JPH02637B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION This invention relates to a loop heat pipe device capable of moving upward heat downward without using an external mechanical drive.

BACKGROUND ART Conventionally, heat pipes and thermosiphons have been known as heat transfer devices such as power pumps and compressors that do not require external mechanical power. For example, a loop heat pipe device shown in FIG. There is. In this device, a heat input device 1 and a heat output device 2 installed above the heat input device 1 are connected by a liquid pipe 3 and a steam pipe 4 to form a sealed pipe, and the pressure inside the sealed pipe is A heating medium 5 which is in a two-phase state of vapor and liquid depending on temperature conditions is enclosed.

With the above configuration, the heat medium 5 heated and vaporized in the heat input device 1 passes through the steam pipe 4, is guided into the heat output device 2, is cooled and liquefied in the heat output device 2, and flows through the liquid pipe 3 by gravity. The heat from the lower part was moved upward by the cycle of returning to the heat input device 1.

Problems to be Solved by the Invention However, in such conventional heat transfer devices, heat is transferred from below to above, and it is not suitable to transfer heat from above to below.

Means for Solving the Problems The technical means of the present invention for solving the above problems includes a heat input device, a heat output device provided below the heat input device, and a heat output device provided below the heat input device. A first liquid reservoir having a cooling function provided at the upper part and a second liquid reservoir provided below the heat output device are connected by pipes to form a sealed pipe, and inside this sealed pipe, Depending on the pressure and temperature inside the sealed pipe, two phases, gas phase and liquid phase,
The heating device is connected to the heating device through a first valve that has a heating medium in a phase state and opens and closes the gas phase portion of the first liquid reservoir depending on the liquid level of the heating medium in the first liquid reservoir. The liquid phase portion of the first liquid reservoir is connected to the liquid phase portion of the heat input device through a first direction valve that allows flow only in the direction of the heat input device, and the liquid phase portion of the first liquid reservoir is connected to the liquid phase portion of the heat input device. is connected to the liquid phase part of the second liquid reservoir via a second directional valve through which only
The liquid phase part of the liquid reservoir is connected to the liquid phase part of the heat output device through a third directional valve that allows flow only to the second liquid reservoir, and the gas phase part of the second liquid reservoir is connected to the liquid phase part of the second liquid reservoir. It is connected to the gas phase portion of the heat output device and to the gas phase portion of the heat input device via a second valve that opens and closes depending on the liquid level of the heat medium in the heat output device.

Effect The effect of this technical means is as follows.
That is, by opening and closing the first valve and the second valve, the heat medium is transferred from the heat input device to the heat output device, from the heat output device to the second liquid reservoir,
Thermal energy is intermittently sent from the second reservoir to the first reservoir, and from the first reservoir to the heat input device, and the thermal energy input into the heat input device is taken out from the heat output device located below the heat input device.
Heat can be transferred from the top to the bottom.

Embodiment Hereinafter, an embodiment of the present invention will be described based on the accompanying drawings.

