JPH0245356B2 - ARUMINIUMUSHINPURINTOHAISENYOKIBANNOSEIZOHOHO - Google Patents
ARUMINIUMUSHINPURINTOHAISENYOKIBANNOSEIZOHOHOInfo
- Publication number
- JPH0245356B2 JPH0245356B2 JP2361883A JP2361883A JPH0245356B2 JP H0245356 B2 JPH0245356 B2 JP H0245356B2 JP 2361883 A JP2361883 A JP 2361883A JP 2361883 A JP2361883 A JP 2361883A JP H0245356 B2 JPH0245356 B2 JP H0245356B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- printed wiring
- wiring board
- resin
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 20
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- 229920002050 silicone resin Polymers 0.000 claims description 12
- 238000007743 anodising Methods 0.000 claims description 11
- 239000005871 repellent Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 4
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 235000011007 phosphoric acid Nutrition 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000005488 sandblasting Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000036571 hydration Effects 0.000 description 2
- 238000006703 hydration reaction Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は熱クラツクの発生しにくいアルミニウ
ム芯プリント配線用基板の製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an aluminum core printed wiring board that is less likely to cause thermal cracks.
従来、アルミニウム芯プリント配線用基板はア
ルミニウム基板とその上の樹脂皮膜との密着性を
向上させるために、また耐電圧を向上させるため
にアルミニウム基板を陽極酸化して酸化アルミニ
ウム皮膜を形成させていた。そのためにプリント
配線基板の製造工程中、特にめつき工程及びエツ
チング工程中に、前記酸化アルミニウム皮膜の水
和封孔が起り、その後の熱処理工程においてクラ
ツクが発生し、電気的絶縁性に関して信頼性に乏
しい欠点があつた。 Conventionally, aluminum core printed wiring boards have been produced by anodizing the aluminum substrate to form an aluminum oxide film in order to improve the adhesion between the aluminum substrate and the resin film on it, and to improve the withstand voltage. . For this reason, hydration sealing of the aluminum oxide film occurs during the manufacturing process of printed wiring boards, especially during the plating process and the etching process, and cracks occur in the subsequent heat treatment process, resulting in poor electrical insulation reliability. There were some shortcomings.
本発明は従来のアルミニウム芯プリント配線用
基板の有する前記欠点を除去、改良した製造方法
を提供することを目的とし、アルミニウム基板を
陽極酸化して形成させた酸化アルミニウム皮膜に
存在する微細孔に揆水性樹脂を含浸し、さらにそ
の上に熱硬化性樹脂皮膜を形成させることを特徴
とするものである。 The purpose of the present invention is to eliminate the above-mentioned drawbacks of conventional aluminum-core printed wiring boards and to provide an improved manufacturing method. It is characterized by being impregnated with an aqueous resin and further forming a thermosetting resin film thereon.
次に本発明を従来と比較しながら、図面に基づ
いて説明する。 Next, the present invention will be explained based on the drawings while comparing it with the conventional technology.
第１図は従来のアルミニウム芯プリント配線用
基板の縦断面図であり、アルミニウム基板１の少
なくとも一面を陽極酸化して酸化アルミニウム皮
膜２を形成させた後に、その上に樹脂皮膜３を形
成させている。このアルミニウム芯プリント配線
用基板を使用したプリント配線基板は、その製造
工程中、特にめつき工程及びエツチング工程中
に、湿気が前記樹脂皮膜３を浸透するため、前記
酸化アルミニウム皮膜２の水和封孔が起り、その
後の熱処理工程においてクラツクが発生してい
た。これに対して第２図は本発明の製造方法によ
るアルミニウム芯プリント配線用基板の縦断面図
であり、アルミニウム基板１の少なくとも一面を
陽極酸化して酸化アルミニウム皮膜２を形成させ
た後に、前記酸化アルミニウム皮膜２に存在する
微細孔４に揆水性樹脂５を含浸し、さらに加熱硬
化し、次いで熱硬化性樹脂を塗布し、さらに加熱
硬化して樹脂皮膜３を形成させる。このアルミニ
ウム芯プリント配線用基板を使用したプリント配
線基板は、その製造工程中、特にめつき工程及び
エツチング工程中に、湿気が前記樹脂皮膜３を浸
透しにくいため、前記酸化アルミニウム皮膜２の
水和封孔が起りにくく、その後の熱処理工程にお
いてクラツクが発生しにくい。さらに熱クラツク
が発生しにくくするためには、リン酸、クロム酸
の何れか少なくとも１種との溶液中で陽極酸化し
て酸化アルミニウム皮膜２を形成させることが好
ましい。この理由はリン酸、クロム酸以外の溶
液、例えば硫酸溶液或いはシユウ酸溶液中で陽極
酸化して形成させた酸化アルミニウム皮膜に比べ
てその微細孔４が比較的大きいために、酸化アル
ミニウム皮膜２とアルミニウム基板１との熱膨張
係数の差が吸収されることによるものであると考
えられる。ところで揆水性樹脂５としてはシリコ
ーン樹脂が好ましく、特にその樹脂濃度が１％以
下の樹脂溶液に含浸することが重要である。この
理由はシリコーン樹脂濃度が１％を越えると微細
孔４がシリコーン樹脂でほぼ完全に封着されるた
めに、その上の樹脂皮膜３の密着が悪くなること
によるものである。さらに前記樹脂皮膜３の密着
を良くするためには、陽極酸化前にアルミニウム
基板面にサンドブラスト処理を施すことが好まし
い。この理由は陽極酸化後の酸化アルミニウム皮
膜２の表面荒さが大きくなることによるものであ
る。第３図は、このサンドブラスト処理を施した
アルミニウム芯プリント配線用基板の縦断面図を
