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JPH0259877B2 - - Google Patents
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JPH0259877B2 - - Google Patents

Info

Publication number
JPH0259877B2
JPH0259877B2 JP6037183A JP6037183A JPH0259877B2 JP H0259877 B2 JPH0259877 B2 JP H0259877B2 JP 6037183 A JP6037183 A JP 6037183A JP 6037183 A JP6037183 A JP 6037183A JP H0259877 B2 JPH0259877 B2 JP H0259877B2
Authority
JP
Japan
Prior art keywords
plating
plated
zone
processing
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6037183A
Other languages
Japanese (ja)
Other versions
JPS59185769A (en
Inventor
Kenji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Original Assignee
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK filed Critical NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority to JP6037183A priority Critical patent/JPS59185769A/en
Publication of JPS59185769A publication Critical patent/JPS59185769A/en
Publication of JPH0259877B2 publication Critical patent/JPH0259877B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • C23C2/40Plates; Strips
    • C23C2/405Plates of specific length

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Chemically Coating (AREA)
  • Coating With Molten Metal (AREA)
  • Tunnel Furnaces (AREA)

Description

【発明の詳細な説明】 この発明は短冊状メツキ物のメツキ処理方法に
関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for plating a strip-shaped plated object.

メツキ処理は、従来より多種多様の処理方法が
提案され且つ実施化されているが、第1図〜第3
図で示すように例えばICリードフレームの如き
短冊状メツキ物1〔以下単に「メツキ物」と称
す〕を噴射メツキ装置2にてメツキ処理する場
合、能率向上のためにパスライン上に多数枚のメ
ツキ物1を置きいわば並列的に移送させながら処
理槽3内で処理液に接触させて前処理ゾーンA及
び後処理ゾーンBで各々意図する前処理、後処理
を施してメツキゾーンCの噴射メツキ装置(図示
せず)上で多数枚同時にメツキする方法が提案さ
れている。このようなメツキ処理方法にあつて
は、通常水平ロール4がパスラインに沿つて複数
配置されその上を並列的に複数枚のメツキ物1を
通すものである。従つて、かかるメツキ処理方法
にあつては、メツキ物1を各々水平状態にして移
送するため複数枚のメツキ物の幅に応じたパスラ
イン幅W1が要求されロードゾーンD、前処理ゾ
ーンA、メツキゾーンC、後処理ゾーンB、及び
アンドロードゾーンEを問わず多数枚のメツキ物
1を通すためにはそれに応じた広幅に全体を構成
せねばならず各処理槽3の幅W2は同様に大幅で
あることが必要とされ、逆に云えば或る幅サイズ
に限定されている処理槽があるとすればその幅サ
イズ内で通せるメツキ物の枚数〔換言すればメツ
キ物の並列数〕が限定されてしまい、それを多く
できないという不具合がある。
For plating processing, a wide variety of processing methods have been proposed and put into practice.
As shown in the figure, when plating a rectangular plated object 1 such as an IC lead frame (hereinafter simply referred to as the "plated object") with an injection plating device 2, a large number of sheets are placed on the pass line to improve efficiency. The plating material 1 is brought into contact with the processing liquid in the processing tank 3 while being transported in parallel, and subjected to the intended pre-treatment and post-treatment in the pre-treatment zone A and the post-treatment zone B, respectively, and the injection plating device in the plating zone C. A method has been proposed in which a large number of sheets are plated at the same time (not shown). In such a plating method, a plurality of horizontal rolls 4 are usually arranged along a pass line, and a plurality of sheets of plating material 1 are passed in parallel over the horizontal rolls 4. Therefore, in such a plating method, in order to transport each plated item 1 in a horizontal state, a pass line width W 1 corresponding to the width of the plurality of plated items is required, and the load zone D and the pretreatment zone A are , plating zone C, post-processing zone B, and unloading zone E, in order to pass a large number of plating objects 1 through, the entire processing tank 3 must be constructed with a correspondingly wide width, and the width W 2 of each processing tank 3 is the same. In other words, if there is a processing tank that is limited to a certain width size, the number of sheets of plated material that can be passed through within that width size [in other words, the number of plated items in parallel] ] is limited, and there is a problem that you cannot increase it.

