JPH0216698B2 - - Google Patents
Info
- Publication number
- JPH0216698B2 JPH0216698B2 JP58015813A JP1581383A JPH0216698B2 JP H0216698 B2 JPH0216698 B2 JP H0216698B2 JP 58015813 A JP58015813 A JP 58015813A JP 1581383 A JP1581383 A JP 1581383A JP H0216698 B2 JPH0216698 B2 JP H0216698B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- solution
- aluminum oxide
- polyimide resin
- methylpyrrolidone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Chemical Treatment Of Metals (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本発明は、絶縁放熱シート、特に発熱性電子部
品の内部で発生する熱を効率良く放熱フインまた
は金属放熱板に伝える絶縁放熱シートの製造方法
に関するものである。
従来、パワートランジスタやハイブリツドIC
等の発熱性電子部品は、多量の熱の発生により、
その特性を劣化したり破損するため、絶縁放熱シ
ートを介して放熱フインまたは金属放熱板に取り
付けられていた。絶縁放熱シートとしてはグリー
スを塗布した雲母板やシリコンゴムシートが使用
されているが、熱伝導性があまり優れておらず、
発熱性電子部品の出力が大きくなるに従つて充分
な放熱ができなくなる欠点があつた。
一方、放熱フインや金属放熱板は小型で非常に
熱効率が良いものが出現して来たが、従来の熱伝
導性が充分でない絶縁シートでは、小型で高性能
の放熱フインや金属放熱板を用いても充分な放熱
効果が得られなかつた。またアルミニウム箔を陽
極酸化して形成させた酸化アルミニウム皮膜を有
するものを絶縁放熱シートとして使用することが
考えられている。しかし、これは酸化アルミニウ
ム皮膜が湿気を吸収し、そして電気絶縁性が悪く
なるため電気的信頼性の高い絶縁放熱シートが得
られていない。この構成に一部改良を加えた発明
が特開昭57−135154号公報に開示されている。こ
の発明は、アルミニウム箔の表面を陽極酸化した
後、溶媒可溶性ポリイミド系樹脂をコーテイング
してなる後加工可能な耐熱性積層体である。しか
し、この発明を達成する手段として当該公報に開
示された当該耐熱性積層体の製造方法は、アルミ
ニウム箔に単一の陽極酸化処理を施した後一旦乾
燥し、その後ポリイミド樹脂をコーテイングする
というものである。すなわち、この製造方法では
ただ1回の陽極酸化処理で形成した酸化アルミニ
ウム皮膜であるため耐電圧が低い。それだけでは
なく、この製造方法では一旦乾燥をするため、酸
化アルミニウム皮膜中の微細孔等にポリイミド樹
脂が完全には充填されず、酸化アルミニウム皮膜
の電気的信頼性を向上させることができない。
本発明は、従来の前記欠点を除去した絶縁放熱
シートの製造方法を提供することを目的とし、ア
ルミニウム箔を陽極酸化して、さらにその酸化ア
ルミニウム皮膜を肥厚化させた酸化アルミニウム
皮膜の微細孔を完全に封着する一連の連続的処理
によつて、熱伝導性が高く、電気的に完全な絶縁
皮膜を極めて容易に形成させることを特徴とする
ものである。
次に本発明の絶縁放熱シートの製造方法を図面
に基づいて詳細に説明する。
第1図は本発明の製造方法中アルミニウム箔に
第1回目の陽極酸化を施した後のアルミニウム箔
と酸化アルミニウム皮膜との縦断面図であり、ア
ルミニウム箔1の少なくとも一面を苛性ソーダ溶
液或いはリン酸系溶液中で脱脂、研摩した後、水
洗し、次いで硝酸溶液中で酸洗した後、水洗し、
次いでリン酸、クロム酸の何れか少なくとも1種
の溶液中で陽極酸化して酸化アルミニウム皮膜2
が形成されている。また第2図は前記アルミニウ
ム箔と酸化アルミニウム皮膜とを拡大した縦断面
図であり、前記酸化アルミニウム皮膜2中には微
細孔3が並んで存在し、この微細孔3の最奥端は
アルミニウム箔1の表面近くにまで達している。
また第3図に示す如く前記酸化アルミニウム皮膜
2中には通常酸化アルミニウムが欠落している開
口欠陥孔4ならびに非開口欠陥空洞5の如き欠陥
部が点在している。本発明によれば前記第1回目
の陽極酸化を施した後、水洗し、次いでホウ酸ア
ンモニウム、酒石酸アンモニウムの何れか少なく
とも1種の水溶液とメタノール、エタノール、N
−メチルピロリドンのなかから選ばれる何れか少
なくとも1種との混合溶液中で再び陽極酸化して
さらに酸化アルミニウム皮膜を形成させる。第4
図はこのように第2回目の陽極酸化を施してさら
に酸化アルミニウム皮膜を形成させた後のアルミ
ニウム箔と酸化アルミニウム皮膜とを拡大した縦
断面図であり、微細孔3の最奥端部とアルミニウ
ム箔1との間に形成されている酸化アルミニウム
皮膜は下方のアルミニウム箔中へ侵入成長し、そ
の部分の酸化アルミニウム皮膜厚が厚くなつてい
る。同図中6は上述の酸化アルミニウム皮膜が成
長してその厚さが厚くなつた部分である。前記第
2回目の陽極酸化を施した後、必要により引き続
いてN−メチルピロリドン液中で洗浄後、直ちに
ポリイミド樹脂のN−メチルピロリドン溶液中に
浸漬させた後、前記ポリイミド樹脂を乾燥、硬化
させ、前記酸化アルミニウム皮膜2に存在する微