示したものである。 FIG. 1 is a vertical cross-sectional view of a conventional aluminum core printed wiring board, in which at least one surface of an aluminum substrate 1 is anodized to form an aluminum oxide film 2, and then a resin film 3 is formed thereon. There is. In a printed wiring board using this aluminum core printed wiring board, moisture permeates the resin film 3 during the manufacturing process, particularly during the plating process and the etching process, so that the aluminum oxide film 2 is hydrated and sealed. Pores were formed and cracks occurred during the subsequent heat treatment process. On the other hand, FIG. 2 is a longitudinal cross-sectional view of an aluminum core printed wiring board produced by the manufacturing method of the present invention, in which at least one surface of the aluminum substrate 1 is anodized to form an aluminum oxide film 2, and then the oxidized A water-repellent resin 5 is impregnated into the micropores 4 existing in the aluminum film 2 and further heated and cured, and then a thermosetting resin is applied and further heated and cured to form the resin film 3. In a printed wiring board using this aluminum core printed wiring board, during the manufacturing process, especially during the plating process and the etching process, moisture does not easily penetrate the resin film 3, so the aluminum oxide film 2 is hydrated. Pore sealing is less likely to occur, and cracks are less likely to occur during the subsequent heat treatment process. Furthermore, in order to make thermal cracks less likely to occur, it is preferable to form the aluminum oxide film 2 by anodic oxidation in a solution containing at least one of phosphoric acid and chromic acid. The reason for this is that the micropores 4 are relatively large compared to aluminum oxide films formed by anodizing in solutions other than phosphoric acid or chromic acid, such as sulfuric acid solutions or oxalic acid solutions. This is thought to be due to the fact that the difference in thermal expansion coefficient with the aluminum substrate 1 is absorbed. By the way, the water-repellent resin 5 is preferably a silicone resin, and it is particularly important to impregnate the silicone resin in a resin solution having a resin concentration of 1% or less. The reason for this is that when the silicone resin concentration exceeds 1%, the micropores 4 are almost completely sealed with the silicone resin, and the adhesion of the resin film 3 thereon becomes poor. Furthermore, in order to improve the adhesion of the resin film 3, it is preferable to perform sandblasting on the aluminum substrate surface before anodizing. The reason for this is that the surface roughness of the aluminum oxide film 2 increases after anodizing. FIG. 3 shows a vertical cross-sectional view of the aluminum core printed wiring board which has been subjected to this sandblasting treatment.
次に本発明を実施例ならびに比較例について説
明する。 Next, the present invention will be explained with reference to Examples and Comparative Examples.
実施例 １
アルミニウム基板の少なくとも一面をリン酸溶
液中の正リン酸換算濃度55ｇ／、液温25℃、電
流密度1A／ｄm2、電圧120Vの条件により陽極酸
化して酸化アルミニウム皮膜厚20μを形成させた
後、水洗し、乾燥した。次にシリコーン樹脂溶液
（トーレ・シリコーン(株)製、商品名SE9140デイス
パージヨン）中のシリコーン樹脂濃度１％のシリ
コーン樹脂溶液に含浸した後、80℃、30分予備乾
燥し、さらに120℃、１時間硬化した。次にポリ
イミドワニス（ローヌ・プーラン社製、商品名ケ
ルイミド601のＮ−メチルピロリドン溶液）に浸
漬してポリイミド樹脂を塗布した後、80℃、30分
予備乾燥し、さらに180℃、１時間硬化してポリ
イミド樹脂皮膜厚20μを形成させた。Example 1 At least one surface of an aluminum substrate was anodized to form an aluminum oxide film with a thickness of 20μ by anodizing at a concentration of 55g/orthophosphoric acid in a phosphoric acid solution, a liquid temperature of 25°C, a current density of 1A/dm 2 , and a voltage of 120V. After that, it was washed with water and dried. Next, it was impregnated with a silicone resin solution (manufactured by Toray Silicone Co., Ltd., trade name: SE9140 dispersion) with a silicone resin concentration of 1%, pre-dried at 80°C for 30 minutes, and further dried at 120°C. It was cured for 1 hour. Next, a polyimide resin was applied by dipping it in polyimide varnish (N-methylpyrrolidone solution of Kerimide 601, manufactured by Rhone Poulenc), pre-dried at 80°C for 30 minutes, and then cured at 180°C for 1 hour. A polyimide resin film with a thickness of 20μ was formed.