In FIG. 1, a heat input device 1 is provided at the top, a heat output device 2 is provided below the heat input device 1, and a first liquid reservoir 7 having a cooling function by a cooling fin 6 is provided above the heat input device 1. A second liquid reservoir 8 is provided below the heat extractor 2 and connected by a liquid pipe 3 and a steam pipe 4, respectively, to form a sealed pipe line. And inside this sealed pipe,
The heating medium 5 is sealed in a two-phase state of a gas phase and a liquid phase depending on the pressure and temperature inside the sealed pipe. Here, the first liquid reservoir 7 has a first float 9 whose position changes in response to changes in the liquid level of the heat medium 5 in the first liquid reservoir 7, and this first float 9 opens when it is at a high position and when it is at a low position. It is connected to the gas phase portion of the heat input device 1 by a steam pipe 4 via a first valve 11 that is closed when the heat input device is in the position. In addition, the liquid phase part of the first liquid reservoir 7 is connected to the liquid of the heat input device 1 through the liquid piping 3 via the first direction valve 13 that allows the heat medium 5 to flow only in the direction of the heat input device 1 from the first liquid reservoir 7. The liquid phase part of the second liquid reservoir 8 is connected to the liquid phase part of the second liquid reservoir 8 through the liquid piping 3 via the second direction valve 14 which is connected to the phase part and allows the heat medium 5 to flow only in the direction from the second liquid reservoir 8 to the first liquid reservoir 7. It is connected to the. The liquid phase part of the second liquid reservoir 8 is connected to the liquid phase of the heat extractor 2 by the liquid pipe 3 via the third direction valve 15 which allows the heat medium 5 to flow only in the direction from the heat extractor 2 to the second liquid reservoir 8. connected to the second
The gas phase portion of the liquid reservoir 8 is connected to a second valve 12 which is closed when the second float 10, which changes position in response to a change in the liquid level of the heat medium 5 in the second liquid reservoir 8, is in a high position and is in a low position.
It is connected to the gas phase portion of the heat output device 2 via the steam piping 4, and is further connected to the gas phase portion of the heat input device 1 via the steam piping 4.

Next, the operation of this embodiment will be explained.
When the liquid level of the heat medium 5 in the second liquid reservoir 8 is low, the second valve 12 is open, and when heat is applied to the heat input device 1, the heat medium 5 in the heat input device 1 is vaporized. The heat medium 5 is sent to the heat output device 2 via the steam pipe 4 and the second valve 12, and when the heat is radiated by the heat output device 2, the heat medium 5 is liquefied. This liquefied heat medium 5 is sent to the second liquid reservoir 8 by gravity via the third directional valve 15 and the liquid pipe 3, and is sent to the second liquid reservoir 8.
The liquid level of the heat medium 5 in the second liquid reservoir 8 is raised.

Next, when the liquid level of the heat medium 5 in the second liquid reservoir 8 is high, the second valve 12 is closed. At this time, the heat medium 5 vaporized in the heat input device 1 is sent to the second liquid reservoir 8 via the steam pipe 4, increasing the pressure in the second liquid reservoir 8,
The heat medium 5 in a liquid phase stored in the second liquid reservoir 8
is sent through the second directional valve 14 and the liquid pipe 3 to the first liquid reservoir 7 maintained at a low pressure by the cooling function of the cooling fins 6, and the liquid level of the heat medium 5 in the second liquid reservoir 8 is lowered.

In addition, when the liquid level of the heat medium 5 in the first liquid reservoir 7 is low, the first valve 11 is closed, and the first liquid reservoir 7, which is kept at a low pressure by the cooling function of the cooling fins 6,
The heat medium 5 in the liquid phase in the second liquid reservoir 8 is sent to the first
It is stored in the liquid reservoir 7 and raises the liquid level of the heat medium 5 in the first liquid reservoir 7.

Next, when the liquid level of the heat medium 5 in the first liquid reservoir 7 is high, the first valve 11 is open. At this time, the heat medium 5 vaporized in the heat input device 1 is sent to the first liquid reservoir 7 through the first valve 11, and the heat medium 5 is transferred between the first liquid reservoir 7 and the heat input device 1. The vapor pressure becomes the same pressure, and the heat medium 5 in a liquid phase stored in the first liquid reservoir 7 is sent to the heat input device 1 by gravity via the first directional valve 13 and the liquid pipe 3. The liquid level of the heat medium 5 in the first liquid reservoir 7 is lowered.

The above operations are repeated in sequence, and the heat entering the upper heat input device 1 is taken out from the lower heat output device 2, thereby making it possible to move the upper heat downward.