細孔3と開口欠陥孔4、非開口欠陥空洞5の如き
欠陥部とを前記ポリイミド樹脂により封着させ
る。なお、非開口欠陥空洞5の中にも前記微細孔
3を経てポリイミド樹脂が浸透する。
次に本発明の製造方法中第1回目の陽極酸化処
理について説明する。リン酸、クロム酸の何れか
少なくとも1種の溶液中の正リン酸換算濃度1〜
800g/、無水クロム酸換算濃度1〜400g/、
液温0〜70℃、電流密度0.1〜10A/dm2、電圧
10〜200Vの条件により陽極酸化し、酸化皮膜厚
1〜50μmとなすことが好ましい。
次に第2回目の陽極酸化処理について説明す
る。ホウ酸アンモニウム、酒石酸アンモニウムの
何れか少なくとも1種の水溶液とメタノール、エ
タノール、N−メチルピロリドンのなかから選ば
れる何れか少なくとも1種との混合溶液中の四ホ
ウ酸アンモニウム濃度0.1〜100g/、酒石酸ア
ンモニウム濃度0.1〜100g/、水10〜900g/、
液温0〜70℃、電流密度0.01〜1A/dm2、電圧
10〜1000Vの条件により陽極酸化するが、酸化皮
膜厚の測定が困難であるのでその処理時間を10〜
120minとすることが好ましい。
次に、前記第2回目の陽極酸化処理後のポリイ
ミド樹脂のN−メチルピロリドン溶液中への浸漬
処理について説明する。前記溶液中のポリイミド
樹脂濃度10〜700g/、液温100℃以下とし、そ
の浸漬時間1min以上とすることが好ましい。
ところで本発明によれば、第1回目の陽極酸化
処理、第2回目の陽極酸化処理ならびにポリイミ
ド樹脂溶液中への浸漬処理は連続的に施すことが
必要である。もし前記第1回目の陽極酸化処理と
第2回目の陽極酸化処理とを連続して施さない
と、第1回目の陽極酸化処理により生じた微細孔
に空気が取り込まれ、第2回目の陽極酸化処理が
完全には施されなくなる。また同様の理由により
第2回目の陽極酸化処理とポリイミド樹脂溶液中
への浸漬処理との間に酸化アルミニウム皮膜が乾
燥すると、微細孔中にポリイミド樹脂が完全に充
填されない部分が発生し、酸化アルミニウム皮膜
の電気的信頼性を向上させることができない。即
ち、本発明は、特に酸化アルミニウム皮膜を形成
させる処理と微細孔ならびに欠陥部すなわち開口
欠陥孔ならびに非開口欠陥空洞を封着させる処理
とを連続させることによつて電気的に完全な絶縁
皮膜を極めて容易に形成させることを特徴とする
ものである。なお、第1回目の陽極酸化処理溶液
以外の溶液、例えば硫酸溶液或いはシユウ酸溶液
中での陽極酸化処理により形成させた酸化アルミ
ニウム皮膜は200℃くらいで多数のクラツクを発
生する。しかし、本発明の第1回目の陽極酸化処
理により形成させた酸化アルミニウム皮膜は300
℃以上の高温時でもクラツクを発生しない。この
理由は、第1回目の陽極酸化処理により形成させ
た酸化アルミニウム皮膜の微細孔が比較的大きい
ために、酸化アルミニウム皮膜とアルミニウムと
の熱膨張係数の差が吸収されることによるもので
あると考える。
また第2回目の陽極酸化処理によりさらに酸化
アルミニウム皮膜を形成させることによつて耐電
圧が向上するが、いまだ充分な電気的信頼性に乏
しい。
第2回目の陽極酸化処理後、ポリイミド樹脂溶
液中への浸漬処理により欠陥部すなわち開口欠陥
孔ならびに非開口欠陥空洞をポリイミド樹脂によ
り封着させることによつて耐電圧が向上する。な
お、ポリイミド樹脂は比較的耐熱性ならびに耐薬
品性が高いので、他の樹脂を用いた場合よりも耐
熱性ならびに耐薬品性において優れている。ま
た、前記樹脂により封着された箔表面には前記樹
脂の薄い皮膜が自動的に形成されている。
次に本発明の実施例ならびにその比較例につい
て説明する。
実施例 1
アルミニウム箔の少なくとも一面をリン酸溶液
中の正リン酸換算濃度55g/、液温25℃、電流
密度1A/dm2、電圧120Vの条件により陽極酸化
して酸化アルミニウム皮膜厚20μmを形成させた
後、水洗し、次いでホウ酸アンモニウム水溶液と
N−メチルピロリドンとの混合溶液中の四ホウ酸
アンモニウム濃度10g/、水100g/、液温20
℃、電流密度0.05A/dm2、電圧500V、処理時間
60minの条件により再び陽極酸化し、引き続いて
N−メチルピロリドン溶液中のポリイミド樹脂濃
度200g/、液温25℃、浸漬時間60minの条件に
よりポリイミド樹脂溶液中に浸漬させて、酸化ア
ルミニウム皮膜に存在する微細孔ならびに欠陥部
をポリイミド樹脂により封着させた。前記一連の
連続的処理により形成させた絶縁皮膜は、300℃
でもクラツクを発生せず、300℃での熱処理後の
耐電圧は2.0KV、熱伝導率は0.42cal/sec・cm・
℃であつた。
実施例 2
アルミニウム箔の少なくとも一面をリン酸溶液
中の正リン酸換算濃度55g/、液温25℃、電流
密度1A/dm2、電圧120Vの条件により陽極酸化
して酸化アルミニウム皮膜厚20μmを形成させた
後、水洗し、次いでホウ酸アンモニウム水溶液と
エタノールとの混合溶液中の四ホウ酸アンモニウ
ム濃度7.5g/、水200g/、液温20℃、電流密
度0.05A/dm2、電圧500V、処理時間60minの条
件により再び陽極酸化し、引き続いてN−メチル
ピロリドン液中で洗浄後、直ちにポリイミド樹脂
のN−メチルピロリドン溶液中のポリイミド樹脂
濃度200g/、液温25℃、時間60minの条件によ
りポリイミド樹脂溶液中に浸漬させて、酸化アル
ミニウム皮膜に存在する微細孔ならびに欠陥部を
ポリイミド樹脂により封着させた。前記一連の連
続的処理により形成させた絶縁皮膜は、300℃で
もクラツクを発生せず、300℃での熱処理後の耐