このアルミニウム芯プリント配線用基板を使用
したプリント配線基板は、その製造工程中、特に
めつき工程及びエツチング工程後の200℃以上の
熱処理工程においてクラツクが発生しなかつた。 A printed wiring board using this aluminum core printed wiring board did not generate any cracks during its manufacturing process, especially during the heat treatment process at 200°C or higher after the plating process and the etching process.
実施例 ２
アルミニウム基板の少なくとも一面をクロム酸
溶液中の無水クロム酸換算濃度30ｇ／、液温40
℃、電流密度0.5A／ｄm2、電圧100Vの条件によ
り陽極酸化して酸化アルミニウム皮膜厚20μを形
成させた後、水洗し、乾燥した。次にシリコーン
樹脂溶液（トーレ・シリコーン(株)製、商品名
SE9140デイスパージヨン）中のシリコーン樹脂
濃度0.5％のシリコーン樹脂溶液に含浸した後、
80℃、30分予備乾燥し、さらに120℃、１時間硬
化した。次に耐熱エポキシワニス（エポキシ・テ
クノロジー社製、商品名エポテツク353NDのメ
チルエチルケトン溶液）に浸漬して耐熱エポキシ
樹脂を塗布した後、50℃、30分予備乾燥し、さら
に120℃、１時間硬化して耐熱エポキシ樹脂皮膜
厚20μを形成させた。このアルミニウム芯プリン
ト配線用基板を使用したプリント配線基板は、そ
の製造工程中、特にめつき工程及びエツチング工
程後の200℃以上の熱処理工程においてクラツク
が発生しなかつた。Example 2 At least one surface of an aluminum substrate was coated in a chromic acid solution with a concentration of chromic acid anhydride equivalent to 30 g/, and a liquid temperature of 40 g.
C., a current density of 0.5 A/dm 2 , and a voltage of 100 V to form an aluminum oxide film with a thickness of 20 μm, followed by washing with water and drying. Next, silicone resin solution (manufactured by Toray Silicone Co., Ltd., trade name)
After impregnation with silicone resin solution with silicone resin concentration of 0.5% in SE9140 dispersion),
It was pre-dried at 80°C for 30 minutes and further cured at 120°C for 1 hour. Next, a heat-resistant epoxy resin was applied by dipping it in a heat-resistant epoxy varnish (manufactured by Epoxy Technology Co., Ltd., trade name: Epotek 353ND, methyl ethyl ketone solution), pre-dried at 50°C for 30 minutes, and then cured at 120°C for 1 hour. A heat-resistant epoxy resin film with a thickness of 20μ was formed. A printed wiring board using this aluminum core printed wiring board did not have any cracks during its manufacturing process, especially during the heat treatment process at 200°C or higher after the plating process and the etching process.
