JPH0250817B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to electronic components that are components of printed circuit boards used in televisions, videotape recorders, car radios, etc., such as leads for jumper wires and the like. This invention relates to a molding device.

[Conventional technology]

FIG. 5 is a schematic cross-sectional view showing a conventional electronic component lead forming apparatus.

In the figure, 1 is an electronic component, 101 is a lead of electronic component 1, 102 is a body of electronic component 1, 2 is a base of a lead molding device for electronic component, 3 is a lower mold, 4 is a
5 is an upper mold, 5 is a cylinder bracket fixed to the base 2 by suitable means such as screws, 6 is an air cylinder for operating the upper mold 4, 301 is a groove provided in the lower mold, and the lead 101 of the electronic component 1 is It is intended to hold the following.

The conventional electronic component molding apparatus is configured as described above, and the electronic component 1 is mounted and held in the groove 301 of the lower mold 3, and the upper mold 4 is lowered by operating the air cylinder 6 to mold the electronic component 1. body 102 of
Press down into the lower mold 3. As a result, the lead 101 of the electronic component is guided along the inner wall of the lower die 3 and bent into a U-shape as shown in FIG.

[Problem to be solved by the invention]

In the conventional electronic component lead forming apparatus as described above, the leads 101 are guided and bent along the inner wall of the lower mold 3, so the pitch P between the molded leads 101 is the same as that of the lower mold 3. It is determined by the inner width W, and if the diameter of the lead 101 is D,
P=W-D, and it cannot be made smaller than that.

By the way, as shown in FIGS. 7 and 8,
When the pitch of the insertion holes 701 into which the leads 101 of the electronic component 1 of the printed circuit board 7 are inserted is smaller than the pitch P between the leads 101 of the electronic component 1 (in the case shown, the pitch of the insertion holes 701 is smaller than the length of the body 102 ), and if it is necessary to use the electronic component 1, the electronic component 1 will be lifted from the printed circuit board 7 when the lead 101 of the molded electronic component 1 is inserted into the insertion hole 701.

In this state, the lead 10 of the electronic component 1
1 is exposed for a long time and may shatter with other electronic components, resulting in a defect, and the printed circuit board 7 may be damaged due to forceful insertion. In particular, the pitch P between the insertion holes 701 is
This disadvantage becomes noticeable when the length is smaller than 2.

Therefore, there was a problem in that the lead 101 of the electronic component 1 had to be shaped in advance using radio pliers or the like and then inserted into the insertion hole 701 of the printed circuit board 7.

[Purpose of the invention]

The present invention was made to solve this problem, and an object of the present invention is to provide an apparatus that can form the pitch P between the leads 101 of the electronic component 1 to a size smaller than W-D.

[Means to solve the problem]

The electronic component lead forming apparatus according to the present invention includes:
Guides are attached that engage with both ends of the lead to restrict upward displacement of the lead end during the initial stage of pressing down the upper die.

[Effect]

In this invention, by attaching the guide, the upward displacement of the lead end is restricted in the initial stage of the lead forming process, so the lead bends into an S-shape, and as the forming process progresses. , will be bent inward and formed with a smaller pitch than W-D.

〔Example〕

FIG. 1 is a schematic sectional view showing an embodiment of the present invention, FIGS. 2 and 3 are schematic sectional views showing the operation process of the embodiment of FIG. 1, and FIG. 1 to 7,101,102,
301 and 701 are exactly the same as the above-mentioned conventional device. A pair of guides 8 are attached to the base 2 by suitable means such as screws 9, and are arranged opposite to each other on both sides of the lower mold 3. As shown in FIG. Electronic component 1 when inserted into
It has a locking part 801 that engages with the end of the lead 101 to restrict upward displacement of the lead end.

In the electronic component lead forming apparatus configured as described above, when the electronic component 1 is placed in the groove 301 of the lower mold 3 and the air cylinder 6 is operated, the upper mold 4 attached to the air cylinder 6 is lowered. , press down the body 102 of the electronic component 1 into the lower mold 3.

At the initial stage of this pressing down, the locking part 801 of the guide 8 engages with the end of the lead 101 of the electronic component 1, as shown in FIG. Pushed into mold 3,
The portion of the lead 101 adjacent to the body 102 is the second
Although the lead 101 is bent upward in the figure, the end of the lead 101 is prevented from moving upward by the locking portion 801 of the guide 8 and tries to maintain its initial state. As a result, the lead 101 is bent downward at the portion in contact with the lower die 3, and the entire lead 101 is formed into an S-shape.

