), and is installed in the space between the transparent substrates 1 and 2 between the outer circumferential gap and the recording layers 5 and 6.

Next, a glass fiber inner wire 11 with a diameter of about 0.45 mmφ is placed in a bath 13 as shown in FIG. 3, and a thermosetting epoxy adhesive (cured by holding at room temperature for 24 hours) 8 The amount of adhesive 8 adhered to the surface of the inner wire 11 was immersed in a solution of Adhere while controlling. An adhesive 10 made of the same material as the adhesive 8 is attached to the outer wire 12 made of glass fiber having a diameter of about 0.45 mm in the same manner as the inner wire 11.

Next, the inner wire 11 to which the adhesive 8 is attached and the outer wire 12 to which the adhesive 10 is attached are wound once around the inner circumferential gap and the outer circumferential gap, respectively, together with the adhesives 8 and 10. insert. Then, the adhesives 8 and 10 filled in the inner circumferential gap and the outer circumferential gap are cured together with the inner wire 11 and the outer wire 12, and the two transparent substrates around the inner circumferential gap are cured. 1,
2 and the ring-shaped inner spacer, and the two surrounding transparent substrates in the outer peripheral cavity and the ring-shaped outer spacer are individually fixed.

According to this example, the adhesive is cured with the inner wire or the outer wire inserted into the inner and outer circumferential gaps. This prevents the adhesive from moving toward the outer periphery of the transparent substrate, and also causes the adhesive on the outer periphery of the transparent substrate than the outer wire to move toward the side of the transparent substrate due to the surface tension between the outer wire and the adhesive on the outer periphery. It is effective in preventing drooling. Further, according to this example, since the inner wire and the outer wire are inserted, the thickness of the adhesive itself is reduced, and the adhesion strength between the two transparent substrates and the ring-shaped inner and outer spacers is increased.

FIG. 4 is a sectional view showing another embodiment of the optical memory disk according to the present invention. In this embodiment, a ring-shaped inner spacer 14 and a ring-shaped outer spacer 1 are shown.
5 is molded integrally with the transparent substrate 2 below, and an inner wire or an outer wire made of Tetron and having a diameter of 0.2 mmφ is inserted into the inner and outer circumferential gaps together with an adhesive, respectively. In this example, since the inner and outer wires have a small cross-sectional diameter, the adhesive is not attached to the surface of the wires as large as the gap between the upper and lower transparent substrates, so the inner and outer wires are wound twice. ing.

The above is not limited to the substances listed in the examples above,
The transparent substrate material may be plastic made of resin such as acrylic, polyvinyl chloride, polycarbonate, or polystyrene, or glass such as quartz, and the ring-shaped inner spacer and ring-shaped outer spacer may be made of the aforementioned plastics, glass, or aluminum. , metals such as nickel and stainless steel may be used.The adhesive is also related to the cross-sectional size of the inner wire and outer wire, but if the viscosity is 300 cps or less, the adhesive will not flow out to the side of the transparent substrate. Attention must be paid to the size of the cross section ^of the inner wire or outer wire as in Therefore, an adhesive with a pressure of 300 to several 10 ⁵ cps or a thixotropic adhesive is preferable. Next, the material of the inner wire and the outer wire may be resin such as nylon, polyethylene, or vinyl chloride, or metal such as aluminum or copper. In addition, the cross-sectional sizes of the inner wire and the outer wire may be large enough to be inserted into the inner circumferential gap and the outer circumferential gap, respectively, but desirably, the cross-sectional size of the inner wire and the outer wire should be smaller than the thickness of the ring-shaped inner spacer and the outer spacer. If the inner and outer wires are very thin, it is necessary to wrap and insert the wires into the inner or outer cavity many times, which reduces work efficiency; on the other hand, if the wires are very thick, Since sufficient adhesion cannot be obtained, the cross-sectional size of the wire is preferably (1/10) to (9/10) of the thickness of the spacer. Further, the shape of the cross section of the wire is not limited to a circle. Next, the number of times the inner wire and outer wire are wound and inserted into the inner circumferential gap and the outer circumferential gap should be at least once, and the cross-sectional size of the inner wire and the outer wire, the viscosity of the adhesive, etc. It may be determined as appropriate.

As described above, according to the present invention, strong adhesion is possible, there is no need to strictly select the adhesive, and workability is improved by applying adhesive to the inner wire and outer wire and wrapping it around the inner and outer gaps. Since it is inserted by attaching it, it is improved several times and also has the effect of saving adhesive.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a conventional optical memory disk, FIG. 2a is a sectional view showing an embodiment of the present invention, FIG. 2b is a partially enlarged view of FIG. FIG. 4 is a schematic diagram illustrating an example of a method of applying adhesive on the surfaces of inner and outer wires that may be used; FIG. 4 is a cross-sectional view illustrating another embodiment of the present invention; 1, 2... Disc-shaped transparent substrate, 3, 4... Hole, 5, 6
...Recording layer, 7,14...Ring-shaped inner spacer,
8, 10... Adhesive, 9, 15... Ring-shaped outer spacer, 11... Inner wire, 12... Outer wire.

Claims (1)

[Claims] 1. The hole is placed between the two disc-shaped transparent substrates in such a direction that the information recording layers attached on the intermediate circumferential regions of the two disc-shaped transparent substrates having a hole in the center face each other. a ring-shaped inner spacer and a ring-shaped outer spacer are placed, respectively, with an inner circumferential gap and an outer circumferential gap facing the information recording layer from the inner opening viewed from the side and the outer opening viewed from the outer periphery; The inner circumferential gap and the outer circumferential gap are each filled with an adhesive, and a wire is interposed in at least one of the inner circumferential gap and the outer circumferential gap to bond the two disc-shaped transparent substrates together. An optical memory disk characterized by being fixed.