実施例 ３
アルミニウム基板面にアルミナ研摩材を使用し
てサンドブラスト処理を施した後、超音波洗浄に
よりアルミナ研摩材を除去したアルミニウム基板
の少なくとも一面をリン酸溶液中の正リン酸換算
濃度55ｇ／、液温25℃、電流密度1A／ｄm2、
電圧120Vの条件により陽極酸化して酸化アルミ
ニウム皮膜厚20μを形成させた後、水洗し、乾燥
した。次にシリコーン樹脂溶液（トーレ・シリコ
ーン(株)製、商品名SE9140デイスパージヨン）中
のシリコーン樹脂濃度１％のシリコーン樹脂溶液
に含浸した後、80℃、30分予備乾燥し、さらに
120℃、１時間硬化した。次にポリイミド系ワニ
ス（三井石油化学工業(株)製）に浸漬してポリイミ
ド系樹脂を塗布した後、80℃、30分予備乾燥し、
さらに180℃、１時間硬化してポリイミド系樹脂
皮膜厚20μを形成させた。このアルミニウム芯プ
リント配線用基板を使用したプリント配線基板
は、その製造工程中、特にめつき工程及びエツチ
ング工程後の200℃以上の熱処理工程においてク
ラツクが発生しなかつた。Example 3 After sandblasting the aluminum substrate surface using an alumina abrasive, at least one surface of the aluminum substrate from which the alumina abrasive was removed by ultrasonic cleaning was treated with a phosphoric acid solution containing 55 g of orthophosphoric acid, Liquid temperature 25℃, current density 1A/dm 2 ,
After anodizing at a voltage of 120 V to form an aluminum oxide film with a thickness of 20 μm, it was washed with water and dried. Next, it was impregnated with a silicone resin solution (manufactured by Toray Silicone Co., Ltd., trade name: SE9140 dispersion) with a silicone resin concentration of 1%, pre-dried at 80°C for 30 minutes, and then
It was cured at 120°C for 1 hour. Next, after applying polyimide resin by dipping it in polyimide varnish (manufactured by Mitsui Petrochemical Industries, Ltd.), it was pre-dried at 80°C for 30 minutes.
Further, it was cured at 180° C. for 1 hour to form a polyimide resin film with a thickness of 20 μm. A printed wiring board using this aluminum core printed wiring board did not generate any cracks during its manufacturing process, especially during the heat treatment process at 200°C or higher after the plating process and the etching process.
比較例 １
アルミニウム基板の少なくとも一面を硫酸溶液
中の硫酸換算濃度183ｇ／、液温25℃、電流密
度1A／ｄm2、電圧10Vの条件により陽極酸化し
て酸化アルミニウム皮膜厚20μを形成させた後、
水洗し、乾燥した。次にエポキシ樹脂ワニス（三
井石油化学工業(株)製）に浸漬してエポキシ樹脂を
塗布した後、50℃、30分予備乾燥し、さらに120
℃、１時間硬化してエポキシ樹脂皮膜厚20μを形
成させた。Comparative Example 1 At least one surface of an aluminum substrate was anodized to form an aluminum oxide film with a thickness of 20 μm under the conditions of a sulfuric acid concentration of 183 g in a sulfuric acid solution, a liquid temperature of 25° C., a current density of 1 A/dm 2 , and a voltage of 10 V. ,
Washed with water and dried. Next, after applying epoxy resin by dipping it in epoxy resin varnish (manufactured by Mitsui Petrochemical Industries, Ltd.), it was pre-dried at 50℃ for 30 minutes, and then
C. for 1 hour to form an epoxy resin film with a thickness of 20 μm.
このアルミニウム芯プリント配線用基板を使用
したプリント配線基板は、その製造工程中、特に
めつき工程及びエツチング工程後の200℃以上の
熱処理工程においてクラツクが発生した。 In the printed wiring board using this aluminum core printed wiring board, cracks occurred during the manufacturing process, particularly during the heat treatment process at 200°C or higher after the plating process and the etching process.
以上のことにより本発明によればアルミニウム
基板を陽極酸化して形成させた酸化アルミニウム
皮膜に存在する微細孔に揆水性樹脂を含浸し、さ
らにその上に熱硬化性樹脂皮膜を形成させるため
に、このアルミニウム芯プリント配線用基板を使
用したプリント配線基板は、その製造工程中、特
にめつき工程及びエツチング工程中に、前記酸化
アルミニウム皮膜の水和封孔が起りにくく、その
後の熱処理工程においてクラツクが発生しにく
い。また陽極酸化前にアルミニウム基板面にサン
ドブラスト処理を施すために、前記酸化アルミニ
ウム皮膜に揆水性樹脂を含浸しても前記熱硬化性
樹脂皮膜の密着が悪くならない。従つて本発明の
製造方法によるアルミニウム芯プリント配線用基
板を使用したプリント配線基板は電気的絶縁性に
関して信頼性が高いという利点がある。よつて本
発明の製造方法はプリント配線基板の信頼性向上
に寄与すること大であり、プリント配線基板工業
に与える利益は大である。 As described above, according to the present invention, in order to impregnate the micropores existing in the aluminum oxide film formed by anodizing an aluminum substrate with a water-repellent resin, and further form a thermosetting resin film thereon, In printed wiring boards using this aluminum core printed wiring board, hydration sealing of the aluminum oxide film is difficult to occur during the manufacturing process, particularly during the plating process and the etching process, and cracks do not occur during the subsequent heat treatment process. Hard to occur. In addition, since the aluminum substrate surface is subjected to sandblasting before anodization, the adhesion of the thermosetting resin film will not deteriorate even if the aluminum oxide film is impregnated with a water-repellent resin. Therefore, the printed wiring board using the aluminum core printed wiring board produced by the manufacturing method of the present invention has the advantage of being highly reliable in terms of electrical insulation. Therefore, the manufacturing method of the present invention greatly contributes to improving the reliability of printed wiring boards, and brings great benefits to the printed wiring board industry.