この発明はこのような点に注目して為されたも
ので、短冊状メツキ物を複数枚高密度にして能率
よく処理するために、水平(横形)に換えて縦形
にして移送することを特徴としており、具体的に
はこの発明に係る短冊状メツキ物のメツキ処理方
法は、複数の短冊状メツキ物の各々がパスライン
に沿つて複数配置した複数の溝付きロールの各溝
内で縦形にして支持されつつ移送されてメツキ処
理を受けることを要旨としている。
This invention was made with attention to these points, and is characterized by transporting a plurality of plated strips in a vertical format instead of horizontally (horizontal) in order to efficiently process a plurality of plated strips at a high density. Specifically, the method of plating a strip-shaped plated object according to the present invention is such that each of a plurality of strip-shaped plated objects is vertically formed in each groove of a plurality of grooved rolls arranged along a pass line. The gist is that the material is transported while being supported by a holder and undergoes the plating process.

以下この発明の詳細を、図面を参照して説明す
る。尚以下では従来と共通する部分につき同一符
号を用いることにし重複説明は省略する。先ず、
この発明ではメツキ物1を水平(横形)に換えて
縦形にして移送するものであり、このため複数の
溝付きロール10が従来の水平ロール4に換えて
使用される。これらの溝付きロール10の複数の
溝11はメツキ物1を縦形にして十分支持できる
サイズと形状のものにされ、第5図イで示すよう
にメツキ物1を受入れ易いように広開口12で、
底13及び斜面14にてメツキ物1を倒れぬよう
支持し、全体としてメツキ物1を若干「傾斜状
態」で縦形にして支持することも、又第5図ロで
示すようにメツキ物1の厚さtに相応させて底1
5及びその近辺部位を凹設し、全体としてメツキ
物1を「垂直に近い状態」で縦形にして支持する
ことも可能であり、種々の形状、サイズの溝11
が採用できるものである。勿論、多数枚のメツキ
物1を同時に移送するためにはその枚数に見合う
数の溝11をロール10に形成しておくことにな
り、メツキ物1が通常のICリードフレームであ
れば、溝11の開口は0.25〜10mm、底13,15
のサイズは0.15〜2.0mm、深さは3〜25mm、溝1
1同士のピツチは5〜40mm程度にすることができ
る。各ロール10は、このような溝11を複数周
面に備えており、パスラインに沿つて複数配置さ
れることになる。配置に当つては、種々の形状、
サイズの溝11付きロール10を組合わせること
も可能であり、第6図の例では、前処理ゾーンA
と後処理ゾーンBの各々中央区間でピツチの比較
的小なる溝付きロール10を用いその前後の区間
ではピツチの比較的大なるそして開口の比較的広
い溝付きロール10を組合わせて用い、前処理ゾ
ーンAと後処理ゾーンBではロード、メツキ及び
アンロードの各ゾーンD,C,Eの処理能力が相
当高くなつてもそれに合わせて多数枚のメツキ物
1を縦形にして高密度にして支持しつつ移送でき
るようにしてある。
The details of this invention will be explained below with reference to the drawings. In the following description, the same reference numerals will be used for parts common to those in the prior art, and redundant explanation will be omitted. First of all,
In this invention, the plating object 1 is conveyed vertically instead of horizontally, and therefore a plurality of grooved rolls 10 are used in place of the conventional horizontal rolls 4. The plurality of grooves 11 of these grooved rolls 10 are of a size and shape that can sufficiently support the plated object 1 in a vertical shape, and have wide openings 12 to easily receive the plated object 1, as shown in FIG. 5A. ,
It is also possible to support the plating object 1 on the bottom 13 and the slope 14 so that it does not fall down, and to support the plating object 1 as a whole in a slightly "inclined" vertical position. The bottom 1 corresponds to the thickness t.
It is also possible to support the plating object 1 vertically in a "nearly vertical state" by recessing the grooves 11 of various shapes and sizes.
can be adopted. Of course, in order to transfer a large number of plated objects 1 at the same time, grooves 11 corresponding to the number of sheets must be formed in the roll 10. If the plated object 1 is a normal IC lead frame, the grooves 11 The opening is 0.25~10mm, bottom 13,15
The size is 0.15~2.0mm, the depth is 3~25mm, groove 1
The pitch between the two can be about 5 to 40 mm. Each roll 10 has a plurality of such grooves 11 on its circumferential surface, and a plurality of grooves 11 are arranged along the pass line. For placement, various shapes,
It is also possible to combine rolls 10 with grooves 11 of different sizes, and in the example of FIG.
In each central section of post-processing zone B, a grooved roll 10 with a relatively small pitch is used, and in the sections before and after that, grooved rolls 10 with a relatively large pitch and a relatively wide opening are used in combination. In processing zone A and post-processing zone B, even if the processing capacity of loading, plating, and unloading zones D, C, and E becomes considerably high, a large number of plating objects 1 are vertically arranged and supported in a high density manner. It is designed so that it can be transported while