FIG. 2 shows the first liquid reservoir 7 in a state where the liquid level of the heat medium 5 in the first liquid reservoir 7 is low in an embodiment of the present invention.
and a detailed sectional view of a portion of the first valve 11;
The figure is also a detailed cross-sectional view in a state where the liquid level is high. As shown in the figure, the first liquid reservoir 7 includes a heating medium 5
The first float 9 changes its position due to changes in the liquid level.
and a magnet 1 with a seal 16 for sealing.
7. Here the first
The float 9 and the first valve 11 are connected by an intermittent transmission mechanism 19 for increasing the change in the liquid level of the heat medium 5 when the first valve 11 opens and closes. Also, a magnetic body 18 fixed in the direction in which the first valve 11 opens
Due to the magnetic force, the opening/closing state changes only when the liquid level of the heating medium 5 is higher than a certain value or lower than a certain value, and in between, the previous state is maintained, thereby ensuring reliable operation.

Further, the second valve 12 in the second liquid reservoir 8 has a similar configuration except that the opening and closing operations are reversed.

FIG. 4 shows the opening/closing operation characteristics of the first valve 11 and the second valve 12 as described above.

Note that the temperature for cooling the first liquid reservoir 7 is equivalent to the liquid column pressure of the heating medium 5 corresponding to the height difference between the first liquid reservoir 7 and the second liquid reservoir 8, rather than the temperature for heating the heat input device 1. As long as the temperature difference is as low as possible. For example, if Freon 22 is used as the heating medium 5, the height difference between the first liquid reservoir 7 and the second liquid reservoir 8 is 8 m, and the temperature of the high temperature source is 60°C,
The temperature of the low temperature source will be below 58.3℃. This temperature is
The temperature is sufficiently higher than the temperature of atmospheric heat, and the atmospheric heat can be used as a low temperature source for cooling the first liquid reservoir 7.

Effects of the Invention As described above, according to the present invention, heat from above can be automatically moved downward without using external mechanical drive.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a loop heat pipe device according to an embodiment of the present invention, FIG. 2 is a detailed sectional view of the first liquid reservoir when the liquid level of the heating medium is low according to the same embodiment, and FIG. 3 4 is a detailed sectional view of the first liquid reservoir when the liquid level is high, FIG. 4 is a diagram of the opening/closing operation characteristics of the first and second valves, and FIG. 5 is a configuration diagram of a conventional loop heat pipe device. be. 1...Heat input device, 2...Heat output device, 3...Liquid piping,
4... Steam piping, 5... Heat medium, 6... Cooling fin, 7... First liquid reservoir, 8... Second liquid reservoir, 9... First float, 10... Second float, 11... ...First valve, 12...Second valve, 13...First direction valve, 1
4...Second direction valve, 15...Third direction valve, 16...
...Patzkin, 17...Magnet, 18...Magnetic material, 1
9...Intermittent transmission mechanism.

Claims (1)

[Claims] 1 A heat input device, a heat output device provided below the heat input device, a first liquid reservoir having a cooling function provided above the heat input device, and a first liquid reservoir provided below the heat transfer device. The second liquid reservoirs are connected by pipes to form a sealed pipe, and a heat medium that enters a two-phase state of a gas phase and a liquid phase depending on the pressure and temperature inside the sealed pipe is placed inside the sealed pipe. and connecting the gas phase portion of the first liquid reservoir to the gas phase portion of the heat input device via a first valve that opens and closes depending on the liquid level of the heating medium in the first liquid reservoir, and 1st
The liquid phase portion of the liquid reservoir is connected to the liquid phase portion of the heat input device through a first directional valve through which the liquid phase portion flows only toward the heat input device, and the second through the second direction valve through which flow only toward the first liquid reservoir is connected.
connected to the liquid phase part of the liquid reservoir, and the liquid phase part of the second liquid reservoir is connected to the liquid phase part of the heat output device through a third directional valve that allows flow only to the second liquid reservoir; The gas phase portion of the liquid reservoir is connected to the gas phase portion of the heat output device through a second valve that opens and closes depending on the liquid level of the heat medium in this second liquid reservoir, and the gas phase portion of the heat input device is connected to the gas phase portion of the heat input device. Loop heat pipe device connected to.