電圧は2.0KV、熱伝導率は0.42cal/sec・cm・℃
であつた。
実施例 3
アルミニウム箔の少なくとも一面をクロム酸溶
液中の無水クロム酸換算濃度30g/、液温40℃、
電流密度0.5A/dm2、電圧100Vの条件により陽
極酸化して酸化アルミニウム皮膜厚20μmを形成
させた後、水洗し、次いで酒石酸アンモニウム水
溶液とメタノールとの混合溶液中の酒石酸アンモ
ニウム濃度7.5g/、水200g/、液温20℃、電
流密度0.05A/dm2、電圧400V、処理時間60min
の条件により再び陽極酸化し、引き続いてN−メ
チルピロリドン液中で洗浄後、直ちにポリイミド
樹脂のN−メチルピロリドン溶液中のポリイミド
樹脂濃度200g/、液温25℃、浸漬時間60minの
条件によりポリイミド樹脂溶液中に浸漬させて酸
化アルミニウム皮膜に存在する微細孔ならびに欠
陥部をポリイミド樹脂により封着させた。前記一
連の連続的処理により形成させた絶縁皮膜は、
300℃でもクラツクは発生せず、300℃での熱処理
後の耐電圧は1.8KV、熱伝導率は0.42cal/sec・
cm・℃であつた。
比較例 1
アルミニウム箔の少なくとも一面をリン酸溶液
中の正リン酸換算濃度55g/、液温25℃、電流
密度1A/dm2、電圧120Vの条件により陽極酸化
して酸化アルミニウム皮膜厚20μmを形成させた
後、水洗し、乾燥させた。次にホウ酸アンモニウ
ム水溶液とN−メチルピロリドンとの混合溶液中
の四ホウ酸アンモニウム濃度10g/、水100g/
、液温20℃、電流密度0.05A/dm2、電圧
500V、処理時間60minの条件により再び陽極酸
化し、水洗し、乾燥させた。次にポリイミド樹脂
のN−メチルピロリドン溶液中のポリイミド樹脂
溶液中に浸漬させて、酸化アルミニウム皮膜に存
在する微細孔ならびに欠陥部をポリイミド樹脂に
より封着させた。前記不連続処理により形成させ
た絶縁皮膜は300℃でもクラツクを発生せず、300
℃での熱処理後の耐電圧は1.0KVと低かつた。
比較例 2
アルミニウム箔の少なくとも一面を硫酸換算濃
度183g/、液温25℃、電流密度1A/dm2、電
圧10Vの条件により陽極酸化して酸化アルミニウ
ム皮膜厚20μmを形成させた絶縁皮膜は200℃でク
ラツクを発生し、300℃での熱処理後の耐電圧は
0.2KVと極めて低かつた。
比較例 3
従来、絶縁放熱シートとして使用されている雲
母板やシリコーンゴムシートの熱伝導率は雲母板
が1.8×10-3cal/sec・cm・℃であり、シリコーン
ゴムシートは6.0×10-3cal/sec・cm・℃であり、
極めて低いものである。
The present invention relates to an insulating heat dissipating sheet, and particularly to a method for manufacturing an insulating heat dissipating sheet that efficiently transfers heat generated inside a heat-generating electronic component to a heat dissipating fin or a metal heat dissipating plate. Traditionally, power transistors and hybrid ICs
Heat-generating electronic components such as
To avoid deterioration of its characteristics or damage, it was attached to a heat dissipation fin or a metal heat dissipation plate via an insulating heat dissipation sheet. Greased mica plates and silicone rubber sheets are used as insulating heat dissipation sheets, but they do not have very good thermal conductivity.
As the output of heat-generating electronic components increases, there is a drawback that sufficient heat dissipation cannot be achieved. On the other hand, compact heat dissipation fins and metal heat dissipation plates with very high thermal efficiency have appeared, but conventional insulation sheets that do not have sufficient thermal conductivity have been replaced by small and high-performance heat dissipation fins and metal heat dissipation plates. However, a sufficient heat dissipation effect could not be obtained. It has also been considered to use a sheet having an