Further, when the upper mold 4 descends and the end of the lead 101 comes off the locking part 801, the downward bending action at the contact part with the lower mold 3 ends, but the body part 10
The upward bending action of the portion adjacent to the lead 101 is continued, and the end of the lead 101 is bent toward the side surface of the upper mold 4. That is, since the lead 101 was originally bent into an S-shape, the adjacent portion of the body 102 is displaced inward, and the lead 101 from the adjacent portion to the end comes into contact with the side surface of the upper mold 4. In other words, since the upper mold 4 is pressed down with the lead 101 being pressed against the side surface of the upper mold 4, the press molding state continues during that time, and as a result, the lead 101 is attached to the inner wall of the lower mold 3 and the upper mold 4. Thus, the portion from the portion adjacent to the body to the end portion is formed into a straight line as shown in FIG. 3, and the pitch P' is smaller than W-D. Therefore, the electronic component 1 having molded leads 101 is inserted into the insertion hole 70 of the lead 101 as shown in FIG.
Even if the pitch between the leads 101 is smaller than W-D, or even if the pitch between the insertion holes 701 is smaller than the length of the body 102 of the electronic component 1 as shown in the figure, the leads 101 can be easily inserted into the insertion holes 701. can.

In the above embodiment, the guide 8 is fixed to the base 2 with the screw 9 and its position relative to the end of the lead 101 cannot be adjusted.
In the length direction of the lead 101, that is, in the first
If the guide 8 is made longer in the left-right direction in the figure so that the position of the guide 8 can be adjusted, the pitch between the leads 101 can be adjusted. For example, left and right guide 8
When the distance between the leads 101 is increased from that shown in FIG. 1, the pitch between the molded leads 101 becomes larger than that shown in FIG. 3. That is, the distance between the left and right guides 8 is
If it is expanded more than the case shown in the figure, the time required for the tip of the lead 101 to come off the locking part 801 of the guide during the lowering process of the upper die 4 will be shorter, so that it will come into contact with the lower die 3 in the state shown in FIG. 2. The time during which the force acting to bend the lead 101 into an S-shape is also shortened.

Therefore, the lead 10 in the vicinity of the body 102
The degree of displacement of lead 101 becomes smaller, and the degree of inward displacement of lead 101 becomes smaller. In other words, P' in FIG. 3 is expanded. The spread of P′ increases as the distance between the guides 8 increases, and when the distance between the guides increases to the point where the locking portion 801 of the guide does not contact the tip of the lead 101,
Since the state shown in FIG. 5 is reached, the lead pitch expands to P as shown in FIG. 6. In other words, the lead pitch can be adjusted from P' in FIG. 3 to P in FIG. 5.

〔Effect of the invention〕

As explained above, this invention has a simple structure in which a guide is provided in a conventional lead forming device for electronic components, and enables W-D, which has been considered difficult up to now, to be
(Inner width W of the lower mold - diameter D of the lead 101) It is now possible to attach electronic components to a printed circuit board that has insertion holes with a smaller pitch so that the electronic components do not float off the printed circuit board, and the molded This has the effect that electronic components can be easily mounted on printed circuit boards.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing an embodiment of the present invention, FIGS. 2 and 3 are schematic sectional views showing the operation process of the embodiment of FIG. 1, and FIG. Fig. 5 is a schematic cross-sectional view of a conventional lead forming device, and Fig. 6 is an electronic component whose leads are formed by the lead forming device shown in Fig. 5. Figures 7 and 8 are enlarged views of Figure 6.
FIG.
101 is an electronic component, 101 is its lead, 102 is a body, 3 is a lower die, 301 is a groove, 4 is an upper die, and 8 is a guide. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Scope of Claims] 1. In an electronic component lead forming apparatus comprising a lower mold having a groove for holding a lead of an electronic component and an upper mold that pushes down the body of the electronic component into the lower mold, the side of the lower mold A lead for an electronic component, characterized in that a guide is disposed on one side and engages with both ends of the lead to restrict upward displacement of the lead end at the initial stage of depression of the upper mold. Molding equipment. 2. The lead forming device according to claim 1, wherein the position of the guide is adjustable in the length direction of the lead of the electronic component.