尚、第5図イ,ロで示すような溝11の斜面1
4の傾斜度を順次暖急又は急暖として用いること
も可能であり、又例えばロードゾーンDは水平送
りとし前処理ゾーンAに入つてから徐々に斜面1
4の傾斜度を暖より急にした溝11付きロール1
0を組合わせてメツキ物1を水平(横形)から縦
形にして移送することも又、その逆にすることも
十分可能である。
Incidentally, the slope 1 of the groove 11 as shown in Fig. 5 A and B
It is also possible to use slope 4 for sequential heating or rapid heating, or, for example, load zone D is fed horizontally, and after entering pretreatment zone A, slope 1 is gradually increased.
Roll 1 with grooves 11 whose inclination in 4 is steeper than warm
It is fully possible to transport the plated object 1 from horizontal (horizontal) to vertical by combining 0 and vice versa.

このようにして、複数の溝付きロールの各溝内
で、メツキ物を縦形にして支持・移送するものと
し、複数枚のメツキ物を並列的に多数枚移送して
は前処理、メツキ及び後処理を施してメツキ処理
するものである。
In this way, the plated items are vertically supported and transported within each groove of the plurality of grooved rolls, and a large number of the plated items are transferred in parallel for pretreatment, plating, and post-processing. It is treated and plated.