aluminum oxide film formed by anodizing aluminum foil as an insulating heat dissipation sheet. However, since the aluminum oxide film absorbs moisture and the electrical insulation properties deteriorate, an insulating heat dissipating sheet with high electrical reliability cannot be obtained. An invention in which some improvements have been made to this configuration is disclosed in Japanese Patent Application Laid-Open No. 135154/1983. The present invention is a heat-resistant laminate that can be post-processed and is made by anodizing the surface of aluminum foil and then coating the aluminum foil with a solvent-soluble polyimide resin. However, the method for manufacturing the heat-resistant laminate disclosed in the publication as a means of achieving the present invention is to perform a single anodic oxidation treatment on aluminum foil, dry it once, and then coat it with polyimide resin. It is. That is, in this manufacturing method, the aluminum oxide film is formed by just one anodizing treatment, so the withstand voltage is low. In addition, since this manufacturing method requires drying once, the polyimide resin does not completely fill the micropores in the aluminum oxide film, making it impossible to improve the electrical reliability of the aluminum oxide film. The purpose of the present invention is to provide a method for manufacturing an insulating heat dissipating sheet that eliminates the above-mentioned conventional drawbacks.The present invention aims to provide a method for manufacturing an insulating heat dissipating sheet that eliminates the above-mentioned drawbacks of the conventional method. It is characterized by the ability to form a highly thermally conductive and electrically perfect insulating film extremely easily through a series of continuous treatments to achieve complete sealing. Next, the method for manufacturing an insulating heat dissipating sheet of the present invention will be explained in detail based on the drawings. FIG. 1 is a longitudinal cross-sectional view of the aluminum foil and the aluminum oxide film after the aluminum foil has been subjected to the first anodization in the manufacturing method of the present invention. After degreasing and polishing in a system solution, washing with water, then pickling in a nitric acid solution, washing with water,
The aluminum oxide film 2 is then anodized in a solution of at least one of phosphoric acid and chromic acid.