第１図は従来のアルミニウム芯プリント配線用
基板の縦断面図、第２図は本発明の製造方法によ
るアルミニウム芯プリント配線用基板の内、陽極
酸化前にサンドブラスト処理を施さない場合の縦
断面図、第３図は同じく陽極酸化前にサンドブラ
スト処理を施す場合の縦断面図である。
１……アルミニウム基板、２……酸化アルミニ
ウム皮膜、３……樹脂皮膜、４……微細孔、５…
…揆水性樹脂。
FIG. 1 is a vertical cross-sectional view of a conventional aluminum-core printed wiring board, and FIG. 2 is a vertical cross-sectional view of an aluminum-core printed wiring board manufactured by the manufacturing method of the present invention, in which sandblasting is not performed before anodization. , FIG. 3 is a longitudinal cross-sectional view in the case where sandblasting is also performed before anodizing. DESCRIPTION OF SYMBOLS 1... Aluminum substrate, 2... Aluminum oxide film, 3... Resin film, 4... Micropore, 5...
...Water repellent resin.
Claims (1)
化して酸化アルミニウム皮膜を形成させた後に、
樹脂濃度が１％以下のシリコーン樹脂溶液に含浸
し、さらに加熱硬化し、次いで熱硬化性樹脂を塗
布し、さらに加熱硬化して樹脂皮膜を形成させる
ことを特徴とするアルミニウム芯プリント配線用
基板の製造方法。 ２ リン酸、クロム酸の何れか少なくとも１種の
溶液中で陽極酸化して酸化アルミニウム皮膜を形
成させることを特徴とする特許請求の範囲第１項
記載のアルミニウム芯プリント配線用基板の製造
方法。 ３ サンドブラスト処理を施したアルミニウム基
板の少なくとも一面を陽極酸化して酸化アルミニ
ウム皮膜を形成させた後に、撥水性樹脂を含浸
し、さらに加熱硬化し、次いで熱硬化性樹脂を塗
布し、さらに加熱硬化して樹脂皮膜を形成させる
ことを特徴とするアルミニウム芯プリント配線用
基板の製造方法。[Claims] 1. After anodizing at least one surface of an aluminum substrate to form an aluminum oxide film,
An aluminum core printed wiring board characterized by being impregnated with a silicone resin solution having a resin concentration of 1% or less, further heated and cured, then coated with a thermosetting resin, and further heated and cured to form a resin film. Production method. 2. The method for manufacturing an aluminum core printed wiring board according to claim 1, which comprises forming an aluminum oxide film by anodizing in a solution of at least one of phosphoric acid and chromic acid. 3 After anodizing at least one side of the sandblasted aluminum substrate to form an aluminum oxide film, it is impregnated with a water-repellent resin, further heat-cured, then a thermosetting resin is applied, and further heat-cured. 1. A method for manufacturing an aluminum core printed wiring board, comprising forming a resin film on the aluminum core printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2361883A JPH0245356B2 (en) | 1983-02-15 | 1983-02-15 | ARUMINIUMUSHINPURINTOHAISENYOKIBANNOSEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2361883A JPH0245356B2 (en) | 1983-02-15 | 1983-02-15 | ARUMINIUMUSHINPURINTOHAISENYOKIBANNOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59149094A JPS59149094A (en) | 1984-08-25 |
| JPH0245356B2 true JPH0245356B2 (en) | 1990-10-09 |
Family
ID=12115593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2361883A Expired - Lifetime JPH0245356B2 (en) | 1983-02-15 | 1983-02-15 | ARUMINIUMUSHINPURINTOHAISENYOKIBANNOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245356B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62222695A (en) * | 1986-03-15 | 1987-09-30 | 松下電工株式会社 | Manufacture of printed wiring board |
| JPS63224391A (en) * | 1987-03-13 | 1988-09-19 | 株式会社アルメックス | Printed wiring board and manufacture of the same |
| JPH01312894A (en) * | 1988-06-10 | 1989-12-18 | Showa Alum Corp | Manufacture of al plate for use with printed circuit board |
-
1983
- 1983-02-15 JP JP2361883A patent/JPH0245356B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59149094A (en) | 1984-08-25 |
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