この発明に係る短冊状メツキ物のメツキ処理方
法は以上の如き内容のものなので、従来の水平ロ
ール使用のメツキ処理方法に比べて同じロール
幅、処理槽幅であつても溝付きロールにてメツキ
物を縦形にして支持・移送するので、ロールの溝
ピツチを小にして多数の溝をロールに形成してお
くことにより格段と高密度にして移送能力を高め
ることができ、短冊状メツキ物を並列的に移送し
ては前処理、メツキ及び後処理を施すメツキ処理
方法にとつてメツキ処理能力の相当な向上が期待
でき、特にメツキ処理条件の内短冊状メツキ物の
移送枚数を相当多めに設定できて、メツキ処理の
ライン設計がし易くなるという利点もある。
Since the method for plating plated strips according to the present invention is as described above, it is possible to perform plating using grooved rolls even if the roll width and processing tank width are the same compared to the conventional plating method using horizontal rolls. Since the objects are supported and transferred vertically, by reducing the groove pitch of the roll and forming a large number of grooves on the roll, it is possible to achieve a much higher density and increase the transfer capacity, making it possible to handle strip-shaped plated objects. For plating processing methods in which pre-processing, plating, and post-processing are carried out in parallel, a considerable improvement in plating processing capacity can be expected, especially when the number of strip-shaped plated objects to be transferred is considerably increased in the plating processing conditions. It also has the advantage of being easy to set, making it easier to design the plating process line.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のメツキ処理方法に用いている水
平ロールの使用状態を示す斜視図、第2図はロー
ドよりアンロードゾーンに至るメツキ処理の工程
概略平面図、第3図は第2図中の矢示部のメツ
キ物の移送状態を示す平面図、第4図はこの発明
に係るメツキ処理方法に用いる溝付きロールの使
用状態を示す第1図相当の斜視図、第5図イ,ロ
は溝付きロールの実施例を各々示すロールの部分
正面図、第6図はこの発明の一実施例を示す第2
図相当の工程概略平面図、そして第7図は第6図
中の矢示部のメツキ物の移送状態を示す第3図
相当の平面図である。 1……短冊状メツキ物、3……処理槽、4……
水平ロール、A……前処理ゾーン、B……後処理
ゾーン、C……メツキゾーン、D……ロードゾー
ン、E……アンロードゾーン、10……溝付きロ
ール、11……溝。
Figure 1 is a perspective view showing how the horizontal roll used in the conventional plating method is used, Figure 2 is a schematic plan view of the plating process from loading to unloading zone, and Figure 3 is the middle of Figure 2. FIG. 4 is a perspective view corresponding to FIG. 1 showing the state of use of the grooved roll used in the plating method according to the present invention, and FIGS. 6 is a partial front view of a roll showing an embodiment of the grooved roll, and FIG. 6 is a second embodiment showing an embodiment of the present invention.
FIG. 7 is a plan view corresponding to FIG. 3 showing the transfer state of the plating material indicated by the arrow in FIG. 6. 1... Strip-shaped plated material, 3... Processing tank, 4...
Horizontal roll, A... pre-processing zone, B... post-processing zone, C... plating zone, D... loading zone, E... unloading zone, 10... grooved roll, 11... groove.

Claims (1)

【特許請求の範囲】 1 複数枚の短冊状メツキ物を並列的に移送して
は前処理、メツキ及び後処理を施す短冊状メツキ
物のメツキ処理方法に於いて、 上記短冊状メツキ物は、各々がパスラインに沿
つて複数配置した複数の溝付きロールの各溝内で
縦形にして支持されつつ移送されることを特徴と
する短冊状メツキ物のメツキ処理方法。
[Scope of Claims] 1. In a method for plating a plated strip in which a plurality of plated strips are transferred in parallel and subjected to pre-treatment, plating and post-treatment, the plated strip has the following properties: 1. A method for plating a strip-shaped plated object, characterized in that the strip-shaped plated object is transported while being vertically supported in each groove of a plurality of grooved rolls arranged along a pass line.
JP6037183A 1983-04-06 1983-04-06 Method for plating strip Granted JPS59185769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6037183A JPS59185769A (en) 1983-04-06 1983-04-06 Method for plating strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6037183A JPS59185769A (en) 1983-04-06 1983-04-06 Method for plating strip

Publications (2)

Publication Number Publication Date
JPS59185769A JPS59185769A (en) 1984-10-22
JPH0259877B2 true JPH0259877B2 (en) 1990-12-13

Family

ID=13140203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6037183A Granted JPS59185769A (en) 1983-04-06 1983-04-06 Method for plating strip

Country Status (1)

Country Link
JP (1) JPS59185769A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831553B2 (en) * 1988-08-26 1996-03-27 日本エレクトロプレイテイング・エンジニヤース株式会社 Plating equipment
US6899223B2 (en) 2002-05-09 2005-05-31 Bert-Co Industries, Inc. Form for a package and method of making same
US6802419B2 (en) 2002-10-11 2004-10-12 Bert Co Industries, Inc. Package form and method of making a package

Also Published As

Publication number Publication date
JPS59185769A (en) 1984-10-22

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