is formed. Further, FIG. 2 is an enlarged vertical cross-sectional view of the aluminum foil and the aluminum oxide film, and the aluminum oxide film 2 has micropores 3 lined up, and the innermost ends of the micropores 3 are located in the aluminum foil. It reaches close to the surface of 1.
Further, as shown in FIG. 3, the aluminum oxide film 2 is dotted with defects such as open defect holes 4 and non-open defect cavities 5 in which aluminum oxide is usually missing. According to the present invention, after the first anodic oxidation, it is washed with water, and then mixed with an aqueous solution of at least one of ammonium borate and ammonium tartrate, methanol, ethanol, and N.
- Anodic oxidation is performed again in a mixed solution with at least one selected from methylpyrrolidone to further form an aluminum oxide film. Fourth
The figure is an enlarged vertical cross-sectional view of the aluminum foil and the aluminum oxide film after the second anodic oxidation and further formation of the aluminum oxide film. The aluminum oxide film formed between the aluminum foil 1 and the foil 1 grows into the aluminum foil below, and the aluminum oxide film becomes thicker in that portion. Reference numeral 6 in the figure indicates a portion where the aluminum oxide film described above has grown and its thickness has increased. After performing the second anodic oxidation, if necessary, after washing in an N-methylpyrrolidone solution, the polyimide resin is immediately immersed in an N-methylpyrrolidone solution, and then the polyimide resin is dried and cured. Then, the fine pores 3 existing in the aluminum oxide film 2 and defective portions such as open defect holes 4 and non-open defect cavities 5 are sealed with the polyimide resin. Note that the polyimide resin also permeates into the non-open defect cavities 5 through the micropores 3. Next, the first anodic oxidation treatment in the manufacturing method of the present invention will be explained. Orthophosphoric acid equivalent concentration in a solution of at least one of phosphoric acid and chromic acid 1 to
800g/, chromic anhydride equivalent concentration 1~400g/,
Liquid temperature 0~70℃, current density 0.1~10A/ dm2 , voltage
It is preferable to carry out anodic oxidation under conditions of 10 to 200 V to form an oxide film with a thickness of 1 to 50 μm. Next, the second anodic oxidation treatment will be explained. Ammonium tetraborate concentration in a mixed solution of at least one of ammonium borate and ammonium tartrate and at least one selected from methanol, ethanol, and N-methylpyrrolidone, tartaric acid Ammonium concentration 0.1~100g/, water 10~900g/,
Liquid temperature 0~70℃, current density 0.01~1A/ dm2 , voltage
Anodic oxidation is performed under the conditions of 10 to 1000V, but since it is difficult to measure the oxide film thickness, the processing time is 10 to 1000V.
It is preferable to set it as 120min. Next, the immersion treatment of the polyimide resin in the N-methylpyrrolidone solution after the second anodic oxidation treatment will be described. It is preferable that the polyimide resin concentration in the solution is 10 to 700 g/, the liquid temperature is 100° C. or less, and the immersion time is 1 min or more. According to the present invention, it is necessary to perform the first anodizing treatment, the second anodizing treatment, and the immersion treatment in the polyimide resin solution continuously. If the first anodizing treatment and the second anodizing treatment are not performed consecutively, air will be drawn into the micropores created by the first anodizing treatment, and the second anodizing treatment will be performed. The process will not be completed completely. Furthermore, for the same reason, if the aluminum oxide film dries between the second anodizing treatment and the immersion treatment in the polyimide resin solution, some parts of the micropores are not completely filled with polyimide resin, and the aluminum oxide It is not possible to improve the electrical reliability of the film. That is, the present invention specifically forms an electrically perfect insulating film by sequentially performing a process for forming an aluminum oxide film and a process for sealing micropores and defective areas, that is, open defective holes and non-open defective cavities. It is characterized by being extremely easy to form. Note that an aluminum oxide film formed by anodizing in a solution other than the first anodizing solution, such as a sulfuric acid solution or an oxalic acid solution, generates many cracks at about 200°C. However, the aluminum oxide film formed by the first anodic oxidation treatment of the present invention was 300%
No cracks occur even at high temperatures above ℃. The reason for this is that the micropores in the aluminum oxide film formed by the first anodizing treatment are relatively large, which absorbs the difference in thermal expansion coefficient between the aluminum oxide film and aluminum. think. Further, by further forming an aluminum oxide film through the second anodizing treatment, the withstand voltage is improved, but the electrical reliability is still insufficient. After the second anodic oxidation treatment, the defect portions, that is, the open defect holes and the non-open defect cavities are sealed with the polyimide resin by immersion treatment in a polyimide resin solution, thereby improving the withstand voltage. Note that since polyimide resin has relatively high heat resistance and chemical resistance, it is superior in heat resistance and chemical resistance to cases where other resins are used. Furthermore, a thin film of the resin is automatically formed on the surface of the foil sealed with the resin. Next, examples of the present invention and comparative examples thereof will be described. Example 1 At least one side of an aluminum foil was anodized to form an aluminum oxide film with a thickness of 20 μm by anodizing at a concentration of 55 g/orthophosphoric acid in a phosphoric acid solution, a liquid temperature of 25° C., a current density of 1 A/dm 2 , and a voltage of 120 V. After washing with water, ammonium tetraborate concentration 10 g/, water 100 g/, liquid temperature 20
°C, current density 0.05A/dm 2 , voltage 500V, processing time
It was anodized again under the conditions of 60 min, and then immersed in the polyimide resin solution under the conditions of a polyimide resin concentration of 200 g/N-methylpyrrolidone solution, a solution temperature of 25°C, and an immersion time of 60 min to remove the aluminum oxide film. The micropores and defective areas were sealed with polyimide resin. The insulating film formed by the above series of continuous treatments is heated to 300°C.
However, the withstand voltage after heat treatment at 300℃ is 2.0KV, and the thermal conductivity is 0.42cal/sec・cm・
It was warm at ℃. Example 2 At least one side of an aluminum foil was anodized to form an aluminum oxide film with a thickness of 20 μm by anodizing at a concentration of 55 g/orthophosphoric acid in a phosphoric acid solution, a liquid temperature of 25° C., a current density of 1 A/dm 2 , and a voltage of 120 V. After washing with water, ammonium tetraborate concentration in a mixed solution of ammonium borate aqueous solution and ethanol was 7.5 g/, water 200 g/, liquid temperature 20°C, current density 0.05 A/dm 2 , voltage 500 V, treatment. After being anodized again for 60 min, and then washed in N-methylpyrrolidone solution, the polyimide resin was immediately anodized using the following conditions: polyimide resin concentration in N-methylpyrrolidone solution was 200g/, liquid temperature was 25°C, and time was 60min. By immersing it in a resin solution, the micropores and defective areas existing in the aluminum oxide film were sealed with polyimide resin. The insulating film formed by the above series of continuous treatments does not generate cracks even at 300℃, has a withstand voltage of 2.0KV after heat treatment at 300℃, and a thermal conductivity of 0.42cal/sec・cm・℃
It was hot. Example 3 At least one side of an aluminum foil was exposed to a chromic acid solution with a concentration of chromic acid anhydride equivalent to 30 g/, a liquid temperature of 40°C,
After forming an aluminum oxide film with a thickness of 20 μm by anodizing at a current density of 0.5 A/dm 2 and a voltage of 100 V, it was washed with water, and then the ammonium tartrate concentration in the mixed solution of ammonium tartrate aqueous solution and methanol was 7.5 g/, Water 200g/, liquid temperature 20℃, current density 0.05A/dm 2 , voltage 400V, processing time 60min
The polyimide resin was anodized again under the following conditions, and then washed in N-methylpyrrolidone solution. Immediately after the polyimide resin was washed in N-methylpyrrolidone solution, the polyimide resin concentration was 200g/, the solution temperature was 25℃, and the immersion time was 60min. By immersing it in a solution, the micropores and defective areas existing in the aluminum oxide film were sealed with polyimide resin. The insulating film formed by the series of continuous treatments is
No cracks occur even at 300℃, the withstand voltage is 1.8KV after heat treatment at 300℃, and the thermal conductivity is 0.42cal/sec.
It was warm at cm・℃. Comparative Example 1 At least one side of an aluminum foil was anodized to form an aluminum oxide film with a thickness of 20 μm under the conditions of a concentration of orthophosphoric acid in a phosphoric acid solution of 55 g/, a liquid temperature of 25°C, a current density of 1 A/dm 2 , and a voltage of 120 V. After that, it was washed with water and dried. Next, the ammonium tetraborate concentration in the mixed solution of ammonium borate aqueous solution and N-methylpyrrolidone was 10 g/100 g/water.
, liquid temperature 20℃, current density 0.05A/dm 2 , voltage
It was anodized again under conditions of 500V and treatment time of 60 minutes, washed with water, and dried. Next, the polyimide resin was immersed in a polyimide resin solution in an N-methylpyrrolidone solution to seal the micropores and defective parts existing in the aluminum oxide film with the polyimide resin. The insulating film formed by the discontinuous process does not generate cracks even at 300°C.
The withstand voltage after heat treatment at ℃ was as low as 1.0KV. Comparative Example 2 At least one side of an aluminum foil was anodized under the conditions of sulfuric acid equivalent concentration of 183 g/, liquid temperature of 25°C, current density of 1A/dm 2 and voltage of 10V to form an aluminum oxide film thickness of 20μm.The insulation film was heated at 200°C. After heat treatment at 300℃, the withstand voltage is
It was extremely low at 0.2KV. Comparative Example 3 The thermal conductivity of mica plates and silicone rubber sheets conventionally used as insulating heat dissipation sheets is 1.8×10 -3 cal/sec・cm・℃, and that of silicone rubber sheets is 6.0×10 - 3 cal/sec・cm・℃,
This is extremely low.
【表】【table】
【表】
以上のことにより本発明の製造方法は第1回目
の陽極酸化処理、第2回目の陽極酸化処理ならび
にポリイミド樹脂溶液中への浸漬処理を連続的に
施すことによつて熱伝導性の高い、電気的に完全
な絶縁放熱シートを極めて容易に与えることがで
きる。よつて本発明の製造方法により得られる絶
縁放熱シートは、放熱効果が大きく電気絶縁性が
高いので、小型で高性能の放熱フインや金属放熱
板の性能を充分発揮することを可能ならしめ、電
子工業界に与える利益は大である。[Table] According to the above, the manufacturing method of the present invention improves thermal conductivity by sequentially performing the first anodizing treatment, the second anodizing treatment, and the immersion treatment in a polyimide resin solution. A highly electrically perfect insulating heat dissipation sheet can be provided very easily. Therefore, the insulating heat dissipation sheet obtained by the manufacturing method of the present invention has a large heat dissipation effect and high electrical insulation, so it can fully demonstrate the performance of small and high-performance heat dissipation fins and metal heat dissipation plates, and can be used for electronic The benefits to industry are huge.
第1図はアルミニウム箔に第1回目の陽極酸化
を施した後のアルミニウム箔と酸化アルミニウム
皮膜との縦断面図、第2図ならびに第3図はそれ
ぞれ前記アルミニウム箔と酸化アルミニウム皮膜
とを拡大した縦断面図、第4図はアルミニウム箔
に第2回目の陽極酸化を施した後のアルミニウム
箔と酸化アルミニウム皮膜とを拡大した縦断面図
である。
1…アルミニウム箔、2…酸化アルミニウム皮
膜、3…微細孔、4…開口欠陥孔、5…非開口欠
陥空洞、6…酸化アルミニウム皮膜厚増加部分。
FIG. 1 is a longitudinal cross-sectional view of the aluminum foil and the aluminum oxide film after the first anodization has been performed on the aluminum foil, and FIGS. 2 and 3 are enlarged views of the aluminum foil and the aluminum oxide film, respectively. FIG. 4 is an enlarged vertical cross-sectional view of the aluminum foil and the aluminum oxide film after the aluminum foil has been subjected to the second anodic oxidation. DESCRIPTION OF SYMBOLS 1... Aluminum foil, 2... Aluminum oxide film, 3... Fine pore, 4... Open defect hole, 5... Non-open defect cavity, 6... Aluminum oxide film thickness increased portion.
Claims (1)
クロム酸の何れか少なくとも1種の溶液中で陽極
酸化して酸化アルミニウム皮膜を形成させた後、
水洗し、次いでホウ酸アンモニウム、酒石酸アン
モニウムの何れか少なくとも1種の水溶液とメタ
ノール、エタノール、N−メチルピロリドンのな
かから選ばれる何れか少なくとも1種との混合溶
液中で再び陽極酸化して前記酸化アルミニウム皮
膜を肥厚化させ、必要により引き続いてN−メチ
ルピロリドン液中で洗浄した後、直ちにポリイミ
ド樹脂のN−メチルピロリドン溶液中に浸漬させ
て、前記肥厚化させた酸化アルミニウム皮膜に存
在する微細孔ならびに欠陥部を前記ポリイミド樹
脂により封着させる一連の連続的処理を特徴とす
る絶縁放熱シートの製造方法。1 At least one side of the aluminum foil is coated with phosphoric acid,
After forming an aluminum oxide film by anodizing in a solution of at least one of chromic acids,
Washing with water, and then anodizing again in a mixed solution of at least one aqueous solution of ammonium borate or ammonium tartrate and at least one selected from methanol, ethanol, and N-methylpyrrolidone to oxidize the After thickening the aluminum film and washing it in an N-methylpyrrolidone solution if necessary, the polyimide resin is immediately immersed in an N-methylpyrrolidone solution to eliminate the micropores present in the thickened aluminum oxide film. and a method for producing an insulating heat dissipation sheet, characterized by a series of continuous treatments for sealing defective parts with the polyimide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1581383A JPS59142138A (en) | 1983-02-01 | 1983-02-01 | Insulating radiating sheet and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1581383A JPS59142138A (en) | 1983-02-01 | 1983-02-01 | Insulating radiating sheet and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59142138A JPS59142138A (en) | 1984-08-15 |
| JPH0216698B2 true JPH0216698B2 (en) | 1990-04-18 |
Family
ID=11899280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1581383A Granted JPS59142138A (en) | 1983-02-01 | 1983-02-01 | Insulating radiating sheet and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59142138A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002313A1 (en) * | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012087107A1 (en) * | 2010-12-23 | 2012-06-28 | Anomax Corp., Ltd. | Integrated plated circuit heat sink and method of manufacture |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57135154A (en) * | 1981-02-16 | 1982-08-20 | Mitsubishi Chem Ind | Heat-resisting laminate |
-
1983
- 1983-02-01 JP JP1581383A patent/JPS59142138A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002313A1 (en) * | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59142138A (en) | 1984-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0258317A (en) | Manufacture of electrode foil for aluminum electrolytic capacitor | |
| JP7701998B2 (en) | Method for producing polyimide-aluminum composite foil | |
| CN102893350A (en) | Solid Electrolytic Capacitor | |
| JP2000348984A (en) | Method for producing electrode foil for aluminum electrolytic capacitor | |
| JPH0216698B2 (en) | ||
| CN110670105A (en) | Pulse-direct current alternate mixed anodic oxidation method of anode foil for aluminum electrolytic capacitor | |
| JPS60157214A (en) | Electrochemical anodizing method for aluminum foil for electrolytic capacitors | |
| JP7227870B2 (en) | Manufacturing method of electrode foil for aluminum electrolytic capacitor | |
| JPH0128514B2 (en) | ||
| TWI738945B (en) | Electrode for aluminum electrolytic capacitor and its manufacturing method | |
| JP4653687B2 (en) | Method for producing electrode foil for electrolytic capacitor | |
| JPH1112797A (en) | Aluminum heat sink and method of manufacturing the same | |
| TWI730207B (en) | Manufacturing method of electrode for aluminum electrolytic capacitor | |
| JPH0245356B2 (en) | ARUMINIUMUSHINPURINTOHAISENYOKIBANNOSEIZOHOHO | |
| JPH03250723A (en) | Manufacture of solid electrolytic capacitor | |
| JPH04324612A (en) | Manufacture of organic semiconductor solid electrolytic capacitor | |
| US3225417A (en) | Ake lagercrantz | |
| RU2353717C1 (en) | Technique of oxide coating on aluminium and its alloys | |
| JPH02276215A (en) | Manufacture of solid electrolyte capacitor | |
| JP2005347681A (en) | Method of manufacturing anode foil for aluminum electrolytic capacitor | |
| JPH09246106A (en) | Solid capacitor and formation of conductive functional polymer film | |
| JPS5819157B2 (en) | Method for manufacturing hybrid integrated circuit board | |
| JP2008282994A (en) | Method for producing electrode foil for aluminum electrolytic capacitor | |
| KR20080067853A (en) | Manufacturing method of aluminum insulating film for printed circuit board and aluminum insulating film manufactured thereby | |
| CN119581227A (en) | A method for preparing highly water-resistant aluminum anode foil |